201014477 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種可撓性印刷配線板薄片、其製造方 法、及硬碟裝置用可撓性印刷配線板薄片。 【先前技術】 於將支持硬碟裝置之磁頭之支持體（金屬箔）、與用於信 號傳遞之配線一體化而成之配線板（以下記作「磁頭配線 板」）等中’與垂直磁記錄方式等之資訊密度之增大相對應 地，配線高密度化。磁頭配線板係使用較薄之不鏽鋼板（箔） 作為支持體，經過蝕刻、鍍敷等之步驟而製造。該等步驟 中，有時會於配線部中產生意外之斷線、微細配線間之短 路。目前，於將磁頭配線板加以組裝直至進行至中間製品 之階段’才會藉由電性檢查而發現此種缺陷。然而，於進 行至中間製品之階段中發現不良品並將其廢棄之情形時， 至此為止之工時及零件全部白費。較好的是於組裝至中間 製品之前之階段發現上述磁頭配線板之缺陷。 磁頭配線板於1塊薄片内設置有數十個。於1塊薄片内， 將鍵敷框架（鑛敷電極）包圍，並連接於該鑛敷框架而形成有 數十個相同之配線圖案（磁頭配線板）。各個磁頭配線板係自 配線將鍍敷引線延伸而與鍍敷框架導通。配線係由銅所形 成，使用上述鍍敷框架而於配線之特定部分（連接部）形成鑛 金層。於各個磁頭配線板中並行有複數條配線，鍍敷引線 部接讀於配線之根部’另一方面，於相反側之前端，上述 複數條配線開放。形成上述鑛金層’並進行其他處理之後， 142540.doc 201014477 廠 組裝 於薄片之狀態下發貨至中間製品薇商或磁頭配線板組求 商。於此處’將各個磁頭配線板自薄片上分離之後， 至中間製品中 專利 於 作為於上述薄片狀態下檢查斷線等之檢查 文獻1(曰本專利特開2000-57543號公報）中提出有如下 法’即’於鑛金處理之後，觀察配線之顏色或光澤而對斷 線進行檢查。又，於同一文獻中，提出有如下方法（電性檢 查法），即，於鍍敷處理之後，將鍍敷引線部切斷，藉由探 針而對配線間之短路進行檢查。 於上述顏色或光澤之外觀檢查中，僅可檢查出斷線，必 需利用電性檢查來檢查短路。然而，為進行電性檢杳， 需將鍍敷引線部切斷，但若於模具等中進行切斷，則於切 斷部會產生端子接觸、毛邊或塵垢。該等毛邊或塵垢會弓丨 起短路、製品瑕疵、微粒，從而需要追加之加工、追加之 檢查步驟。 【發明内容】 本發明之目的在於提供一種不會產生與上述鍍敷引線之 切斷相伴之毛邊等之問題，且可簡單地於薄片狀態下進行 電性檢查之可撓性印刷配線板薄片、其製造方法、及硬碟 裝置用可撓性印刷配線板薄片。 本發明之可撓性印刷配線板薄片之特徵在於：其係包含 鑛敷框架與複數個可撓性印刷配線板之薄片。於該薄片 中，可撓性印刷配線板包含金屬箔、位於金屬箔上之基部 ”邑緣層位於基部絕緣層上之配線、自配線延伸並連結於 142540.doc 201014477 鍍敷框架之鍍敷引線部、以及覆蓋配線及鍍敷引線部之覆 蓋絕緣層，覆蓋絕緣層覆蓋鍍敷框架，且共同地位於整個 薄片上。而且，複數個配線板係均將覆蓋鍍敷引線部之覆 蓋絕緣層之部分除去。 根據上述構成，可選擇性採取以下之步驟（al)或（a2^(ai) 之後，可於可撓性印刷配線板薄片之製造工場發貨之前， 於工場内將鍍敷引線部切斷，將各配線板自鍍敷框架上分 離，對每個配線板進行電性檢查。（a2)可直接發貨，於中間 製品廠商或磁頭配線板組裝廠商處，將鑛敷引線部切斷（切 斷方法任意）’於組裝配線板之前，對每個配線板進行電性 檢查。 藉由上述（al)或（a2)，於將配線板組裝至中間製品之前， 於可撓性印刷配線板薄片之狀態下進行電性檢查，因此於 發現不良之情形時，僅將㈣線板廢棄即可，故可抑制浪 費’從而可抑制製造成本。χ，亦可採取如下選項，即， 於（a2)中’由於某些原因而沿用先前之方法，於將上述配線 板組裝至中間製品之後進行電性檢查。 於上述（al)或（a2)中，可藉由餘刻而直接將鍛敷引線部切 斷（可省去將覆蓋絕緣層等除去之後進行㈣之周折）。利用 钮刻而將鍍敷引線部除去’藉此，可防止產生利用脫模或 雷射切斷等之切斷方法而產生之毛邊、塵垢等，從而益需 將毛邊、塵垢等除去之工夫，便可確實地進行電性檢查。 #亦可將已除去上述覆蓋絕緣層部分之鑛敷引線部除去。 糟此’可於工場發貨之前’於薄片之狀態下對每個可挽性 142540.doc 201014477 印刷配線板進行電性檢查。因此，與組裝可撓性印刷配線 板之後進行電性檢查而發現不良之情形相比較，可大幅度 地抑制浪費。其結果’可有助於提高組裝有可撓性印刷配 線板之製品之製造良率，且可獲得對於可撓性印刷配線板 薄片之高可靠性。 本發明之可撓性印刷配線板薄片之製造方法之特徵在 於：其係製造包含具有經鍍敷處理之配線之複數個可撓性 印刷配線板之薄片的方法。於該製造方法中包含以下步 驟：配線層形成步驟，其於基部絕緣層上，形成鍍敷框架、 每個可撓性印刷配線板之配線、以及將鍍敷框架與每個可 撓性印刷配線板之配線連結之鑛敷引線部；形成覆蓋配線 層之覆蓋絕緣層之步驟；以及將锻敷引線部上之覆蓋絕緣 層部分除去之步驟。 根據上述方法，之後可簡單地將鍍敷引線部切斷，可於 配線板薄片之狀態下直接進行電性檢查。因此，與藉由將 可撓性印刷配線板組裝至中間製品之後進行之電性檢查而 於可撓性印刷配線板中發現不良的情形相比較，可抑制由 除去過程引起之浪費。 可藉由蝕刻而將已除去了上述覆蓋絕緣層部分鍍敷引線 部除去。藉此，不會產生塵垢、金屬粉等，可確實地將鍍 敷引線部自鍍敷框架上分離。因此，可對每個配線板進行 可罪性面之電性檢查。 上述可撓性印刷配線板薄片之製造方法包含對金屬箔部 分進行蝕刻之步驟，鍍敷引線部之蝕刻步驟係於相同之蝕 142540.doc 201014477 刻時機一併it行㈣。藉&，例#於將上述可挽性印刷配 線板使用於磁頭中之情形時，必需將成為磁頭之磁信號拾 取部之可撓性印刷配線板之前端部（與鍍敷引線相反側之 女而）的金屬箔除去，但可於將該金屬箔除去之同時，一併將 鍍敷引線部除去，從而可提高製造效率。 上述可撓性印刷配線板薄片之製造方法包含對上述可撓 性印刷配線板之配線部分進行鍍金處理之步驟，可於除去 進行鍍金處理之部分之覆蓋絕緣層時，一併將鍍敷引線部 上之覆蓋絕緣層之部分除去。藉此，可減少工時而提高製 造效率。 本發明之硬碟裝置用可撓性印刷配線板薄片之特徵在 . 於：於上述任一種可撓性印刷配線板薄片、或者由上述任 - 一種製造方法所製造之可撓性印刷配線板薄片中，將可撓 f生印刷配線板設為用於磁頭中之可撓性印刷配線板。藉 此’透過可抑制製造成本之可撓性印刷配線板薄片，可獲 肇付包3咼可罪性之配線板之硬碟裝置用可撓性印刷配線板 薄片。 根據本發明之可撓性印刷配線板薄片等，不會產生毛邊 等之問題’可簡單地於薄片狀態下進行電性檢查。 【實施方式】 圖1係表示本發明之實施形態中之可撓性印刷配線板薄 片50之平面圖。可撓性印刷配線板丨〇為硬碟裝置用可撓性 印刷配線板’其輪廓係由矩形之虛線表示。於圖1之可撓性 印刷配線板薄片5 0中，可撓性印刷配線板1 〇之排列係以縱 142540.doc 201014477 橫與邊平行之方式對齊，但亦可無需對齊，而使相同之端 部相對，對於薄片或覆蓋絕緣層3之邊傾斜地配置。又，亦 可對於下文中說明之鍍敷框架21傾斜地配置。圖丨中，可挽 性印刷配線板10之配線11係以i根粗線所表示，但更詳細而 言，如圖2所示，例如並行有3根或超過3根之導線。配線u 之前端部彎曲，該彎曲部相向地成對配置。自配線^延伸 而設置有鍍敷引線部Ilk，該鍍敷引線部Uk接續於鍍敷框 架21。圖丨中，鍍敷引線部Uk僅設置於可撓性印刷配線板 之一方之端部，但亦可設置於兩方之端部。圖丨及圖2中， 配線11/鍍敷引線部llk/鍍敷框架21係位於相同之層（高 度、厚度方向位置）即配線層。根據下文中說明之製造方 法，可明白該配線層位於圖2所示之基部絕緣層2上。以覆 蓋配線層之方式設置覆蓋絕緣層3,但於配線丨丨之一部分之 區域中，為進行連接而進行鍍金處理（參照圖14及圖i5B)， 於該連接用之經鍍金之部位，將覆蓋絕緣層3除去。 (本發明之實施形態之可撓性印刷配線板薄片对之要點） 要點在於如下方面：如圖2所示，將鑛敷引線部心上之 覆蓋絕緣層3除去’形成露出有鑛敷引線部1 lk之-部分之[Technical Field] The present invention relates to a flexible printed wiring board sheet, a method of manufacturing the same, and a flexible printed wiring board sheet for a hard disk device. [Prior Art] In a wiring board (hereinafter referred to as a "head wiring board") that integrates a support for a magnetic head of a hard disk device and a wiring for signal transmission (hereinafter referred to as a "head wiring board") Correspondingly, the increase in the information density such as the recording method increases the density of the wiring. The magnetic head wiring board is manufactured by using a thin stainless steel plate (foil) as a support and etching or plating. In these steps, an unexpected disconnection or a short circuit between the fine wirings may occur in the wiring portion. At present, such defects are found by electrical inspection in the stage of assembling the head wiring board until proceeding to the intermediate product. However, when a defective product is found in the stage of the intermediate product and discarded, the working hours and parts up to this point are in vain. It is preferable to find the defects of the above-mentioned magnetic head wiring board at the stage before assembling to the intermediate product. The head wiring board is provided with tens of pieces in one sheet. In one sheet, a keying frame (mineral electrode) is surrounded and connected to the metallized frame to form tens of identical wiring patterns (head wiring boards). Each of the head wiring boards extends the plating leads from the wiring to be electrically connected to the plating frame. The wiring is formed of copper, and a gold layer is formed in a specific portion (connection portion) of the wiring using the plating frame. A plurality of wirings are arranged in parallel in each of the magnetic head wiring boards, and the plating lead portions are read on the root portion of the wiring. On the other hand, the plurality of wirings are opened at the front end on the opposite side. After forming the above-mentioned mineral gold layer' and performing other processing, the 142540.doc 201014477 factory is assembled in a sheet state and shipped to the intermediate product Weishang or the head wiring board group for consultation. Here, it is proposed in the inspection document 1 (Japanese Patent Laid-Open Publication No. 2000-57543), which is the same as the inspection of the above-mentioned sheet in the state of the above-mentioned sheet state, after the separation of the respective head-type wiring boards from the sheet. The following method 'is' after the gold treatment, observe the color or luster of the wiring to check the broken wire. Further, in the same document, there is proposed a method (electrical inspection method) in which the plating lead portion is cut after the plating treatment, and the short circuit between the wirings is inspected by the probe. In the visual inspection of the above color or gloss, only the broken wire can be checked, and the electrical check must be used to check the short circuit. However, in order to perform electrical inspection, the plating lead portion needs to be cut. However, when cutting is performed in a mold or the like, terminal contact, burrs, or dust is generated in the cut portion. These burrs or grime will cause short-circuiting, product defects, and fine particles, which require additional processing and additional inspection procedures. SUMMARY OF THE INVENTION An object of the present invention is to provide a flexible printed wiring board sheet which can be electrically inspected in a sheet state without causing problems such as burrs associated with the cutting of the plating lead. A manufacturing method thereof and a flexible printed wiring board sheet for a hard disk device. The flexible printed wiring board sheet of the present invention is characterized in that it comprises a sheet of a mineral deposit frame and a plurality of flexible printed wiring boards. In the sheet, the flexible printed wiring board comprises a metal foil, a base on the metal foil, a wiring on the base insulating layer, a wiring extending from the wiring and connected to the plating lead of the 142540.doc 201014477 plating frame. And a cover insulating layer covering the wiring and the plated lead portion, the cover insulating layer covers the plating frame, and is collectively located on the entire sheet. Moreover, the plurality of wiring boards are covered with the cover insulating layer of the plating lead portion. According to the above configuration, the following steps (al) or (a2^(ai) may be selectively employed to form the lead portion in the factory before shipment to the manufacturing site of the flexible printed wiring board sheet. Cut off, separate the wiring boards from the plating frame, and perform electrical inspection on each wiring board. (a2) It can be shipped directly, and the intermediate part is cut at the intermediate product manufacturer or the head wiring board assembly manufacturer. Breaking (optional cutting method) 'Electrical inspection of each wiring board before assembling the wiring board. By (al) or (a2), before assembling the wiring board to the intermediate product, The electrical inspection is performed in the state of the flexible printed wiring board sheet. Therefore, when the defect is found, only the (four) wiring board can be discarded, so that waste can be suppressed, and the manufacturing cost can be suppressed. χ, the following options can also be adopted. That is, in (a2), for some reasons, the previous method is used to perform electrical inspection after assembling the above-mentioned wiring board to the intermediate product. In the above (al) or (a2), The forged lead portion is directly cut (the peripheral portion of the forged insulating layer or the like is removed and then removed). The plating lead portion is removed by the button engraving, thereby preventing the use of demolding or laser cutting. If the burrs, dust, etc. are generated by the cutting method, it is necessary to remove the burrs, dirt, etc., and the electrical inspection can be performed reliably. #The portion of the mineralized lead portion from which the above-mentioned insulating layer is removed may also be removed. Except for this, it is possible to perform an electrical inspection of each of the 142540.doc 201014477 printed wiring boards in a state of a sheet before the factory is shipped. Therefore, electrical properties are performed after assembling the flexible printed wiring board. Compared with the case where the inspection is found to be unsatisfactory, the waste can be greatly suppressed. The result 'can help to improve the manufacturing yield of the product in which the flexible printed wiring board is assembled, and the flexible printed wiring board sheet can be obtained. The method for producing a flexible printed wiring board sheet according to the present invention is characterized in that it is a method of manufacturing a sheet comprising a plurality of flexible printed wiring boards having a plated wiring. The method includes the following steps: a wiring layer forming step of forming a plating frame, wiring of each flexible printed wiring board, and wiring of the plating frame and each flexible printed wiring board on the base insulating layer a step of bonding the core portion; forming a cover insulating layer covering the wiring layer; and removing the portion of the insulating layer on the forged lead portion. According to the above method, the plating lead portion can be easily cut, and the electrical inspection can be directly performed in the state of the wiring board sheet. Therefore, compared with the case where a defect is found in the flexible printed wiring board by electrical inspection performed after assembling the flexible printed wiring board to the intermediate product, waste caused by the removal process can be suppressed. The portion of the plating portion from which the overlying insulating layer has been removed can be removed by etching. Thereby, dust, metal powder, and the like are not generated, and the plating lead portion can be surely separated from the plating frame. Therefore, it is possible to perform an electrical inspection of the sinus surface for each wiring board. The method for manufacturing the flexible printed wiring board sheet includes the step of etching the metal foil portion, and the etching step of plating the lead portion is performed at the same time as the timing of the etching (142). In the case where the above-mentioned switchable printed wiring board is used in a magnetic head, it is necessary to form the front end portion of the flexible printed wiring board which becomes the magnetic signal pickup portion of the magnetic head (on the opposite side to the plating lead) The metal foil of the female is removed, but the metal foil can be removed and the plating lead portion can be removed, thereby improving the manufacturing efficiency. The method for producing a flexible printed wiring board sheet includes a step of performing gold plating on a wiring portion of the flexible printed wiring board, and removing a plating lead portion when removing a portion of the insulating layer that is subjected to gold plating treatment The portion of the upper insulating layer is removed. Thereby, the working hours can be reduced and the manufacturing efficiency can be improved. The flexible printed wiring board sheet for a hard disk device according to the present invention is characterized in that: the flexible printed wiring board sheet of any one of the above, or the flexible printed wiring board sheet manufactured by any one of the above-described manufacturing methods Among them, a flexible printed wiring board is used as a flexible printed wiring board for use in a magnetic head. By the flexible printed wiring board sheet which can suppress the manufacturing cost, it is possible to obtain a flexible printed wiring board sheet for a hard disk device which includes a sinister wiring board. According to the flexible printed wiring board sheet of the present invention, problems such as burrs do not occur, and electrical inspection can be easily performed in a sheet state. [Embodiment] Fig. 1 is a plan view showing a flexible printed wiring board sheet 50 in an embodiment of the present invention. The flexible printed wiring board 丨〇 is a flexible printed wiring board for a hard disk device', and its outline is indicated by a rectangular dotted line. In the flexible printed wiring board sheet 50 of FIG. 1, the flexible printed wiring board 1 is arranged in a horizontal direction of 142540.doc 201014477, and the horizontal and vertical sides are aligned, but the alignment is not required, and the same is The ends are opposed to each other and are disposed obliquely to the side of the sheet or cover insulating layer 3. Further, the plating frame 21 described below may be disposed obliquely. In the figure, the wiring 11 of the printable printed wiring board 10 is indicated by i thick lines, but in more detail, as shown in Fig. 2, for example, there are three or more than three wires in parallel. The front end of the wiring u is bent, and the bent portions are arranged in pairs in opposite directions. The plating lead portion Ik is provided to extend from the wiring, and the plating lead portion Uk is continued to the plating frame 21. In the figure, the plating lead portion Uk is provided only at one end of the flexible printed wiring board, but may be provided at both end portions. In Fig. 2 and Fig. 2, the wiring 11 / plating lead portion 11k / plating frame 21 are located in the same layer (height, thickness direction position), that is, the wiring layer. According to the manufacturing method explained hereinafter, it is understood that the wiring layer is located on the base insulating layer 2 shown in Fig. 2. The cover insulating layer 3 is provided so as to cover the wiring layer, but in a region of one portion of the wiring turn, gold plating is performed for connection (see FIGS. 14 and 19B), and the gold-plated portion for the connection is The cover insulating layer 3 is removed. (Points of the flexible printed wiring board sheet according to the embodiment of the present invention) The main point is that, as shown in FIG. 2, the cover insulating layer 3 on the center of the core portion of the core is removed to form an exposed portion of the exposed portion. 1 lk - part of
不需要該鑛敷引線部llk。 部llk露出。為進行上述用以連接 線部11 k，於結束鍍金處理之後則 倒不如說為對可撓性印刷配線板 142540.doc 201014477 ^個進行電性檢查’若將鍍敷引線部l ik連結於鍍敷框架 21則會成為阻礙。 若利用姓刻處理將鍵敷引線部llk除去，則如上所述，不 會產生毛邊、塵垢等，而可確實且容易地對每個可挽性印 刷配線板進㈣性檢查。如圖i所示，於可撓性印刷配線板 薄片50上形成根部露出部κ，係成為（ei)藉由㈣而將鑛敷 引線部11 k除去之準備。 又，例如即便於藉由脫模或雷射照射而非藉由蝕刻進行 切斷之情形時，因（e2)僅使根部露出料露出，故於電性檢 查中，不易文毛邊或塵垢之影響。根部露出部κ必需使整個 寬度之配線11露出或使所有之配線u露出但於長度方向 上具有僅磅保切斷（開放）之長度即可。進而根部露出部K 之形成不僅係為順利地藉由蝕刻而將鍍敷引線部i lk切 斷，亦係為順利地（63)藉由脫模（利用金屬刀之切斷）或雷射 切斷（利用光能之熔解之切斷）而將鍍敷引線部llk切斷。 藉由形成根部露出部K，可獲得上述（el)〜(e3)之優點。 繼而，對上述可撓性印刷配線板薄片50之製造方法加以 說明。 首先，如圖3所示，於金屬箔即不鏽鋼箔丨上形成成為基 部絕緣層2之聚醯亞胺層。不鏽鋼箔丨係作為支持體之強度 上之核心構件，且擔負如下之作用，即，一面允許磁頭之 i號拾取部分離開磁記錄媒體（碟片）面，一面彈性地進行支 持。 其次’如圖4及圖5所示，形成包含配線u/鍍敷引線部llk/ 142540.doc 201014477 鍍敷框架21之配線層。對具體之處理進行更細緻地敍述， 藉由非電解鍍敷等而於圖3之聚醯亞胺層2上形成鎳或鉻等 之導體薄膜。於該導體薄膜上形成光阻圖案之後，藉由鑛 銅而於導體薄膜上形成配線U/鍍敷引線部llk/鍍敷框架 21。之後’將未形成有配線U/鍍敷引線部llk/鍍敷框架以 之部分（未圖示）之導體薄膜除去。於該階段，圖4中之以下3 個位置之剖面相同。 剖面位置A-A’ ：與信號拾取部相對應之前端位置 剖面位置B-B’：形成用於連接之鑛金層之位置 剖面位置C-C’ ：與鑛敷引線11 k相對應之位置 例如將剖面位置A_A，記作A剖面位置或A剖面。對於8及c 亦相同。再者，對照圖丨之表示，表示有2根配線，但實際 上如圖2所示，設置有更多之配線。 繼而，以覆蓋絕緣層3包覆配線丨！ /鍍敷引線部〗〗k/鍍敷框 架。覆蓋絕緣層3較好的是由聚醯亞胺、鐵氟龍（註冊商標） 以及液晶聚合物中之任一者所形成。於剛性變大不會成為 問題之情料’亦可由環氧玻_成覆蓋絕緣h然而， 於磁頭之情形時，如上所述，由於需要微妙且柔和之彈性， 故而較好的是由上述材料形成上述覆蓋絕緣層3。形成覆蓋 、邑緣層3之後，如圖6及圖7所示，將進行鑛金之部分（b剖面 置）及與錢敷引線部Π k相對應之部分（c剖面位置）之覆蓋 !緣層3除去。圖7A係圖6中之a剖面，圖表示圖6令相同 之剖面形態，且表示B剖面及c剖面。如下文中所述，預先 又敷引線部1 lk之位置之覆蓋絕緣層3除去之目的在於， 142540.doc 201014477 於鍍金處理結束之後，高效地將鍍敷引線部Ilk除去。 其次，如圖8及圖9所示，將形成鍍金層之部分（B剖面位 置）打開而形成光阻圖案4。圖9A係圖8之A剖面，圖9B係B 剖面’圖9C係C剖面。僅將形成鍍金層之B剖面位置打開’ 並導入鍍金之鍍敷液。因未形成鑛金層，故於鍵敷引線部The ore dressing lead portion llk is not required. Part llk exposed. In order to perform the above-described connection of the wire portion 11 k, it is better to perform an electrical inspection on the flexible printed wiring board 142540.doc 201014477 after the end of the gold plating process. If the plating lead portion 1 ik is connected to the plating Applying the frame 21 will be an obstacle. When the key placement lead portion 11k is removed by the last name processing, as described above, no burrs, dust, or the like is generated, and each of the printable wiring boards can be surely and easily inspected. As shown in Fig. 1, the root exposed portion κ is formed on the flexible printed wiring board sheet 50, and the preparation of the deposited lead portion 11k by (4) is removed. Further, for example, even when the film is cut by demolding or laser irradiation instead of etching, since (e2) only exposes the root portion, it is not easy to affect the edge of the fabric or the scale during the electrical inspection. . The root exposed portion κ must be such that the entire width of the wiring 11 is exposed or all of the wirings u are exposed, but the length is only cut and opened (open). Further, the formation of the root exposed portion K is not only to smoothly cut the plating lead portion i lk by etching, but also to smoothly (63) by demolding (cutting with a metal knife) or laser cutting The plating lead portion 11k is cut by breaking (cutting by melting of light energy). The advantages of the above (el) to (e3) can be obtained by forming the root exposed portion K. Next, a method of manufacturing the above-described flexible printed wiring board sheet 50 will be described. First, as shown in Fig. 3, a polyimide layer of the base insulating layer 2 is formed on a metal foil, i.e., a stainless steel foil. The stainless steel foil is used as the core member of the strength of the support, and functions to elastically support while allowing the pickup portion of the magnetic head to leave the surface of the magnetic recording medium (disc). Next, as shown in Figs. 4 and 5, a wiring layer including the wiring u/plating lead portion 11k/142540.doc 201014477 plating frame 21 is formed. The specific treatment will be described in more detail, and a conductor film of nickel or chromium or the like is formed on the polyimide layer 2 of Fig. 3 by electroless plating or the like. After the photoresist pattern is formed on the conductor film, the wiring U/plating lead portion 11k/plating frame 21 is formed on the conductor film by the copper ore. Thereafter, the conductor film in which the wiring U/plating lead portion 11k/plating frame is not formed (not shown) is removed. At this stage, the profiles of the following three locations in Figure 4 are the same. Section position A-A': Position position B-B' at the front end position corresponding to the signal pickup portion: Positional position C-C' forming the gold layer for connection: Position corresponding to the mineral deposit 11k For example, the section position A_A is referred to as an A section position or an A section. The same is true for 8 and c. Further, the reference figure , indicates that there are two wirings, but actually, as shown in Fig. 2, more wiring is provided. Then, the wiring layer is covered with the cover insulating layer 3! / plating lead section〗 〖 k / plating frame. The cover insulating layer 3 is preferably formed of any one of polyimine, Teflon (registered trademark), and liquid crystal polymer. In the case where the rigidity becomes large, it does not become a problem. The epoxy glass can also be used to cover the insulation. However, in the case of the magnetic head, as described above, since the subtle and soft elasticity is required, it is preferable to use the above materials. The above cover insulating layer 3 is formed. After the cover and the rim layer 3 are formed, as shown in FIG. 6 and FIG. 7, the portion of the gold deposit (b-section) and the portion corresponding to the lead portion Π k (c-section position) are covered. Layer 3 is removed. Fig. 7A is a cross section taken along line a of Fig. 6, and Fig. 6 is a view showing the same cross-sectional view of Fig. 6 and showing a B section and a c section. As described later, the purpose of removing the insulating cover layer 3 at the position where the lead portion 1 lk is applied in advance is to remove the plating lead portion Ilk efficiently after the end of the gold plating treatment by 142540.doc 201014477. Next, as shown in Figs. 8 and 9, the portion (the B-sectional position) where the gold plating layer is formed is opened to form the photoresist pattern 4. Fig. 9A is a cross section taken along line A of Fig. 8, and Fig. 9B is a cross section taken along line B of Fig. 9C. Only the position of the B section where the gold plating layer is formed is opened ’ and the gold plating plating solution is introduced. Because the gold layer is not formed, the key portion is applied to the key.
Ilk之位置，於已除去覆蓋絕緣層之狀態下形成光阻之頂板 (蓋）4。 繼而’於B剖面位置之配線丨丨上形成鍍金層15。圖1〇係表 示於配線11上形成有鍍金層15之8剖面之圖。於鍍金處理 中’將上述鍍敷框架21作為鍍敷電極（負極），自未圖示之金 離子供給電極（正極）供給金離子，形成鍍金層15。於形成有 該鍍金層15之部分實施用於連接之接合等。之後，將光阻 圖案4除去之後’可獲得圖丨1A〜圖11C之各剖面之狀態。然 後’為將圖11C所示之C剖面中之鍍敷引線部11 k除去而形 成光阻圖案。 圖12係形成有光阻圖案之狀態之平面圖，該光阻圖案係 用以藉由蝕刻而將鍍敷引線部1 Ik及A剖面位置之不鏽鋼箔 1之一部分除去者。又，圖13 A〜圖13C為A刮面圖〜C剖面圖。 光阻圖案6於2個部位開放^ 1個部位為前端部之a剖面位 置’其與將要除去之不鏽鋼箔1之部分相對應地開放。另一 個部位為鍍敷引線部11 k所在之C剖面位置。將圖丨3 A〜圖 13C之狀態之可撓性印刷配線板薄片5〇浸潰於蝕刻劑中，分 別將圖13 A之不鏽鋼箔1之一部分及圖丨3c之鍍敷引線部 1 lk除去。之後，將光阻圖案6除去。 142540.doc 201014477 圖14係將上述光阻圖案除去後之平面圖。又，圖15A〜圖 1 5C為A剖面圖〜c剖面圖。於本發明之實施形態中之可撓性 印刷配線板薄片5 0中’如圖15 C所示，已除去鐘敷引線部 Ilk。 先前’於可撓性印刷配線板薄片製造工場中，未將鍍敷 引線部1 lk除去，於作為發貨目的地之將可撓性印刷配線板 組裝至中間製品之中間製品廠商處，亦未將鍍敷引線部丨i k 除去。 因此’先前於發貨時’殘存有包覆鍍敷引線部nk之覆蓋 絕緣層3。先前，無如圖7；8所示般將覆蓋絕緣層3除去之步 驟，而經常如圖7A所示般由覆蓋絕緣層3所包覆。然而，為 自磁碟拾取信號，於前端部（A剖面位置）必需將不鏽鋼 之一部分除去，且無一例外地進行^亦可於將上述不鏽鋼 箔1之一部分除去之後，藉由另外之處理，利用蝕刻而將上 述鍍敷引線部1 1 k除去，但藉由於將前端部之不鏽鋼箔j之 —部分除去之同時，將上述鍍敷引線部Uk除去，可減少工 時。 圖16係用於對上述本發明之實施形態中之可撓性印刷配 線板薄片50之優點進行說明的流程圖。與上述製造方法之 說明中所使用之圖併用。 (1)覆蓋絕緣層之除去 本發明之實施形態中，於可撓性印刷配線板薄片5〇中， 使設置於各可撓性印刷配線板10上之鍍敷引線部丨丨^露 出。因此，於圖6及圖7所示之階段中，預先準備未包覆铲 142540.doc -12- 201014477 敷引線部Ilk之狀態下之覆蓋絕緣層3。亦即，與進行必需 之處理即鍍金處理之B剖面位置相同地，亦於c剖面位置， 預先將覆蓋絕緣層3除去。並非為（：剖面位置而特別地設置 覆蓋絕緣層3之除去步驟，而是於除去B剖面位置之覆蓋絕 緣層3之同時，將C剖面位置之覆蓋絕緣層3除去，藉此可減 少工時。 若於B剖面位置，於配線丨丨上形成鍍金層15之後將光阻圖 案除去，則如圖11(：所示，鍍敷引線部Ilk露出。露出有該 * 鑛敷引線部llk之狀態（圖lie)係表示圖16所示之本發明之 實施形態之頂欄的階段。鍍敷引線部Uk於鍍金處理結東之 後不會被使用。其後，對（a丨）過程加以說明。 ' (2)蝕刻處理 - 於（al)過程中，於進行蝕刻處理時，將鍍敷引線部llk及 前端部之不鏽鋼箔之一部分一併除去。如上所述，於磁頭 用配線板中，必需將前端部之不鏽鋼箔丨之一部分除去。當 • 進仃該必需之蝕刻處理時，可將鍍敷引線部1 lk除去。因 此，無需另外設置用以將鍍敫引線部llk除去之蝕刻處理步 驟，從而可減少工時。 (3)於可撓性印刷配線板薄片之狀態下之電性檢查 可撓性印刷配線板1〇因上述鍍敷引線部丨lk被除去而成 為電性獨立之狀態，可單獨地進行電性檢查。藉此，與組 裝至中間製品中之後進行電性檢查而發現不良品之情形相 比較，可於較早之階段發現不良品。藉此，可提高中間製 品之製造良率，抑制中間製品之零件（配線板）成本。其結 142540.doc •13· 201014477 果’可降低作為發貨目的地之中間製品廠商之製造成本。 對如下流程加以說明，即’使鍍敷引線部】lk露出，繼而 不將鑛敷引線部Ilk除去’而是將不鑛鋼猪1之一部分除去 之後發貨。該流程為（a2)過程。於（a2)過程中，於發貨目的 地可以任意之方法將鍍敷引線部丨丨k自鍍敷框架21上分 離。因鍍敷引線部Ilk未由覆蓋絕緣層3所包覆，故該鑛敷 引線部11 k之切斷相對容易。為進行切斷，除可使用餘刻之 外’亦可使用沖裁或雷射切斷等之方法。因僅鍍敷引線部 11 k露出’而其他配線部分仍被包覆，故可抑制毛邊等之影 春 響。因此，可不費事地將各可撓性印刷配線板自鍍敷框架 21上分離’且可於可撓性印刷配線板薄片5 〇之狀態下直接 對每個可撓性印刷配線板1〇進行電性檢查。藉此，可獲得 與（a 1)過程相同之優點。 於（a2)過程之情形時’亦可於發貨目的地’不將鑛敷引線 部Ilk切斷，而是取出可撓性印刷配線板，將該可撓性印刷 配線板組裝至中間製品中。於該情形時，與先前之方式同 樣地，於中間製品之狀態下進行電性檢查。該過程並未活❿ 用最廣泛之本發明之範圍中之「使鍍敷引線部露出之可撓 性印刷配線板薄片」的優點，實質上與先前相同。如上所 . 述，本發明包含如下範圍，即，將鍍敷引線部切斷，於工 場發貨時，對每個可撓性印刷配線板進行電性檢查，不產 生如上所述之不採用之過程。 為進行比較，將先前之流程示於圖17中。鍍敷引線部nk 由覆蓋絕緣層3所包覆，當然於鍍敷引線部1 lk殘存之狀態 142540.doc -14· 201014477 下發貨。其中’進行必需之處理，即，將前端部之不鏽鋼 ’/高1之一部分除去。電性檢查並非於薄片之狀態下對每個可 挽性印刷配線板進行，而是於組裝至中間製品之後，於中 間製品之狀態下進行電性檢查。若將圖1 7之流程與圖1 6之 流程進行比較，則本發明之有用性明顯在於以下方面：（1) 確保對於可撓性印刷配線板薄片之高可靠性，（2)有助於提 南組裝有可撓性印刷配線板薄片之製品之製造良率。 於上述中，對本發明之實施形態及實施例進行了說明， 但上述所揭示之本發明之實施形態及實施例僅為例示本 發明之範圍並不限定於該等發明之實施形態。本發明之範 圍係藉由申請專利範圍之揭示所表示，而且包含與申請專 利範圍之揭示均等之意義及範圍内的所有變更。 根據本發明，不特別地設置多餘之工時，便可於薄片之 狀態下直接對每個可撓性印刷配線板進行電性檢查。因 此’不會提高製造成本，可減少中間製品之成本等。 【圖式簡單說明】 圖1係表示本發明之實施形態中之可撓性印刷配線板薄 片之平面圖； 圖2係圖1之可撓性印刷配線板中之鍍敷引線部之部分放 大圖； 圖3係表示於圖1之可撓性印刷配線板薄片之製造中\於 不鏽鋼羯上形成有聚醯亞胺層之基部絕緣層之狀態的圖； 圖4係表示於基部絕緣層上形成有配線/鍍敷引線部/鍍敷 框架之狀態之平面圖； 142540.doc 15 201014477 圖5係圖4之各部分之剖面圖，且於A、B及c剖面位置均 相同； 圖6係表示同樣以覆蓋絕緣層進行包覆之後，為對b剖面 位置之配線進讀金*部分地將覆蓋絕緣層除去之狀態的 平面圖； 圖7係圖6之各部分之剖面圖，圖7八係A剖面圖，圖了^係b 剖面圖及C剖面圖； 圖8係形成有用以對B剖面位置之配線進行鑛金之光阻圖 案之狀態的平面圖； 圖9係圖8之各部分之剖面圖，圖9八係a剖面圖，圖奶係b 剖面圖，圖9(：係(：剖面圖； 圖10係鍍金處理後之B剖面圖； 圖11係於錢金處理之後將光阻圖案除去後之剖面圖，圖 11A係A剖面圖，@ub#b剖面圖，圖係c剖面圖； 圖12係為將鍍敷引線部及前端部之不鏽㈣之一部分除 去而形成有光阻圖案之狀態的平面圖； 圖係圖12之各部分之剖面圖，圖13a係a剖面圖，圖別 係B剖面圖，圖13C係C剖面圖； 广4係表示藉由姓刻而將鑛敷引線部及前端部之不鏽鋼 泊之一部分除去之狀態的平面圖； 係圖14之各。p分之剖面圖，圖15人係a剖面圖，圖HR 係B剖面圖，圖15C係C剖面圖； 圖_包含本發明之實施形態之可撓性印刷配線板薄片 之發貨及電性檢查的步驟之流程圖；及 142540.doc 16 201014477 圖17係包含先前之可撓性印刷配線板薄片之發貨及電性 檢查的步驟之流程圖。 【主要元件符號說明】 1 不錯鋼箱 2 聚醯亞胺層（基部絕緣層） 3 覆蓋絕緣層 4 光阻圖案 6 • 10 光阻圖案 可撓性印刷配線板 11 配線 Ilk 鍍敷引線部 15 鍍金層 - 21 鍍敷框架 50 可撓性印刷配線板薄片 K 根部露出部 • 142540.doc -17·The position of Ilk is a top plate (cover) 4 in which a photoresist is formed in a state where the insulating layer is removed. Then, a gold plating layer 15 is formed on the wiring layer at the position of the B section. Fig. 1 is a view showing a cross section of the gold plating layer 15 formed on the wiring 11. In the gold plating process, the plating frame 21 is used as a plating electrode (negative electrode), and gold ions are supplied from a gold ion supply electrode (positive electrode) (not shown) to form a gold plating layer 15. Bonding or the like for connection is performed in a portion where the gold plating layer 15 is formed. Thereafter, after the photoresist pattern 4 is removed, the states of the respective sections of Figs. 1A to 11C can be obtained. Then, a photoresist pattern is formed by removing the plating lead portion 11 k in the C section shown in Fig. 11C. Fig. 12 is a plan view showing a state in which a photoresist pattern is formed, which is used to remove a part of the stainless steel foil 1 at the position of the lead portion 1 Ik and the A portion by etching. 13A to 13C are A plan view to C view. The photoresist pattern 6 is opened at two locations, and the one portion is a cross-sectional position of the front end portion, which is open corresponding to the portion of the stainless steel foil 1 to be removed. The other portion is the C-section position where the plating lead portion 11 k is located. The flexible printed wiring board sheet 5 of the state of FIGS. 3A to 13C is immersed in an etchant, and one portion of the stainless steel foil 1 of FIG. 13A and the plated lead portion 1 lk of FIG. 3c are removed. . Thereafter, the photoresist pattern 6 is removed. 142540.doc 201014477 Figure 14 is a plan view showing the above photoresist pattern removed. 15A to 15C are cross-sectional views taken along the line A to c. In the flexible printed wiring board sheet 50 of the embodiment of the present invention, as shown in Fig. 15C, the bell-shaped lead portion Ilk is removed. In the flexible printed wiring board sheet manufacturing factory, the plating lead portion 1 lk was not removed, and the flexible printed wiring board was assembled as an intermediate product manufacturer of the intermediate product as a delivery destination. The plating lead portion 丨ik is removed. Therefore, the covering insulating layer 3 covering the plating lead portion nk remains in the "previously shipped". Previously, the step of removing the insulating layer 3 was omitted as shown in Figs. 7 and 8, and was often covered by the cover insulating layer 3 as shown in Fig. 7A. However, in order to pick up the signal from the magnetic disk, it is necessary to remove one part of the stainless steel at the front end portion (A cross-sectional position), and without exception, after removing one portion of the stainless steel foil 1 by another treatment, The plating lead portion 1 1 k is removed by etching, but the plating lead portion Uk is removed while removing the portion of the stainless steel foil j at the tip end portion, thereby reducing man-hours. Fig. 16 is a flow chart for explaining the advantages of the flexible printed wiring board sheet 50 in the embodiment of the present invention. It is used in combination with the drawings used in the description of the above manufacturing method. (1) Removal of Covering Insulating Layer In the embodiment of the present invention, the plating lead portions provided on the respective flexible printed wiring boards 10 are exposed in the flexible printed wiring board sheet 5 of the present invention. Therefore, in the stage shown in Figs. 6 and 7, the cover insulating layer 3 in a state where the lead portion Ilk is not coated with the shovel 142540.doc -12- 201014477 is prepared in advance. That is, the cover insulating layer 3 is removed in advance at the c-sectional position as in the case of performing the necessary processing, that is, the B-section position of the gold plating process. Instead of the removal step of covering the insulating layer 3, the removal of the insulating layer 3 at the position of the B-section is removed, and the covering insulating layer 3 at the position of the C-section is removed, thereby reducing the number of working hours. When the gold plating layer 15 is formed on the wiring layer at the position of the B section, the photoresist pattern is removed, and as shown in Fig. 11 (:, the plating lead portion Ilk is exposed. The state of the * mineralized lead portion 11k is exposed. (Fig. lie) shows the stage of the top column of the embodiment of the present invention shown in Fig. 16. The plating lead portion Uk is not used after the gold plating treatment is performed. Hereinafter, the (a) process will be described. (2) Etching treatment - In the (al) process, one portion of the plating lead portion 11k and the stainless steel foil at the tip end portion are collectively removed during the etching process. As described above, in the wiring board for a magnetic head, it is necessary The portion of the stainless steel foil of the front end portion is removed. When the necessary etching treatment is performed, the plating lead portion 1 lk can be removed. Therefore, there is no need to separately provide an etching treatment step for removing the rhodium-plated lead portion 11k. , which can be reduced (3) Electrical inspection in the state of the flexible printed wiring board sheet The flexible printed wiring board 1 is electrically isolated from the plating lead portion 丨lk, and can be separately used. The electrical inspection is performed, whereby the defective product can be found at an earlier stage as compared with the case where the defective product is found after being assembled into the intermediate product, thereby improving the manufacturing yield of the intermediate product. The cost of the parts (wiring board) of the intermediate product is suppressed. The result is 142540.doc •13· 201014477. 'The manufacturing cost of the intermediate product manufacturer as the delivery destination can be reduced. The following process is explained, ie, the plating lead portion is made 】 lk exposed, and then not remove the mineral deposit lead Ilk 'but to remove part of the non-mineral pig 1 after delivery. The process is (a2) process. In the process of (a2), at the delivery destination The plating lead portion 丨丨k is separated from the plating frame 21 by any method. Since the plating lead portion Ilk is not covered by the insulating cover layer 3, the cutting of the mineralized lead portion 11k is relatively easy. Cut off, except In addition to the remaining moments, a method such as punching or laser cutting can be used. Since only the plating lead portion 11 k is exposed and the other wiring portions are still covered, the shadow of the burrs and the like can be suppressed. Each flexible printed wiring board can be separated from the plating frame 21 without any trouble, and each flexible printed wiring board 1 can be directly electrically connected to the flexible printed wiring board sheet 5 In this way, the same advantages as the process of (a 1) can be obtained. In the case of the process of (a2), the wire can be cut off at the destination of the delivery, and the flexibility is taken out. In the printed wiring board, the flexible printed wiring board is assembled into an intermediate product. In this case, an electrical inspection is performed in the state of the intermediate product as in the prior art. This process is not active. The advantage of the "flexible printed wiring board sheet which exposes the plating lead portion" in the widest range of the present invention is substantially the same as before. As described above, the present invention includes a range in which the plating lead portion is cut and the flexible printed wiring board is electrically inspected at the time of shipment from the factory, and the above-described non-use is not caused. process. For comparison, the previous flow is shown in FIG. The plating lead portion nk is covered by the cover insulating layer 3, and of course, it is shipped under the state in which the plating lead portion 1 lk remains 142540.doc -14· 201014477. Wherein 'the necessary treatment is performed, i.e., one of the stainless steel '/high 1 of the front end portion is removed. The electrical inspection was performed not on each of the printable printed wiring boards in the state of the sheet, but after the assembly to the intermediate product, the electrical inspection was performed in the state of the intermediate product. If the flow of Fig. 17 is compared with the flow of Fig. 16, the usefulness of the present invention is clearly in the following aspects: (1) ensuring high reliability for flexible printed wiring board sheets, and (2) contributing to The manufacturing yield of the product of the flexible printed wiring board sheet assembled by Tienan. The embodiments and examples of the present invention have been described above, but the embodiments and examples of the invention disclosed above are merely illustrative of the scope of the invention and are not limited to the embodiments of the invention. The scope of the present invention is defined by the scope of the claims, and all modifications within the meaning and scope of the disclosure of the application. According to the present invention, each of the flexible printed wiring boards can be electrically inspected directly in the state of the sheet without particularly providing an extra working time. Therefore, the manufacturing cost is not increased, and the cost of the intermediate product can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a flexible printed wiring board sheet in an embodiment of the present invention; Fig. 2 is a partially enlarged view showing a plating lead portion in the flexible printed wiring board of Fig. 1; 3 is a view showing a state in which a base insulating layer of a polyimide layer is formed on a stainless steel crucible in the manufacture of the flexible printed wiring board sheet of FIG. 1; FIG. 4 is a view showing that a base insulating layer is formed on the base insulating layer. A plan view of the state of the wiring/plating lead portion/plating frame; 142540.doc 15 201014477 FIG. 5 is a cross-sectional view of each portion of FIG. 4, and is the same in the A, B, and c cross-sectional positions; FIG. 6 is the same as After covering the insulating layer for coating, a plan view of a state in which the insulating layer is partially removed for the wiring of the b-section position; FIG. 7 is a cross-sectional view of each part of FIG. 6, and FIG. Fig. 8 is a plan view showing a state in which a photoresist pattern for performing gold deposits on the wiring of the B section is formed; Fig. 9 is a sectional view of each part of Fig. 8, Fig. 9 Department a profile view, figure milk system b profile view, Figure 9 (: system (: sectional view; Fig. 10 is a cross-sectional view of B after gold plating treatment; Fig. 11 is a cross-sectional view after removing the photoresist pattern after the money gold treatment, Fig. 11A is a sectional view of A, @ub#b sectional view, drawing Fig. 12 is a plan view showing a state in which a portion of the plating lead portion and the front end portion of the stainless portion (four) is removed to form a photoresist pattern; Fig. 12 is a cross-sectional view of each portion, and Fig. 13a is a cross section. Fig. 13C is a cross-sectional view of Fig. 13C, and Fig. 13C is a cross-sectional view taken along line C; Fig. 4 is a plan view showing a state in which one part of the stainless steel berth of the core portion and the tip end portion is removed by surname; FIG. 15 is a cross-sectional view of the human body, a cross-sectional view of the HR system B, and a cross-sectional view taken along line C of FIG. 15C. FIG. _ is a view showing the delivery and electrical properties of the flexible printed wiring board sheet according to the embodiment of the present invention. Flow chart of the steps of the inspection; and 142540.doc 16 201014477 Figure 17 is a flow chart showing the steps of the delivery and electrical inspection of the previous flexible printed wiring board sheet. [Main component symbol description] 1 Good steel box 2 Polyimine layer (base insulating layer) 3 covering insulating layer 4 photoresist pattern 6 • 10 photoresist pattern 11 may be a flexible printed circuit board wiring lead portion Ilk plated gold plating layer 15 --21 plating frame 50 flexible printed wiring board sheet exposed root portion K • 142540.doc -17 ·