JP4257816B2 - 廃液回収機構付ウェーハ表面処理装置 - Google Patents

廃液回収機構付ウェーハ表面処理装置 Download PDF

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Publication number
JP4257816B2
JP4257816B2 JP2000073307A JP2000073307A JP4257816B2 JP 4257816 B2 JP4257816 B2 JP 4257816B2 JP 2000073307 A JP2000073307 A JP 2000073307A JP 2000073307 A JP2000073307 A JP 2000073307A JP 4257816 B2 JP4257816 B2 JP 4257816B2
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JP
Japan
Prior art keywords
wafer
rotating disk
waste liquid
medium
liquid recovery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000073307A
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English (en)
Japanese (ja)
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JP2001267278A (ja
JP2001267278A5 (https=
Inventor
正人 土屋
俊一 小笠原
秀幸 室岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mimasu Semiconductor Industry Co Ltd
Original Assignee
Mimasu Semiconductor Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimasu Semiconductor Industry Co Ltd filed Critical Mimasu Semiconductor Industry Co Ltd
Priority to JP2000073307A priority Critical patent/JP4257816B2/ja
Priority to TW089113882A priority patent/TW504776B/zh
Priority to SG200004814A priority patent/SG93257A1/en
Priority to SG200204723-1A priority patent/SG138436A1/en
Priority to US09/650,367 priority patent/US6672318B1/en
Priority to EP00119294A priority patent/EP1083589B1/en
Priority to ES00119294T priority patent/ES2394942T3/es
Publication of JP2001267278A publication Critical patent/JP2001267278A/ja
Priority to US10/700,546 priority patent/US6810888B2/en
Publication of JP2001267278A5 publication Critical patent/JP2001267278A5/ja
Application granted granted Critical
Publication of JP4257816B2 publication Critical patent/JP4257816B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2000073307A 1999-09-09 2000-03-16 廃液回収機構付ウェーハ表面処理装置 Expired - Lifetime JP4257816B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000073307A JP4257816B2 (ja) 2000-03-16 2000-03-16 廃液回収機構付ウェーハ表面処理装置
TW089113882A TW504776B (en) 1999-09-09 2000-07-12 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
SG200204723-1A SG138436A1 (en) 1999-09-09 2000-08-25 Wafer surface treatment apparatus
SG200004814A SG93257A1 (en) 1999-09-09 2000-08-25 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
US09/650,367 US6672318B1 (en) 1999-09-09 2000-08-29 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
EP00119294A EP1083589B1 (en) 1999-09-09 2000-09-06 Wafer rotary holding apparatus
ES00119294T ES2394942T3 (es) 1999-09-09 2000-09-06 Aparato de sujeción rotatoria de oblea
US10/700,546 US6810888B2 (en) 1999-09-09 2003-11-05 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000073307A JP4257816B2 (ja) 2000-03-16 2000-03-16 廃液回収機構付ウェーハ表面処理装置

Publications (3)

Publication Number Publication Date
JP2001267278A JP2001267278A (ja) 2001-09-28
JP2001267278A5 JP2001267278A5 (https=) 2007-01-25
JP4257816B2 true JP4257816B2 (ja) 2009-04-22

Family

ID=18591567

Family Applications (1)

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JP2000073307A Expired - Lifetime JP4257816B2 (ja) 1999-09-09 2000-03-16 廃液回収機構付ウェーハ表面処理装置

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Country Link
JP (1) JP4257816B2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017183402A1 (ja) 2016-04-21 2017-10-26 三益半導体工業株式会社 回転テーブル用非接触電力供給機構及び方法並びにウェーハ回転保持装置
US10818538B2 (en) 2016-05-24 2020-10-27 Mimasu Semiconductor Industry Co., Ltd. Wafer holding mechanism for rotary table and method and wafer rotating and holding device
US11056362B2 (en) 2016-05-26 2021-07-06 Mimasu Semiconductor Industry Co., Ltd. Wafer heating and holding mechanism and method for rotary table, and wafer rotating and holding device

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3734154B2 (ja) * 2001-07-11 2006-01-11 東京エレクトロン株式会社 液処理装置及びその方法
WO2004070807A1 (ja) * 2003-02-03 2004-08-19 Personal Creation Ltd. 基板の処理装置及び基板の処理方法
JP4293830B2 (ja) * 2003-05-12 2009-07-08 葵精機株式会社 基板処理装置およびその処理方法
KR100752246B1 (ko) 2005-03-31 2007-08-29 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
JP4504859B2 (ja) * 2005-03-31 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP4791068B2 (ja) * 2005-03-31 2011-10-12 大日本スクリーン製造株式会社 基板処理装置
JP4692785B2 (ja) * 2005-04-01 2011-06-01 エフエスアイ インターナショナル インコーポレイテッド 一つ又はそれ以上の処理流体を用いた、半導体ウエハー又は他のマイクロエレクトロニクス用の基板に使用されるツール用の移動かつ入れ子化できる、コンパクトなダクトシステム
JP4676272B2 (ja) * 2005-07-26 2011-04-27 株式会社 エイ・エス・エイ・ピイ 基板処理装置
KR100637719B1 (ko) 2005-10-05 2006-10-25 세메스 주식회사 기판 처리 장치
US8387635B2 (en) 2006-07-07 2013-03-05 Tel Fsi, Inc. Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
KR100757911B1 (ko) 2006-08-22 2007-09-12 (주)이노맥스 웨이퍼의 액처리장치
JP4938892B2 (ja) 2007-08-07 2012-05-23 エフエスアイ インターナショナル インコーポレーテッド 一種類以上の処理流体により超小型電子半製品をプロセス処理すべく使用されるツールにおける隔壁板およびベンチュリ状封じ込めシステムのための洗浄方法および関連装置
CN102683249B (zh) 2008-05-09 2015-06-17 泰尔Fsi公司 用于处理微电子工件的系统
JP5084639B2 (ja) * 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
KR101592058B1 (ko) * 2010-06-03 2016-02-05 도쿄엘렉트론가부시키가이샤 기판 액처리 장치
JP5242632B2 (ja) * 2010-06-03 2013-07-24 東京エレクトロン株式会社 基板液処理装置
JP2011254019A (ja) * 2010-06-03 2011-12-15 Tokyo Electron Ltd 基板液処理装置
TWM505052U (zh) * 2015-01-22 2015-07-11 Scientech Corp 流體製程處理裝置
JP6799409B2 (ja) * 2016-07-25 2020-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI638394B (zh) 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
KR102174762B1 (ko) * 2018-11-28 2020-11-05 세메스 주식회사 기판 처리 장치
CN115973995B (zh) * 2022-12-16 2025-07-22 浙江大学 一种成像芯片批量表面处理、分区功能化的装置及方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017183402A1 (ja) 2016-04-21 2017-10-26 三益半導体工業株式会社 回転テーブル用非接触電力供給機構及び方法並びにウェーハ回転保持装置
US10679862B2 (en) 2016-04-21 2020-06-09 Mimasu Semiconductor Industry Co., Ltd. Contactless electric power supply mechanism and method for rotary table, and wafer rotating and holding device
US10818538B2 (en) 2016-05-24 2020-10-27 Mimasu Semiconductor Industry Co., Ltd. Wafer holding mechanism for rotary table and method and wafer rotating and holding device
US11056362B2 (en) 2016-05-26 2021-07-06 Mimasu Semiconductor Industry Co., Ltd. Wafer heating and holding mechanism and method for rotary table, and wafer rotating and holding device

Also Published As

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