JP2641407B2 - Adhesive cutting and removing device for anisotropic conductive film - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive film adhesive cutting / removing apparatus for cutting and removing unnecessary portions of an anisotropic conductive film adhesive for connecting electrodes.

[0002]

2. Description of the Related Art In recent years, the number of electrodes has increased along with the increase in the number of dots of a liquid crystal panel or the like, and the gap between the electrodes has become smaller, making it difficult to connect outer leads with a normal soldering method. Therefore, a connection method based on the TAB method has been adopted so that connection can be performed even at a narrow interval.

The anisotropic conductive film (hereinafter simply referred to as ACF) used for the TAB connection has a structure in which an adhesive containing conductive particles is sandwiched between protective films called separators, laminated, and easily stored and transported. . And
The device for cutting and removing the adhesive of the anisotropic conductive film to be pre-processed when the ACF is used for electrode connection, peels off the separator of the ACF, exposes the adhesive, cuts and removes other parts than necessary, and removes the adhesive at a predetermined pitch The adhesive was left. But,
This ACF is easy to store and transport, but is in the form of a thin film. Therefore, various attempts have been made to automate this processing.

FIG. 5 is a diagram showing the configuration of an example of a conventional apparatus for cutting and removing an adhesive for an anisotropic conductive film. Automated adhesive cutting of this type of anisotropic conductive film
The removing device is disclosed, for example, in Japanese Patent Application Laid-Open No. 5-258826.

[0005] As shown in FIG.
A reel 22b for winding the separator 23c from the reel 22a on which the reel 3 has been wound, a worktable 21 on which the separate 23c is peeled off, the adhesive 23a is exposed, and the separator 23b is moved to position the workbench 21; 2
A cutting blade 24 that cuts and gathers the adhesive 23a on the separate 23b positioned and mounted on the first la within a predetermined length range.
a, 24b, and a second stage 21
The unnecessary portion 23 of the adhesive which has been sent to b and cut and collected
and a removing unit 25 for attaching and removing d to the adhesive tape 25c.

FIGS. 6A to 6C are diagrams showing the operation order of the cutting section in FIG. Next, the operation of this device will be described. First, as shown in FIG. 5, the separate 23b to which the adhesive 23a is exposed is sent to the first stage 21a by the intermittent feed mechanism and positioned. Next, the cutting portion 24 in FIG. 5 descends, and the cutting blades 24a and 24b cut the adhesive 23a to a predetermined length. Next, FIG. 6A to FIG.
As shown in (1), the cutting blades 24a and 24b move so as to approach each other to gather the adhesive 23a cut to a predetermined length to form an unnecessary portion 23d.

FIGS. 7A to 7C are diagrams showing the order of operation of the removing unit in FIG. Next, as shown in FIG. 5, the separated portion 23B to which the unnecessary portion 23d of the adhesive that has been cut and gathered is attached is separated by the intermittent feed mechanism into the second stage 21b.
To be positioned. 7A and FIG.
As shown in (b), the adhesive tape 25c tensioned by the reel 25a and the reel 25b is pressed by the press block 25d and descends to adhere the unnecessary portion 23d. Next, as shown in FIG.
Rises with the unnecessary part 23d adhered, and the unnecessary part 23d
Is peeled off from the separate 23b.

As described above, the apparatus for cutting and removing the adhesive of the anisotropic conductive film is provided by the first stage 21 of the work table 21.
The ACF 23 to which the adhesive 23a has been exposed is intermittently fed and positioned in the order of a and the second stage 21b.
Is characterized in that the cutting and removal processing of the paper is automatically performed.

[0009]

In the conventional apparatus for cutting and removing the adhesive of the conventional anisotropic conductive film described above,
The adhesive adheres to the cutting blade by the operation of collecting the adhesive by the cutting blade for each cutting of the adhesive, and the adhesive is deposited on the cutting blade, so that the adhesive cannot be cut. As a result, the adhesive is not completely cut, so that the adhesive is pressed and solidified on the separate, and the hardened adhesive is connected to the necessary adhesive part adjacent thereto, and is bonded in the next adhesive removing step. When the agent is peeled off, the adjacent adhesive to be left is also peeled off, and the adhesive to be left is eroded, resulting in a shortage of the length, which hinders the actual electrode connection in the subsequent process.

Further, since the cutting of the adhesive and the removal of the unnecessary portion of the cut adhesive are performed at a distant position on the worktable, the expansion and contraction of the ACF and the precision failure of the intermittent feed positioning mechanism of the ACF may cause a problem. There is a problem that the position where the unnecessary portion of the cut adhesive is positioned is out of order and the adhesive portion cannot be removed. Depending on the misalignment, the adhesive to be left behind may be peeled off. In particular, in recent years, when the electrode pitch becomes fine, this problem may frequently occur.

Therefore, an object of the present invention is to maintain the sharpness of a cutting blade, to secure a predetermined length without being eroded by remaining adhesive regardless of the feeding accuracy of the ACF, and to reduce unnecessary adhesive. An object of the present invention is to provide an adhesive cutting / removing device for an anisotropic conductive film which can be cut and removed.

[0012]

SUMMARY OF THE INVENTION A feature of the present invention is a cutting device having a pair of cutting blades for cutting a predetermined length of an adhesive portion exposed from an anisotropic conductive film which is intermittently fed and positioned. And a removing unit that is disposed at the same position as the cutting unit and removes the adhesive part cut from the anisotropic conductive film while the cutting blade cuts into the adhesive part; and the cutting unit. Of the adhesive portion adhering to the cutting blade of
An adhesive cutting / removing device for an anisotropic conductive film having a residue removing unit having a removing tool for removing a residue .

[0013] Further, it is transferred to the removing tool of the residue removing section.
And recovering the adhesive residue and the peeled adhesive pieces.
It is desirable to provide an adhesive collecting mechanism that performs the operation.

[0014]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a view showing the configuration of an embodiment of an apparatus for cutting and removing an adhesive of an anisotropic conductive film according to the present invention. As shown in FIG. 1, this adhesive cutting / removing device for anisotropic conductive film is disposed on a separate 23b exposing an adhesive 23a positioned on a stage 8 and at the same time a predetermined amount of the adhesive 23a is applied. A pair of cutting blades 4a, 4b that cut over the interval L and the pair of cutting blades 4a, 4
a cutting portion 1 having a gate-shaped frame 3 for mounting b at a predetermined interval L, and an unnecessary portion of an adhesive which is appropriately arranged in the portal-shaped frame 3, is coaxial with the cutting portion 1, and is cut. And a removing unit 2 that adheres with an adhesive tape 6 in a state where the adhesive is surrounded by a pair of cutting blades 4a and 4b, and peels off an unnecessary portion of the adhesive from the separate 23b. Other ACF23
And a reel 22b for winding the separator 23c to be peeled off from the ACF 23 are provided in the same manner as in the conventional example.

Further, it is desirable to provide a residue removing section 9 having a claw 10 for peeling off a residue of the adhesive adhering to the cutting blades 4a and 4b. Further, as will be described later, it is desirable to provide an adhesive collecting mechanism for removing and collecting an adhesive residue transferred to the nail 10 of the residue removing section 9 and an unnecessary portion of the adhesive transferred to the adhesive tape 6. .

FIGS. 2A to 2D are diagrams showing the operation of the cutting section of FIG. 1 in order of operation. Next, the operation of the adhesive cutting / removing device for an anisotropic conductive film will be described. First, as shown in FIG. 2A, the separator 23b with the adhesive 23a exposed is positioned at a predetermined position on the stage 8. Next, as shown in FIG. 2B, the cutting blades 4a and 4b descend to cut the adhesive 23a at a predetermined interval length. Next, as shown in FIG.
With the a and 4a stopped, the press block 7 is lowered to bring the adhesive tape 6 into contact with the cut adhesive, and the adhesive is attached to the adhesive tape 6. Next, as shown in FIG. 2D, the adhesive 23a to be left is stopped by the cutting blades 4a and 4b so as not to be pulled by pulling up the adhesive tape 6, and the press block 7 is raised and adhered with the adhesive tape 6. The agent piece 23e is picked up and removed.

FIGS. 3A to 3D are diagrams showing the operation of the residue removing section of FIG. 1 in order of operation. FIG.
As shown in (d), the cut adhesive is applied to the adhesive piece 23.
After being removed as e, the cutting blades 4a, 4b rise as shown in FIG. 3 (a), but the adhesive is removed by the cutting blades 4a, 4b.
Adhering to the cutting edge and forming a residue 24. Next, as shown in FIG. 3B, the claw 10 narrows the blade edge by the air pressure accompanying the rise of the cutting blades 4a and 4b, and scrapes off the residue 24. Then, as shown in FIG. 3 (c), the movable rollers 11a and 11b are moved laterally from below by the adhesive collecting mechanism described above, the adhesive tape 6 is pulled out from the reels 5a and 5b, and the adhesive tape 6 is placed on the lower surface of the claw 10. And the residue 24 is transferred to the adhesive tape 6.

Then, as shown in FIG. 3D, the movable rollers 11a and 11b, which have been moved, return to their original positions.
Due to the rotation of the reels 5a and 5b as one of the adhesive collecting mechanisms, the adhesive piece 23e and the residue 24
Is wound around the reel 5b and collected. The ACF is fed one pitch at a time by the intermittent motion mechanism, and the operation shown in FIGS. 2 to 3 is repeated to cut and remove the adhesive.

It should be noted that the cutting blades 4a, 4 shown in this embodiment
Since the operation b is merely an operation of cutting the adhesive, there is no adhesive gathering operation by the cutting blade as in the conventional case. If the tool steel was polished to make the cutting edge a mirror surface, it was expected that the amount of adhesive residue adhering to the cutting edges of the cutting blades 4a and 4b would be extremely small. To confirm this, the cutting blade was cut into the adhesive several tens of times, and the amount of adhesive adhering was small, and there was no problem in cutting. In consideration of this, it can be said that the residue removing unit does not need to always operate, and it is sufficient to remove the residue once every several tens of adhesive cutting / removing cycles.

FIG. 4 is a diagram showing the configuration of another embodiment of the apparatus for cutting and removing an adhesive of an anisotropic conductive film according to the present invention. As shown in FIG. 4, the adhesive cutting / removing device for anisotropic conductive film is provided with a residue removing section 9a which is a rotary blade 14 for scraping off the residue of the cutting edges of the cutting blades 4a and 4b. Other than that, it is the same as the above-mentioned embodiment. The operation of this apparatus is the same except that the rotary blade 14 is used in place of the claw in the above-described embodiment to remove the residue, and thus the description is omitted.

The residue removing section and adhesive collecting mechanism of the present invention described above are not particularly limited to the mechanism shown in this embodiment.

[0023]

As described above, according to the present invention, a pair of cutting blades for cutting over the adhesive portion at the same position of the adhesive portion exposed from the ACF and a state surrounded by the cutting blades are provided. And a removing unit for removing the adhesive from the separator, a residue removing unit for removing the adhesive residue adhering to the cutting blade, and further transferred to the residue removing unit as necessary. By providing a mechanism to collect adhesive residue,
By always maintaining the sharpness of the cutting blade and sharpening the cutting surface, the cutting part and the removing part are in the same position, the cutting blade stops and stops the flow of the adhesive that should be left, and the unnecessary part is peeled off and removed. There is an effect that the remaining adhesive can always be obtained with a stable length regardless of the intermittent feeding accuracy of the ACF.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an embodiment of an apparatus for cutting and removing an adhesive of an anisotropic conductive film of the present invention.

FIG. 2 is a diagram showing an operation order for explaining an operation of a cutting unit in FIG. 1;

FIG. 3 is a diagram illustrating an operation of the residue removing unit in FIG. 1 in order of operation.

FIG. 4 is a view showing the configuration of another embodiment of the apparatus for cutting and removing an adhesive of an anisotropic conductive film of the present invention.

FIG. 5 is a diagram showing a configuration of an example of a conventional adhesive cutting / removing apparatus for an anisotropic conductive film.

FIG. 6 is a diagram illustrating an operation order of a cutting unit in FIG. 5;

FIG. 7 is a diagram illustrating an operation order of a removing unit in FIG. 5;

[Description of Signs] 1,24 cutting part 2,25 removing part 3 frame 4a, 4b, 24a, 24b cutting blade 5a, 5b, 22a, 22b, 25a, 25b reel 6,25c adhesive tape 7,25d press block 8 stage 9, 9a Residue removal unit 10 Claw 11a, 11b Movable roller 14 Rotary blade 15 Scraper 23 ACF 23a Adhesive 23b, 23c Separator 23d Unnecessary part 23e Adhesive piece 24 Residue

Claims (2)

(57) [Claims] 1. A cutting section having a pair of cutting blades for cutting an adhesive section exposed from an anisotropic conductive film intermittently fed and positioned at a predetermined length, and a cutting section provided at the same position as the cutting section. A removing portion that is disposed and peels off the adhesive portion cut from the anisotropic conductive film while the cutting blade cuts into the adhesive portion; and a cutting blade of the cutting portion.
A residue having a removing tool for removing the residue of the adhesive portion to be adhered.
An adhesive cutting / removing apparatus for an anisotropic conductive film, comprising a residue removing section . 2. Before being transferred to a removing tool of the residue removing section.
Collecting the adhesive residue and the peeled-off adhesive part
2. The apparatus for cutting and removing an adhesive of an anisotropic conductive film according to claim 1, further comprising an adhesive collecting mechanism .