TWI712669B - Adhesive sheet and method of use - Google Patents

Abstract

The adhesive sheet (100) is characterized in that it has an adhesive layer (3), a first sheet (1) and a second sheet (2) provided on both sides of the adhesive layer (3), and one of the second sheet (2) In a plan view, the first region (21a) including the opposite end or the vicinity of the end and the second region (21b) other than the first region (21a) are peeled from the adhesive layer (3) The properties are different. When the peeling force of the first sheet (1) from the adhesive layer (3) is set to F ₁ , the second sheet (2) in the second area (21b) is separated from the adhesive layer (3) The peeling force of peeling is set to F ₂ , and the peeling force of the second sheet (2) in the first area (21a) is set to F ₃ for peeling from the adhesive layer (3), and the following number is satisfied The condition of formula (F1) is F ₂ <F ₁ <F ₃ ‧‧‧(F1).

Description

Adhesive sheet and method of use

The present invention relates to adhesive sheets and methods of use.

As an adhesive sheet, it is required that the stamping process can be performed stably (work stability). In particular, it is required to perform the operation stability in the step (scrap removal step) of removing parts other than the adhesive layer (scrap part) after the press processing after the press processing of the adhesive layer. More specifically, when the process including the press processing step of the adhesive sheet, the waste removal step, and the bonding step to the adherend is performed by an in-line type device, the adhesive layer When the waste is removed after pressing, it is required to avoid the problem of breakage of the adhesive layer in the middle (hereinafter also referred to as defective removal of waste).

In order to solve the above-mentioned problems, for example, Document 1 (Japanese Patent Application Laid-Open No. 11-181364) proposes an adhesive sheet composed of a surface substrate, an adhesive, and a release sheet. In the adhesive sheet of Document 1, the peeling force (180 degrees) of the surface base material and the adhesive against the peeling sheet is adjusted to a predetermined range.

However, the adhesive sheet of Document 1 cannot sufficiently inhibit the removal of waste bad.

The object of the present invention is to provide an adhesive sheet that can sufficiently suppress poor removal of waste materials and a method of use thereof. More specifically, it provides an adhesive sheet and a method of using the same, which can sufficiently suppress waste when a continuous device is used to carry out the press processing step including the adhesive sheet, the waste removal step, and the bonding step to the adherend. Remove bad.

According to one aspect of the present invention, an adhesive sheet is provided, which is provided with an adhesive layer, a first sheet and a second sheet disposed on both sides of the adhesive layer, and the second sheet includes opposite ends in a plan view. The first area near the end or the first area and the second area other than the first area have different releasability from the adhesive layer. When the first sheet is peeled off from the adhesive layer The force is set to F ₁ , the peeling force of the second sheet in the second area from the adhesive layer is set to F ₂ , the peeling force of the second sheet in the first area from the adhesive layer is set to In the case of F ₃ , the condition F ₂ <F ₁ <F ₃ ‧‧‧(F1) is satisfied in the following formula (F1).

In the adhesive sheet of one aspect of the present invention, it is preferable that a first release layer is provided on the first sheet, the adhesive layer and the first sheet are laminated through the first release layer; and the second sheet is provided The second release layer, the adhesive layer and the second sheet are laminated through the second release layer.

One aspect of the adhesive sheet of the present invention is preferably that the aforementioned adhesive sheet is It is elongated, and the said 1st area|region contains the both ends of the width direction of a plan view of the said 2nd sheet, or the vicinity of the said both ends.

According to one aspect of the present invention, there is provided a method of using an adhesive sheet. The method of using the adhesive sheet of one aspect of the present invention is provided with: the adhesive layer implemented on the adhesive sheet and the second sheet are formed The step of half-cutting the cut to divide the adhesive layer into a press-processed part, a continuous waste part other than the press-processed part, and a step of removing the continuous waste part from the adhesive sheet.

In the method of using the adhesive sheet according to one aspect of the present invention, it is preferable that the punching part is provided in the second area.

According to the present invention, it is possible to provide an adhesive sheet capable of sufficiently suppressing defective removal of waste materials and a method of use thereof.

1‧‧‧The first slice

2‧‧‧Second sheet

3‧‧‧Adhesive layer

4‧‧‧Cut

5‧‧‧Auxiliary belt

11‧‧‧The first substrate sheet

12‧‧‧The first peeling layer

21‧‧‧Second substrate sheet

21a‧‧‧Region 1

21b‧‧‧Region 2

22‧‧‧Second peeling layer

31‧‧‧Stamping Department

32‧‧‧Continuous waste department

100, 100A‧‧‧ adhesive sheet

Fig. 1 is a schematic view showing the adhesive sheet of the first embodiment of the present invention.

Fig. 2 is a cross-sectional view showing the II-II section of Fig. 1.

Fig. 3 is a schematic view showing a state in which a press working part is provided on the adhesive sheet of the first embodiment of the present invention and an auxiliary tape body is attached.

Fig. 4 is a cross-sectional view showing the IV-IV section of Fig. 3.

Fig. 5 is a schematic view showing a state where the continuous waste part is removed from the adhesive sheet of the first embodiment of the present invention.

Fig. 6 is a cross-sectional view showing the VI-VI section of Fig. 5.

Figure 7 shows the arrangement of the adhesive sheet in the second embodiment of the present invention A schematic diagram of the state of the press processing section.

[First Embodiment]

Hereinafter, an embodiment is taken as an example and the present invention is explained based on the drawings. The present invention is not limited to the content of the embodiment. In the drawings, for the sake of ease of description, there are parts that are shown enlarged or reduced.

(Adhesive sheet)

First, the adhesive sheet of this embodiment will be described.

The adhesive sheet 100 of this embodiment is elongated (belt-shaped) as shown in FIGS. 1 and 2, and includes a first sheet 1, a second sheet 2, and an adhesive layer 3. The first sheet 1 and the second sheet 2 are provided on both sides of the adhesive layer 3.

The first sheet 1 includes a first base sheet 11 and a first release layer 12. The first sheet 1 and the adhesive layer 3 are laminated through the first release layer 12. The second sheet 2 includes a second base sheet 21 and a second release layer 22. The second sheet 2 and the adhesive layer 3 are laminated through the second release layer 22.

The second sheet 2 has a first area 21a and a second area 21b in a plan view. The peelability from the adhesive layer 3 in the first region 21a is different from the peelability from the adhesive layer 3 in the second region 21b. In addition, the first region 21a includes opposite ends, that is, both ends of the second sheet 2 in the width direction in a plan view. More specifically, zone 1 21a is in the vicinity of both ends of the second sheet 2 in the width direction in a plan view, and is provided continuously along the both ends in the entire length direction.

In the adhesive sheet 100 of this embodiment, when the peeling force of the first sheet 1 peeled from the adhesive layer 3 is set to F ₁ , the peeling force of the second sheet 2 in the second area 21b is set to peel off from the adhesive layer 3 Is F ₂ and the peeling force of the second sheet 2 in the first region 21a from the adhesive layer 3 is set to F ₃ , and the following formula (F1) is satisfied: F ₂ <F ₁ <F ₃ ‧ ‧‧(F1).

When the aforementioned condition (F1) is not satisfied, the press-worked part 31 is easily peeled from the first sheet 1 in the waste removal step, and it becomes difficult to leave the press-worked part 31 on the first sheet 1. In addition, in the waste removal step, the adhesive layer 3 constituting the continuous waste portion 32 is likely to remain on the first sheet 1 side.

The peeling force F ₁ , the peeling force F ₂ and the peeling force F _{3 are} , for example, a sample (width: 100 mm, length: 100 mm) containing the sheet to be peeled (first sheet 1 or second sheet 2) and the adhesive layer 3 Fix and use a tensile tester to stretch the peeling target sheet in the direction of 180° at a speed of 300 mm/min. The peeling force at the interface between the peeling target sheet and the adhesive layer 3 (unit: mN/ 100mm).

The measuring methods of peeling force F ₁ , peeling force F ₂ and peeling force F ₃ are not limited to the above-mentioned methods. When the peeling force is too large or too small, the above method cannot be used for measurement. In this case, the measurement conditions (sample size, speed, etc.) of the peeling force can be appropriately changed to investigate the relationship between the peeling force F ₁ , the peeling force F _2, and the peeling force F ₃ . In addition, for example, when the peeling force is too large to measure the peeling force, it can be said that the peeling force of the sample is greater than the peeling force of the sample capable of measuring the peeling force.

The peeling force F ₁ and the peeling force F ₂ can be changed by, for example, changing the formula or thickness of the peeling layer provided on the first sheet 1 and the second sheet 2, or changing the type or thickness of the first sheet 1 and the second sheet 2 To make adjustments.

The peeling force F ₃ can be adjusted by, for example, any of the following methods (i) to (v). That is, make a greater peel force in the second sheet 21a of the first region 2 F ₃ F ratio of the peel force of the second region 21b _2.

(i) The second peeling layer 22 is not provided in the first region 21a of the second sheet 2 (refer to FIG. 2).

(ii) The second peeling layer 22 in the first region 21a of the second sheet 2 is subjected to modification treatments such as corona treatment and plasma treatment.

(iii) The effect of the second peeling layer 22 in the first area 21a of the second sheet 2 is inactivated.

(iv) The first region 21a of the second sheet 2 is subjected to UV irradiation or the like to re-peel it.

(v) The second release layer 22 in the second area 21b of the second sheet 2 and the second release layer 22 in the first area 21a are formed using different release agents.

(1st sheet and 2nd sheet)

The first sheet 1 used in this embodiment includes a first base sheet 11 and a first release layer 12. In addition, the second sheet 2 used in this embodiment includes a second base sheet 21 and a second release layer 22.

The thickness of the first sheet 1 is not particularly limited, but is usually 20 μm or more and 250 μm or less, preferably 38 μm or more and 100 μm or less.

The thickness of the second sheet 2 is not particularly limited, but is usually 20 μm or more and 250 μm or less, preferably 25 μm or more and 75 μm or less, and more preferably 25 μm or more and 50 μm or less.

As the first base material sheet 11 and the second base material sheet 21, a resin film, paper, and the like can be cited. Examples of resins as resin films include polyethylene terephthalate, polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymers, and poly(p-phenylene) Butylene dicarboxylate, polyurethane, ethylene-vinyl acetate copolymer, ionic polymer resin, ethylene (meth) acrylic copolymer, polystyrene, polycarbonate, fluororesin, low density polyethylene, linear low density poly Ethylene, and cellulose triacetate, etc. Examples of paper include Daolin paper, coated paper, cellophane, and laminated paper. These can be used individually by 1 type, and can also use 2 or more types together. Among them, a polyethylene terephthalate film is preferred from the viewpoint of being inexpensive and having elasticity.

The first release layer 12 and the second release layer 22 can be formed using a release agent.

Examples of such release agents include silicone resins, fluorine resins, and long-chain alkyl resins. These can be used individually by 1 type, and can also use 2 or more types together. Among them, a silicone-based resin is preferred from the viewpoint of being inexpensive and capable of obtaining stable performance.

The thickness of the first release layer 12 or the second release layer 22 is preferably 0.01 μm or more and 2.0 μm or less, and more preferably 0.05 μm or more and 0.5 μm or less. under.

(Adhesive layer)

The adhesive layer 3 used in this embodiment can be formed using a known adhesive. The adhesive is not particularly limited, and examples include acrylic adhesives, rubber-based adhesives, silicone-based adhesives, polyurethane-based adhesives, polyester-based adhesives, epoxy-based adhesives, and polyamides. Imine-based adhesives, etc. These can be used individually by 1 type, and can also use 2 or more types together. Such an adhesive can be appropriately selected according to the purpose of the adhesive sheet. In addition, this adhesive may contain hardening aids, energy beam hardening components, and other resin components as necessary.

For example, when the application of the adhesive sheet is the film-like adhesive used in the die bond step of the chip or the underfill sheet used in the flip chip assembly, it is used as the adhesive The agent is preferably an epoxy-based adhesive or a polyimide-based adhesive.

The use of the adhesive sheet is a dicing die bonding film that has both the wafer fixing function during dicing and the die bonding function during die bonding. As an adhesive, it is preferably an adhesive containing acrylic polymer or the like (Binder) components and epoxy adhesives, and if necessary, materials containing energy beam curable compounds, energy beam curable polymers, and curing aids can be used.

When the adhesive sheet is used as a protective film on the back of a semiconductor wafer, as the adhesive, it is preferably an adhesive containing acrylic polymer or the like Ingredients, epoxy-based adhesives and hardening aids, and, as necessary, materials containing energy beam hardening compounds, energy beam hardening polymers, fillers, and coloring agents can be used.

The thickness of the adhesive layer 3 can be selected in various ways depending on its use. From the viewpoint of workability during press processing, it is preferably 1 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less, and particularly preferably 10 to 100 μm.

(How to use the adhesive sheet)

First, the method of using the adhesive sheet of this embodiment will be explained.

The method of using the adhesive sheet of the present embodiment is the method of using the adhesive sheet 100 of the present embodiment, and includes the press processing step and the waste removal step described below.

In the press processing step, as shown in FIGS. 3 and 4, the adhesive layer 3 and the second sheet 2 of the adhesive sheet 100 are half-cut to form a cut 4, and the adhesive layer 3 is divided into the press processing part 31. Continuous scrap part 32 other than the stamping part 31.

As shown in FIG. 3, the punching part 31 is preferably provided in the second region 21 b of the second sheet 2. In addition, the press-processed part 31 is provided in plural positions over the entire length direction of the adhesive sheet 100.

The half-cutting in the stamping process refers to forming the cut 4 in such a way that the adhesive sheet 100 is not cut. The adhesive layer 3 and the second sheet 2 are cut by the cut 4, but the first sheet 1 is not cut. The cut 4 is from the second sheet 2 side of the adhesive sheet 100 through the second sheet 2 and the adhesive layer 3 and reach the first sheet 1. The cut 4 only needs to reach at least the interface between the adhesive layer 3 and the first sheet 1, but it is preferable to completely cut the adhesive layer 3 and form a cut on the surface of the first sheet 1.

In this half-cutting, a known punching knife can be suitably used.

The half cutting in the press working step is performed on the entire circumference of the press working part 31 to provide the press working part 31.

The portion other than the press-processed portion 31 is a continuous scrap portion 32 that is peeled off when the second sheet 2 is peeled from the adhesive sheet 100.

After the punching process, as shown in FIGS. 3 and 4, an auxiliary tape body bonding step in which an auxiliary tape body 5 is provided on the surface of the second sheet 2 of the adhesive sheet 100 may be performed.

By bonding the auxiliary belt body 5 along the entire length direction, the second sheet 2 with the cut 4 formed can be integrated. Therefore, in the waste removal step described later, the second sheet 2 on the surface of the adhesive layer 3 can be peeled off.

As the auxiliary tape body 5, a known tape can be used.

In the waste removal step, as shown in FIGS. 5 and 6, the continuous waste portion 32 is peeled from the first sheet 1, and the continuous waste portion 32 is removed from the adhesive sheet 100.

The continuous waste portion 32 is removed together with the second sheet 2 and the auxiliary belt body 5. By removing the continuous waste part 32 from the adhesive sheet 100, as shown in FIG. 5, an adhesive film cut into the shape of the punched part 31 can be obtained.

Here, the shape of the press-processed part 31 in a plan view is not particularly limited, and can be appropriately changed according to the purpose of use. As a stamping part 31 The shape in plan view includes a polygonal shape (triangular, quadrangular, pentagonal, etc.), a circular shape, an elliptical shape, and a star shape.

The adhesive film obtained in this way can be used in various applications, such as film-like adhesives used in the die bonding step of wafers, dicing die bonding films, underfill sheets, backside protection films for semiconductor wafers, etc.

In the method of using the adhesive sheet of the present embodiment, after the waste removal step, a bonding step of bonding the press processing part 31 to the adherend may be provided. In this bonding step, the first sheet 1 is peeled off, and the press-processed part 31 is bonded to the adherend.

In addition, in the method of using the adhesive sheet of the present embodiment, it is preferable that the press processing step, the waste removal step, and the bonding step are continuously performed by a continuous device.

(Effects of the first embodiment)

According to this embodiment, the following effects can be achieved.

(1) The continuous waste portion 32 and the second sheet 2 are removed together. In the area including the first area 21 a, the continuous waste portion 32 is bonded to the first sheet 1 and the second sheet 2. Further, compared to the peel force of the first sheet from the adhesive layer 3 is peeled F _1, the first region 21a of the second sheet 2 F ₃ 3 larger peel force from the release of the adhesive layer 1. Therefore, in the waste removal step, the adhesive layer 3 constituting the continuous waste portion 32 can be suppressed from remaining on the first sheet 1 side. In this way, it is possible to sufficiently suppress defective removal of waste.

(2) than in the second region 21b of the second sheet from peeling force F 2 of the adhesive layer 3 release _2, a first sheet from the adhesive layer 13 of the peel force F ₁ of larger peeled. Therefore, in the waste removal step, the punched portion 31 can be left on the first sheet 1.

(3) In this embodiment, it is preferable that the press processing step, the waste removal step, and the bonding step are continuously performed by a continuous device. In this way, a series of steps are continuously performed, the adhesive sheet 100 can be used efficiently, and workability and productivity can be improved.

[Second Embodiment]

Next, the second embodiment of the present invention will be described based on the drawings.

In this embodiment, except that the adhesive sheet 100A is used instead of the adhesive sheet 100, it has the same structure as the first embodiment. Therefore, only the adhesive sheet 100A and its method of use will be described, and other descriptions will be omitted.

The adhesive sheet 100A of this embodiment is elongated as shown in FIG. 7 and includes a first sheet 1, a second sheet 2, and an adhesive layer 3. The first sheet 1 and the second sheet 2 are provided on both sides of the adhesive layer 3.

The second sheet 2 has a first area 21a and a second area 21b as shown in FIG. 7 in a plan view. The first region 21a and the second region 21b have different releasability from the adhesive layer 3. In addition, the first region 21a includes both ends of the second sheet 2 in the width direction in a plan view. Moreover, the first area 21a is not only provided on the width side of the second sheet 2 in a plan view. The first region 21a is provided in the vicinity of both ends of the direction, in a part of the longitudinal direction in the plan view, and even in the vicinity of the center in the width direction in the plan view. More specifically, in a plan view, the first region 21a is provided in the portion between the plurality of press-processed portions 31 even in the vicinity of the center in the width direction.

In the press processing step of the method of using the adhesive sheet of the present embodiment, as shown in FIG. 7, a half-cut is performed to form a cut 4 on the adhesive layer 3 and the second sheet 2 of the adhesive sheet 100A, and press processing is set部31. At this time, as shown in FIG. 7, the press-processed part 31 is provided in the second region 21 b of the second sheet 2.

(Effects of the second embodiment)

According to this embodiment, the same effect as the effect (1) to (3) of the aforementioned first embodiment can be exhibited, and the following effect (4) can also be exhibited.

(4) The first area 21a is not only provided near both ends of the second sheet 2 in the width direction in plan view, but also in a part of the length direction in plan view, and even near the center in the width direction in plan view. 1 area 21a. Therefore, in the second embodiment, the area of the first region 21a becomes larger than the area of the first region 21a of the aforementioned first embodiment. In this way, in the waste removal step, it is possible to more reliably prevent the adhesive layer 3 constituting the continuous waste portion 32 from remaining on the first sheet 1 side.

[Transformation of the embodiment]

The present invention is not limited to the foregoing embodiments, and can reach the cost of the invention Modifications and improvements within the scope of the purpose are also included in the present invention.

For example, in the foregoing embodiment, the adhesive film cut into a predetermined shape is used as a thin film adhesive used in the die bonding step of a wafer, a dicing die bonding film, an underfill sheet, and a semiconductor wafer The adhesive film used for the back surface protective film etc., but it is not limited to this. Examples of the use of the adhesive film cut into a predetermined shape include labels, stickers, wappen, and the like.

In the aforementioned embodiment, the first region 21a is provided so as to include both ends of the second sheet 2 in the width direction in a plan view, but it is not limited to this. For example, the first region 21a can also be provided so as not to include both ends of the second sheet 2 in the width direction in a plan view, but to include the vicinity of the both ends.

In the foregoing embodiment, the adhesive layer 3 is provided on the entire surface in a plan view, but it is not limited to this. For example, in a plan view, the adhesive layer 3 may have a space where no adhesive exists.

In the aforementioned second embodiment, as shown in FIG. 7, in a plan view, the two first regions 21a including the ends are provided in the vicinity of the center in the width direction in the portions between the plurality of press-processed portions 31. In addition, these two first regions 21a are separated from a portion between the plurality of press-worked portions 31, but it is not limited to this. In the portion between the plurality of press-processed portions 31, the two first regions 21a including the ends may be provided in the vicinity of the center in the width direction and may be connected to each other. In this case, in addition to the continuous waste parts 32 at both ends, even the continuous waste parts 32 connected between the plurality of press-processed parts 31 can prevent defective waste removal. Such as Therefore, in the waste removal step, it is possible to more reliably prevent the adhesive layer 3 constituting the continuous waste portion 32 from remaining on the first sheet 1 side.

Example

Next, the present invention will be explained in more detail using examples and comparative examples, but the present invention is not limited to these examples.

[Example 1]

As the first sheet, the following heavy release sheet was prepared, and as the second sheet, the following light release sheet was prepared. The first sheet and the second sheet are elongated sheets.

. 1st sheet (heavy peeling sheet)

Product name: SP-PET38T124-2, manufactured by Lindk Co., Ltd.

Thickness: 38μm

The material of the substrate sheet: Polyethylene terephthalate (PET)

. 2nd sheet (light peeling sheet)

Product name: SP-PET381031, manufactured by Lindk Co., Ltd.

Thickness: 38μm

The material of the substrate sheet: Polyethylene terephthalate (PET)

Treatment of the peeling layer: Yes (in the vicinity of both ends in the width direction of the peeling layer, plasma treatment is applied to the areas along the both ends to form the first area).

Next, an adhesive layer having a thickness of 25 μm after drying was formed between the first sheet and the second sheet to obtain an adhesive sheet. Specifically, first, the adhesive is applied by a knife coater so that the thickness after drying becomes 25 μm on the first sheet (heavy release sheet), and then dried to form an adhesive layer. Next, the second sheet (light release sheet) is laminated and wound to obtain a long adhesive sheet.

Next, the obtained long adhesive sheet was cut to a width of 230 mm. The first area formed on the second sheet (light release sheet) includes both ends of the second sheet in the width direction in a plan view, and the distance from the end is about 10 mm.

In addition, the peeling force F ₁ of the first sheet from the adhesive layer and the peeling force F ₂ of the second sheet from the adhesive layer in the second area were measured using a tensile tester under the following conditions As a result, the peeling force F ₁ was 492 mN/100 mm, and the peeling force F ₂ was 156 mN/100 mm. When the case of the embodiment and the known plasma treatment, the peel force becomes very large, the second sheet can be concluded in the first area of the peel force F ₃ adhesive layer is greater than the peel force F. _1.

The size of the sample: width 100mm×length 100mm

Stretching speed: 300mm/min

Stretching direction: 180° direction

For the obtained adhesive sheet, using an LC tape laminating device (manufactured by Lindeco Co., Ltd., "RAD-3600F/12"), the adhesive layer and the second sheet were half-cut to form cuts under the following conditions. This set up a circular stamping part and a continuous scrap part other than the stamping part. Then remove the continuous waste from the adhesive sheet. As a result of confirming the state of the adhesive layer at this time, the fracture of the adhesive layer in the continuous scrap part and the separation of the adhesive layer in the press processing part did not occur.

Temperature inside the device: 30℃

Diameter of the stamping part: 200mm

Feeding speed: 20mm/sec

[Comparative Example 1]

The adhesive sheet was obtained in the same manner as in Example 1, except that the first area was not formed in the second sheet.

Furthermore, with respect to the obtained adhesive sheet, as in Example 1, the continuous waste part was removed from the adhesive sheet. As a result of confirming the state of the adhesive layer at this time, the width direction end of the adhesive layer of the continuous scrap portion could not be peeled from the heavy peeling sheet, and it was broken after extending in the longitudinal direction.

According to the comparison result of Example 1 and Comparative Example 1, it can be clearly confirmed that when the peeling force F ₁ , the peeling force F ₂ and the peeling force F ₃ satisfy the conditions of the aforementioned formula (F1) (Example 1), it can be sufficiently suppressed Poor waste removal. On the other hand, in the adhesive sheet used, when the second sheet did not provide two regions with different releasability from the adhesive layer (Comparative Example 1), it was not possible to suppress defective removal of waste.

[Example 2]

As the second sheet, the following light release sheet was used, and the handling of the release layer was changed as follows, except that it was obtained in the same manner as in Example 1 Adhesive flakes.

. 2nd sheet (light peeling sheet)

Product name: SP-PET381031, manufactured by Lindk Co., Ltd.

Thickness: 38μm

The material of the substrate sheet: polyethylene terephthalate (PET)

Treatment of the peeling layer: Yes (in the vicinity of both ends in the width direction of the peeling layer, except for the area along the two ends, in the part between the plurality of punching parts in the plan view, including the widthwise center The region (see FIG. 7) is also subjected to plasma treatment, thereby forming the first region).

Furthermore, with respect to the obtained adhesive sheet, as in Example 1, the continuous waste part was removed from the adhesive sheet. As a result of confirming the state of the adhesive layer at this time, the breakage of the adhesive layer in the continuous scrap part and the separation of the adhesive layer in the press processing part did not occur.

1‧‧‧The first slice

2‧‧‧Second sheet

3‧‧‧Adhesive layer

11‧‧‧The first substrate sheet

12‧‧‧The first peeling layer

21‧‧‧Second substrate sheet

21a‧‧‧Region 1

21b‧‧‧Region 2

22‧‧‧Second peeling layer

100‧‧‧Adhesive sheet

Claims (5)

An adhesive sheet, characterized in that it is provided with an adhesive layer, a first sheet and a second sheet provided on both sides of the adhesive layer, and the second sheet includes opposite ends or the ends in a plan view The first area near the first area and the second area other than the first area have different peelability from the adhesive layer. When the peeling force of the first sheet peeled from the adhesive layer is set to F ₁ If the peeling force of the second sheet in the second area from the adhesive layer is set to F ₂ , and the peeling force of the second sheet in the first area from the adhesive layer is set to F ₃ ，Satisfy the following formula (F1) condition F ₂ <F ₁ <F ₃ ‧‧‧(F1). The adhesive sheet according to claim 1, wherein a first release layer is provided on the first sheet, the adhesive layer and the first sheet are laminated through the first release layer, and the second sheet is provided with a 2 release layer, the adhesive layer and the second sheet are laminated through the second release layer. The adhesive sheet according to claim 1 or claim 2, wherein the adhesive sheet is elongated, and the first area includes the two ends of the second sheet in the width direction in a plan view or the two ends Near. A method of using an adhesive sheet is to use the adhesive sheet described in any one of Claims 1 to 3, characterized in that it has: Perform a half-cut of the adhesive layer and the second sheet of the adhesive sheet to form a cut mark to divide the adhesive layer into a press-processed part, a continuous waste part other than the press-processed part, and from the adhesive The step of removing the aforementioned continuous waste part by the sheet. The method of using the adhesive sheet according to claim 4, wherein the punching part is provided in the second area.

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