JP4262267B2 - モールド、インプリント装置及びデバイスの製造方法 - Google Patents

モールド、インプリント装置及びデバイスの製造方法 Download PDF

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Publication number
JP4262267B2
JP4262267B2 JP2006194266A JP2006194266A JP4262267B2 JP 4262267 B2 JP4262267 B2 JP 4262267B2 JP 2006194266 A JP2006194266 A JP 2006194266A JP 2006194266 A JP2006194266 A JP 2006194266A JP 4262267 B2 JP4262267 B2 JP 4262267B2
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JP
Japan
Prior art keywords
mold
surface layer
pattern
resin
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006194266A
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English (en)
Japanese (ja)
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JP2007103914A (ja
JP2007103914A5 (enExample
Inventor
敦則 寺崎
淳一 関
信人 末平
秀樹 稲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006194266A priority Critical patent/JP4262267B2/ja
Priority to US11/468,862 priority patent/US20070090574A1/en
Publication of JP2007103914A publication Critical patent/JP2007103914A/ja
Publication of JP2007103914A5 publication Critical patent/JP2007103914A5/ja
Application granted granted Critical
Publication of JP4262267B2 publication Critical patent/JP4262267B2/ja
Priority to US13/094,354 priority patent/US8568639B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Thermal Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2006194266A 2005-09-06 2006-07-14 モールド、インプリント装置及びデバイスの製造方法 Expired - Fee Related JP4262267B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006194266A JP4262267B2 (ja) 2005-09-06 2006-07-14 モールド、インプリント装置及びデバイスの製造方法
US11/468,862 US20070090574A1 (en) 2005-09-06 2006-08-31 Mold and imprint apparatus
US13/094,354 US8568639B2 (en) 2005-09-06 2011-04-26 Process for producing a device using a mold

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005257394 2005-09-06
JP2006194266A JP4262267B2 (ja) 2005-09-06 2006-07-14 モールド、インプリント装置及びデバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2007103914A JP2007103914A (ja) 2007-04-19
JP2007103914A5 JP2007103914A5 (enExample) 2009-02-26
JP4262267B2 true JP4262267B2 (ja) 2009-05-13

Family

ID=37984612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006194266A Expired - Fee Related JP4262267B2 (ja) 2005-09-06 2006-07-14 モールド、インプリント装置及びデバイスの製造方法

Country Status (2)

Country Link
US (2) US20070090574A1 (enExample)
JP (1) JP4262267B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7687007B2 (en) * 2002-06-20 2010-03-30 Obducat Ab Mold for nano imprinting
JP4330168B2 (ja) * 2005-09-06 2009-09-16 キヤノン株式会社 モールド、インプリント方法、及びチップの製造方法
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
US7690910B2 (en) * 2006-02-01 2010-04-06 Canon Kabushiki Kaisha Mold for imprint, process for producing minute structure using the mold, and process for producing the mold
JP4872373B2 (ja) * 2006-02-15 2012-02-08 株式会社日立製作所 部位選択的に修飾された微細構造体およびその製造方法
KR100831046B1 (ko) * 2006-09-13 2008-05-21 삼성전자주식회사 나노 임프린트용 몰드 및 그 제조 방법
JP4862033B2 (ja) * 2007-12-19 2012-01-25 旭化成株式会社 光吸収性を有するモールド、該モールドを利用する感光性樹脂のパターン形成方法、及び印刷版の製造方法
JP5899931B2 (ja) * 2012-01-06 2016-04-06 大日本印刷株式会社 ナノインプリント用テンプレート及びその製造方法
JP2014120584A (ja) * 2012-12-14 2014-06-30 Toshiba Corp インプリント用マスクの洗浄方法
TW201438863A (zh) * 2013-04-10 2014-10-16 Hon Hai Prec Ind Co Ltd 模仁及其製作方法
JP5944436B2 (ja) * 2014-05-29 2016-07-05 大日本印刷株式会社 パターンの形成方法およびテンプレートの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3231165B2 (ja) * 1993-11-15 2001-11-19 キヤノン株式会社 光学素子成形用型及びその製造方法
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
KR100295518B1 (ko) * 1997-02-25 2001-11-30 아끼구사 나오유끼 질화실리콘층의에칭방법및반도체장치의제조방법
US6671034B1 (en) * 1998-04-30 2003-12-30 Ebara Corporation Microfabrication of pattern imprinting
EP1303792B1 (en) * 2000-07-16 2012-10-03 Board Of Regents, The University Of Texas System High-resolution overlay alignement methods and systems for imprint lithography
JP3907504B2 (ja) 2002-03-14 2007-04-18 三菱電機株式会社 半導体装置の製造方法および半導体装置製造用モールド
US7037639B2 (en) * 2002-05-01 2006-05-02 Molecular Imprints, Inc. Methods of manufacturing a lithography template
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
US7083880B2 (en) * 2002-08-15 2006-08-01 Freescale Semiconductor, Inc. Lithographic template and method of formation and use
US6916511B2 (en) 2002-10-24 2005-07-12 Hewlett-Packard Development Company, L.P. Method of hardening a nano-imprinting stamp
JP4036820B2 (ja) * 2002-12-18 2008-01-23 インターナショナル・ビジネス・マシーンズ・コーポレーション サブ波長構造体の製造
US8069782B2 (en) * 2004-12-20 2011-12-06 Nanoink, Inc. Stamps with micrometer- and nanometer-scale features and methods of fabrication thereof
US7767129B2 (en) * 2005-05-11 2010-08-03 Micron Technology, Inc. Imprint templates for imprint lithography, and methods of patterning a plurality of substrates
JP4330168B2 (ja) 2005-09-06 2009-09-16 キヤノン株式会社 モールド、インプリント方法、及びチップの製造方法
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
US7690910B2 (en) 2006-02-01 2010-04-06 Canon Kabushiki Kaisha Mold for imprint, process for producing minute structure using the mold, and process for producing the mold

Also Published As

Publication number Publication date
JP2007103914A (ja) 2007-04-19
US8568639B2 (en) 2013-10-29
US20070090574A1 (en) 2007-04-26
US20110198783A1 (en) 2011-08-18

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