TWI724109B - Adhesive sheet and method of use - Google Patents

Abstract

A long strip of adhesive sheet (100) provided with an adhesive layer (3), a first sheet (1) and a second sheet (2) provided on both sides of the adhesive layer (3). In the vicinity of both ends of the first sheet (1) in the width direction in a plan view, a first cut (41) is provided along the two ends. When the first sheet (1) is removed from the adhesive layer ( 3) When the peeling force of the peeling is set to F ₁ and the peeling force of the second sheet (2) from the adhesive layer (3) is set to F ₂ , the condition of the following formula (F1) is satisfied F ₂ < F ₁ . . . (F1).

Description

Adhesive sheet and method of use

The present invention relates to adhesive sheets and methods of use.

As an adhesive sheet, it is required that the stamping process can be performed stably (work stability). In particular, it is required to perform the operation stability in the step (scrap removal step) of removing parts other than the adhesive layer (scrap part) after the press processing after the press processing of the adhesive layer is performed. More specifically, when the process including the press processing step of the adhesive sheet, the waste removal step, and the bonding step to the adherend is performed by an in-line type device, the adhesive layer When the waste is removed after stamping, it is required to avoid the problem of breakage of the adhesive layer in the middle (hereinafter also referred to as defective removal of waste).

In order to solve the aforementioned problems, for example, Document 1 (Japanese Patent Application Laid-Open No. 11-181364) proposes an adhesive sheet composed of a surface substrate, an adhesive, and a release sheet. In the adhesive sheet of Document 1, the peeling force (180 degrees) of the surface base material and the adhesive with respect to the peeling sheet is adjusted to a predetermined range.

However, the adhesive sheet of Document 1 cannot sufficiently inhibit the removal of waste bad.

The object of the present invention is to provide an adhesive sheet that can sufficiently suppress poor removal of waste materials and a method of use thereof. More specifically, it is to provide an adhesive sheet and a method of use thereof, which can sufficiently suppress waste when a continuous device is used to carry out a process including a press processing step of an adhesive sheet, a waste removal step, and a bonding step to an adherend. Remove the bad.

According to one aspect of the present invention, there is provided an adhesive sheet, which is an elongated adhesive sheet provided with an adhesive layer, a first sheet and a second sheet provided on both sides of the adhesive layer, in the presence of the first sheet In the vicinity of both ends in the width direction in a plan view, a first cut is provided along the both ends, and when the peeling force of the first sheet from the adhesive layer is set to F ₁ , the second sheet When the peeling force from the adhesive layer is set to F _{2 , the condition F 2} <F _{1 of the} following formula (F1) is satisfied. . . (F1).

In the adhesive sheet of one aspect of the present invention, it is preferable that a first release layer is provided on the first sheet, and the adhesive layer and the first sheet are laminated through the first release layer; and the second sheet is provided The second release layer, the adhesive layer and the second sheet are laminated through the second release layer.

In the adhesive sheet of one aspect of the present invention, it is preferable that the first cut mark passes through the first sheet from the first sheet side of the adhesive sheet and reaches the adhesive layer.

In the adhesive sheet of one aspect of the present invention, it is preferable that the first cut is continuously provided in the entire length direction of the first sheet in a plan view.

In the adhesive sheet of one aspect of the present invention, it is preferable that, in a plan view, a space portion where no adhesive is present is formed in the adhesive layer.

According to one aspect of the present invention, a method of using an adhesive sheet is provided. The method of using the adhesive sheet of one aspect of the present invention includes: the adhesive layer implemented on the adhesive sheet and the second sheet forming a first 2 The step of half-cutting the cut to divide the adhesive layer into a press-processed part, a continuous waste part other than the press-processed part, and a step of removing the continuous waste part from the adhesive sheet.

According to one aspect of the present invention, there is provided a method of using an adhesive sheet, which includes an adhesive layer, a first sheet and a second sheet provided on both sides of the adhesive layer. Equipped with: implementing a half-cut to form a first cut on the first sheet of the adhesive sheet, and providing the first cut along the both ends in the vicinity of both ends of the first sheet in the width direction in a plan view In the step of obtaining an adhesive sheet of one aspect of the present invention, the adhesive layer of the adhesive sheet and the second sheet are half-cut to form a second cut to divide the adhesive layer into stamping parts , The step of the continuous waste part other than the press processing part, and the step of removing the continuous waste part from the adhesive sheet.

In the method of using the adhesive sheet according to one aspect of the present invention, it is preferable that the punched part is provided on the inner side of the first cut in a plan view.

The method of using the adhesive sheet of one aspect of the present invention is preferably when In the case where the adhesive layer is formed with a space part where there is no adhesive, in a plan view, the press processing part is provided so that the space part overlaps the continuous waste part.

The method of using the adhesive sheet according to one aspect of the present invention preferably further comprises: in a plan view, a step of forming a space without an adhesive in the adhesive layer, and in a plan view, the space is overlapped with the aforementioned space. The aforementioned stamping part is provided as a continuous waste part.

According to the present invention, it is possible to provide an adhesive sheet capable of sufficiently suppressing defective removal of waste materials and a method of use thereof.

1‧‧‧The first slice

1a‧‧‧Part of the first sheet

2‧‧‧Second sheet

3‧‧‧Adhesive layer

3a‧‧‧Ministry of Space

5‧‧‧Auxiliary belt

11‧‧‧The first substrate sheet

12‧‧‧The first peeling layer

21‧‧‧Second substrate sheet

22‧‧‧Second peeling layer

41‧‧‧The first cut

42‧‧‧Second cut

100, 100A‧‧‧Adhesive sheet

Fig. 1 is a schematic view showing the adhesive sheet of the first embodiment of the present invention.

Fig. 2 is a cross-sectional view showing the II-II section of Fig. 1.

Fig. 3 is a schematic view showing a state in which a press working part is provided on the adhesive sheet of the first embodiment of the present invention and an auxiliary tape body is attached.

Fig. 4 is a cross-sectional view showing the IV-IV section of Fig. 3.

Fig. 5 is a schematic view showing a state where the continuous waste part is removed from the adhesive sheet of the first embodiment of the present invention.

Fig. 6 is a cross-sectional view showing the VI-VI section of Fig. 5.

Fig. 7 is a schematic view showing the adhesive sheet of the second embodiment of the present invention.

[First Embodiment]

Hereinafter, an embodiment is taken as an example and the present invention will be explained based on the drawings. The present invention is not limited to the content of the embodiment. In the drawings, for the sake of ease of description, there are parts that are enlarged or reduced to be illustrated.

(Adhesive sheet)

First, the adhesive sheet of this embodiment will be described.

The adhesive sheet 100 of this embodiment is elongated (belt-shaped) as shown in FIG. 1, and includes a first sheet 1, a second sheet 2, and an adhesive layer 3. The first sheet 1 and the second sheet 2 are provided on both sides of the adhesive layer 3.

The first sheet 1 includes a first base sheet 11 and a first release layer 12. The first sheet 1 and the adhesive layer 3 are laminated through the first release layer 12. The second sheet 2 includes a second base sheet 21 and a second release layer 22. The second sheet 2 and the adhesive layer 3 are laminated through the second release layer 22.

In the first sheet 1, as shown in FIGS. 1 and 2, in the vicinity of both ends in the width direction in a plan view, first cuts 41 are provided along both ends. The first cut 41 is continuously provided in the entire longitudinal direction of the first sheet 1 in a plan view. The first cut 41 passes through the first sheet 1 from the first sheet 1 side of the adhesive sheet 100 and reaches the adhesive layer 3. The first cut 41 only needs to reach at least the interface between the first sheet 1 and the adhesive layer 3.

In the adhesive sheet 100 of this embodiment, when the peeling force of the first sheet 1 from the adhesive layer 3 is set to F ₁ , the peeling force of the second sheet 2 from the adhesive layer 3 is set to F ₂ The situation is that the condition F ₂ <F _{1 of the} following formula (F1) is satisfied. . . (F1).

When the condition of the aforementioned formula (F1) is not satisfied, the press-worked part 31 is easily peeled from the first sheet 1 in the waste removal step, and it becomes difficult to leave the press-worked part 31 on the first sheet 1.

The peeling force F ₁ and the peeling force F _{2 are} , for example, a sample (width: 100mm, length: 100mm) containing the peeling target sheet (first sheet 1 or second sheet 2) and adhesive layer 3 (width: 100mm, length: 100mm) is fixed and stretched The testing machine stretches the peeling target sheet in the 180° direction at a speed of 300 mm/min, thereby measuring the peeling force (unit: mN/100mm) at the interface between the peeling target sheet and the adhesive layer 3.

The force F F Determination of peel _{force. 1} and ₂ the peeling is not limited to the method described above. When the peeling force is too large or too small, the above method cannot be used for measurement. In this case, the peel force measurement conditions (sample size and speed) is appropriately changed to investigate the peeling force and peel _{force. 1} F F ₂ magnitude relation. In addition, for example, when the peeling force is too large to measure the peeling force, it can be said that the peeling force of the sample is greater than the peeling force of the sample for which the peeling force can be measured.

The peeling force F ₁ and the peeling force F ₂ can be changed by, for example, changing the formula or thickness of the peeling layer provided on the first sheet 1 and the second sheet 2, or changing the type or thickness of the first sheet 1 and the second sheet 2 To make adjustments.

(1st and 2nd sheets)

The first sheet 1 used in this embodiment includes a first base sheet 11 and a first release layer 12. In addition, the second sheet 2 used in this embodiment includes a second base sheet 21 and a second release layer 22.

The thickness of the first sheet 1 is not particularly limited, but is usually 20 μm or more and 250 μm or less, preferably 38 μm or more and 100 μm or less.

The thickness of the second sheet 2 is not particularly limited, but is usually 20 μm or more and 250 μm or less, preferably 25 μm or more and 75 μm or less, and more preferably 25 μm or more and 50 μm or less.

Examples of the first base material sheet 11 and the second base material sheet 21 include resin films, paper, and the like. Examples of resins for the resin film include polyethylene terephthalate, polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymers, and poly(p-phenylene). Butylene dicarboxylate, polyurethane, ethylene-vinyl acetate copolymer, ionic polymer resin, ethylene (meth) acrylic copolymer, polystyrene, polycarbonate, fluororesin, low-density polyethylene, linear low-density poly Ethylene, and cellulose triacetate, etc. Examples of paper include Daolin paper, coated paper, cellophane, laminated paper, and the like. These can be used individually by 1 type, and can also use 2 or more types together. Among them, a polyethylene terephthalate film is preferred from the viewpoint of being inexpensive and having elasticity.

The first release layer 12 and the second release layer 22 can be formed using a release agent.

Examples of such a release agent include silicone-based resins, fluorine-based resins, and long-chain alkyl-based resins. These can be used individually by 1 type, and can also use 2 or more types together. Among them, based on cheap and stable sex From the viewpoint of energy, silicone resins are preferred.

The thickness of the first release layer 12 or the second release layer 22 is preferably 0.01 μm or more and 2.0 μm or less, and more preferably 0.05 μm or more and 0.5 μm or less.

(Adhesive layer)

The adhesive layer 3 used in this embodiment can be formed using a known adhesive. The adhesive is not particularly limited, and examples include acrylic adhesives, rubber-based adhesives, silicone-based adhesives, polyurethane-based adhesives, polyester-based adhesives, epoxy-based adhesives, and polyamides. Imine-based adhesives, etc. These can be used individually by 1 type, and can also use 2 or more types together. Such an adhesive can be appropriately selected according to the purpose of the adhesive sheet. In addition, this adhesive may contain hardening aids, energy beam hardening components, and other resin components as necessary.

For example, when the application of the adhesive sheet is the film-like adhesive used in the die bond step of the chip or the underfill sheet used in the flip chip assembly, it is used as the adhesive The agent is preferably an epoxy-based adhesive or a polyimide-based adhesive.

The use of the adhesive sheet is a dicing die bonding film that has both a wafer fixing function during dicing and a die bonding function during die bonding. As an adhesive, it is preferably an adhesive containing acrylic polymer or the like (Binder) ingredients and epoxy adhesives, and as necessary, energy beam curable compounds, energy beam curable polymers, and curing agents can be used. Additives and other things.

When the adhesive sheet is used as a protective film on the back surface of a semiconductor wafer, as an adhesive, it is preferable to contain an adhesive component such as an acrylic polymer, an epoxy adhesive and a hardening aid, and it may be used as necessary. Energy beam hardening compounds, energy beam hardening polymers, fillers, and coloring agents.

The thickness of the adhesive layer 3 can be selected in various ways depending on the application. From the viewpoint of workability during press processing, it is preferably 1 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less, and particularly preferably 10 to 100 μm.

(Method of manufacturing adhesive sheet)

The adhesive sheet 100 of this embodiment can be manufactured by, for example, a method including the cutting step described below.

In the cutting step, the adhesive sheet (not shown) on which the first cut 41 is not yet provided is subjected to half-cutting in which the first cut 41 is formed in the first sheet 1. In this way, in the vicinity of both ends in the width direction of the first sheet 1 in a plan view, the first cut 41 is provided along the both ends, and the adhesive sheet 100 can be manufactured.

The half-cutting in the cutting step means that the first cut 41 is formed so that the adhesive sheet 100 is not cut. The first sheet 1 is cut by the first cut 41, but the adhesive layer 3 and the second sheet 2 are not cut.

In this half-cutting, a known cutter can be suitably used.

(How to use the adhesive sheet)

First, the method of using the adhesive sheet of this embodiment will be explained.

The method of using the adhesive sheet of the present embodiment is the method of using the adhesive sheet 100 of the present embodiment, and includes the press processing step and the waste removal step described below.

In the press processing step, as shown in FIGS. 3 and 4, the adhesive layer 3 and the second sheet 2 of the adhesive sheet 100 are half-cut to form the second cut 42, and the adhesive layer 3 is divided into press processing The portion 31 and the continuous scrap portion 32 other than the press-processed portion 31.

As shown in FIG. 3, the press-processed part 31 is preferably provided on the inner side of the first cut 41 in a plan view. In addition, the press processing part 31 is provided in a plurality of locations over the entire length direction of the adhesive sheet 100.

The half-cutting in the press processing step means that the second cut 42 is formed so that the adhesive sheet 100 is not cut. The adhesive layer 3 and the second sheet 2 are cut by the second cut 42, but the first sheet 1 is not cut. The second cut 42 reaches the first sheet 1 through the second sheet 2 and the adhesive layer 3 from the second sheet 2 side of the adhesive sheet 100. The second cut 42 only needs to reach at least the interface between the adhesive layer 3 and the first sheet 1, but it is preferable to completely cut the adhesive layer 3 to form a cut on the surface of the first sheet 1.

In this half-cutting, a known punching knife can be suitably used.

The half-cut in the press working step is performed on the entire circumference of the press working part 31 to provide the press working part 31.

The portion other than the press-processed portion 31 is a continuous scrap portion 32 that is peeled off when the second sheet 2 is peeled from the adhesive sheet 100.

After the punching process, as shown in FIGS. 3 and 4, an auxiliary tape body bonding step in which an auxiliary tape body 5 is provided on the surface of the second sheet 2 of the adhesive sheet 100 can be performed.

By bonding the auxiliary belt body 5 along the entire length direction, the second sheet 2 formed with the second cut 42 can be integrated. Therefore, in the waste removal step described later, the second sheet 2 on the surface of the adhesive layer 3 can be peeled off.

As the auxiliary tape body 5, a well-known tape can be used.

In the waste removal step, as shown in FIGS. 5 and 6, the continuous waste part 32 is peeled from the first sheet 1, thereby removing the continuous waste part 32 from the adhesive sheet 100.

The continuous waste portion 32 is removed together with the second sheet 2, a part 1a of the first sheet 1 (both ends outside the first cut 41), and the auxiliary tape body 5. By removing the continuous waste part 32 from the adhesive sheet 100, as shown in FIG. 5, an adhesive film cut into the shape of the press-processed part 31 can be obtained.

Here, the shape of the press-processed part 31 in a plan view is not particularly limited, and can be appropriately changed according to the purpose of use. Examples of the shape of the press-processed portion 31 in a plan view include a polygonal shape (triangular, quadrangular, pentagonal, etc.), a circular shape, an elliptical shape, and a star shape.

The adhesive film obtained in this way can be used in various applications, such as film adhesives used in the die bonding step of wafers, dicing die bonding films, underfill sheets, backside protection films for semiconductor wafers, etc. .

In the method of using the adhesive sheet of the present embodiment, after the waste removal step, a bonding step of bonding the press-processed part 31 to the adherend may be provided. In this bonding step, the first sheet 1 is peeled off, and the press-processed part 31 is bonded to the adherend.

In addition, in the method of using the adhesive sheet of the present embodiment, it is preferable that the press processing step, the waste removal step, and the bonding step are continuously performed by a continuous device.

(Effects of the first embodiment)

According to this embodiment, the following effects can be achieved.

(1) The continuous waste portion 32 is removed together with the second sheet 2 and the part 1a of the first sheet 1 (both ends outside the first cut 41). Therefore, in the waste removal step, the first sheet 1 is removed. 1 The area where the sheet 1 is peeled from the adhesive layer 3 is reduced. Therefore, in the waste removal step, it is possible to prevent the adhesive layer 3 constituting the continuous waste portion 32 from remaining on the first sheet 1 side. In addition, the continuous waste portion 32 is sandwiched between the second sheet 2 and a part 1a of the first sheet 1. Therefore, the waste removal step can be performed in a state where the continuous waste portion 32 is held by the second sheet 2 and the part 1 a of the first sheet 1. In this way, it is possible to sufficiently suppress defective removal of waste.

(2) than the second sheet 3 peel force F ₂ from peeling of the adhesive layer 2, the peel force of the first sheet from the adhesive layer 3 of a larger peeling F _1. In the waste removal step, the punched part 31 can be left on the first sheet 1.

(3) In this embodiment, it is preferable that the press processing step, the waste removal step, and the bonding step are continuously performed by a continuous device. By continuously performing a series of steps in this way, the adhesive sheet 100 can be used efficiently and workability and productivity can be improved.

[Second Embodiment]

Next, the second embodiment of the present invention will be described based on the drawings.

In this embodiment, except that the adhesive sheet 100A is used instead of the adhesive sheet 100, it has the same structure as the first embodiment. Therefore, only the adhesive sheet 100A, its manufacturing method and the method of use will be explained, and the other explanations will be given. Be omitted.

As shown in FIG. 7, the adhesive sheet 100A of the present embodiment is elongated and includes a first sheet 1, a second sheet 2, and an adhesive layer 3. The first sheet 1 and the second sheet 2 are provided on both sides of the adhesive layer 3.

As shown in FIG. 7, the adhesive layer 3 has a space 3 a where the adhesive does not exist in a plan view. More specifically, a space portion 3a is formed in a portion between the plurality of press working portions 31.

In addition, the first sheet 1 is the same as in the first embodiment, and in the vicinity of both ends in the width direction in a plan view, first cuts 41 are provided along the both ends.

As a manufacturing method of the adhesive sheet 100A of this embodiment, the following methods (i) and (ii) etc. can be used, for example.

Method (i): Can produce on the first sheet 1 or the second sheet 2 The adhesive is applied in the manner of the space portion 3a to form the adhesive layer 3. Next, the first sheet 1 or the second sheet 2 is laminated on the adhesive layer 3 to produce an adhesive sheet in which the first cut 41 is not yet provided. Then, the first cut 41 is provided in the aforementioned cutting step, and the adhesive sheet 100A is manufactured.

Method (ii): apply an adhesive on the first sheet 1 or the second sheet 2 to form the adhesive layer 3. Next, press the adhesive layer 3 to create a space 3a, and then laminate the first sheet 1 or the second sheet 2 on the adhesive layer 3 to produce an adhesive sheet without the first cut 41 . Next, the first cut 41 is provided by the aforementioned cutting step, and the adhesive sheet 100A is manufactured.

In the press processing step of the method of using the adhesive sheet of the present embodiment, in a plan view, the press processing portion 31 is provided so that the space portion 3a and the continuous waste portion 32 overlap. In this way, there is no part where the adhesive does not exist in the press-processed part 31, and the adhesive film cut into the shape of the press-processed part 31 can be obtained through the waste removal step. In addition, in the press working step, it is preferable to form the second cut 42 on the boundary of the space portion 3a in a plan view.

(Effects of the second embodiment)

According to this embodiment, in addition to the same operational effects as the operational effects (1) to (3) of the aforementioned first embodiment, the following operational effects (4) can be exhibited.

(4) Since there is no adhesive in the space portion 3a, the area where the first sheet 1 is peeled from the adhesive layer 3 corresponding to the area of the space portion 3a Will become less. In addition, because the space portion 3a is provided in the portion between the plurality of press-processed portions 31, only the continuous scrap portion 32 at the end portion is taken up in the waste removal step. Therefore, in the waste removal step, it is possible to more reliably prevent the adhesive layer 3 constituting the continuous waste portion 32 from remaining on the first sheet 1 side.

[Third Embodiment]

Next, the third embodiment of the present invention will be described.

The method of using the adhesive sheet of this embodiment is the method of using a strip of adhesive sheet, which is provided with: forming the first sheet 1 on the first sheet 1 of the adhesive sheet (not shown) on which the first cut 41 is not yet provided The half-cut of the cut 41 is a step of providing the first cut 41 along the both ends near the both ends of the first sheet 1 in the width direction in a plan view to obtain the adhesive sheet 100 of the first embodiment ( 1 and 2), as well as the stamping process and waste removal process of the first embodiment.

As the step of obtaining the adhesive sheet 100 of the third embodiment, the same method as the method of manufacturing the adhesive sheet of the first embodiment can be used.

(Effects of the third embodiment)

According to this embodiment, in addition to the same operational effects as the operational effects (1) to (3) of the aforementioned first embodiment, the following operational effects (5) can be exhibited.

(5) The step of obtaining the adhesive sheet 100, the stamping process step, and the waste removal step can be performed in a series of steps. Therefore, the use of In the method of using the adhesive sheet of the adhesive sheet with the first cut 41, the same effects (1) to (3) of the first embodiment can be exerted.

[Fourth Embodiment]

Next, the fourth embodiment of the present invention will be described.

The method of using the adhesive sheet of this embodiment further includes the step of forming a space portion 3a in the adhesive layer 3 where the adhesive does not exist in a plan view of the adhesive sheet of the aforementioned first embodiment. In a plan view, the press-worked portion 31 is provided such that the space portion 3a overlaps the continuous waste portion 32.

In the step of forming the space portion, as a method of forming the space portion 3a, for example, the adhesive layer 3 and the second sheet 2 of the adhesive sheet 100 are half-cut to form a third cut (not shown), and then the adhesive layer 3 and a part of the second sheet 2 are removed, thereby forming a space 3a in the adhesive layer 3.

In the press processing step of the method of using the adhesive sheet of this embodiment, the press processing is the same as the press processing step of the second embodiment described above. In a plan view, the press processing is provided such that the space portion 3a overlaps the continuous scrap portion 32部31.

(Effects of the fourth embodiment)

According to this embodiment, in addition to the same functions and effects as the above-mentioned first embodiment (1) to (3), the following functions and effects can be exerted. (6).

(6) According to the step of forming the space portion, an adhesive sheet provided with the space portion 3a in the adhesive layer 3 can be formed. Therefore, even in the method of using the adhesive sheet using the adhesive sheet in which the space portion 3a is not formed in the adhesive layer 3, the same effect as the effect (4) of the second embodiment can be exerted.

[Transformation of the embodiment]

The present invention is not limited to the aforementioned embodiments, and modifications, improvements, etc. within the scope of achieving the object of the present invention are also included in the present invention.

For example, in the foregoing embodiment, the adhesive film cut into a predetermined shape is used as a thin film adhesive used in the die bonding step of a wafer, a dicing die bonding film, an underfill sheet, and a semiconductor wafer The adhesive film used for the back surface protective film, etc., but it is not limited to this. As the use of the adhesive film cut into a predetermined shape, labels, stickers, and badges (wappen) can be cited.

1‧‧‧The first slice

2‧‧‧Second sheet

3‧‧‧Adhesive layer

11‧‧‧The first substrate sheet

12‧‧‧The first peeling layer

21‧‧‧Second substrate sheet

22‧‧‧Second peeling layer

41‧‧‧The first cut

100‧‧‧Adhesive sheet

Claims (9)

An adhesive sheet is an elongated adhesive sheet provided with an adhesive layer, a first sheet and a second sheet provided on both sides of the adhesive layer, characterized in that the width direction of the first sheet in the plan view In the vicinity of the two ends of the adhesive sheet, a first cut is provided along the two ends, and the first cut is from the first sheet side of the adhesive sheet through the first sheet to reach the adhesive layer, The adhesive layer is not cut by the first cut. When the peeling force of the first sheet from the adhesive layer is set to F ₁ , the peeling force of the second sheet from the adhesive layer is set When F _{2 is set, the condition F 2} <F _{1 of the} following formula (F1) is satisfied. . . (F1). The adhesive sheet according to claim 1, wherein a first release layer is provided on the first sheet, the adhesive layer and the first sheet are laminated through the first release layer; and the second sheet is provided with a first release layer. 2 release layer, the adhesive layer and the second sheet are laminated through the second release layer. The adhesive sheet according to claim 1, wherein the first cut is continuously provided in the entire length direction of the first sheet in a plan view. The adhesive sheet according to any one of claim 1 to claim 3, wherein, in a plan view, a void without adhesive is formed in the adhesive layer Between. A method of using an adhesive sheet is the method of using the adhesive sheet according to any one of claims 1 to 4, characterized by comprising: the adhesive layer implemented on the adhesive sheet and the second sheet A step of forming a half cut of the second cut to divide the adhesive layer into a press-processed part, a continuous waste part other than the press-processed part, and a step of removing the continuous waste part from the adhesive sheet. A method of using an adhesive sheet is a method of using an adhesive sheet having an adhesive layer, a first sheet and a second sheet provided on both sides of the aforementioned adhesive layer, and the method is characterized in that it includes: The first sheet of the adhesive sheet forms a half-cut of the first cut, and the first cut is provided along the both ends in the vicinity of the both ends of the first sheet in the width direction in a plan view, and the request is obtained The step of the adhesive sheet according to any one of items 1 to 4 is to implement half-cutting of the adhesive layer of the adhesive sheet and the second sheet to form a second cut to divide the adhesive layer into punching The step of processing part, the continuous waste part other than the pressing part, and the step of removing the continuous waste part from the adhesive sheet. The method of using the adhesive sheet according to claim 5 or claim 6, wherein the punching part is provided on the inner side of the first cut in a plan view. The user of the adhesive sheet as described in claim 5 or claim 6 Method, wherein, when a space part where no adhesive is present is formed in the adhesive layer, the press-processed part is provided in a plan view such that the space part overlaps the continuous waste part. The method of using the adhesive sheet according to claim 5 or claim 6, wherein the method further comprises: in a plan view, a step of forming a space portion without an adhesive in the adhesive layer, and in a plan view, using the space portion The press processing part is provided so as to overlap the continuous waste part.

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