JP4289961B2 - 位置決め装置 - Google Patents

位置決め装置 Download PDF

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Publication number
JP4289961B2
JP4289961B2 JP2003335641A JP2003335641A JP4289961B2 JP 4289961 B2 JP4289961 B2 JP 4289961B2 JP 2003335641 A JP2003335641 A JP 2003335641A JP 2003335641 A JP2003335641 A JP 2003335641A JP 4289961 B2 JP4289961 B2 JP 4289961B2
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JP
Japan
Prior art keywords
substrate
positioning
alignment
positioning reference
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003335641A
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English (en)
Japanese (ja)
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JP2005101455A5 (enExample
JP2005101455A (ja
Inventor
文昭 北山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003335641A priority Critical patent/JP4289961B2/ja
Priority to US10/947,284 priority patent/US7311738B2/en
Publication of JP2005101455A publication Critical patent/JP2005101455A/ja
Publication of JP2005101455A5 publication Critical patent/JP2005101455A5/ja
Application granted granted Critical
Publication of JP4289961B2 publication Critical patent/JP4289961B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003335641A 2003-09-26 2003-09-26 位置決め装置 Expired - Fee Related JP4289961B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003335641A JP4289961B2 (ja) 2003-09-26 2003-09-26 位置決め装置
US10/947,284 US7311738B2 (en) 2003-09-26 2004-09-23 Positioning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003335641A JP4289961B2 (ja) 2003-09-26 2003-09-26 位置決め装置

Publications (3)

Publication Number Publication Date
JP2005101455A JP2005101455A (ja) 2005-04-14
JP2005101455A5 JP2005101455A5 (enExample) 2007-03-22
JP4289961B2 true JP4289961B2 (ja) 2009-07-01

Family

ID=34462974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003335641A Expired - Fee Related JP4289961B2 (ja) 2003-09-26 2003-09-26 位置決め装置

Country Status (2)

Country Link
US (1) US7311738B2 (enExample)
JP (1) JP4289961B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4216263B2 (ja) * 2005-03-09 2009-01-28 シャープ株式会社 製造検査解析システム、および製造検査解析方法
US7342642B2 (en) * 2005-06-20 2008-03-11 Asml Netherlands B.V. Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method
JP4892225B2 (ja) * 2005-10-28 2012-03-07 株式会社日立ハイテクノロジーズ 真空処理方法、真空搬送装置および半導体処理装置
NL1036025A1 (nl) * 2007-10-10 2009-04-15 Asml Netherlands Bv Method of transferring a substrate, transfer system and lithographic projection apparatus.
EP2196857A3 (en) * 2008-12-09 2010-07-21 ASML Netherlands BV Lithographic apparatus and device manufacturing method
JP5316172B2 (ja) * 2009-04-02 2013-10-16 株式会社安川電機 ウェハ吸引パッド及びそれを備えたプリアライナ
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
JP5582152B2 (ja) 2012-02-03 2014-09-03 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
JP2013247235A (ja) * 2012-05-25 2013-12-09 Ulvac Japan Ltd 基板位置算出装置、基板位置算出方法、及び、基板位置算出プログラム
JP6465565B2 (ja) * 2014-05-19 2019-02-06 キヤノン株式会社 露光装置、位置合わせ方法およびデバイス製造方法
JP5858103B2 (ja) * 2014-07-16 2016-02-10 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
KR101757815B1 (ko) * 2015-09-25 2017-07-14 세메스 주식회사 기판 중심 검출 방법, 기판 반송 방법, 반송 유닛 및 이를 포함하는 기판 처리 장치.
US10386515B2 (en) * 2015-12-04 2019-08-20 Cgg Services Sas Method and apparatus for analyzing fractures using AVOAz inversion
CN108214965B (zh) * 2018-02-08 2024-03-12 常熟市创新陶瓷有限公司 大功率水泵轴叶轮定位平台的加工夹具及加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225012B1 (en) * 1994-02-22 2001-05-01 Nikon Corporation Method for positioning substrate
CN1244018C (zh) * 1996-11-28 2006-03-01 株式会社尼康 曝光方法和曝光装置
US6188467B1 (en) * 1997-06-13 2001-02-13 Canon Kabushiki Kaisha Method and apparatus for fabricating semiconductor devices
JPH1116806A (ja) 1997-06-20 1999-01-22 Toshiba Corp プリアライメントサーチを含む位置合わせ方法
EP0973069A3 (en) * 1998-07-14 2006-10-04 Nova Measuring Instruments Limited Monitoring apparatus and method particularly useful in photolithographically processing substrates
TW527526B (en) * 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
EP1258834B1 (en) * 2001-05-14 2004-12-29 Infineon Technologies AG Method for performing an alignment measurement of two patterns in different layers on a semiconductor wafer

Also Published As

Publication number Publication date
US7311738B2 (en) 2007-12-25
US20050095116A1 (en) 2005-05-05
JP2005101455A (ja) 2005-04-14

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