JP4493322B2 - Manufacturing method of electronic component package - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component package, and more particularly to an electronic component package manufacturing method corresponding to downsizing.

  In recent years, there has been a strong demand for miniaturization of the external size of electronic components mounted on electronic devices. For example, a piezoelectric vibrator, which is one of electronic components, has a size of several millimeters square and a thickness of 1 mm or less. The invention is disclosed.

  For such an electronic component, a rectangular package formed of an insulating material such as ceramics is used. An example of a method for manufacturing such a package is shown in FIGS. FIG. 3 is a process diagram illustrating a process for producing a conventional package. FIG. 4 is a perspective view showing the form of the insulating material in step b2 in FIG. In FIGS. 3 to 4, a part of the structure is not shown and the dimensions are partially exaggerated for the sake of clarity. In addition, the thickness dimension of each part is shown in a deformed form for easy understanding of the explanation.

  That is, in the step (b1) shown in FIG. 3, a plurality of recesses 32 and a plurality of element connection electrodes on the bottom surface in the recesses 32 are provided at predetermined positions on the main surface on the front side of the plate-like insulating material 31. The pads 33 and a plurality of external connection electrode pads 34 including those electrically connected to the element connection electrode pads 33 are formed at predetermined positions on the main surface on the back side of the insulating material 31. .

  Next, in the step (b2), the adhesive sheet 35 is covered on the back side main surface of the insulating material 31 from the external connection electrode pad 34 on the back side main surface of the insulating material 31 on which the external connection electrode pads 34 are formed. Is pasted.

  Next, in steps (b3) and (b4), only the insulating material 31 is cut by the rotary blade 37 along the cutting line 36 from the front main surface side of the insulating material 31 in which the recesses 32 are formed, and the desired shape is formed. A plurality of electronic component packages 30 are formed. In addition, since the adhesive sheet 35 is not cut | disconnected, the package for electronic components does not fall apart individually.

  Next, in the step (b5), the package 30 is washed with pure water, a cleaning agent, or the like, with fine cutting powder generated during cutting or a remaining lubricant. In particular, since the inside of the recess 32 is a part where an electronic element is mounted in a later process, sufficient cleaning is required.

  The following literature is disclosed about the manufacturing method of the above electronic component packages.

JP-A-7-212454

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  In the above-described conventional manufacturing method, the cutting powder of the insulating material or lubricant generated at the time of cutting scatters and adheres to the surface of the package including the inside of the recess, and a process of cleaning the package after cutting is necessary for the removal. It is said.

  However, as electronic components have become smaller and the external dimensions of electronic component packages are several mm or less in length and width and 1 mm or less in thickness, it has become difficult to clean the package after cutting. . In particular, in the cleaning of the recesses formed in the package, since the outer shape of the recesses themselves is small, the cutting powder that has entered the corners of the recesses, etc., is completely cleaned by a cleaning machine that supports conventional size packages. It is difficult to do. Therefore, cleaning may be incomplete and cutting powder or the like may remain in the recess, and this cutting powder may adhere to the electronic element mounted in the recess in a later step, which may adversely affect the characteristics of the electronic element. There is.

  In addition, when a cleaning machine capable of precise cleaning corresponding to a small package is introduced, there is a problem that the manufacturing cost of the package becomes high.

The present invention has been made to solve the above-described problems. A recess space is formed inside a package formed of an insulating material, and an element connection electrode pad is formed on the inner bottom surface of the recess. In the method of manufacturing a package for an electronic component in which a plurality of external connection electrode pads including those electrically connected to the element connection electrode pads are formed on the outer bottom surface of the package, A plurality of recesses at a predetermined location on one main surface of the material, an element connection electrode pad on the bottom surface in the recess, and an element connection electrode pad and an electrical connection at a predetermined location on the other main surface of the insulating material Forming a plurality of external connection electrode pads including those connected to each other, and an insulating material in which the plurality of formed recesses are opened in a state in which no electronic element is mounted in each recess The entire surface of one of the main surfaces A process of attaching an adhesive sheet or an adhesive tape and an insulating material from the other main surface side where the external connection electrode pad is formed, by cutting only the insulating material at a predetermined cutting position into a plurality of electronic component packages And a step of separating the electronic component package.

  In the method for manufacturing an electronic component package of the present invention, an adhesive sheet or an adhesive tape is attached to the main surface on the opening side of the recess, and further, cutting is performed from the main surface on the side where the adhesive sheet or adhesive tape is not attached. Therefore, the cutting powder and lubricant generated at the time of cutting do not scatter and enter the recess, so that the step of precisely cleaning the recess is not necessary. Furthermore, since cutting powder or the like does not enter the recess, cutting powder remaining in the recess due to incomplete cleaning is less likely to cause problems in the characteristics of the electronic device mounted in the recess in a later process. Become. In addition, since the package cleaning portion in the cleaning step performed after the cutting step is mainly a flat portion on the back side of the package, it can be sufficiently cleaned even with a conventional cleaning machine.

  Therefore, according to the method for manufacturing an electronic component package of the present invention, there are significant effects in improving the reliability of the characteristics of electronic components using the package, improving the yield due to the reduction of defective products, and further suppressing the increase in manufacturing cost.

Hereinafter, an embodiment of a method for manufacturing an electronic component package according to the present invention will be described with reference to the drawings.
FIG. 1 is a process diagram showing an embodiment of a part of an electronic component package manufacturing process according to the present invention. FIG. 2 is a perspective view showing the insulating material in the step (a2) from an oblique upper part among the steps shown in FIG. In FIG. 1 and FIG. 2, a part of the structure is not shown and a part of the dimensions is exaggerated for clarity of explanation. The thickness dimension of each part is shown in a particularly deformed form to facilitate understanding of the present invention. Furthermore, in the following description, in order to simplify the description, the description is made with the upper side of the paper in FIG.

  That is, in the step (a1) shown in FIG. 1, a predetermined place on the main surface that is the back side of the plate-like insulating material 11 (formed when cut into individual electronic component packages in the subsequent steps, A plurality of recesses 12, a plurality of element connection electrode pads 13 on the bottom surface in the recess 12, and a predetermined location on the main surface on the front side of the insulating material 11 (in a later step) Four external connection electrode pads 14 including those electrically connected to the element connection electrode pads 33 are formed in the vicinity of the four corners formed when the individual packages are cut. Yes.

  Next, in the step (a2), an ultraviolet curable adhesive tape 15 is attached to the back main surface of the insulating material 11 in which the opening of the recess 12 is formed so as to cover the entire back main surface of the insulating material 11. . FIG. 2 is a perspective view of the insulating material 11 with the ultraviolet curable adhesive tape 15 attached thereto. The actual UV curable adhesive tape has a thickness of several hundreds of μm or less.

  Next, in steps (a3) and (a4), only the insulating material 11 is precisely cut by the rotary blade 17 along the cutting line 16 from the front main surface of the insulating material 11 on which the external connection electrode pad 14 is formed. A plurality of rectangular electronic component packages 10 are formed. At this time, the cutting powder generated at the time of cutting and the lubricant used at the time of cutting adhere to the front side of the insulating material 11 (corresponding to the external bottom surface as the electronic component package 10), but UV curable adhesive It does not enter the surface of the tape 15 or the inside of the recess 12. Since the ultraviolet curable adhesive sheet 15 is not cut, the cut electronic component packages 10 are not individually separated at this stage.

  After this step, the outer surface of the plurality of electronic component packages 10 (mainly the outer bottom surface of the electronic component package 10) combined by the ultraviolet curable adhesive sheet 15 is washed, and then irradiated with ultraviolet rays. In a state in which the ultraviolet curable adhesive tape 15 is peeled off and the electronic component packages 10 are individually separated, or the ultraviolet curable adhesive tape 15 is attached and a plurality of electronic component packages are integrated. A plurality of ultraviolet curable adhesive tapes are applied to the entire bottom surface of the electronic component package on which the external connection electrode pads 14 are formed after cleaning, and a plurality of the ultraviolet curable adhesive tapes 15 are peeled off. The electronic component package is brought into a state where it can be worked as a unit, and the process proceeds to the step of mounting the electronic element in the next recess 12.

  In the above embodiment, the ultraviolet curable adhesive tape is used for preventing separation after the formation of the electronic component package 10, but it has the same effect as the ultraviolet curable adhesive tape in the present invention. If there is, for example, a sheet or tape coated with a solvent-melting adhesive may be used.

FIG. 1 is a process diagram showing a part of an embodiment of a method for manufacturing an electronic component package according to the present invention. FIG. 2 is a perspective view showing the form in step (a2) among the steps of the method for manufacturing the electronic component package illustrated in FIG. FIG. 3 is a process diagram showing a part of an embodiment of a conventional method for manufacturing an electronic component package. FIG. 4 is a perspective view showing the form in step (b2) among the steps of the conventional method for manufacturing an electronic component package illustrated in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, Package for electronic components 11, Insulation material 12, Recessed part 13, Element connection electrode pad 14, External connection electrode pad 15, UV curable adhesive tape

Claims (1)

A recess space is formed inside the package formed of an insulating material, an element connection electrode pad is formed on the inner bottom surface of the recess, and the element connection electrode pad is electrically connected to the outer bottom surface of the package. In a method for manufacturing an electronic component package in which a plurality of external connection electrode pads including those connected are formed,
A plurality of the concave portions, a device connection electrode pad on the bottom surface in the concave portion, and a predetermined location on the other main surface of the insulating material at a predetermined location on one main surface of the plate-like insulating material. Forming a plurality of external connection electrode pads including those electrically connected to the element connection electrode pads;
A step of attaching an adhesive sheet or an adhesive tape to the entire surface of one main surface of the insulating material in which the plurality of recesses are opened in a state where no electronic element is mounted in each of the recesses;
A step of cutting only the insulating material at a predetermined cutting position from the other main surface side where the external connection electrode pad is formed, and separating the insulating material into a plurality of electronic component packages. And a method for manufacturing an electronic component package.

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