JP4272507B2 - 多数個取り配線基板 - Google Patents
多数個取り配線基板 Download PDFInfo
- Publication number
- JP4272507B2 JP4272507B2 JP2003428252A JP2003428252A JP4272507B2 JP 4272507 B2 JP4272507 B2 JP 4272507B2 JP 2003428252 A JP2003428252 A JP 2003428252A JP 2003428252 A JP2003428252 A JP 2003428252A JP 4272507 B2 JP4272507 B2 JP 4272507B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- plating
- conductor
- wiring
- conduction pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 104
- 238000007747 plating Methods 0.000 claims description 96
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
2・・・配線基板領域
3・・・捨て代領域
4・・・めっき導通用パターン
5・・・配線導体
5a・・・貫通導体
7・・・分割線
Claims (3)
- 複数の絶縁層が積層されて成る絶縁基体に複数の配線基板領域が縦横に配列形成されているとともに、前記配線基板領域に形成された配線導体に電解めっき法によりめっき層を被着させるためのめっき導通用パターンが形成されている多数個取り配線基板であって、前記配線導体は、一部の前記絶縁層に前記配線基板領域の分割線を跨って形成された貫通穴の内周面に形成された貫通導体を含んでおり、前記めっき導通用パターンは、前記貫通導体が形成されていない前記絶縁層の表面に前記分割線と交差して形成されていることを特徴とする多数個取り配線基板。
- 前記めっき導通用パターンは、前記分割線と斜めに交差していることを特徴とする請求項1記載の多数個取り配線基板。
- 前記めっき導通用パターンは、前記分割線との交差部において幅が狭くなっていることを特徴とする請求項1または請求項2記載の多数個取り配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003428252A JP4272507B2 (ja) | 2003-12-24 | 2003-12-24 | 多数個取り配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003428252A JP4272507B2 (ja) | 2003-12-24 | 2003-12-24 | 多数個取り配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005191141A JP2005191141A (ja) | 2005-07-14 |
JP4272507B2 true JP4272507B2 (ja) | 2009-06-03 |
Family
ID=34787316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003428252A Expired - Fee Related JP4272507B2 (ja) | 2003-12-24 | 2003-12-24 | 多数個取り配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4272507B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4699941B2 (ja) * | 2006-05-17 | 2011-06-15 | 株式会社住友金属エレクトロデバイス | 電子部品収納用セラミックパッケージ |
JP4775160B2 (ja) * | 2006-07-31 | 2011-09-21 | エプソントヨコム株式会社 | シート状基板母材及び電子デバイス |
JP5235627B2 (ja) * | 2008-08-21 | 2013-07-10 | 京セラ株式会社 | 多数個取り配線基板 |
JP5295807B2 (ja) * | 2009-02-07 | 2013-09-18 | 日本特殊陶業株式会社 | 配線基板多数個取り用の母基板 |
JP2015115489A (ja) * | 2013-12-12 | 2015-06-22 | 京セラ株式会社 | 多数個取り配線基板および配線基板 |
-
2003
- 2003-12-24 JP JP2003428252A patent/JP4272507B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
---|---|
JP2005191141A (ja) | 2005-07-14 |
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