JP4225781B2 - 担体から担体の一部を取り除くための方法 - Google Patents

担体から担体の一部を取り除くための方法 Download PDF

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Publication number
JP4225781B2
JP4225781B2 JP2002561272A JP2002561272A JP4225781B2 JP 4225781 B2 JP4225781 B2 JP 4225781B2 JP 2002561272 A JP2002561272 A JP 2002561272A JP 2002561272 A JP2002561272 A JP 2002561272A JP 4225781 B2 JP4225781 B2 JP 4225781B2
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JP
Japan
Prior art keywords
carrier
cutting
separation
cutting element
housing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002561272A
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English (en)
Japanese (ja)
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JP2004520712A5 (enExample
JP2004520712A (ja
Inventor
ウィルヘルマス ヴァン ダレン アドリアナス
ヨセフ ヴァン エグモンド ヘンリ
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フィーコ ビー．ブイ．
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Publication date
Priority claimed from NL1017215A external-priority patent/NL1017215C2/nl
Priority claimed from NL1018511A external-priority patent/NL1018511C2/nl
Application filed by フィーコ ビー．ブイ． filed Critical フィーコ ビー．ブイ．
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Publication of JP2004520712A5 publication Critical patent/JP2004520712A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y10T29/515—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means to trim electric component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0207—Other than completely through work thickness or through work presented
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9447—Shear type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2002561272A 2001-01-29 2002-01-29 担体から担体の一部を取り除くための方法 Expired - Fee Related JP4225781B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1017215A NL1017215C2 (nl) 2001-01-29 2001-01-29 Werkwijze en inrichting voor het uit een drager verwijderen van een draagdeel.
NL1018511A NL1018511C2 (nl) 2001-07-11 2001-07-11 Werkwijze en inrichting voor het met een enkele bewerking uit een drager verwijderen van een dragerdeel, en een uit een drager verwijderd product.
PCT/NL2002/000068 WO2002061822A1 (en) 2001-01-29 2002-01-29 Method and apparatus for removing a carrier part from a carrier, and a product removed from a carrier

Publications (3)

Publication Number Publication Date
JP2004520712A JP2004520712A (ja) 2004-07-08
JP2004520712A5 JP2004520712A5 (enExample) 2005-06-23
JP4225781B2 true JP4225781B2 (ja) 2009-02-18

Family

ID=26643289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002561272A Expired - Fee Related JP4225781B2 (ja) 2001-01-29 2002-01-29 担体から担体の一部を取り除くための方法

Country Status (5)

Country Link
US (1) US7162906B2 (enExample)
EP (1) EP1358672A1 (enExample)
JP (1) JP4225781B2 (enExample)
KR (2) KR100909117B1 (enExample)
WO (1) WO2002061822A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051911B2 (en) * 2001-12-21 2006-05-30 Eastman Kodak Company Apparatus and method for cutting sheet materials
WO2005097373A1 (ja) * 2004-04-09 2005-10-20 Toyota Boshoku Kabushiki Kaisha せん断加工装置
WO2008144893A1 (en) * 2007-05-25 2008-12-04 Magna International Inc. Integrated die trim and method
JP5383255B2 (ja) * 2009-02-27 2014-01-08 日本発條株式会社 板材の切断方法、板材の切断装置、ヘッドサスペンション及び板材の積層品
DE102016201433A1 (de) * 2016-02-01 2017-08-03 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Bearbeiten und/oder Herstellen eines Bauteils

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1434190A (en) * 1921-04-08 1922-10-31 Automatic Machinery & Equipmen Process of coining and dies therefor
DE1169404B (de) * 1959-09-02 1964-05-06 Kienzle Apparate Gmbh Werkzeug zum Stanzschneiden von Blech
US3656379A (en) * 1969-10-22 1972-04-18 Vandervell Products Ltd Methods of cutting laminated strip material
DE2526318A1 (de) 1975-06-12 1976-12-23 Siemens Ag Metallischer zwischentraeger zur halterung und kontaktierung eines halbleiterkoerpers
US4362902A (en) * 1981-03-27 1982-12-07 Amp Incorporated Ceramic chip carrier
JPS5890750A (ja) 1982-11-15 1983-05-30 Hitachi Ltd リ−ドフレ−ムの製法
JPH065758A (ja) 1992-06-19 1994-01-14 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体装置の製造装置
US5458158A (en) * 1993-03-30 1995-10-17 Toyo Communication Equipment Co., Ltd. Lead cutting apparatus and an anticorrosive coat structure of lead
JPH0722554A (ja) 1993-06-30 1995-01-24 Dainippon Printing Co Ltd 薄板のトリミング装置およびその方法
JP2586352B2 (ja) 1995-01-26 1997-02-26 日本電気株式会社 半導体装置用リード切断装置
JPH09223706A (ja) 1996-02-15 1997-08-26 Sony Corp 半導体製造方法およびその製造装置
JPH09307046A (ja) 1996-05-15 1997-11-28 Nec Corp 金型及び該金型を用いたタイバ−切断方法
JP3110413B2 (ja) 1999-01-20 2000-11-20 広島日本電気株式会社 半導体装置用リード切断装置
US6401510B1 (en) * 1999-04-07 2002-06-11 3M Innovative Properties Company Method for stamping a part from a multi-layered strip

Also Published As

Publication number Publication date
KR100909117B1 (ko) 2009-07-23
EP1358672A1 (en) 2003-11-05
JP2004520712A (ja) 2004-07-08
KR20080064207A (ko) 2008-07-08
KR20040010582A (ko) 2004-01-31
US20040074353A1 (en) 2004-04-22
US7162906B2 (en) 2007-01-16
WO2002061822A1 (en) 2002-08-08

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