JP4343640B2 - 透明基板の位置合わせ方法 - Google Patents
透明基板の位置合わせ方法 Download PDFInfo
- Publication number
- JP4343640B2 JP4343640B2 JP2003344013A JP2003344013A JP4343640B2 JP 4343640 B2 JP4343640 B2 JP 4343640B2 JP 2003344013 A JP2003344013 A JP 2003344013A JP 2003344013 A JP2003344013 A JP 2003344013A JP 4343640 B2 JP4343640 B2 JP 4343640B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- outer peripheral
- alignment
- transparent substrate
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003344013A JP4343640B2 (ja) | 2003-10-02 | 2003-10-02 | 透明基板の位置合わせ方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003344013A JP4343640B2 (ja) | 2003-10-02 | 2003-10-02 | 透明基板の位置合わせ方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005109376A JP2005109376A (ja) | 2005-04-21 |
JP2005109376A5 JP2005109376A5 (enrdf_load_stackoverflow) | 2006-11-16 |
JP4343640B2 true JP4343640B2 (ja) | 2009-10-14 |
Family
ID=34537774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003344013A Expired - Fee Related JP4343640B2 (ja) | 2003-10-02 | 2003-10-02 | 透明基板の位置合わせ方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4343640B2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11333986B2 (en) | 2020-03-12 | 2022-05-17 | Canon Kabushiki Kaisha | Detection apparatus, exposure apparatus, and article manufacturing method |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010032372A (ja) | 2008-07-29 | 2010-02-12 | Toshiba Corp | エッジ検出方法 |
JP2014086578A (ja) * | 2012-10-19 | 2014-05-12 | Applied Materials Inc | オリエンタチャンバ |
US11043437B2 (en) * | 2019-01-07 | 2021-06-22 | Applied Materials, Inc. | Transparent substrate with light blocking edge exclusion zone |
-
2003
- 2003-10-02 JP JP2003344013A patent/JP4343640B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11333986B2 (en) | 2020-03-12 | 2022-05-17 | Canon Kabushiki Kaisha | Detection apparatus, exposure apparatus, and article manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JP2005109376A (ja) | 2005-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI502187B (zh) | 基板檢查裝置及基板檢查方法 | |
US7876432B2 (en) | Method for detecting position of defect on semiconductor wafer | |
KR101379538B1 (ko) | 접합 기판의 회전 어긋남량 계측 장치, 접합 기판의 회전 어긋남량 계측 방법 및 접합 기판의 제조 방법 | |
JP4744458B2 (ja) | 基板位置決め装置および基板位置決め方法 | |
JP5373707B2 (ja) | 貼合わせ基板の位置ズレ検出装置およびそれを用いる半導体製造装置ならびに貼合わせ基板の位置ズレ検出方法 | |
US8487237B2 (en) | Rotary encoder and method of assembling the same | |
WO1997037376A1 (en) | A method and apparatus for determining the center and orientation of a wafer-like object | |
FR2776421A1 (fr) | Dispositif et procede de fabrication de semi-conducteurs determinant l'alignement d'une galette a la station de fabrication de celle-ci | |
US10094684B2 (en) | Method of manufacturing rotary scale, rotary scale, rotary encoder, driving apparatus, image pickup apparatus and robot apparatus | |
JP2602415B2 (ja) | ウェーハ位置決め装置 | |
JP4343640B2 (ja) | 透明基板の位置合わせ方法 | |
KR20090132610A (ko) | 반도체 웨이퍼 처리 장치, 기준각도 위치 검출 방법 및 반도체 웨이퍼 | |
JP6219692B2 (ja) | ウェーハのidマーク読取装置 | |
JP2024054636A (ja) | ロボットシステム、アライナおよび半導体基板のアライメント方法 | |
US6201603B1 (en) | Position detecting apparatus for semiconductor wafer | |
US20030117590A1 (en) | Method of making a rotational optical arrangement, and the optical arrangement made by the method | |
JP2010287816A (ja) | 基板の位置合わせ装置、及び基板の位置合わせ方法 | |
JPH11317439A (ja) | 位置決め装置 | |
CN115808427A (zh) | 端部状态确认装置 | |
JPH04128605A (ja) | オリエンテーションフラット検出装置 | |
US12148646B2 (en) | Aligner apparatus | |
JPH1012709A (ja) | 円形基板位置決め装置 | |
JP4400341B2 (ja) | ウエハのプリアライメント装置およびプリアライメント方法 | |
JP5875405B2 (ja) | 基板処理装置および基板処理方法 | |
JPH10173031A (ja) | 円形基板位置決め装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061002 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061002 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090119 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090128 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090330 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20090330 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20090406 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090630 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090709 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120717 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4343640 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120717 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130717 Year of fee payment: 4 |
|
LAPS | Cancellation because of no payment of annual fees |