JP4333219B2 - 感光性樹脂組成物および耐熱性樹脂膜の製造方法 - Google Patents

感光性樹脂組成物および耐熱性樹脂膜の製造方法 Download PDF

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JP4333219B2
JP4333219B2 JP2003150454A JP2003150454A JP4333219B2 JP 4333219 B2 JP4333219 B2 JP 4333219B2 JP 2003150454 A JP2003150454 A JP 2003150454A JP 2003150454 A JP2003150454 A JP 2003150454A JP 4333219 B2 JP4333219 B2 JP 4333219B2
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resin film
photosensitive resin
mol
boiling point
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JP2004054254A (ja
JP2004054254A5 (enrdf_load_stackoverflow
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一登 三好
良治 奥田
真佐夫 富川
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Toray Industries Inc
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Toray Industries Inc
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  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2003150454A 2002-05-29 2003-05-28 感光性樹脂組成物および耐熱性樹脂膜の製造方法 Expired - Lifetime JP4333219B2 (ja)

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JP2003150454A JP4333219B2 (ja) 2002-05-29 2003-05-28 感光性樹脂組成物および耐熱性樹脂膜の製造方法

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JP2002155460 2002-05-29
JP2003150454A JP4333219B2 (ja) 2002-05-29 2003-05-28 感光性樹脂組成物および耐熱性樹脂膜の製造方法

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JP2004054254A JP2004054254A (ja) 2004-02-19
JP2004054254A5 JP2004054254A5 (enrdf_load_stackoverflow) 2006-06-29
JP4333219B2 true JP4333219B2 (ja) 2009-09-16

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Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2381308B1 (en) * 2003-06-23 2015-07-29 Sumitomo Bakelite Co., Ltd. Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
JP4556616B2 (ja) * 2003-10-28 2010-10-06 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP4494061B2 (ja) * 2004-03-30 2010-06-30 東京応化工業株式会社 ポジ型レジスト組成物
JP2005309032A (ja) * 2004-04-21 2005-11-04 Toray Ind Inc ポジ型感光性樹脂組成物
JP4698356B2 (ja) * 2005-09-20 2011-06-08 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
WO2008020573A1 (fr) * 2006-08-15 2008-02-21 Asahi Kasei Emd Corporation Composition de résine photosensible positive
JP4929982B2 (ja) * 2006-10-30 2012-05-09 住友ベークライト株式会社 感光性樹脂組成物、絶縁膜、保護膜および電子機器
KR101411681B1 (ko) * 2007-02-19 2014-06-25 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물, 경화막, 보호막, 절연막 및 이를 이용한 반도체 장치, 표시체 장치
JPWO2009014113A1 (ja) * 2007-07-26 2010-10-07 住友ベークライト株式会社 スプレー塗布用ポジ型感光性樹脂組成物、それを用いた硬化膜の形成方法、硬化膜および半導体装置
TW200930467A (en) * 2007-11-16 2009-07-16 Sumitomo Chemical Co Coating liquid for use in a coating method by delivering the coating liquid through a slit-shaped delivery port
JP5292799B2 (ja) * 2007-12-19 2013-09-18 凸版印刷株式会社 基板用支持ピン
JP5434027B2 (ja) * 2008-09-24 2014-03-05 住友化学株式会社 有機光電変換素子
US20110200937A1 (en) * 2008-10-20 2011-08-18 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition for spray coating and method for producing through electrode using the same
CN102549497B (zh) * 2009-09-10 2013-07-31 东丽株式会社 感光性树脂组合物及感光性树脂膜的制造方法
KR101333704B1 (ko) 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101728820B1 (ko) 2013-12-12 2017-04-20 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
JP6658514B2 (ja) * 2015-03-27 2020-03-04 東レ株式会社 薄膜トランジスタ用感光性樹脂組成物、硬化膜の製造方法、薄膜トランジスタの製造方法および液晶表示装置または有機電界発光表示装置の製造方法
JP7487518B2 (ja) 2020-03-27 2024-05-21 住友ベークライト株式会社 感光性樹脂組成物、硬化膜、硬化膜を備えるパネルレベルパッケージ及びその製造方法
JP7443970B2 (ja) * 2020-07-22 2024-03-06 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
CN113149465B (zh) * 2020-08-13 2023-08-29 广东科迪微晶玻璃实业有限公司 一种多孔电致变色玻璃的制备方法

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