JP4295682B2 - 多層配線基板 - Google Patents
多層配線基板 Download PDFInfo
- Publication number
- JP4295682B2 JP4295682B2 JP2004190174A JP2004190174A JP4295682B2 JP 4295682 B2 JP4295682 B2 JP 4295682B2 JP 2004190174 A JP2004190174 A JP 2004190174A JP 2004190174 A JP2004190174 A JP 2004190174A JP 4295682 B2 JP4295682 B2 JP 4295682B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- vol
- wiring board
- ceramic mixed
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Inorganic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004190174A JP4295682B2 (ja) | 2004-06-28 | 2004-06-28 | 多層配線基板 |
KR1020050055797A KR100930852B1 (ko) | 2004-06-28 | 2005-06-27 | 저온 소성 기판 재료 및 그것을 사용한 다층 배선 기판 |
EP05013812A EP1612194B1 (en) | 2004-06-28 | 2005-06-27 | Low-temperature co-fired ceramic material and multilayer wiring board using the same |
DE602005025285T DE602005025285D1 (de) | 2004-06-28 | 2005-06-27 | Bei niedriger Temperatur simultan gebrannte Keramik und mehrschichtige Leiterplatte |
US11/166,367 US7307032B2 (en) | 2004-06-28 | 2005-06-27 | Low-temperature co-fired ceramics material and multilayer wiring board using the same |
CN 200510080911 CN100561604C (zh) | 2004-06-28 | 2005-06-28 | 低温共烧陶瓷材料和使用该材料的多层配线板 |
TW094121534A TWI361800B (en) | 2004-06-28 | 2005-06-28 | Low-temperature co-fired ceramics material and multilayer wiring board using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004190174A JP4295682B2 (ja) | 2004-06-28 | 2004-06-28 | 多層配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006012687A JP2006012687A (ja) | 2006-01-12 |
JP4295682B2 true JP4295682B2 (ja) | 2009-07-15 |
Family
ID=35779673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004190174A Expired - Fee Related JP4295682B2 (ja) | 2004-06-28 | 2004-06-28 | 多層配線基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4295682B2 (zh) |
CN (1) | CN100561604C (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4655715B2 (ja) * | 2005-03-24 | 2011-03-23 | Tdk株式会社 | 低温焼成基板材料及びそれを用いた多層配線基板 |
EP1967504B1 (en) * | 2006-10-24 | 2012-05-02 | Murata Manufacturing Co. Ltd. | Slurry composition for ceramic green sheet and method for producing the same, and multilayer ceramic electronic component and method for manufacturing the same |
TWI424802B (zh) * | 2007-02-20 | 2014-01-21 | Hitachi Chemical Co Ltd | Flexible multilayer wiring board |
JP5590869B2 (ja) | 2009-12-07 | 2014-09-17 | 新光電気工業株式会社 | 配線基板及びその製造方法並びに半導体パッケージ |
JP5514559B2 (ja) | 2010-01-12 | 2014-06-04 | 新光電気工業株式会社 | 配線基板及びその製造方法並びに半導体パッケージ |
JP2011155149A (ja) * | 2010-01-27 | 2011-08-11 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法並びに半導体パッケージ |
JP5651040B2 (ja) * | 2011-02-22 | 2015-01-07 | 日本電産サンキョー株式会社 | センサユニットおよび複合基板 |
DE102012101606A1 (de) * | 2011-10-28 | 2013-05-02 | Epcos Ag | ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED |
JP6075481B2 (ja) * | 2015-02-10 | 2017-02-08 | Tdk株式会社 | ガラスセラミックス組成物およびコイル電子部品 |
JP6724481B2 (ja) * | 2016-03-30 | 2020-07-15 | 日立金属株式会社 | セラミック基板及びその製造方法 |
CN106747357B (zh) * | 2016-12-22 | 2019-12-06 | 广东风华高新科技股份有限公司 | 低温共烧陶瓷及其制备方法 |
JP7180689B2 (ja) * | 2018-12-21 | 2022-11-30 | 株式会社村田製作所 | 積層体及び電子部品 |
CN109655194A (zh) * | 2018-12-26 | 2019-04-19 | 联合汽车电子有限公司 | 压力传感器 |
CN112341178B (zh) * | 2020-11-06 | 2023-04-21 | 南京工业大学 | 一种宽频低膨胀系数低温共烧玻璃复合陶瓷及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4939106A (en) * | 1987-08-31 | 1990-07-03 | Tdk Corporation | Sintered ceramic body |
KR960006230B1 (ko) * | 1991-08-09 | 1996-05-11 | 티디케이 가부시끼가이샤 | 고주파 유전체 재료와 공진기 및 그 제조방법 |
CN1197802C (zh) * | 2002-09-18 | 2005-04-20 | 深圳南虹电子陶瓷有限公司 | 低温共烧低介电常数玻璃陶瓷材料 |
CN1309680C (zh) * | 2003-07-09 | 2007-04-11 | 山东硅苑新材料科技股份有限公司 | 低温烧结复相耐磨陶瓷材料 |
-
2004
- 2004-06-28 JP JP2004190174A patent/JP4295682B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-28 CN CN 200510080911 patent/CN100561604C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006012687A (ja) | 2006-01-12 |
CN1716459A (zh) | 2006-01-04 |
CN100561604C (zh) | 2009-11-18 |
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