JP4225781B2 - 担体から担体の一部を取り除くための方法 - Google Patents

担体から担体の一部を取り除くための方法 Download PDF

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Publication number
JP4225781B2
JP4225781B2 JP2002561272A JP2002561272A JP4225781B2 JP 4225781 B2 JP4225781 B2 JP 4225781B2 JP 2002561272 A JP2002561272 A JP 2002561272A JP 2002561272 A JP2002561272 A JP 2002561272A JP 4225781 B2 JP4225781 B2 JP 4225781B2
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JP
Japan
Prior art keywords
carrier
cutting
separation
cutting element
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002561272A
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English (en)
Japanese (ja)
Other versions
JP2004520712A (ja
JP2004520712A5 (enExample
Inventor
ウィルヘルマス ヴァン ダレン アドリアナス
ヨセフ ヴァン エグモンド ヘンリ
Original Assignee
フィーコ ビー．ブイ．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1017215A external-priority patent/NL1017215C2/nl
Priority claimed from NL1018511A external-priority patent/NL1018511C2/nl
Application filed by フィーコ ビー．ブイ． filed Critical フィーコ ビー．ブイ．
Publication of JP2004520712A publication Critical patent/JP2004520712A/ja
Publication of JP2004520712A5 publication Critical patent/JP2004520712A5/ja
Application granted granted Critical
Publication of JP4225781B2 publication Critical patent/JP4225781B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y10T29/515—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means to trim electric component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0207—Other than completely through work thickness or through work presented
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9447—Shear type

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2002561272A 2001-01-29 2002-01-29 担体から担体の一部を取り除くための方法 Expired - Fee Related JP4225781B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1017215A NL1017215C2 (nl) 2001-01-29 2001-01-29 Werkwijze en inrichting voor het uit een drager verwijderen van een draagdeel.
NL1018511A NL1018511C2 (nl) 2001-07-11 2001-07-11 Werkwijze en inrichting voor het met een enkele bewerking uit een drager verwijderen van een dragerdeel, en een uit een drager verwijderd product.
PCT/NL2002/000068 WO2002061822A1 (en) 2001-01-29 2002-01-29 Method and apparatus for removing a carrier part from a carrier, and a product removed from a carrier

Publications (3)

Publication Number Publication Date
JP2004520712A JP2004520712A (ja) 2004-07-08
JP2004520712A5 JP2004520712A5 (enExample) 2005-06-23
JP4225781B2 true JP4225781B2 (ja) 2009-02-18

Family

ID=26643289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002561272A Expired - Fee Related JP4225781B2 (ja) 2001-01-29 2002-01-29 担体から担体の一部を取り除くための方法

Country Status (5)

Country Link
US (1) US7162906B2 (enExample)
EP (1) EP1358672A1 (enExample)
JP (1) JP4225781B2 (enExample)
KR (2) KR20040010582A (enExample)
WO (1) WO2002061822A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051911B2 (en) * 2001-12-21 2006-05-30 Eastman Kodak Company Apparatus and method for cutting sheet materials
JP4899864B2 (ja) * 2004-04-09 2012-03-21 トヨタ紡織株式会社 せん断加工装置
ES2850150T3 (es) * 2007-05-25 2021-08-25 Magna Int Inc Componente de chapa de metal
JP5383255B2 (ja) * 2009-02-27 2014-01-08 日本発條株式会社 板材の切断方法、板材の切断装置、ヘッドサスペンション及び板材の積層品
DE102016201433A1 (de) * 2016-02-01 2017-08-03 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Bearbeiten und/oder Herstellen eines Bauteils

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1434190A (en) * 1921-04-08 1922-10-31 Automatic Machinery & Equipmen Process of coining and dies therefor
DE1169404B (de) * 1959-09-02 1964-05-06 Kienzle Apparate Gmbh Werkzeug zum Stanzschneiden von Blech
US3656379A (en) * 1969-10-22 1972-04-18 Vandervell Products Ltd Methods of cutting laminated strip material
DE2526318A1 (de) 1975-06-12 1976-12-23 Siemens Ag Metallischer zwischentraeger zur halterung und kontaktierung eines halbleiterkoerpers
US4362902A (en) * 1981-03-27 1982-12-07 Amp Incorporated Ceramic chip carrier
JPS5890750A (ja) 1982-11-15 1983-05-30 Hitachi Ltd リ−ドフレ−ムの製法
JPH065758A (ja) 1992-06-19 1994-01-14 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体装置の製造装置
US5458158A (en) * 1993-03-30 1995-10-17 Toyo Communication Equipment Co., Ltd. Lead cutting apparatus and an anticorrosive coat structure of lead
JPH0722554A (ja) 1993-06-30 1995-01-24 Dainippon Printing Co Ltd 薄板のトリミング装置およびその方法
JP2586352B2 (ja) 1995-01-26 1997-02-26 日本電気株式会社 半導体装置用リード切断装置
JPH09223706A (ja) 1996-02-15 1997-08-26 Sony Corp 半導体製造方法およびその製造装置
JPH09307046A (ja) 1996-05-15 1997-11-28 Nec Corp 金型及び該金型を用いたタイバ−切断方法
JP3110413B2 (ja) 1999-01-20 2000-11-20 広島日本電気株式会社 半導体装置用リード切断装置
US6401510B1 (en) * 1999-04-07 2002-06-11 3M Innovative Properties Company Method for stamping a part from a multi-layered strip

Also Published As

Publication number Publication date
KR20040010582A (ko) 2004-01-31
US7162906B2 (en) 2007-01-16
KR20080064207A (ko) 2008-07-08
EP1358672A1 (en) 2003-11-05
US20040074353A1 (en) 2004-04-22
WO2002061822A1 (en) 2002-08-08
JP2004520712A (ja) 2004-07-08
KR100909117B1 (ko) 2009-07-23

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