JP4257106B2 - 感光性樹脂組成物及びその使用 - Google Patents

感光性樹脂組成物及びその使用 Download PDF

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Publication number
JP4257106B2
JP4257106B2 JP2002354335A JP2002354335A JP4257106B2 JP 4257106 B2 JP4257106 B2 JP 4257106B2 JP 2002354335 A JP2002354335 A JP 2002354335A JP 2002354335 A JP2002354335 A JP 2002354335A JP 4257106 B2 JP4257106 B2 JP 4257106B2
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Japan
Prior art keywords
photosensitive resin
mass
resin composition
resist pattern
substrate
Prior art date
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Expired - Lifetime
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JP2002354335A
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English (en)
Japanese (ja)
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JP2004184878A (ja
JP2004184878A5 (enExample
Inventor
徹 森
輝彦 足立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
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Asahi Kasei EMD Corp
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Priority to JP2002354335A priority Critical patent/JP4257106B2/ja
Publication of JP2004184878A publication Critical patent/JP2004184878A/ja
Publication of JP2004184878A5 publication Critical patent/JP2004184878A5/ja
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Publication of JP4257106B2 publication Critical patent/JP4257106B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
JP2002354335A 2002-12-05 2002-12-05 感光性樹脂組成物及びその使用 Expired - Lifetime JP4257106B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002354335A JP4257106B2 (ja) 2002-12-05 2002-12-05 感光性樹脂組成物及びその使用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002354335A JP4257106B2 (ja) 2002-12-05 2002-12-05 感光性樹脂組成物及びその使用

Publications (3)

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JP2004184878A JP2004184878A (ja) 2004-07-02
JP2004184878A5 JP2004184878A5 (enExample) 2006-01-12
JP4257106B2 true JP4257106B2 (ja) 2009-04-22

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JP2002354335A Expired - Lifetime JP4257106B2 (ja) 2002-12-05 2002-12-05 感光性樹脂組成物及びその使用

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JP (1) JP4257106B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4578269B2 (ja) * 2005-02-23 2010-11-10 旭化成イーマテリアルズ株式会社 光重合性樹脂組成物
JP2006251458A (ja) * 2005-03-11 2006-09-21 Asahi Kasei Electronics Co Ltd 長尺状の感光性樹脂付き積層板
JP4655726B2 (ja) * 2005-04-01 2011-03-23 Jsr株式会社 ネガ型感放射線性樹脂組成物
WO2006129469A1 (ja) * 2005-05-30 2006-12-07 Hitachi Chemical Company, Ltd. 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2007026520A1 (ja) * 2005-08-30 2007-03-08 Jsr Corporation 感放射線性樹脂組成物およびメッキ造形物の製造方法
JP4614858B2 (ja) * 2005-10-05 2011-01-19 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその積層体
JP4749305B2 (ja) * 2005-10-05 2011-08-17 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体
JP4788716B2 (ja) 2005-10-25 2011-10-05 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR101036784B1 (ko) * 2006-05-09 2011-05-25 아사히 가세이 일렉트로닉스 가부시끼가이샤 감광성 수지 조성물
JP2011202127A (ja) * 2010-03-26 2011-10-13 Asahi Kasei E-Materials Corp 感光性樹脂組成物及び硬化物
WO2016104585A1 (ja) * 2014-12-25 2016-06-30 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法

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