JP4335668B2 - 太陽電池の製造方法 - Google Patents
太陽電池の製造方法 Download PDFInfo
- Publication number
- JP4335668B2 JP4335668B2 JP2003506017A JP2003506017A JP4335668B2 JP 4335668 B2 JP4335668 B2 JP 4335668B2 JP 2003506017 A JP2003506017 A JP 2003506017A JP 2003506017 A JP2003506017 A JP 2003506017A JP 4335668 B2 JP4335668 B2 JP 4335668B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- silicon
- aluminum
- layer
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 39
- 229910052710 silicon Inorganic materials 0.000 claims description 39
- 239000010703 silicon Substances 0.000 claims description 39
- 229910052782 aluminium Inorganic materials 0.000 claims description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 27
- 238000005245 sintering Methods 0.000 claims description 21
- 229910021478 group 5 element Inorganic materials 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 7
- 239000012298 atmosphere Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical group ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 claims description 6
- 150000003018 phosphorus compounds Chemical class 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 55
- 239000010410 layer Substances 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 238000000151 deposition Methods 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 230000008021 deposition Effects 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- 229910052698 phosphorus Inorganic materials 0.000 description 11
- 239000011574 phosphorus Substances 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 10
- 239000010453 quartz Substances 0.000 description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000000543 intermediate Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0114896.4A GB0114896D0 (en) | 2001-06-19 | 2001-06-19 | Process for manufacturing a solar cell |
| PCT/GB2002/002673 WO2002103810A1 (en) | 2001-06-19 | 2002-06-17 | Process for manufacturing a solar cell |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004531074A JP2004531074A (ja) | 2004-10-07 |
| JP2004531074A5 JP2004531074A5 (enExample) | 2005-08-04 |
| JP4335668B2 true JP4335668B2 (ja) | 2009-09-30 |
Family
ID=9916873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003506017A Expired - Fee Related JP4335668B2 (ja) | 2001-06-19 | 2002-06-17 | 太陽電池の製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7071018B2 (enExample) |
| EP (1) | EP1397839A1 (enExample) |
| JP (1) | JP4335668B2 (enExample) |
| CN (1) | CN100383984C (enExample) |
| AU (1) | AU2002257979B2 (enExample) |
| GB (1) | GB0114896D0 (enExample) |
| WO (1) | WO2002103810A1 (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
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| SG139508A1 (en) * | 2001-09-10 | 2008-02-29 | Micron Technology Inc | Wafer dicing device and method |
| SG102639A1 (en) * | 2001-10-08 | 2004-03-26 | Micron Technology Inc | Apparatus and method for packing circuits |
| SG142115A1 (en) | 2002-06-14 | 2008-05-28 | Micron Technology Inc | Wafer level packaging |
| US7402448B2 (en) * | 2003-01-31 | 2008-07-22 | Bp Corporation North America Inc. | Photovoltaic cell and production thereof |
| SG119185A1 (en) | 2003-05-06 | 2006-02-28 | Micron Technology Inc | Method for packaging circuits and packaged circuits |
| US7893347B2 (en) | 2003-10-09 | 2011-02-22 | Helmholtz-Zentrum Berlin Fuer Materialien Und Energie Gmbh | Photovoltaic solar cell |
| US20050189013A1 (en) * | 2003-12-23 | 2005-09-01 | Oliver Hartley | Process for manufacturing photovoltaic cells |
| US7659203B2 (en) * | 2005-03-18 | 2010-02-09 | Applied Materials, Inc. | Electroless deposition process on a silicon contact |
| US7514353B2 (en) | 2005-03-18 | 2009-04-07 | Applied Materials, Inc. | Contact metallization scheme using a barrier layer over a silicide layer |
| US7718092B2 (en) | 2005-10-11 | 2010-05-18 | E.I. Du Pont De Nemours And Company | Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof |
| US20070099806A1 (en) * | 2005-10-28 | 2007-05-03 | Stewart Michael P | Composition and method for selectively removing native oxide from silicon-containing surfaces |
| US7655542B2 (en) * | 2006-06-23 | 2010-02-02 | Applied Materials, Inc. | Methods and apparatus for depositing a microcrystalline silicon film for photovoltaic device |
| EP1892767A1 (en) * | 2006-08-22 | 2008-02-27 | BP Solar Espana, S.A. Unipersonal | Photovoltaic cell and production thereof |
| US20080121276A1 (en) * | 2006-11-29 | 2008-05-29 | Applied Materials, Inc. | Selective electroless deposition for solar cells |
| NO333757B1 (no) * | 2006-12-04 | 2013-09-09 | Elkem Solar As | Solceller |
| EP1936698A1 (en) | 2006-12-18 | 2008-06-25 | BP Solar Espana, S.A. Unipersonal | Process for manufacturing photovoltaic cells |
| US20080223440A1 (en) * | 2007-01-18 | 2008-09-18 | Shuran Sheng | Multi-junction solar cells and methods and apparatuses for forming the same |
| US20080173350A1 (en) * | 2007-01-18 | 2008-07-24 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
| US8203071B2 (en) * | 2007-01-18 | 2012-06-19 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
| US7582515B2 (en) * | 2007-01-18 | 2009-09-01 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
| US20080245414A1 (en) * | 2007-04-09 | 2008-10-09 | Shuran Sheng | Methods for forming a photovoltaic device with low contact resistance |
| JP5576273B2 (ja) | 2007-07-03 | 2014-08-20 | マイクロリンク デバイセズ インコーポレイテッド | Iii−v化合物薄膜太陽電池の加工方法 |
| US7875486B2 (en) * | 2007-07-10 | 2011-01-25 | Applied Materials, Inc. | Solar cells and methods and apparatuses for forming the same including I-layer and N-layer chamber cleaning |
| US7763535B2 (en) * | 2007-08-30 | 2010-07-27 | Applied Materials, Inc. | Method for producing a metal backside contact of a semiconductor component, in particular, a solar cell |
| EP2031659A1 (de) * | 2007-08-30 | 2009-03-04 | Applied Materials, Inc. | Verfahren zur Erzeugung eines metallischen Rückkontaktes eines Halbleiterbauelements, insbesondere einer Solarzelle |
| CN101855181A (zh) * | 2007-08-31 | 2010-10-06 | Csg索拉尔有限公司 | 玻璃的研磨-蚀刻纹理化 |
| US20090104733A1 (en) * | 2007-10-22 | 2009-04-23 | Yong Kee Chae | Microcrystalline silicon deposition for thin film solar applications |
| JP2011503848A (ja) * | 2007-11-02 | 2011-01-27 | アプライド マテリアルズ インコーポレイテッド | 堆積プロセス間のプラズマ処置 |
| US20090130827A1 (en) * | 2007-11-02 | 2009-05-21 | Soo Young Choi | Intrinsic amorphous silicon layer |
| US20100285631A1 (en) * | 2008-01-02 | 2010-11-11 | Blue Himmel Solar Pty Ltd | Method of selectively doping a semiconductor material for fabricating a solar cell |
| US20090229663A1 (en) * | 2008-03-17 | 2009-09-17 | Nanopv Technologies Inc. | Nanocrystalline photovoltaic device |
| US7993752B2 (en) * | 2008-03-17 | 2011-08-09 | Nano PV Technologies, Inc. | Transparent conductive layer and method |
| US20090233007A1 (en) * | 2008-03-17 | 2009-09-17 | Nanopv Technologies Inc. | Chemical vapor deposition reactor and method |
| US20090229664A1 (en) * | 2008-03-17 | 2009-09-17 | Nanopv Technologies Inc. | Method of manufacturing nanocrystalline photovoltaic devices |
| WO2009126186A1 (en) | 2008-04-10 | 2009-10-15 | Cardinal Ig Company | Manufacturing of photovoltaic subassemblies |
| ATE524835T1 (de) * | 2008-04-10 | 2011-09-15 | Cardinal Ig Co | Glasierungsbaugruppen mit photovoltaikelementen und diesbezügliche herstellungsverfahren |
| WO2009137241A2 (en) | 2008-04-14 | 2009-11-12 | Bandgap Engineering, Inc. | Process for fabricating nanowire arrays |
| CN102057503A (zh) * | 2008-05-13 | 2011-05-11 | 应用材料股份有限公司 | 用于太阳能电池制造的晶体生长装置 |
| US8895842B2 (en) * | 2008-08-29 | 2014-11-25 | Applied Materials, Inc. | High quality TCO-silicon interface contact structure for high efficiency thin film silicon solar cells |
| US20100059110A1 (en) * | 2008-09-11 | 2010-03-11 | Applied Materials, Inc. | Microcrystalline silicon alloys for thin film and wafer based solar applications |
| DE102009008786A1 (de) * | 2008-10-31 | 2010-06-10 | Bosch Solar Energy Ag | Verfahren zur Herstellung einer Solarzelle und Solarzelle |
| PT2351100T (pt) * | 2008-11-14 | 2020-04-21 | Bandgap Eng Inc | Dispositivos nanoestruturados |
| US20100163406A1 (en) * | 2008-12-30 | 2010-07-01 | Applied Materials, Inc. | Substrate support in a reactive sputter chamber |
| US20110114177A1 (en) * | 2009-07-23 | 2011-05-19 | Applied Materials, Inc. | Mixed silicon phase film for high efficiency thin film silicon solar cells |
| CN101630702B (zh) * | 2009-07-30 | 2012-02-01 | 东莞南玻太阳能玻璃有限公司 | 一种太阳能电池组件镀膜盖板玻璃的制造方法 |
| WO2011046664A2 (en) * | 2009-10-15 | 2011-04-21 | Applied Materials, Inc. | A barrier layer disposed between a substrate and a transparent conductive oxide layer for thin film silicon solar cells |
| WO2011053344A1 (en) * | 2009-10-26 | 2011-05-05 | Narayanan Srinivasamohan | Crystalline silicon solar cell and manufacturing process |
| US9634165B2 (en) * | 2009-11-02 | 2017-04-25 | International Business Machines Corporation | Regeneration method for restoring photovoltaic cell efficiency |
| DE102009053818A1 (de) | 2009-11-18 | 2011-05-19 | Evonik Degussa Gmbh | Dotierung von Siliciumschichten aus flüssigen Silanen für Elektronik- und Solar-Anwendungen |
| US20110126875A1 (en) * | 2009-12-01 | 2011-06-02 | Hien-Minh Huu Le | Conductive contact layer formed on a transparent conductive layer by a reactive sputter deposition |
| US20110192316A1 (en) * | 2010-02-05 | 2011-08-11 | E-Chem Enterprise Corp. | Electroless plating solution for providing solar cell electrode |
| US8865502B2 (en) * | 2010-06-10 | 2014-10-21 | International Business Machines Corporation | Solar cells with plated back side surface field and back side electrical contact and method of fabricating same |
| DE102010025281A1 (de) * | 2010-06-28 | 2011-12-29 | Centrotherm Photovoltaics Ag | Verfahren zur lokalen Entfernung einer Oberflächenschicht sowie Solarzelle |
| DE102010034551A1 (de) * | 2010-08-17 | 2012-02-23 | Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh | Verfahren zur Herstellung eines Aluminium-Rückseitenreflektors für eine Si-Solarzelle und Si-Solarzelle mit einem solchen Reflektor |
| CN102468363B (zh) * | 2010-11-09 | 2013-07-10 | 浚鑫科技股份有限公司 | 低效太阳能电池处理方法 |
| CN102097534A (zh) * | 2010-11-18 | 2011-06-15 | 中国科学院宁波材料技术与工程研究所 | 同时形成晶体硅太阳能电池pn结和氮化硅减反射膜的方法 |
| CN102082199B (zh) * | 2010-11-19 | 2012-05-02 | 山东力诺太阳能电力股份有限公司 | 一种用于晶体硅太阳能电池刻槽埋栅的方法 |
| TWI467783B (zh) * | 2011-11-10 | 2015-01-01 | Nat Univ Tsing Hua | A solar cell manufacturing method and solar cell with curved embedded electrode wire |
| KR101921738B1 (ko) | 2012-06-26 | 2018-11-23 | 엘지전자 주식회사 | 태양 전지 |
| CN103107237B (zh) * | 2012-12-06 | 2016-03-23 | 杭州赛昂电力有限公司 | 单晶硅太阳能电池及其制作方法 |
| US20150179834A1 (en) * | 2013-12-20 | 2015-06-25 | Mukul Agrawal | Barrier-less metal seed stack and contact |
| CN104393095B (zh) * | 2014-09-25 | 2016-09-07 | 锦州华昌光伏科技有限公司 | n型硅太阳电池、其制备方法及铝蒸发扩散装置 |
| CN109216479A (zh) * | 2018-09-07 | 2019-01-15 | 泰州隆基乐叶光伏科技有限公司 | 一种太阳能电池及其生产工艺 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6174378A (ja) * | 1984-09-20 | 1986-04-16 | Hamamatsu Photonics Kk | 赤外線照射により浅い接合とbsfを同時に形成する光センサの製造方法 |
| JP2951061B2 (ja) | 1991-09-18 | 1999-09-20 | 三洋電機株式会社 | 太陽電池の製造方法 |
| JP3032422B2 (ja) | 1994-04-28 | 2000-04-17 | シャープ株式会社 | 太陽電池セルとその製造方法 |
| US5510271A (en) * | 1994-09-09 | 1996-04-23 | Georgia Tech Research Corporation | Processes for producing low cost, high efficiency silicon solar cells |
| DE19508712C2 (de) * | 1995-03-10 | 1997-08-07 | Siemens Solar Gmbh | Solarzelle mit Back-Surface-Field und Verfahren zur Herstellung |
| JPH09191118A (ja) * | 1996-01-11 | 1997-07-22 | Shin Etsu Chem Co Ltd | 太陽電池の製造方法 |
| US6552414B1 (en) * | 1996-12-24 | 2003-04-22 | Imec Vzw | Semiconductor device with selectively diffused regions |
| EP0851511A1 (en) * | 1996-12-24 | 1998-07-01 | IMEC vzw | Semiconductor device with two selectively diffused regions |
-
2001
- 2001-06-19 GB GBGB0114896.4A patent/GB0114896D0/en not_active Ceased
-
2002
- 2002-06-17 US US10/481,268 patent/US7071018B2/en not_active Expired - Fee Related
- 2002-06-17 EP EP02727782A patent/EP1397839A1/en not_active Withdrawn
- 2002-06-17 AU AU2002257979A patent/AU2002257979B2/en not_active Ceased
- 2002-06-17 WO PCT/GB2002/002673 patent/WO2002103810A1/en not_active Ceased
- 2002-06-17 JP JP2003506017A patent/JP4335668B2/ja not_active Expired - Fee Related
- 2002-06-17 CN CNB028160789A patent/CN100383984C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| AU2002257979B2 (en) | 2007-10-04 |
| US7071018B2 (en) | 2006-07-04 |
| EP1397839A1 (en) | 2004-03-17 |
| GB0114896D0 (en) | 2001-08-08 |
| CN100383984C (zh) | 2008-04-23 |
| US20050074917A1 (en) | 2005-04-07 |
| JP2004531074A (ja) | 2004-10-07 |
| WO2002103810A1 (en) | 2002-12-27 |
| CN1543681A (zh) | 2004-11-03 |
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