JP4343640B2 - 透明基板の位置合わせ方法 - Google Patents

透明基板の位置合わせ方法 Download PDF

Info

Publication number
JP4343640B2
JP4343640B2 JP2003344013A JP2003344013A JP4343640B2 JP 4343640 B2 JP4343640 B2 JP 4343640B2 JP 2003344013 A JP2003344013 A JP 2003344013A JP 2003344013 A JP2003344013 A JP 2003344013A JP 4343640 B2 JP4343640 B2 JP 4343640B2
Authority
JP
Japan
Prior art keywords
substrate
outer peripheral
alignment
transparent substrate
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003344013A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005109376A5 (https=
JP2005109376A (ja
Inventor
文昭 北山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003344013A priority Critical patent/JP4343640B2/ja
Publication of JP2005109376A publication Critical patent/JP2005109376A/ja
Publication of JP2005109376A5 publication Critical patent/JP2005109376A5/ja
Application granted granted Critical
Publication of JP4343640B2 publication Critical patent/JP4343640B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003344013A 2003-10-02 2003-10-02 透明基板の位置合わせ方法 Expired - Fee Related JP4343640B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003344013A JP4343640B2 (ja) 2003-10-02 2003-10-02 透明基板の位置合わせ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003344013A JP4343640B2 (ja) 2003-10-02 2003-10-02 透明基板の位置合わせ方法

Publications (3)

Publication Number Publication Date
JP2005109376A JP2005109376A (ja) 2005-04-21
JP2005109376A5 JP2005109376A5 (https=) 2006-11-16
JP4343640B2 true JP4343640B2 (ja) 2009-10-14

Family

ID=34537774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003344013A Expired - Fee Related JP4343640B2 (ja) 2003-10-02 2003-10-02 透明基板の位置合わせ方法

Country Status (1)

Country Link
JP (1) JP4343640B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11333986B2 (en) 2020-03-12 2022-05-17 Canon Kabushiki Kaisha Detection apparatus, exposure apparatus, and article manufacturing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010032372A (ja) * 2008-07-29 2010-02-12 Toshiba Corp エッジ検出方法
JP2014086578A (ja) * 2012-10-19 2014-05-12 Applied Materials Inc オリエンタチャンバ
US11043437B2 (en) * 2019-01-07 2021-06-22 Applied Materials, Inc. Transparent substrate with light blocking edge exclusion zone
JP7781668B2 (ja) * 2022-02-22 2025-12-08 キヤノン株式会社 搬送装置、基板処理装置、搬送方法および物品製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11333986B2 (en) 2020-03-12 2022-05-17 Canon Kabushiki Kaisha Detection apparatus, exposure apparatus, and article manufacturing method

Also Published As

Publication number Publication date
JP2005109376A (ja) 2005-04-21

Similar Documents

Publication Publication Date Title
US7876432B2 (en) Method for detecting position of defect on semiconductor wafer
KR101379538B1 (ko) 접합 기판의 회전 어긋남량 계측 장치, 접합 기판의 회전 어긋남량 계측 방법 및 접합 기판의 제조 방법
JP5373707B2 (ja) 貼合わせ基板の位置ズレ検出装置およびそれを用いる半導体製造装置ならびに貼合わせ基板の位置ズレ検出方法
US7737426B2 (en) Substrate positioning device and substrate positioning method for a substrate having a transparent layer and a nontransparent layer
US8487237B2 (en) Rotary encoder and method of assembling the same
WO1997037376A1 (en) A method and apparatus for determining the center and orientation of a wafer-like object
FR2776421A1 (fr) Dispositif et procede de fabrication de semi-conducteurs determinant l'alignement d'une galette a la station de fabrication de celle-ci
US10094684B2 (en) Method of manufacturing rotary scale, rotary scale, rotary encoder, driving apparatus, image pickup apparatus and robot apparatus
JP2602415B2 (ja) ウェーハ位置決め装置
JP4343640B2 (ja) 透明基板の位置合わせ方法
KR101164310B1 (ko) 반도체 웨이퍼 처리 장치 및 기준각도 위치 검출 방법
US12148646B2 (en) Aligner apparatus
JP2010287816A (ja) 基板の位置合わせ装置、及び基板の位置合わせ方法
JP6219692B2 (ja) ウェーハのｉｄマーク読取装置
US6201603B1 (en) Position detecting apparatus for semiconductor wafer
US20030117590A1 (en) Method of making a rotational optical arrangement, and the optical arrangement made by the method
JP2024054636A (ja) ロボットシステム、アライナおよび半導体基板のアライメント方法
JPH11317439A (ja) 位置決め装置
JPH0645226A (ja) 位置決め装置及びそれを用いた半導体素子の製造方法
JP2874795B2 (ja) オリエンテーションフラット検出装置
JP4400341B2 (ja) ウエハのプリアライメント装置およびプリアライメント方法
JPH1012709A (ja) 円形基板位置決め装置
JP5875405B2 (ja) 基板処理装置および基板処理方法
JP2010129821A (ja) 半導体ウエハとそのノッチの位置を検出する装置及び方法
JP2002252267A (ja) ウエハ搬送装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061002

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061002

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090128

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090330

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20090330

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20090406

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090630

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090709

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120717

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4343640

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120717

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130717

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees