JP4298523B2 - エッチング装置 - Google Patents
エッチング装置 Download PDFInfo
- Publication number
- JP4298523B2 JP4298523B2 JP2004004044A JP2004004044A JP4298523B2 JP 4298523 B2 JP4298523 B2 JP 4298523B2 JP 2004004044 A JP2004004044 A JP 2004004044A JP 2004004044 A JP2004004044 A JP 2004004044A JP 4298523 B2 JP4298523 B2 JP 4298523B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- outer diameter
- jig
- chuck table
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 title claims description 49
- 239000004065 semiconductor Substances 0.000 claims description 80
- 239000000919 ceramic Substances 0.000 claims description 78
- 235000012431 wafers Nutrition 0.000 description 74
- 239000007789 gas Substances 0.000 description 37
- 238000001020 plasma etching Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Description
14:位置合わせテーブル 15:第一の搬送手段 16:第二の搬送手段
17、18、19、20:保持テーブル 21:ターンテーブル
22:第一の研削手段 23:第二の研削手段 24:洗浄手段
25:壁部 26:レール 27:駆動源 28:支持板 29:スピンドル
30:マウンタ 31:研削ホイール 32:研削砥石 33:レール
34:駆動源 35:支持板 36:スピンドル 37:マウンタ 38:研削ホイール
39:研削砥石
40:エッチング手段 41:吸着部 42:アーム部 43:駆動部
50:エッチング装置 51:ガス供給部 52:プラズマ処理部 53:チャンバー
54:エッチングガス供給手段 55:チャックテーブル 55a:軸部
55b:下部電極 55c:保持面 55d:第一の絶縁領域
55e:第二の絶縁領域 56:軸受け 57:ガス流通路 58:モータ
59:ボールネジ 60:昇降部 61:軸受け 62:吸引源 63:吸引路
64:冷却部 65:冷却路 66:開口部 67:開閉シャッター 68:シリンダ
69:ピストン 70:ガス排気部 71:排気口 72:高周波電源
80:治具判別手段 81:光センサー 82:判断手段
Claims (4)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物にエッチングガスを供給するエッチングガス供給手段と、該チャックテーブル及び該エッチングガス供給手段を収容すると共に該被加工物の搬出入口となる開口部が形成されたチャンバーと、該開口部を介して該チャンバーに対する被加工物の搬入及び搬出を行う搬出入手段と、該開口部を開状態または閉状態とする開閉シャッターとを含み、
該チャックテーブルは、被加工物を保持すると共にエッチングガスのプラズマ化に供する保持面と、被加工物の外径より小さい内径を有すると共に該被加工物の外径より大きい外径を有する絶縁領域とから構成され、
該絶縁領域は、少なくとも2種類の外径の被加工物に対応し、外径が大きい方の第一の被加工物の外径より小さい内径を有すると共に該第一の被加工物の外径より大きい外径を有するリング状の第一の絶縁領域と、該第一の被加工物より外径が小さい第二の被加工物の外径より小さい内径を有すると共に該第二の被加工物の外径より大きい外径を有するリング状の第二の絶縁領域とを少なくとも備え、
該チャックテーブルには、該第一の被加工物を収容すると共に該チャックテーブルのうち該第一の絶縁領域の一部を含んで該第一の被加工物を保持していない領域を覆う第一のセラミックス治具と、該第二の被加工物を収容すると共に該チャックテーブルのうち該第二の絶縁領域の一部を含んで該第二の被加工物を保持していない領域を覆う第二のセラミックス治具とを搭載可能なエッチング装置であって、
該第一のセラミックス治具と該第二のセラミックス治具とを判別する治具判別手段が配設されているエッチング装置。 - 前記第一のセラミックス治具の外径と前記第二のセラミックス治具の外径とが異なり、
前記治具判別手段は、前記チャンバーの外側に配設され、前記開口部を開状態にした際に該第一のセラミックス治具の外径と該第二のセラミックス治具の外径とを判別する請求項1に記載のエッチング装置。 - 前記治具判別手段は、判別結果に対応する信号を出力する機能を有し、該治具判別手段には、該信号の入力により前記チャックテーブルに搭載されているセラミックス治具と前記チャンバー内に搬入されようとする被加工物とが対応するか否かを判断する判断手段が接続され、該判断手段による判断の結果が前記搬出入手段に通知され、該搬出入手段では、該判断の結果に基づき該被加工物の該チャンバー内への搬入を制御する請求項2に記載のエッチング装置。
- 被加工物は半導体ウェーハであり、前記チャンバー内では研削後の半導体ウェーハの面をエッチングする請求項1、2または3に記載のエッチング装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004004044A JP4298523B2 (ja) | 2004-01-09 | 2004-01-09 | エッチング装置 |
US11/029,481 US20050150860A1 (en) | 2004-01-09 | 2005-01-06 | Etching apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004004044A JP4298523B2 (ja) | 2004-01-09 | 2004-01-09 | エッチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005197571A JP2005197571A (ja) | 2005-07-21 |
JP4298523B2 true JP4298523B2 (ja) | 2009-07-22 |
Family
ID=34737178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004004044A Expired - Lifetime JP4298523B2 (ja) | 2004-01-09 | 2004-01-09 | エッチング装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050150860A1 (ja) |
JP (1) | JP4298523B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4781833B2 (ja) * | 2006-02-01 | 2011-09-28 | 株式会社ディスコ | エッチング装置 |
JP5248038B2 (ja) * | 2007-05-22 | 2013-07-31 | 東京エレクトロン株式会社 | 載置台およびそれを用いたプラズマ処理装置 |
JP5918044B2 (ja) * | 2012-06-25 | 2016-05-18 | 株式会社ディスコ | 加工方法および加工装置 |
US9385017B2 (en) * | 2012-08-06 | 2016-07-05 | Nordson Corporation | Apparatus and methods for handling workpieces of different sizes |
TW201711077A (zh) * | 2015-09-04 | 2017-03-16 | 漢辰科技股份有限公司 | 電漿基礎處理系統及其運作方法 |
CN106611737B (zh) * | 2015-10-26 | 2020-11-10 | 北京北方华创微电子装备有限公司 | 一种压环装置 |
US10739671B2 (en) | 2017-11-10 | 2020-08-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing phase shift photo masks |
KR20200039861A (ko) * | 2018-10-05 | 2020-04-17 | 삼성전자주식회사 | 반도체 패키지 소잉 장치 |
JP7461118B2 (ja) * | 2019-08-19 | 2024-04-03 | 株式会社ディスコ | ウエーハの加工方法 |
CN117476519A (zh) * | 2023-11-17 | 2024-01-30 | 华天科技(昆山)电子有限公司 | 一种半导体Ring环料盒 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5589928A (en) * | 1994-09-01 | 1996-12-31 | The Boeing Company | Method and apparatus for measuring distance to a target |
US5796486A (en) * | 1997-03-31 | 1998-08-18 | Lam Research Corporation | Apparatus method for determining the presence or absence of a wafer on a wafer holder |
US6077387A (en) * | 1999-02-10 | 2000-06-20 | Stmicroelectronics, Inc. | Plasma emission detection for process control via fluorescent relay |
US6763281B2 (en) * | 1999-04-19 | 2004-07-13 | Applied Materials, Inc | Apparatus for alignment of automated workpiece handling systems |
US6164633A (en) * | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
US6592673B2 (en) * | 1999-05-27 | 2003-07-15 | Applied Materials, Inc. | Apparatus and method for detecting a presence or position of a substrate |
TW492100B (en) * | 2000-03-13 | 2002-06-21 | Disco Corp | Semiconductor wafer processing apparatus |
JP4754757B2 (ja) * | 2000-03-30 | 2011-08-24 | 東京エレクトロン株式会社 | 基板のプラズマ処理を調節するための方法、プラズマ処理システム、及び、電極組体 |
US6956196B2 (en) * | 2000-04-11 | 2005-10-18 | Oncology Automation, Inc. | Systems for maintaining the spatial position of an object and related methods |
JP2003100708A (ja) * | 2001-09-27 | 2003-04-04 | Mitsubishi Electric Corp | 終点判別方法、半導体処理装置および半導体装置の製造方法 |
-
2004
- 2004-01-09 JP JP2004004044A patent/JP4298523B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-06 US US11/029,481 patent/US20050150860A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20050150860A1 (en) | 2005-07-14 |
JP2005197571A (ja) | 2005-07-21 |
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