JP4295682B2 - 多層配線基板 - Google Patents

多層配線基板 Download PDF

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Publication number
JP4295682B2
JP4295682B2 JP2004190174A JP2004190174A JP4295682B2 JP 4295682 B2 JP4295682 B2 JP 4295682B2 JP 2004190174 A JP2004190174 A JP 2004190174A JP 2004190174 A JP2004190174 A JP 2004190174A JP 4295682 B2 JP4295682 B2 JP 4295682B2
Authority
JP
Japan
Prior art keywords
glass
vol
wiring board
ceramic mixed
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004190174A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006012687A (ja
Inventor
泰治 宮内
友宏 嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004190174A priority Critical patent/JP4295682B2/ja
Application filed by TDK Corp filed Critical TDK Corp
Priority to US11/166,367 priority patent/US7307032B2/en
Priority to KR1020050055797A priority patent/KR100930852B1/ko
Priority to EP05013812A priority patent/EP1612194B1/en
Priority to DE602005025285T priority patent/DE602005025285D1/de
Priority to CN 200510080911 priority patent/CN100561604C/zh
Priority to TW094121534A priority patent/TWI361800B/zh
Publication of JP2006012687A publication Critical patent/JP2006012687A/ja
Application granted granted Critical
Publication of JP4295682B2 publication Critical patent/JP4295682B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2004190174A 2004-06-28 2004-06-28 多層配線基板 Expired - Fee Related JP4295682B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004190174A JP4295682B2 (ja) 2004-06-28 2004-06-28 多層配線基板
KR1020050055797A KR100930852B1 (ko) 2004-06-28 2005-06-27 저온 소성 기판 재료 및 그것을 사용한 다층 배선 기판
EP05013812A EP1612194B1 (en) 2004-06-28 2005-06-27 Low-temperature co-fired ceramic material and multilayer wiring board using the same
DE602005025285T DE602005025285D1 (de) 2004-06-28 2005-06-27 Bei niedriger Temperatur simultan gebrannte Keramik und mehrschichtige Leiterplatte
US11/166,367 US7307032B2 (en) 2004-06-28 2005-06-27 Low-temperature co-fired ceramics material and multilayer wiring board using the same
CN 200510080911 CN100561604C (zh) 2004-06-28 2005-06-28 低温共烧陶瓷材料和使用该材料的多层配线板
TW094121534A TWI361800B (en) 2004-06-28 2005-06-28 Low-temperature co-fired ceramics material and multilayer wiring board using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004190174A JP4295682B2 (ja) 2004-06-28 2004-06-28 多層配線基板

Publications (2)

Publication Number Publication Date
JP2006012687A JP2006012687A (ja) 2006-01-12
JP4295682B2 true JP4295682B2 (ja) 2009-07-15

Family

ID=35779673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004190174A Expired - Fee Related JP4295682B2 (ja) 2004-06-28 2004-06-28 多層配線基板

Country Status (2)

Country Link
JP (1) JP4295682B2 (zh)
CN (1) CN100561604C (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4655715B2 (ja) * 2005-03-24 2011-03-23 Ｔｄｋ株式会社 低温焼成基板材料及びそれを用いた多層配線基板
EP1967504B1 (en) * 2006-10-24 2012-05-02 Murata Manufacturing Co. Ltd. Slurry composition for ceramic green sheet and method for producing the same, and multilayer ceramic electronic component and method for manufacturing the same
TWI424802B (zh) * 2007-02-20 2014-01-21 Hitachi Chemical Co Ltd Flexible multilayer wiring board
JP5590869B2 (ja) 2009-12-07 2014-09-17 新光電気工業株式会社 配線基板及びその製造方法並びに半導体パッケージ
JP5514559B2 (ja) 2010-01-12 2014-06-04 新光電気工業株式会社 配線基板及びその製造方法並びに半導体パッケージ
JP2011155149A (ja) * 2010-01-27 2011-08-11 Shinko Electric Ind Co Ltd 配線基板及びその製造方法並びに半導体パッケージ
JP5651040B2 (ja) * 2011-02-22 2015-01-07 日本電産サンキョー株式会社 センサユニットおよび複合基板
DE102012101606A1 (de) * 2011-10-28 2013-05-02 Epcos Ag ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED
JP6075481B2 (ja) * 2015-02-10 2017-02-08 Tdk株式会社 ガラスセラミックス組成物およびコイル電子部品
JP6724481B2 (ja) * 2016-03-30 2020-07-15 日立金属株式会社 セラミック基板及びその製造方法
CN106747357B (zh) * 2016-12-22 2019-12-06 广东风华高新科技股份有限公司 低温共烧陶瓷及其制备方法
JP7180689B2 (ja) * 2018-12-21 2022-11-30 株式会社村田製作所 積層体及び電子部品
CN109655194A (zh) * 2018-12-26 2019-04-19 联合汽车电子有限公司 压力传感器
CN112341178B (zh) * 2020-11-06 2023-04-21 南京工业大学 一种宽频低膨胀系数低温共烧玻璃复合陶瓷及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939106A (en) * 1987-08-31 1990-07-03 Tdk Corporation Sintered ceramic body
KR960006230B1 (ko) * 1991-08-09 1996-05-11 티디케이 가부시끼가이샤 고주파 유전체 재료와 공진기 및 그 제조방법
CN1197802C (zh) * 2002-09-18 2005-04-20 深圳南虹电子陶瓷有限公司 低温共烧低介电常数玻璃陶瓷材料
CN1309680C (zh) * 2003-07-09 2007-04-11 山东硅苑新材料科技股份有限公司 低温烧结复相耐磨陶瓷材料

Also Published As

Publication number Publication date
JP2006012687A (ja) 2006-01-12
CN1716459A (zh) 2006-01-04
CN100561604C (zh) 2009-11-18

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