JP2013247136A - Tape and method for processing plate-like object using the tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide tape that prevents chip scattering due to mill ends, that prevents adhesion of paste to chip rear surfaces so as to facilitate pickup of the chips, and that reduces damage to the chips during pickup, and to provide a method for processing a plate-like object using the tape.SOLUTION: Tape is to be stuck on a plate-like object that has: chip regions having chips in respective regions that are defined by a plurality of set intersecting division lines; and a peripheral surplus region that surrounds the chip regions. The tape includes: a substrate sheet that is made of a material having tack force on the plate-like object; and annular paste that is disposed on the substrate sheet corresponding to the peripheral surplus region of the plate-like object on which the tape is to be stuck.

Description

  The present invention relates to a tape attached to a plate-like material such as a wafer and a method for processing a plate-like material using the tape.

  When a plate-like object such as a wafer is cut into individual chips by cutting with a cutting blade, the plate-like object is previously disclosed in, for example, Japanese Patent Application Laid-Open No. 1-297483 in order to facilitate handling of the divided chips. Affixed to an adhesive tape as disclosed.

  Such an adhesive tape is generally constituted by forming a rubber or acrylic paste layer on a base material such as polyolefin, vinyl chloride, polyethylene terephthalate or the like. The plate-like material divided into individual chips is picked up from the adhesive tape and accommodated in the tray.

Japanese Patent Laid-Open No. 1-297483

  However, an adhesive tape having a strong adhesive layer has a problem that it is difficult to pick up a chip. Further, there is a problem that the glue may adhere to the back side of the chip, and the chip adheres to the tray in which the chip is accommodated by the glue attached to the back side of the chip. Further, for example, in a semiconductor wafer thinned to 100 μm or less, there is a possibility that the chip is damaged during pick-up.

  On the other hand, when the plate-like object is cut and divided into a plurality of chips, end materials are formed on the outer peripheral portion. Since the end material is smaller than the chip size, it is easily peeled off from the adhesive tape by the cutting fluid supplied during cutting. In particular, when the plate-like object is circular, a non-rectangular end material is formed, and the non-rectangular end material has a smaller adhesion area to the adhesive tape, and thus is particularly easily peeled off from the adhesive tape.

  When the end material is peeled off from the adhesive tape and collides with the cutting blade, there is a problem that the cutting blade is damaged. Further, the peeled off end material may collide with the upper surface of the plate-like object to form a scratch.

  The present invention has been made in view of the above points, and an object of the present invention is to prevent chip jumping of the end material and to easily pick up the chip by preventing adhesion of glue to the back surface of the chip. Another object is to provide a tape that can reduce chip breakage during pick-up and a plate-like material processing method using the tape.

  According to the first aspect of the present invention, it is attached to a plate-like object having a chip area having a chip in each area defined by a plurality of set intersecting scheduled lines and an outer peripheral surplus area surrounding the chip area. It is a tape to be attached, and is disposed on the base sheet corresponding to the outer peripheral surplus area of the stick-like plate to be attached, and the base sheet made of a material having a tack force against the plate-like object A tape characterized in that it is made of an annular glue made by the method is provided.

  Preferably, a groove corresponding to the annular glue is formed in a region of the base sheet where the annular glue is disposed, and the upper surface of the annular glue and the upper surface of the base sheet are flush with each other. Thus, the annular glue is embedded in the groove. Preferably, the base sheet is made of a fluorinated rubber.

  According to the invention of claim 4, using the tape according to any one of claims 1 to 3, a chip region having a chip in each region partitioned by a plurality of division lines set on the surface; A plate-like material processing method for processing a plate-like material having an outer peripheral surplus region surrounding the chip region on a surface thereof, wherein the tape is plated with the annular glue corresponding to the outer peripheral surplus region of the plate-like material. After sticking to the back surface of the article, the chip region is held in close contact with the base sheet, and the outer peripheral surplus region is fixed with the annular glue, and after the tape sticking step, the plate A cutting step in which a cutting fluid is supplied to the object and the cutting blade, and the cutting blade is cut into the tape together with the plate with the cutting blade along the division line, and the cutting object is divided into individual chips, and the cutting step After carrying out Method for processing a plate-like material characterized by comprising a pickup step for picking up the individual chips from the tape is provided.

  Preferably, the plate-like object is composed of a silicon wafer having a thickness of 100 μm or less.

  The tape of this invention has the base material sheet which has a tack force with respect to a plate-shaped object, and the cyclic | annular glue arrange | positioned on the base material sheet corresponding to the outer periphery excess area | region of a plate-shaped object. Therefore, the chip region of the plate-like material is held in close contact with the tack force of the base sheet during cutting of the plate-like material, and the outer peripheral surplus region where the end material is formed is fixed with an annular glue. The chip can be prevented from jumping, the adhesive can be prevented from adhering to the back surface of the chip, and the chip can be easily picked up and the chip can be prevented from being damaged during the picking up.

1 is a perspective view of a tape according to a first embodiment of the present invention. It is the II-II sectional view taken on the line of FIG. It is the II-II sectional view taken on the line of FIG. 1 of 2nd Embodiment of this invention. It is a disassembled perspective view which shows the tape sticking step using the tape of 3rd Embodiment. It is a partial cross section side view which shows a cutting step. It is a typical top view of the plate-shaped object explaining an end material. It is sectional drawing which shows a pick-up step.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a tape according to a first embodiment of the present invention is shown. The tape 10 is wound around a roll shape 12. The tape 10 is provided with a plurality of, for example, a rubber-based and acrylic-based annular glue 16 spaced apart from each other in the roll winding direction on a base sheet 14 wound in a roll shape.

  The base material sheet 14 is formed of a material such as fluorine-based rubber having a tack force against a plate-like object such as a wafer placed on the base material sheet 14. Here, the fluorinated rubber includes a fluorinated hydrocarbon polymer.

  A separator 18 is disposed on the annular glue 16, and the tape 10 is wound in a roll shape with the annular glue 16 sandwiched between the base sheet 14 and the separator 18. FIG. 2 shows a cross-sectional view taken along the line II-II in FIG.

  As shown in FIG. 4, the plate-like object is composed of, for example, a semiconductor wafer 11. On the surface 11 a of the semiconductor wafer 11, devices 15 such as LSIs are formed in each region partitioned by a plurality of division lines 13 formed in a lattice shape. The semiconductor wafer 11 has a device region 17 in which a plurality of devices 15 are formed, and an outer peripheral surplus region 19 surrounding the device region 17 on the surface 11a.

  However, the plate-like object to which the tape 10 of the present invention is attached is not limited to the semiconductor wafer 11, and does not have a pattern formed on another wafer such as an optical device wafer or the surface, and intersects at the time of division. It also includes a plate-like object that is divided into a plurality of chips by setting a plurality of division lines on the surface.

  The diameter of the annular glue 16 is such that the annular glue 16 is stuck to the outer peripheral surplus area when sticking to a plate-like object having a chip area having a plurality of chips and an outer peripheral surplus area surrounding the chip area. Set to dimensions.

  Referring to FIG. 3, a sectional view taken along line II-II of FIG. 1 of a tape 10A according to a second embodiment of the present invention is shown. In the tape 10A of this embodiment, the annular groove 15 is formed in the base sheet 14, and the annular glue 16 is embedded in the annular groove 15 so that the upper surface of the annular glue 16 and the upper surface of the base sheet 14 are flush with each other. Has been.

  Referring to FIG. 4, there is shown an exploded perspective view showing a tape adhering step using the tape 10B of the third embodiment of the present invention. The tape 10 </ b> B of the present embodiment has a frame fixing annular glue 16 a that is attached to the annular frame F in addition to the annular glue 16 having a diameter corresponding to the outer peripheral surplus region 19 of the semiconductor wafer 11.

  In this tape attaching step, the semiconductor wafer 11 is placed on the tape 10 </ b> B so that the back surface 11 b corresponding to the outer peripheral surplus area 19 of the semiconductor wafer 11 is attached to the annular glue 16.

  Since the base material sheet 14 of the tape 10B is formed of a material such as fluorine rubber having tack force, when the semiconductor wafer 11 is placed on the tape 10B, the back surface 11b of the semiconductor wafer 11 is applied to the tape 10B by the tack force. In close contact.

  Next, the back surface of the annular frame F is attached to the frame fixing annular glue 16 a, and the base sheet 14 of the tape 10 </ b> B is cut into an annular shape in the middle of the annular frame F in the width direction. As a result, the semiconductor wafer 11 is supported by the annular frame F via the tape 10B.

  After the tape sticking step shown in FIG. 4 is performed, the semiconductor wafer 11 is cut to the tape 10B along the planned division line 13, and the cutting step for dividing the semiconductor wafer 11 into individual chips is performed.

  In this cutting step, as shown in FIG. 5, the semiconductor wafer 11 is sucked and held by the chuck table 20 of the cutting device via the tape 10 </ b> B, and the annular frame F is clamped and fixed by the clamp 22.

  Then, the cutting blade 24 rotating at high speed in the direction of arrow A is cut to the tape 10B along the scheduled division line 13 of the semiconductor wafer 11, and the chuck table 20 is moved to the arrow X1 while supplying the cutting fluid to the semiconductor wafer 11 and the cutting blade 24. By processing and feeding in the direction, the semiconductor wafer 11 is completely cut along the planned dividing line 13.

  The semiconductor wafer 11 is completely cut along all the division lines 13 extending in the first direction while indexing and feeding the cutting blades 24 at the pitch of the adjacent division lines 13.

  Next, after the chuck table 20 is rotated by 90 degrees, the same cutting step is repeated along the planned dividing line 13 extending in the second direction orthogonal to the first direction to extend in the second direction. The semiconductor wafer 11 is completely cut along all the division lines 13. As a result, the semiconductor wafer 11 is divided into individual device chips 23.

  Referring to FIG. 6, a schematic plan view of the semiconductor wafer 11 is shown in which the device region 17 is divided into individual device chips 23 and a plurality of non-rectangular end materials 21 are formed in the outer peripheral surplus region 19. Has been.

  As shown in FIG. 7, since the individual device chips 23 divided by the cutting step are in close contact with the base material sheet 14 of the tape 10B by the tack force, the shape of the semiconductor wafer 11 is maintained by the tack force even after the division. I'm leaning. The end material 21 is stuck to the annular glue 16 disposed on the tape 10B.

  Therefore, since the device chip 23 is only in close contact with the tape 10B by the tack force, the device chip 23 can be easily picked up by the pickup collet 26.

  Adhesive adhesion to the device chip 23 is prevented, and damage to the device chip 23 during pickup can be reduced. Furthermore, since the end material 21 is adhered to the annular glue 16, it is possible to prevent the end material 21 from skipping chips.

10, 10A, 10B Tape 11 Semiconductor wafer 13 Scheduled division line 14 Base sheet 15 Device 16 Annular glue 16a Annular glue 17 for frame fixing Device area 19 Excess peripheral area 21 End material 23 Device chip 24 Cutting blade 26 Pickup collet

Claims (5)

A tape that is attached to a plate-like object having a chip area having a chip in each area divided by a plurality of set division lines that intersect, and an outer peripheral surplus area surrounding the chip area,
A base material sheet made of a material having a tack force against a plate-like object;
An annular glue disposed on the base sheet corresponding to the outer peripheral surplus region of the plate-like object to be stuck;
A tape characterized by comprising A groove corresponding to the annular glue is formed in a region of the base sheet where the annular glue is disposed,
The tape according to claim 1, wherein the annular glue is embedded in the groove so that an upper surface of the annular glue and an upper surface of the base sheet are flush with each other.   The tape according to claim 1 or 2, wherein the base sheet is made of fluorine-based rubber. Using the tape according to any one of claims 1 to 3, a chip area having a chip in each area partitioned by a plurality of division lines set on the surface, and an outer peripheral surplus area surrounding the chip area A processing method of a plate-like material for processing a plate-like material having on the surface,
The annular glue is made to correspond to the outer peripheral surplus area of the plate-like object, and the tape is adhered to the back surface of the plate-like article, the chip area is held in close contact with the base sheet, and the outer peripheral surplus area is fixed to the annular glue Tape sticking step to fix with,
After carrying out the tape adhering step, while supplying cutting fluid to the plate and cutting blade, the cutting blade is cut into the tape together with the plate with the cutting blade along the line to be divided into individual chips. A cutting step to divide into
A pickup step for picking up individual chips from the tape after performing the cutting step;
A method for processing a plate-like object comprising:   The plate-like material processing method according to claim 4, wherein the plate-like material is formed of a silicon wafer having a thickness of 100 μm or less.

Images