JP4333776B2 - 操作パネル - Google Patents
操作パネル Download PDFInfo
- Publication number
- JP4333776B2 JP4333776B2 JP2007130572A JP2007130572A JP4333776B2 JP 4333776 B2 JP4333776 B2 JP 4333776B2 JP 2007130572 A JP2007130572 A JP 2007130572A JP 2007130572 A JP2007130572 A JP 2007130572A JP 4333776 B2 JP4333776 B2 JP 4333776B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light source
- layer
- operation panel
- pressing operation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
- H01H2219/039—Selective or different modes of illumination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
- H01H2219/052—Phosphorescence
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/062—Light conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/064—Optical isolation of switch sites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
Description
2 筐体
5U,5L 押圧操作部材
5F 前面壁部(光漏出部)
15 基板
18 ライトアップ用光源
18M 光照出面
38 ケース部
40 発光素子
45 樹脂モールド
45D 第一領域
45B 第二領域
45C 素子配置用凹部
46 遮光層
48 減光調整層
Claims (10)
- 筐体と、
該筐体の内部に設けられたライトアップ用光源と、
前記筐体の前面部に取り付けられ、前記ライトアップ用光源からの光を操作前面側に漏出させる光漏出部を有した操作部材とを有し、
前記ライトアップ用光源から前記光漏出部までの距離が相違する複数個の前記操作部材が前記筐体の前面部に取り付けられるとともに、それら操作部材間で共用される前記ライトアップ用光源の光照出面の、各前記操作部材の前記光漏出部を見込む領域の少なくとも1つのものが、前記ライトアップ用光源による前記光漏出部からの照明強度の、それら領域間の前記ライトアップ用光源と前記光漏出部との距離に応じた差を縮小する減光調整層により覆われてなることを特徴とする操作パネル。 - 前記減光調整層は、対応する前記光漏出部までの距離が相違する複数の前記領域を個々に覆う部分の減光率が、前記距離が小さくなるほど大きくなるように調整されてなる請求項1記載の操作パネル。
- 前記光照出面の前記領域の一部が前記減光調整層により覆われない非被覆領域とされ、対応する前記光漏出部までの距離が該非被覆領域よりも小さい別の領域が、前記減光調整層により覆われてなる請求項1記載の操作パネル。
- 前記減光調整層は、遮光性又は吸光性の顔料又は染料を配合した樹脂層である請求項1ないし請求項3のいずれか1項に記載の操作パネル。
- 前記減光調整層をなす前記樹脂層は印刷樹脂層として形成され、該印刷層の印刷濃度に応じて前記減光率が調整される請求項4記載の操作パネル。
- 前記ライトアップ用光源は、発光素子を透光性の樹脂モールドにより覆った発光モジュールとして構成され、前記樹脂モールドの表面が前記光照出面とされてなる請求項1ないし請求項5のいずれか1項に記載の操作パネル。
- 前記発光モジュールは、素子配置用凹部が形成されたケース部を有するとともに該素子配置用凹部の底面に前記発光素子が配置され、樹脂モールドは当該素子配置用凹部を充填する形で形成され、当該樹脂モールドの前記素子配置用凹部の開口側に前記光照出面が平坦に形成されてなる請求項6記載の操作パネル。
- 前記ライトアップ用光源は、前記発光素子からの発光光束を、当該発光光束の色調の補色に対応する波長を有した励起光に変換する光励起材料粒子を透明基質樹脂に分散させたものとして前記樹脂モールドが構成されるとともに、該透明基質樹脂に対する前記発光素子からの直接透過光と前記励起光とを補色混合して照出する白色光源として構成され、
前記樹脂モールド上の前記光照出面に形成する前記減光調整層は、前記樹脂モールドに対する光透過長が、予め定められた上限基準長よりも長くなる領域においては前記励起光の減光率が大きくなり、予め定められた下限基準長よりも短くなる領域において前記直接透過光の減光率が大きくなるように、それら各領域を覆う部分の色調が定められてなる請求項6又は請求項7に記載の操作パネル。 - 前記操作部材は、押圧操作面が前記筐体の前面に倣う形で互いに隣接して配列する複数の押圧操作部材であり、
前記筐体内にて前記ライトアップ用光源は、該筐体の前記前面部の後方に対向配置された基板上にて、互いに隣接配置される1対の前記押圧操作部材の境界に対応する位置に配置され、
前記1対の押圧操作部材の各押圧操作面は、前記境界位置にて互いに連なるとともに、該境界と交差する向きに傾斜する傾斜面を形成してなり、
前記ライトアップ用光源の前記光照出面を覆う前記減光調整層は、前記傾斜面の傾斜方向において、前記光照出面に接近する側に位置する押圧操作面を見込む第一領域に対する減光率が、前記光照出面から離間する側に位置する押圧操作面を見込む第二領域に対する減光率よりも大きくなるように調整されてなる請求項1ないし請求項7のいずれか1項に記載の操作パネル。 - 前記ライトアップ用光源の前記光照出面にて1対の前記押圧操作部材の境界に対応する領域が遮光層にて覆われてなる請求項9記載の操作パネル。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007130572A JP4333776B2 (ja) | 2007-05-16 | 2007-05-16 | 操作パネル |
US12/118,851 US7661859B2 (en) | 2007-05-16 | 2008-05-12 | Operation panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007130572A JP4333776B2 (ja) | 2007-05-16 | 2007-05-16 | 操作パネル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008287963A JP2008287963A (ja) | 2008-11-27 |
JP4333776B2 true JP4333776B2 (ja) | 2009-09-16 |
Family
ID=40027288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007130572A Expired - Fee Related JP4333776B2 (ja) | 2007-05-16 | 2007-05-16 | 操作パネル |
Country Status (2)
Country | Link |
---|---|
US (1) | US7661859B2 (ja) |
JP (1) | JP4333776B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8639407B2 (en) * | 2009-04-06 | 2014-01-28 | Honda Motor Co., Ltd. | Switch image control system and method |
DE102010056250A1 (de) * | 2010-12-24 | 2012-06-28 | GM Global Technology Operations LLC | Fahrzeug mit zumindest einem Instrument in einem Fahrerinformationssystem sowie ein Verfahren zur Vermeidung von Spiegelungen eines Instruments in einer Windschutzscheibe eines Fahrzeugs |
WO2012156063A1 (de) | 2011-05-13 | 2012-11-22 | Volkswagen Aktiengesellschaft | Anzeigeeinheit für ein fahrzeug |
US9902265B2 (en) * | 2011-05-13 | 2018-02-27 | Volkswagen Ag | Display device for a vehicle, and vehicle |
JP5710084B2 (ja) * | 2013-01-07 | 2015-04-30 | 三菱電機株式会社 | ボタン構造 |
JP2014167854A (ja) * | 2013-02-28 | 2014-09-11 | Stanley Electric Co Ltd | スイッチ装置 |
JP6266923B2 (ja) * | 2013-08-26 | 2018-01-24 | シチズン電子株式会社 | Led発光装置 |
FR3045202B1 (fr) * | 2015-12-09 | 2018-01-05 | Sagemcom Broadband Sas | Equipement electronique comportant au moins un bouton lumineux |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0793458B2 (ja) | 1986-09-05 | 1995-10-09 | ロ−ム株式会社 | Ledアレイヘツドの製造方法 |
JP2890823B2 (ja) * | 1990-11-21 | 1999-05-17 | 株式会社デンソー | 表示盤 |
JPH0963393A (ja) | 1995-08-18 | 1997-03-07 | Matsushita Electric Ind Co Ltd | 車両用表示付操作パネルスイッチ |
EP0971210B1 (en) * | 1998-01-29 | 2004-06-30 | Nippon Seiki Co., Ltd. | Light emitting indicator |
US20020001183A1 (en) * | 1998-06-01 | 2002-01-03 | Ariyama Shigehiro | Surface emission light source device and method of manufacturing light guide plate with reflecting plate therefor |
JP4104097B2 (ja) | 1999-01-14 | 2008-06-18 | 矢崎総業株式会社 | 透過照明型スイッチ装置 |
JP2003179266A (ja) | 2001-12-11 | 2003-06-27 | Yukihiro Mukoda | 表示用光源装置 |
JP2003222537A (ja) | 2002-01-30 | 2003-08-08 | Nippon Seiki Co Ltd | 照明装置 |
JP2006128054A (ja) | 2004-10-28 | 2006-05-18 | Kouichi Yamanoue | 操作パネルの照明構造、及びその部材としてのプリント配線板 |
JP2006221044A (ja) | 2005-02-14 | 2006-08-24 | Denso Corp | 表示板の製造方法 |
JP2006286906A (ja) * | 2005-03-31 | 2006-10-19 | Sony Corp | 発光ダイオード装置とこれを用いたバックライト装置及び液晶表示装置 |
-
2007
- 2007-05-16 JP JP2007130572A patent/JP4333776B2/ja not_active Expired - Fee Related
-
2008
- 2008-05-12 US US12/118,851 patent/US7661859B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080285296A1 (en) | 2008-11-20 |
JP2008287963A (ja) | 2008-11-27 |
US7661859B2 (en) | 2010-02-16 |
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