TWI600072B - Coated film burr removal method - Google Patents
Coated film burr removal method Download PDFInfo
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- TWI600072B TWI600072B TW106102375A TW106102375A TWI600072B TW I600072 B TWI600072 B TW I600072B TW 106102375 A TW106102375 A TW 106102375A TW 106102375 A TW106102375 A TW 106102375A TW I600072 B TWI600072 B TW I600072B
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Description
本發明是有關於一種去除毛邊的方法,特別是指一種鍍膜後之鍍膜毛邊去除方法。 The invention relates to a method for removing burrs, in particular to a method for removing burrs after coating.
在一般鍍膜的製程中,為了防止被鍍物在製程過程中產生移位,通常會使用膠材將被鍍物與承載治具固定,以及非鍍膜區的部分,再進行後續鍍膜的步驟,然而,由於鍍膜後該被鍍物與膠材之間是一連續膜層,要將被鍍物與膠材分離時容易因膠材本身的黏性,而造成分離的位置產生不平整的斷面,即鍍層毛邊,或者是部分的膜層直接從被鍍物表面剝離,造成欠鍍的現象。 In the general coating process, in order to prevent the object to be displaced during the process of the coating, the glue is usually used to fix the object to be plated and the bearing fixture, and the portion of the non-coated area, and then the subsequent coating step, however, Since the plated material and the rubber material are a continuous film layer after the coating, the separation of the object to be coated and the rubber material is likely to result in an uneven section due to the viscosity of the rubber material itself. That is, the burr of the plating layer or a part of the film layer is directly peeled off from the surface of the object to be plated, resulting in underplating.
為了改善鍍層毛邊的現象,習知的一種改善方法是使用黏性較低的膠材來固定被鍍物,然而因膠材黏性不足可能會產生如被鍍物移位或是非鍍膜區的部分產生溢鍍。習知的另一種改善方法是在被鍍物與膠材分離後,於被鍍物與膠材分離的位置上以毛刷、滾輪、塑膠片...等,以刷動的方式去除毛邊,然而此種方式可能會刮傷被鍍物或者是鍍層表面,或是去除後的毛邊因靜電關係或 其他原因而重覆沾黏至被鍍物的其他地方,而導致需再次去除毛邊或是需要再增加額外的處理程序。上述的習知改善方法均可能會造成成品不良,如此一來,不僅導致製程的良率下降,而且花費更多時間及製造成本。 In order to improve the phenomenon of burrs of the coating, a conventional improvement method is to use a less viscous glue to fix the object to be plated. However, due to insufficient adhesion of the glue, a portion such as a plated object or a non-coated portion may be generated. Produce overflow plating. Another improvement method is to remove the burrs by brushing, roller, plastic sheet, etc. at a position where the object to be plated is separated from the glue after the object to be plated is separated from the glue. However, this method may scratch the surface of the object to be plated or the surface of the coating, or the burr after removal may be due to static electricity or For other reasons, it is repeatedly applied to other parts of the object to be plated, which may result in the need to remove the burrs again or require additional processing. The above-mentioned conventional improvement methods may cause defective products, which not only causes a decrease in the yield of the process, but also takes more time and manufacturing costs.
因此,本發明之目的,即在提供一種可節省人力、時間及設備成本,並可提升良率的鍍膜後之毛邊去除方法。 Accordingly, it is an object of the present invention to provide a method for removing burrs after coating which can save manpower, time and equipment costs, and improve yield.
於是,本發明鍍膜後之鍍膜毛邊去除方法,包含下列步驟:(A)準備一基座、一設置於該基座頂面的軟性膠材、一下壓裝置、一鍍膜裝置,及一用於運送該基座的輸送裝置,該軟性膠材具有一厚度,該下壓裝置包括至少一壓桿,將至少一個元件固定於該軟性膠材的頂面。(B)藉由該輸送裝置將該基座輸送進入該鍍膜裝置內,並於該軟性膠材與該至少一元件上形成一連續鍍膜層。(C)藉由該輸送裝置將該基座輸送離開該鍍膜裝置,並將該基座輸送至該下壓裝置的下方,該下壓裝置的該至少一壓桿會以一定的下壓力量朝下移動,並於接觸該至少一元件後向下壓動一下壓深度,接著再朝上移動至未接觸該至少一元件的位置,如此重覆數次,該下壓深度小於該軟性膠材的厚度。(D)將該至少一元件自該軟性膠材取下。 Therefore, the method for removing the burr of the coating after the coating of the present invention comprises the following steps: (A) preparing a pedestal, a soft rubber material disposed on the top surface of the pedestal, a pressing device, a coating device, and a transporting device. The conveying device of the base, the soft rubber material has a thickness, and the pressing device comprises at least one pressing rod for fixing at least one component to the top surface of the soft rubber material. (B) transporting the susceptor into the coating device by the conveying device, and forming a continuous coating layer on the soft rubber material and the at least one component. (C) transporting the susceptor away from the coating device by the conveying device, and conveying the pedestal to the lower portion of the pressing device, the at least one pressing rod of the pressing device is directed to a certain amount of downward pressure Moving downward, and after pressing the at least one component, pressing down the pressing depth, and then moving upward to a position not contacting the at least one component, thus repeating several times, the pressing depth is less than that of the soft rubber material thickness. (D) removing at least one component from the soft gel.
本發明之功效在於:利用該下壓裝置的該至少一壓桿壓動該元件,由於該軟性膠材具有彈性,固定於該軟性膠材的該至少一元件會被向下壓動,重覆壓動數次後,該連續鍍膜層鄰近該至少一元件外周側與該軟性膠材接觸位置的部分會受一剪切力而形成平整的斷面,將該至少一元件自該軟性膠材取下後,該至少一元件表面的鍍膜層不會有毛邊,因此不需額外再進行破壞性的去毛邊作業,可大幅提升良率並且降低人力、時間與設備成本。 The effect of the present invention is that the element is pressed by the at least one pressure bar of the pressing device, and the at least one component fixed to the soft rubber material is pressed downward due to the elasticity of the soft rubber material. After being pressed several times, the portion of the continuous coating layer adjacent to the outer peripheral side of the at least one component in contact with the soft rubber material is subjected to a shearing force to form a flat cross section, and the at least one component is taken from the soft rubber material. After that, the coating layer on the surface of the at least one component does not have burrs, so that no additional deburring operation is required, which can greatly improve the yield and reduce labor, time and equipment costs.
1‧‧‧基座 1‧‧‧Base
2‧‧‧軟性膠材 2‧‧‧Soft rubber
62‧‧‧第二輸送單元 62‧‧‧Second transport unit
8‧‧‧元件 8‧‧‧ components
21‧‧‧通孔 21‧‧‧through hole
3‧‧‧下壓裝置 3‧‧‧Under pressure device
31‧‧‧壓桿 31‧‧‧Press
4‧‧‧鍍膜裝置 4‧‧‧ Coating device
5‧‧‧取料裝置 5‧‧‧Reclaiming device
51‧‧‧頂針 51‧‧‧ thimble
6‧‧‧輸送裝置 6‧‧‧Conveyor
61‧‧‧第一輸送單元 61‧‧‧First conveyor unit
9‧‧‧連續鍍膜層 9‧‧‧Continuous coating
D‧‧‧下壓深度 D‧‧‧Dressing depth
S100‧‧‧步驟 S100‧‧‧ steps
S200‧‧‧步驟 S200‧‧‧ steps
S300‧‧‧步驟 S300‧‧‧ steps
S400‧‧‧步驟 S400‧‧‧Steps
S500‧‧‧步驟 S500‧‧‧Steps
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是本發明鍍膜後之鍍膜毛邊去除方法的一實施例的一流程圖;圖2是該實施例的一基座、一軟性膠材、一下壓裝置、一鍍膜裝置、一取料裝置及一輸送裝置的一側視示意圖;圖3是該實施例的該基座、該軟性膠材、該下壓裝置及該取料裝置的前視示意圖;圖4是一俯視示意圖,說明數元件排列固定於該軟性膠材;圖5是該實施例的一作動示意圖;圖6是該實施例的另一作動示意圖; 圖7是圖6的一局部放大圖;圖8是該實施例的又一作動示意圖;圖9是圖8的一局部放大圖;及圖10是一作動示意圖,說明該取料裝置的頂針向上頂推使數個元件分離該軟性膠材。 Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a flow chart showing an embodiment of a method for removing a burr of a coated film after coating according to the present invention; A side view of a base, a soft rubber material, a pressure pressing device, a coating device, a take-up device and a conveying device; FIG. 3 is the base of the embodiment, the soft rubber material, the FIG. 4 is a top plan view showing a plurality of components arranged and fixed to the soft rubber material; FIG. 5 is a schematic view of the operation of the embodiment; FIG. 6 is another schematic view of the embodiment; a schematic diagram of the operation; Figure 7 is a partial enlarged view of Figure 6; Figure 8 is a further enlarged view of the embodiment; Figure 9 is a partial enlarged view of Figure 8; and Figure 10 is an actuating diagram illustrating the ejector pin of the take-up device Pushing causes several components to separate the soft glue.
如圖1所示,本發明鍍膜後之鍍膜毛邊去除方法的一實施例,包含下列步驟: As shown in FIG. 1, an embodiment of a method for removing a burr of a coated film after coating according to the present invention comprises the following steps:
步驟S100:配合參閱圖2至4,準備一基座1、一設置於該基座1頂面的軟性膠材2、一下壓裝置3、一鍍膜裝置4、一取料裝置5,及一用於輸送該基座1的輸送裝置6,該軟性膠材2的厚度為0.7-0.8mm,且該軟性膠材2頂面具有粘膠層,並包括多數貫穿頂、底面的通孔21,該下壓裝置3包括多數壓桿31,該取料裝置5包括多數頂針51,該輸送裝置6包括一設置於該下壓裝置3的第一輸送單元61,及一設置於該鍍膜裝置4的第二輸送單元62,將多數元件8分別對應於該等通孔21的位置而以黏貼的方式固定於該軟性膠材2的頂面,置放該等元件8是利用一置料機(圖未示)來進行,該等元件8排列成數橫排。 Step S100: Referring to FIGS. 2 to 4, a susceptor 1, a soft rubber material 2 disposed on the top surface of the susceptor 1, a pressure reducing device 3, a coating device 4, a reclaiming device 5, and the like are prepared. The flexible adhesive material 2 has a thickness of 0.7-0.8 mm, and the soft rubber material 2 has an adhesive layer on the top surface thereof, and includes a plurality of through holes 21 extending through the top and bottom surfaces. The pressing device 3 includes a plurality of pressing rods 31. The reclaiming device 5 includes a plurality of ejector pins 51. The conveying device 6 includes a first conveying unit 61 disposed on the pressing device 3, and a first setting unit disposed on the coating device 4. The second transport unit 62 fixes the plurality of components 8 to the top surface of the soft rubber material 2 in a manner corresponding to the positions of the through holes 21, and the components 8 are placed by using a feeder (not shown). The components 8 are arranged in a plurality of rows.
步驟S200:該下壓裝置3的該等壓桿31向下壓動該等元件8一次,以使該等元件8更穩固地黏貼固定於該軟性膠材2,在本實施例中,該等壓桿31是以一次壓動其中一橫排的下壓方式來壓動該等元件8。 Step S200: the pressure bars 31 of the pressing device 3 press the components 8 downwards once, so that the components 8 are more firmly adhered and fixed to the soft rubber 2, in the embodiment, the same The pressing rod 31 presses the elements 8 in a downward pressing manner in which one of the horizontal rows is pressed once.
步驟S300:配合參閱圖2、5,藉由該輸送裝置6的第二輸送單元62將該基座1輸送進入該鍍膜裝置4內,並於該軟性膠材2與該等元件8上形成一連續鍍膜層9,在本實施例中,該連續鍍膜層9的厚度為3-10μm。 Step S300: Referring to FIGS. 2 and 5, the susceptor 1 is transported into the coating device 4 by the second conveying unit 62 of the conveying device 6, and a soft rubber material 2 and the components 8 are formed. In the present embodiment, the continuous plating layer 9 has a thickness of 3 to 10 μm.
步驟S400:配合參閱圖2,藉由該輸送裝置6的第二輸送單元62將該基座1輸送離開該鍍膜裝置4,並藉由該輸送裝置6的第一輸送單元61將該基座1輸送至該下壓裝置3的下方,配合參閱圖6至圖9,該下壓裝置3的每一壓桿31以一定的下壓力量朝下移動,並於接觸其中一元件8後向下壓動一下壓深度D,並停止2秒後,接著再朝上移動至未接觸該元件8的位置,該下壓深度D會小於該軟性膠材2的厚度,在本實施例中,該下壓深度D為0.55-0.65mm,每一壓桿31會重覆壓動其中一元件10次,但並不以此為限,重覆壓動的次數可依鍍膜厚度以及所需產品之品質來做調整。 Step S400: Referring to FIG. 2, the susceptor 1 is transported away from the coating device 4 by the second conveying unit 62 of the conveying device 6, and the pedestal 1 is taken by the first conveying unit 61 of the conveying device 6. It is conveyed to the lower side of the pressing device 3, and with reference to FIG. 6 to FIG. 9, each pressing rod 31 of the pressing device 3 moves downward with a certain amount of downward pressure, and is pressed downward after contacting one of the components 8. After pressing the depth D, and stopping for 2 seconds, then moving up to the position where the element 8 is not touched, the pressing depth D will be smaller than the thickness of the soft rubber 2, in the embodiment, the pressing The depth D is 0.55-0.65mm, and each pressure bar 31 will repeatedly press one of the components 10 times, but not limited thereto. The number of repeated pressing can be made according to the thickness of the coating and the quality of the desired product. Adjustment.
步驟S500:配合參閱圖10,利用該取料裝置5的該等頂針51朝上穿過該軟性膠材2的通孔21後,向上推動該等元件8並 使該等元件8與該軟性膠材2分離,再將該等元件8自該軟性膠材2取下。 Step S500: Referring to FIG. 10, after the ejector pins 51 of the reclaiming device 5 pass upward through the through holes 21 of the soft rubber material 2, the components 8 are pushed up and The elements 8 are separated from the soft glue 2 and the elements 8 are removed from the soft glue 2.
經由該下壓裝置3的該等壓桿31重覆向下壓動該等元件8後,該連續鍍膜層9鄰近該等元件8外周側與該軟性膠材2接觸的部分會因為剪切力作用而斷裂,且斷裂面是平整的(見圖6、7),不會形成毛邊,以該取料裝置5將該等元件8自該軟性膠材2取下後,也不會使該等元件8表面上的鍍膜剝離,後續也不需再進行如用毛刷刷動等破壞性的方式來去除毛邊,除了能縮短製程時間外,更能提升產品的良率。 After the pressing members 31 of the pressing device 3 repeatedly press the members 8 downward, the portion of the continuous coating layer 9 adjacent to the soft rubber material 2 adjacent to the outer peripheral side of the members 8 may be sheared. The function is broken, and the fracture surface is flat (see Figs. 6, 7), and no burrs are formed. After the component 8 is removed from the soft rubber 2 by the reclaiming device 5, the same does not occur. The coating on the surface of the component 8 is peeled off, and the burr is not required to be removed in a destructive manner such as brushing with a brush. In addition to shortening the process time, the yield of the product can be improved.
綜上所述,本發明鍍膜後之鍍膜毛邊去除方法不需進行破壞性的去除毛邊製程,不會刮傷鍍膜層及元件,可大幅提升良率並且降低人力、時間及設備成本,故確實能達成本發明之目的。 In summary, the method for removing the burr of the coating after the coating of the present invention does not require a destructive burr removal process, does not scratch the coating layer and components, can greatly improve the yield and reduce the labor, time and equipment costs, so it can indeed The object of the invention is achieved.
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.
1‧‧‧基座 1‧‧‧Base
2‧‧‧軟性膠材 2‧‧‧Soft rubber
21‧‧‧通孔 21‧‧‧through hole
31‧‧‧壓桿 31‧‧‧Press
8‧‧‧元件 8‧‧‧ components
9‧‧‧連續鍍膜層 9‧‧‧Continuous coating
D‧‧‧下壓深度 D‧‧‧Dressing depth
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TW511260B (en) * | 2000-08-31 | 2002-11-21 | Hitachi Ltd | Semiconductor device and its manufacture method |
TW200302161A (en) * | 2002-01-25 | 2003-08-01 | Jsr Corp | Dual layer laminated film and method for forming patterns by means of the laminated film |
TW550776B (en) * | 2001-07-09 | 2003-09-01 | Hitachi Ltd | Semiconductor device and method of manufacturing the same |
TW200541430A (en) * | 2004-06-07 | 2005-12-16 | Advanced Semiconductor Eng | Method for making a circuit board |
TW200920206A (en) * | 2007-05-29 | 2009-05-01 | Somar Corp | Method for plating wiring board, and wiring board |
TW201403113A (en) * | 2012-07-11 | 2014-01-16 | zhi-min Wu | Lens and its pattern coating film fabrication method |
TWI439187B (en) * | 2008-09-26 | 2014-05-21 | Sumitomo Elec Printed Circuits | Sheet having multi-flexible printed circuit boards and method of producing the same |
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TW511260B (en) * | 2000-08-31 | 2002-11-21 | Hitachi Ltd | Semiconductor device and its manufacture method |
TW550776B (en) * | 2001-07-09 | 2003-09-01 | Hitachi Ltd | Semiconductor device and method of manufacturing the same |
TW200302161A (en) * | 2002-01-25 | 2003-08-01 | Jsr Corp | Dual layer laminated film and method for forming patterns by means of the laminated film |
TWI285591B (en) * | 2002-01-25 | 2007-08-21 | Jsr Corp | Dual layer laminated film and method for forming patterns by means of the laminated film |
TW200541430A (en) * | 2004-06-07 | 2005-12-16 | Advanced Semiconductor Eng | Method for making a circuit board |
TW200920206A (en) * | 2007-05-29 | 2009-05-01 | Somar Corp | Method for plating wiring board, and wiring board |
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