TWI286784B - Method and device for separating a carrier part from a carrier - Google Patents

Method and device for separating a carrier part from a carrier Download PDF

Info

Publication number
TWI286784B
TWI286784B TW90104840A TW90104840A TWI286784B TW I286784 B TWI286784 B TW I286784B TW 90104840 A TW90104840 A TW 90104840A TW 90104840 A TW90104840 A TW 90104840A TW I286784 B TWI286784 B TW I286784B
Authority
TW
Taiwan
Prior art keywords
carrier
cutting
cutting plate
separating
score line
Prior art date
Application number
TW90104840A
Other languages
Chinese (zh)
Inventor
Dalen Adrianus Wilhelmus Van
Egmond Henri Joseph Van
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Application granted granted Critical
Publication of TWI286784B publication Critical patent/TWI286784B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention relates to a method for separating from a carrier a carrier part with a housing arranged thereon, wherein prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separating edge to be arranged. The invention also relates to a device for performing this method mechanically.

Description

1286784 A7 -----B7__ 五、發明說明(7 ) 板必須具有非常有限的接觸面大小之複雜的形式。這樣將 會降低此類切割板工具的壽命,且將造成載體材料的損傷 。另一個現有製程的缺點是在分離的過程中,介於切割板 和切割構件間必須保持很有限的間距以獲得良好的切割結 果(小於或等於0.01 mm)。由於除了這些缺點之外,現 有的封裝材料的顆粒(特別是矽的顆粒)彼此間有限的距 離將加速切割板及切割構件的磨耗。 本發明的主要目的是改進分離製程的結果,其中特別 是減少在製程元件中的破裂,且毛邊的形成將會較少或是 較不具有阻礙。 爲達到此目的,本發明提供一個從載體移除在其上有 殼體佈置的載體部份的方法,其中在執行分離操作之前, 至少在載體的一側上,沿著要排置分離邊緣之長度的至少 一部份中配置一條刻痕線。刻痕線的安排係在載體以及封 裝材料中必須安排分離邊界的位置處製造一條弱化線。此 結果將使以較少的力量來執行實際的分離成爲可能,而且 可精確地界定分離邊緣的邊界。藉此方式封裝材料產生裂 痕的危險亦可消除。另一個顯著的優點是,可能於分離過 程中形成的毛邊將不會相對於被分離的載體部份之平坦側 邊突出。毛邊會在未被以刻痕線定義之分離邊緣部份的位 置處形成。結果毛邊將不會在鄰近於載體部份之平坦側邊 形成;畢竟分離邊緣會藉由刻痕線形成於該處。 刻痕線的安排以刻痕工具壓入載體的方式較佳,其中 刻痕線的深度小於載體的厚度。更佳的方式,是在載體要 4 (請先閱讀背面之注意事項再填寫本頁) 訂---------Φ— 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 1286784 A7 B7 五、發明說明(,) 安排有分離邊緣的位置上的兩側上安排刻痕線。以刻痕工 具將一刻痕線壓入載體是一個非常簡單的操作。刻痕工具 的形式決定製成之刻痕線的形式。當安排刻痕線時,僅需 注意刻痕線欲到達的深度。當在載體兩側安排有刻痕線時 ,對於材料的弱化更是有加強的效果。而附帶的好處是刻 痕線的定位可更精確的予以界定。 在一個更爲較佳的實施例中,分離製程是以接合在載 體一側的切割構件以及接合在載體相對的另一側之切割板 來執行的,如此在執行分離製程時之切割構件與切割板相 互間的距離可較一般製程中切割構件與切割板相互間的距 離來的大,例如至少爲0.025 mm,較佳地爲〇·〇4 mm。因 爲分離邊緣的位置是以刻痕線來界定載體較大的部份,因 此切割構件與切割板相互間的距離可較先前技術來得大而 不會產生問題。其結果爲將可減少因爲使用切割構件與切 割板的磨耗。此結果將使該切割構件與切割板的使用壽命 延長。 本發明亦提供了一個從載體移除其上有封裝佈置的載 體部份之裝置,其包含:用於定位載體的機構以及一個切 割板與一個可相對於切割板移動的切割構件,本裝置的特 徵是亦包含一個刻痕機構以用來將刻痕線配置在載體的至 少一側邊,該刻痕線的位置是在之後載體要被分離的邊緣 上。在本裝置中,刻痕機構最好與驅動機構結合,以使得 刻痕機構相對於一可放置在該裝置中的載體移動。以現有 的分離裝置僅需作有限的調整便可使它適用於本發明所述 5 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) ------訂—--------— 經濟部智慧財產局員工消費合作社印製 1286784 A7 ______B7____ 五、發明說明(> ) 之方法。上述的優點僅需投入少量的投資即可達成;只要 配置具有選擇性的分離驅動構件的刻痕構件便已足夠。 爲了在載體的兩側邊中安排刻痕線,刻痕機構可包含 至少二個可相對於彼此移動的刻痕構件,用以接合在載體 相對的兩側邊。因而刻痕線可在短時間內配置於載體兩側 邊’而不須將刻痕機構從載體的一側移到另一側。在一較 佳的實施例中,刻痕機構由包含至少一個有著尖銳刻痕邊 緣的刻痕構件所組成。 爲了簡化分離裝置的構造,用於載體定位的機構是由 切割板形成。因此切割板達到雙重的功能,不需要分離定 位機構。刻痕機構的位置可藉由控制機構來加以控制,例 如一個自動化的控制。 附圖之簡略說明 本發明將更進一步以不受實施例制限的基礎,根據下 列之圖例來闡明。在此: 圖1所示爲載體的一部分之側視圖,在其中,係在執 行一分離操作; 圖2a和2b所示爲根據習知技術在執行分離操作前之 一載體的一部份之橫切面側視圖,其中,在該載體上係配 置有一殼體; 圖2c和2d所示爲根據習知技術在執行分離操作後之 一載體的部份之橫切面側視圖,其中,在該載體上係配置 有一殼體,如圖2a和2b所示; 6 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -------訂---------— 經濟部智慧財產局員工消費合作社印製 1286784 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 A7 B7 五、發明說明(<) 圖3a所示爲一具有殼體配置於其上之載體的一部份之 橫切面側視圖,其係在執行形成部份本發明之製程步驟之 前,其中,在該載體上係安置有一刻痕線; 圖3b和3c所示爲一具有殻體配置於其上之載體的一 部份之橫切面側視圖,如圖3a所示,其係在執行根據本發 明之最後的製程步驟; 圖3d和k所示爲一具有彀體配置於其上之載體的一 部份之橫切面側視圖,如圖3b和3C廿μ —-士η ~ &所不,其係在執行根 據本發明的製程步驟之後。 元件符號說明 1載體 2殼體 3金屬軌帶 4居中空間 5切割板 6刀具 7間隙 8毛邊 9裂痕 11刻痕邊緣 12間隙 13裂痕 14毛邊 -----------Awl -------訂---------—^wi (請先閱讀背面之注意事項再填寫本頁) 1286784 經濟部智慧財產局員工消費合作社印製 A7 ____Β7_ 五、發明說明(b ) 較佳實施例之詳細說明 圖1所示爲一載體1的橫切面側視圖,在其上安置有 一殻體2。載體1爲複合型且含有金屬軌帶3,居中的空間 4在製作殼體2期間以環氧樹脂塡充。遠離殼體2之載體1 的側邊並非完全平坦,此部份在以液態環氧樹脂補充期間 通常均會以薄片層予以包覆。所示型式的載體1尤其是應 用在生產所謂的“無引線封裝(leadless package) ”。 圖2a所示爲與圖1所示之橫切面相垂直的載體1和殼 體2的橫切面。以習知技術,係從環繞在欲分離部份的載 體1之剩餘部份來分離載體1的一部份,載體1是放置在 切割板5上。在本圖中所示橫切面僅有載體1之金屬軌帶 3。金屬軌帶3支撐在切割板5上。一可移動刀具6位於距 切割板較遠之載體1的一側邊。一個狹窄間隙7位於切割 板5與刀具6之間。圖2b所示爲載體1與殼體2之橫切面 ,其平行於圖2a所示之橫切面,其中係表示一以環氧樹脂 所塡充的載體1之居中空間4。可淸楚的看到,載體1之 以環氧樹脂塡充的居中空間4並未支撐在切割板5上,而 是位於距該切割板5 —些距離處。在此可看到一有限部份 的金屬軌帶3。 圖2c所示爲如圖2a所示之載體1和殼體2的視圖, 然而在此圖中所示爲已根據先前技術執行過分離製程的結 果。現存方法的缺點是在已分離的金屬軌帶3底面可能會 產生一突出於金屬軌帶3下方的毛邊8。毛邊8使得已分 8 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -------訂·--------— 1286784 A7 B7 五、發明說明(q) 離製品的下一製程更加困難。如圖2d所示,以環氧樹脂塡 充的居中空間4在分離製程期間,因無切割板5的支撐, 可能會開始出現(極細微線條之)裂痕9的危險。如此之 裂痕9因會使一分離的產品使用壽命縮短且使得分離的產 品的尺寸難以控制等等而爲不希望發生者。 圖3a所示爲根據本發明分離一產品之製程步驟。載體 1之金屬軌帶3和以環氧樹脂塡充的居中空間4均藉由刻 痕構件(“刻痕衝頭”)而具有刻痕邊緣11。由於刻痕 邊緣11的存在使得最後的分離操作不需那麼的嚴謹,且介 於切割板5與刀具6之間的間隙12大小可以較先前技術所 需之間隙7來的大。這樣的好處是切割板5與刀具6之使 用壽命皆可增加。由於以環氧樹脂塡充的居中空間4 ’當 刻痕已被配置時,裂痕13通常已經形成於較脆的環氧樹脂 中。因此,在此之最後的分離操作亦不需過於嚴謹。 圖3d所示爲如圖3b所示之載體1和殼體2的視圖’ 然而在此爲在執行根據先前技術的分離操作之後。先前技 術之突出於分離的金屬軌帶3底面的毛邊8的缺點已經消 除,其中一毛邊14將形成於距金屬軌帶3的一平坦側邊一 段距離處。圖最後所示爲如圖3c所示之載體1和殼體 2的視圖,然而在此爲在執行先前技術的分離操作之後° 由於裂痕13已在以環氧樹脂塡充的居中空間4中產生’最 後的分離操作將不會產生如圖2d所示之裂痕9的結果° 9 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) I----- 訂--------- f 經濟部智慧財產局員工消費合作社印製1286784 A7 -----B7__ V. INSTRUCTIONS (7) The board must have a very limited form of contact surface size. This will reduce the life of such cutting board tools and will result in damage to the carrier material. Another disadvantage of the prior art process is that during the separation process, a very limited spacing between the cutting plate and the cutting member must be maintained to achieve good cutting results (less than or equal to 0.01 mm). In addition to these disadvantages, the limited distance between the particles of the existing encapsulating material (especially the crucible particles) will accelerate the wear of the cutting plate and the cutting member. The primary object of the present invention is to improve the results of the separation process wherein, in particular, cracking in the process elements is reduced and the formation of burrs will be less or less obstructive. To achieve this object, the present invention provides a method of removing a carrier portion having a housing arrangement thereon from a carrier, wherein at least one side of the carrier is disposed along the side of the separation before the separation operation is performed A score line is placed in at least a portion of the length. The scoring line arrangement creates a line of weakness at the location where the carrier and the encapsulating material must be separated. This result will make it possible to perform the actual separation with less force and to precisely define the boundaries of the separated edges. In this way, the risk of cracking of the encapsulating material can also be eliminated. Another significant advantage is that the burrs that may form during the separation process will not protrude relative to the flat sides of the separated carrier portion. The burrs are formed at locations that are not separated by the score line. As a result, the burrs will not form adjacent to the flat sides of the carrier portion; after all, the separation edges will be formed there by the score lines. The arrangement of the score lines is preferably carried out by means of a scoring tool pressed into the carrier, wherein the depth of the score line is less than the thickness of the carrier. A better way is to use the carrier 4 (please read the note on the back and then fill out this page). Order---------Φ- Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperative, Print this paper scale for China National Standard (CNS) A4 Specification (210 X 297 mm) 1286784 A7 B7 V. INSTRUCTIONS (,) Arrange the score lines on both sides of the position where the separated edges are arranged. Pressing a score line into the carrier with a nicking tool is a very simple operation. The form of the scoring tool determines the form of the score line that is made. When arranging the score line, just pay attention to the depth to which the score line is to be reached. When the score line is arranged on both sides of the carrier, the weakening of the material is more enhanced. The added benefit is that the positioning of the score line can be more precisely defined. In a more preferred embodiment, the separating process is performed by a cutting member joined to one side of the carrier and a cutting plate joined to the opposite side of the carrier, such that the cutting member and the cutting are performed during the separation process The distance between the plates may be greater than the distance between the cutting member and the cutting plate in the general process, for example at least 0.025 mm, preferably 〇·〇 4 mm. Since the position of the separation edge is a larger portion of the carrier defined by the score line, the distance between the cutting member and the cutting plate can be made larger than in the prior art without causing problems. As a result, wear due to the use of the cutting member and the cutting plate can be reduced. This result will extend the life of the cutting member and the cutting plate. The present invention also provides an apparatus for removing a carrier portion having a package arrangement thereon from a carrier, comprising: a mechanism for positioning the carrier and a cutting plate and a cutting member movable relative to the cutting plate, the device The feature is also comprised of a scoring mechanism for arranging the score line on at least one side of the carrier, the location of the score line being on the edge after which the carrier is to be separated. In the present device, the scoring mechanism is preferably coupled to the drive mechanism to move the scoring mechanism relative to a carrier that can be placed in the device. With the existing separation device, only a limited adjustment is required to make it suitable for the five paper sizes of the present invention applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the note on the back first) Fill in this page) ------Booking --------------- Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1267884 A7 ______B7____ Five, invention instructions (>) method. The above advantages can be achieved with only a small investment; it is sufficient to configure a scoring member with a selective separation drive member. To arrange the score line in the sides of the carrier, the score mechanism can include at least two score members movable relative to each other for engaging opposite sides of the carrier. Thus, the score line can be disposed on both sides of the carrier in a short time without moving the scoring mechanism from one side of the carrier to the other side. In a preferred embodiment, the scoring mechanism is comprised of at least one score member having sharply scored edges. In order to simplify the construction of the separating device, the mechanism for positioning the carrier is formed by a cutting plate. Therefore, the cutting plate achieves a dual function and does not require a separate positioning mechanism. The position of the scoring mechanism can be controlled by a control mechanism, such as an automated control. BRIEF DESCRIPTION OF THE DRAWINGS The invention will be further elucidated on the basis of the following examples, which are not limited by the embodiments. Herein: Figure 1 shows a side view of a portion of the carrier in which a separation operation is performed; Figures 2a and 2b show a portion of a carrier prior to performing the separation operation in accordance with conventional techniques. a side view of a cut surface in which a housing is disposed on the carrier; and Figures 2c and 2d are cross-sectional side views of a portion of the carrier after performing the separating operation according to the prior art, wherein the carrier is on the carrier It is equipped with a casing, as shown in Figures 2a and 2b; 6 This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill in this page) --- ----订---------- Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1267884 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 B7 V. Invention description (<) Figure 3a A cross-sectional side view of a portion of a carrier having a housing disposed thereon prior to performing a portion of the process steps of forming the present invention, wherein a score line is disposed on the carrier; Figure 3b And 3c are shown as having a housing configured A cross-sectional side view of a portion of the upper carrier, as shown in Figure 3a, is performed in accordance with the final process steps of the present invention; Figures 3d and k show a carrier having a cartridge disposed thereon. A cross-sectional side view of a portion, as shown in Figures 3b and 3C, is performed after the execution of the process steps in accordance with the present invention. Component symbol description 1 carrier 2 housing 3 metal rail belt 4 centered space 5 cutting board 6 cutter 7 gap 8 burrs 9 cracks 11 nicks edge 12 gap 13 cracks 14 burrs ----------- Awl -- -----Order----------^wi (Please read the notes on the back and fill out this page) 1286784 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 ____Β7_ V. Invention description (b DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Figure 1 shows a cross-sectional side view of a carrier 1 with a housing 2 disposed thereon. The carrier 1 is of a composite type and contains a metal rail 3, and the centered space 4 is filled with epoxy resin during the production of the casing 2. The side of the carrier 1 remote from the housing 2 is not completely flat, and this portion is usually covered with a laminar layer during replenishment with liquid epoxy resin. The carrier 1 of the type shown is especially useful in the production of so-called "leadless packages". Figure 2a shows the cross section of the carrier 1 and the housing 2 perpendicular to the cross section shown in Figure 1. In the prior art, a portion of the carrier 1 is separated from the remainder of the carrier 1 surrounding the portion to be separated, and the carrier 1 is placed on the cutting plate 5. The cross section shown in this figure has only the metal rail 3 of the carrier 1. The metal rail belt 3 is supported on the cutting board 5. A movable cutter 6 is located on one side of the carrier 1 which is further away from the cutting plate. A narrow gap 7 is located between the cutting plate 5 and the cutter 6. Figure 2b shows a cross-section of the carrier 1 and the housing 2, which is parallel to the cross-section shown in Figure 2a, which shows a central space 4 of the carrier 1 filled with epoxy resin. It can be clearly seen that the intermediate space 4 of the carrier 1 which is filled with epoxy resin is not supported on the cutting board 5, but is located at a distance from the cutting board 5. A limited portion of the metal rail strip 3 can be seen here. Figure 2c shows a view of the carrier 1 and the housing 2 as shown in Figure 2a, however the results of the separation process that has been performed according to the prior art are shown in this figure. A disadvantage of the existing method is that a burr 8 protruding below the metal rail strip 3 may be produced on the bottom surface of the separated metal rail strip 3. The burr 8 makes it suitable for the Chinese National Standard (CNS) A4 specification (210 X 297 mm) in 8 paper sizes (please read the notes on the back and fill out this page) -------Book·--- -----— 1286784 A7 B7 V. INSTRUCTIONS (q) The next process of leaving the product is more difficult. As shown in Fig. 2d, during the separation process, the centered space 4 filled with epoxy resin may start to appear (very fine lines) of cracks 9 due to the support of the cutting board 5. Such a crack 9 is undesirable because it shortens the service life of a separate product and makes the size of the separated product difficult to control and the like. Figure 3a shows the process steps for separating a product in accordance with the present invention. The metal rail 3 of the carrier 1 and the centered space 4 filled with epoxy resin each have a scored edge 11 by a score member ("scratch punch"). Due to the presence of the scored edge 11, the final separation operation does not need to be as rigorous, and the gap 12 between the cutting plate 5 and the cutter 6 can be as large as the gap 7 required by the prior art. This has the advantage that the service life of the cutting plate 5 and the tool 6 can be increased. The crack 13 is usually already formed in the brittle epoxy resin due to the centered space 4' filled with epoxy resin when the score has been configured. Therefore, the final separation operation at this time does not need to be too strict. Figure 3d shows a view of the carrier 1 and the housing 2 as shown in Figure 3b'. However, here after performing the separation operation according to the prior art. The disadvantages of the prior art that protruded from the burrs 8 of the bottom surface of the separated metal rail strip 3 have been eliminated, wherein a burr 14 will be formed at a distance from a flat side of the metal rail strip 3. The figure at the end shows a view of the carrier 1 and the housing 2 as shown in Fig. 3c, but here after performing the separation operation of the prior art, since the crack 13 has been produced in the centered space 4 filled with epoxy resin. 'The final separation operation will not produce the result of the crack 9 as shown in Figure 2d. ° This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill in the form) This page) I----- Order--------- f Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing

Claims (1)

1286784 六、申請專利範圍 B8 C8 D81286784 VI. Patent application scope B8 C8 D8 ι·一種用於從載體處分離在其上配置有殻體的載體部 份之方法,該方法包含有以下的步驟: (a) 以一個切割板支撐該載體,該切割板係接合在該 載體的一第一側邊上; (b) 將該載體的一第二側邊與一個切割構件相接合; (c) 在該部份的至少一個側邊上而沿著一分離邊緣之 至少一部份長度,將一刻痕線配置在該部份中到達一個小 於該部份厚度的深度; (d) 前述的刻痕線係被配置到一個深度,該深度係使 得刻痕線能夠將該載體前述第一側邊上之表面高度的任何 差異變平(leveling),藉以藉著在步驟(a)中的切割板 產生平均的支撐;以及 (e) 進行一個分離操作。 2·如申請專利範圍第1項的方法,其中,該刻痕線係 藉由將刻痕工具壓入載體來配置。 3.如申請專利範圍第1或2項的方法,其中,刻痕線 保配置在載體上將要配置分離邊緣之位置的二側邊上。 4·如申請專利範圍第1或2項的方法,其中,分離製 程是以接合在載體一側邊的切割構件以及接合在載體相對 另一側邊的切割板來執行,使得在執行分離操作期間,切 割構件與切割板相互間的距離就可較一般製程之切割構件 與切割板之間的距離來的大。 5· —種用於從載體處分離其上配置有殼體的載體部份 之裝置,該裝置其包含有: ^纸張Λ度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 線丨编 B8C8D8 1286784 六、申請專利範圍 -用於定位該載體的機構; -一切割板和一可相對於該切割板移動的切割構件; 以及 -刻痕機構,用來在要在之後配置一分離邊緣的位置 處將刻痕線配置在該部份至少的一側邊上而到達一個小於 該部份厚度的深度,其中,該刻痕線係將該載體被該切割 板所支撐的側邊上的高度差異變平(levels),以及其中切 割板及切割構件可以在該分離邊緣的相對側邊上移動。 6·如申請專利範圍第5項所述的裝置,其中,該刻痕 機構係與驅動機構結合,用來將刻痕機構相對於一可放置 在該裝置中的載體移動。 7.如申請專利範圍第5或6項所述的裝置,其中,刻 痕機構包含至少兩個可相對於彼此移動的刻痕機構,用以 接合在一載體相對的二側邊。 8·如申請專利範圍第5或6項所述的裝置,其中,該 刻痕機構包含至少一具有尖銳刻痕邊緣的刻痕機構。 9·如申請專利範圍第5或6項所述的裝置,其中,甩 於定位載體的機構是由切割板形成。 1〇·如申請專利範圍第5或6項所述的裝置,其中, 該裝置係具有控制刻痕機構位置的控制機構。 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 線」ι. A method for separating a carrier portion on which a housing is disposed from a carrier, the method comprising the steps of: (a) supporting the carrier with a cutting plate, the cutting plate being bonded to the carrier (b) engaging a second side of the carrier with a cutting member; (c) at least one side of the portion along at least one side of the separating edge a length, a score line is disposed in the portion to a depth less than the thickness of the portion; (d) the aforementioned score line is configured to a depth such that the score line enables the carrier to be Any difference in surface height on the first side is leveling, whereby an average support is produced by the cutting plate in step (a); and (e) a separation operation is performed. 2. The method of claim 1, wherein the score line is configured by pressing a scoring tool into the carrier. 3. The method of claim 1 or 2, wherein the score line is disposed on the carrier on the two sides of the position where the separation edge is to be disposed. 4. The method of claim 1 or 2, wherein the separating process is performed by a cutting member joined to one side of the carrier and a cutting plate joined to the opposite side of the carrier, so that during the performing the separating operation The distance between the cutting member and the cutting plate can be larger than the distance between the cutting member and the cutting plate of the general process. 5. A device for separating a carrier portion on which a housing is disposed from a carrier, the device comprising: ^ Paper temperature applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back and fill out this page.) Ordering B8C8D8 1286784 VI. Patent application scope - mechanism for positioning the carrier; - a cutting board and a cutting member movable relative to the cutting board; And a scoring mechanism for arranging the score line on at least one side of the portion at a position to be disposed after a separate edge to reach a depth less than the thickness of the portion, wherein the score The wire system flattens the height difference on the side of the carrier supported by the cutting plate, and wherein the cutting plate and the cutting member are movable on opposite sides of the separating edge. 6. The device of claim 5, wherein the scoring mechanism is coupled to a drive mechanism for moving the scoring mechanism relative to a carrier that can be placed in the device. 7. The device of claim 5, wherein the scoring mechanism comprises at least two scoring mechanisms movable relative to one another for engaging opposite sides of a carrier. 8. The device of claim 5, wherein the scoring mechanism comprises at least one scoring mechanism having sharply scored edges. 9. The device of claim 5, wherein the mechanism for positioning the carrier is formed by a cutting plate. The device of claim 5, wherein the device has a control mechanism for controlling the position of the scoring mechanism. This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page).
TW90104840A 2001-01-29 2001-03-02 Method and device for separating a carrier part from a carrier TWI286784B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1017215A NL1017215C2 (en) 2001-01-29 2001-01-29 Carrier part from carrier removing apparatus and method involves arranging notched line in carrier on at least one side of carrier along part of length of separating edge prior to performing separating operation

Publications (1)

Publication Number Publication Date
TWI286784B true TWI286784B (en) 2007-09-11

Family

ID=19772810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90104840A TWI286784B (en) 2001-01-29 2001-03-02 Method and device for separating a carrier part from a carrier

Country Status (2)

Country Link
NL (1) NL1017215C2 (en)
TW (1) TWI286784B (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2526318A1 (en) * 1975-06-12 1976-12-23 Siemens Ag Semiconductor contacting metal intermediate support - containing holding strips each with breaking point with min. cross section
JPS5890750A (en) * 1982-11-15 1983-05-30 Hitachi Ltd Preparation of lead frame
JPH065758A (en) * 1992-06-19 1994-01-14 Mitsubishi Electric Corp Method and apparatus for fabricating semiconductor device
JPH0722554A (en) * 1993-06-30 1995-01-24 Dainippon Printing Co Ltd Apparatus and method of trimming of thin plate
JPH09223706A (en) * 1996-02-15 1997-08-26 Sony Corp Manufacture of semiconductor and its manufacturing equipment
JPH09307046A (en) * 1996-05-15 1997-11-28 Nec Corp Molding die and tie-bar cutting method using molding die

Also Published As

Publication number Publication date
NL1017215C2 (en) 2002-07-30

Similar Documents

Publication Publication Date Title
JP2003529521A (en) Method for producing small glass sheet and large glass sheet as semi-finished product for producing small glass sheet
JPH02218598A (en) Releasing device for punched chip in paperware punching device
TWI286784B (en) Method and device for separating a carrier part from a carrier
TW548666B (en) Apparatus and method for laminating blank, and method for manufacturing laminated ceramic electronic part
JP4379807B2 (en) Method and apparatus for cutting and separating glass plate
KR100909117B1 (en) Method and apparatus for removing a carrier part from a carrier, and a aproduct removed from a carrier
JP5048441B2 (en) Lead molding apparatus and semiconductor device manufacturing method
JP2987080B2 (en) Ejection device for punching waste in paper cutting machine
JP2004520712A5 (en)
JPH0831498B2 (en) Method and apparatus for forming external lead of device
JP2609214B2 (en) Circuit board dividing method and circuit board dividing mold
JP2786983B2 (en) Ejection device for punching waste in paper cutting machine
TW508685B (en) Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrier
JP2669763B2 (en) Lead frame tie bar cutting device
JP2987082B2 (en) Ejection device for punching waste in paper cutting machine
JP4439563B2 (en) Mold for shaving, manufacturing method of processed plate, and manufacturing method of product plate
JP2003165096A (en) Punching device for ceramic green sheet
JP3744783B2 (en) Shape processing mold equipment
JP3285390B2 (en) Cutting method of micro joint and structure of micro joint
JP4600797B2 (en) Electronic component lead cutting device
JP4493322B2 (en) Manufacturing method of electronic component package
JPS60186009A (en) Projection forming device of laminated core
JP2003136489A (en) Cutting device of film substrate
JPH0947997A (en) Removing-to-outside device for punching chip for carton punching device and material sheet punched by the removing-to-outside device
JP2004273599A (en) Mounting construction of reinforcement plate in flexible circuit board

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent