JPWO2008126486A1 - セラミック基板およびその製造方法 - Google Patents
セラミック基板およびその製造方法 Download PDFInfo
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- JPWO2008126486A1 JPWO2008126486A1 JP2008538064A JP2008538064A JPWO2008126486A1 JP WO2008126486 A1 JPWO2008126486 A1 JP WO2008126486A1 JP 2008538064 A JP2008538064 A JP 2008538064A JP 2008538064 A JP2008538064 A JP 2008538064A JP WO2008126486 A1 JPWO2008126486 A1 JP WO2008126486A1
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- surface layer
- layer portion
- ceramic substrate
- inner layer
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- 239000000919 ceramic Substances 0.000 title claims abstract description 180
- 239000000758 substrate Substances 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000002344 surface layer Substances 0.000 claims abstract description 117
- 239000010410 layer Substances 0.000 claims abstract description 100
- 239000000203 mixture Substances 0.000 claims abstract description 91
- 239000004020 conductor Substances 0.000 claims abstract description 41
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 58
- 239000013078 crystal Substances 0.000 claims description 49
- 238000010304 firing Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 10
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- 239000011147 inorganic material Substances 0.000 claims description 9
- 238000001354 calcination Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 15
- 239000000126 substance Substances 0.000 abstract description 6
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 25
- 230000000694 effects Effects 0.000 description 8
- 238000010828 elution Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000001603 reducing effect Effects 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
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- 229910000679 solder Inorganic materials 0.000 description 2
- -1 BaCO 3 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
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- 239000003989 dielectric material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 235000021384 green leafy vegetables Nutrition 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/58—Forming a gradient in composition or in properties across the laminate or the joined articles
- C04B2237/582—Forming a gradient in composition or in properties across the laminate or the joined articles by joining layers or articles of the same composition but having different additives
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/249988—Of about the same composition as, and adjacent to, the void-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/24999—Inorganic
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
3 内層部
4,5 表層部
9 内部導体膜
10,11 外部導体膜
12 ビアホール導体
21 未焼成の積層構造体
23 未焼成の内層部
24,25 未焼成の表層部
Claims (11)
- BaをBaO換算で10〜40重量%、SiをSiO2換算で20〜65重量%、AlをAl2O3換算で6〜40重量%、BをB2O3換算で1〜15重量%、CrをCr2O3換算で0.3〜3重量%、ならびに、ZrをZrO2換算で1〜40重量%含む、誘電体セラミック組成物。
- さらに、Y、Ca、MgおよびSrの少なくとも1種を、それぞれ、Y2O3、CaO、MgOおよびSrOに換算して、0.1〜3重量%含む、請求項1に記載の誘電体セラミック組成物。
- 当該誘電体セラミック組成物の焼結体が、前記Zrを含むZrO2系結晶相として、正方晶ジルコニアを含む、請求項2に記載の誘電体セラミック組成物。
- 請求項1ないし3のいずれかに記載の誘電体セラミック組成物を焼結させてなる誘電体セラミック層を備える、セラミック基板。
- 表層部と内層部とからなる積層構造を有し、前記表層部および前記内層部は、SiO2系結晶相を含み、前記表層部における前記SiO2系結晶相の割合が、前記内層部における前記SiO2系結晶相の割合よりも少なくされ、それによって、前記表層部の熱膨張係数が前記内層部の熱膨張係数より小さくされた、セラミック基板であって、
前記表層部が請求項1ないし3のいずれかに記載の誘電体セラミック組成物の焼結体から構成される、
セラミック基板。 - 前記SiO2系結晶相は、クォーツおよび/またはクリストバライトである、請求項5に記載のセラミック基板。
- 前記表層部と前記内層部とは、前記SiO2系結晶相の割合を除き、互いに実質的に同組成の材料によって形成されている、請求項5または6に記載のセラミック基板。
- 当該セラミック基板の表面および/または内部に形成された、銀または銅を主成分とする導体パターンを備える、請求項4ないし7のいずれかに記載のセラミック基板。
- 第1の熱膨張係数を持つ表層部と前記第1の熱膨張係数より大きな第2の熱膨張係数を持つ内層部とからなる積層構造を有する、セラミック基板を製造する方法であって、
焼成されたとき前記表層部となる未焼成の表層部と、焼成されたとき前記内層部となる未焼成の内層部とからなる積層構造を有する、未焼成の積層構造体を作製する工程と、
前記未焼成の積層構造体を焼成する工程と
を備え、
前記未焼成の表層部および前記未焼成の内層部は、少なくともSiO2を含み、かつ、焼成されたとき、SiO2系結晶相を生成する材料を含み、焼成後において、前記表層部における前記SiO2系結晶相の割合は、前記内層部における前記SiO2系結晶相の割合よりも少なくなるようにされ、
前記未焼成の表層部は請求項1ないし3のいずれかに記載の誘電体セラミック組成物によって形成されている、
セラミック基板の製造方法。 - 前記未焼成の表層部に含まれるSiO2の割合は、前記未焼成の内層部に含まれるSiO2の割合よりも少ない、請求項9に記載のセラミック基板の製造方法。
- 前記未焼成の表層部と前記未焼成の内層部とは互いに実質的に同組成の材料によって形成されており、前記未焼成の表層部に含まれる無機材料を作製する際に適用される仮焼温度は、前記未焼成の内層部に含まれる無機材料を作製する際に適用される仮焼温度よりも高い、請求項9に記載の多層セラミック基板の製造方法。
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CN104589738A (zh) * | 2008-05-15 | 2015-05-06 | 株式会社村田制作所 | 多层陶瓷基板及其制造方法 |
WO2010092969A1 (ja) * | 2009-02-16 | 2010-08-19 | 株式会社村田製作所 | 低温焼結セラミック材料およびセラミック基板 |
JP5120406B2 (ja) * | 2010-03-31 | 2013-01-16 | Tdk株式会社 | セラミック電子部品及びセラミック電子部品の製造方法 |
US9801277B1 (en) | 2013-08-27 | 2017-10-24 | Flextronics Ap, Llc | Bellows interconnect |
US9659478B1 (en) | 2013-12-16 | 2017-05-23 | Multek Technologies, Ltd. | Wearable electronic stress and strain indicator |
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US10321560B2 (en) | 2015-11-12 | 2019-06-11 | Multek Technologies Limited | Dummy core plus plating resist restrict resin process and structure |
WO2017096167A1 (en) * | 2015-12-02 | 2017-06-08 | Multek Technologies Limited | Pcb hybrid redistribution layer |
WO2017122381A1 (ja) * | 2016-01-13 | 2017-07-20 | 株式会社村田製作所 | 積層体及び電子部品 |
US20170238416A1 (en) | 2016-02-17 | 2017-08-17 | Multek Technologies Limited | Dummy core restrict resin process and structure |
US9999134B2 (en) | 2016-03-14 | 2018-06-12 | Multek Technologies Limited | Self-decap cavity fabrication process and structure |
US10064292B2 (en) | 2016-03-21 | 2018-08-28 | Multek Technologies Limited | Recessed cavity in printed circuit board protected by LPI |
US10712398B1 (en) | 2016-06-21 | 2020-07-14 | Multek Technologies Limited | Measuring complex PCB-based interconnects in a production environment |
US10182494B1 (en) | 2017-09-07 | 2019-01-15 | Flex Ltd. | Landless via concept |
WO2020129858A1 (ja) * | 2018-12-20 | 2020-06-25 | 株式会社村田製作所 | 積層体、電子部品及び積層体の製造方法 |
JP7294827B2 (ja) * | 2019-02-22 | 2023-06-20 | 日本特殊陶業株式会社 | 電気検査用基板 |
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