JP2011236370A - Multilayer adhesive sheet and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer adhesive sheet in which a peeling base material is peeled from a film-like adhesive without peeling between a self-adhesive film and the film-like adhesive, and which sufficiently holds a wafer ring.SOLUTION: The multilayer adhesive sheet includes a peeling base material (1), a punched film-like adhesive (2) which is arranged on the surface of the peeling base material (1), and a self-adhesive film (3) arranged so as to cover the film-like adhesive (2). Further, a peeling assisting film (4) having a self-adhesive layer on both surfaces is arranged in a region including the whole or a portion of the periphery of the film-like adhesive (2) between the peeling base material (1) and each of the film-like adhesive (2) and the adhesive film (3), and the adhesive force (Fa) between the peeling assisting film (4) and each of the film-like adhesive (2) and the self-adhesive film (3) is larger than the adhesive force (Fb) between the peeling base material (1) and the peeling assisting film (4).

Description

  The present invention relates to a multilayer adhesive sheet and a method for producing the same.

  In recent years, miniaturization and high functionality of electric and electronic devices have progressed, and accordingly, demand for high-density mounting of semiconductors has increased. One example of a material for mounting a semiconductor is a die bonding material for mounting a semiconductor chip on a lead frame or a substrate. Die-bonding materials are classified into die-bonding pastes that are applied in liquid form and cured, and die-bonding sheets that are pasted and cured in film form. From the viewpoint of prevention, thickness uniformity, void reduction, and reliability improvement, die bonding sheets are used.

  Further, in the flash memory, a stacked package in which a plurality of semiconductor chips are stacked and mounted is mainly employed for the purpose of increasing the memory capacity. In a stacked package, without using a spacer as in the past, an adhesive attached to a semiconductor chip disposed on the upper side is embedded without damaging the metal wire provided on the semiconductor chip disposed on the lower side. A method of directly laminating (film on wire method) is employed. In the lamination of semiconductor chips by the film-on-wire method, a die bonding sheet is mainly used from the viewpoint of preventing the adhesive from protruding.

  On the other hand, die bonding sheets are often integrated with an adhesive film called a dicing tape from the viewpoint of cost reduction by simplifying the manufacturing process, so-called dicing tape integrated die bonding sheet (multi-layer adhesive sheet). ) Has been used. In such a dicing tape-integrated die bonding sheet, a die bonding sheet as a film adhesive and a dicing tape as an adhesive film are punched in advance in accordance with the shapes of the semiconductor wafer and the wafer ring. In other words, so-called pre-cut processing is performed.

  In such pre-cut processing, in order to cut the film adhesive reliably, the pre-cut processing blade is set to reach not only the film adhesive but also the peeling substrate. In such a case, the precut processing blade is cut into the release substrate, and the film adhesive is deeply bitten into the release substrate during long-term storage of the multilayer adhesive sheet. When peeling the release substrate from the film adhesive before laminating to the semiconductor wafer, there was a problem that the film adhesive remained on the release substrate or a problem that the film adhesive and the adhesive film were peeled off. .

  In order to solve such a problem, for example, JP 2005-350520 A (Patent Document 1) discloses an adhesive sheet having a configuration in which a release substrate, an adhesive layer, an adhesive layer, and a substrate film are sequentially laminated. The adhesive layer has a predetermined first planar shape and is partially formed on the release substrate, and the release substrate has a peripheral edge of the first planar shape. A first cut portion is formed from the surface on the side in contact with the adhesive layer, and the cut depth of the first cut portion is less than the thickness of the release substrate and 25 μm or less. An adhesive sheet is disclosed. JP-A-2006-111727 (Patent Document 2) discloses a release substrate, a substrate film, and a first adhesive layer disposed between the release substrate and the substrate film. In the adhesive sheet comprising: the release substrate, a cut portion is formed in an annular shape from the surface on the first adhesive layer side, and the first adhesive layer is formed on the release substrate. An adhesive sheet is disclosed which is laminated so as to cover the entire inner surface of the cut portion, and the cut depth of the cut portion is less than the thickness of the release substrate and is 25 μm or less. .

  However, the adhesive sheet as described in the above-mentioned patent documents is not always sufficient in terms of the peelability between the film adhesive and the peeling substrate and the peeling between the adhesive film and the film adhesive. It was not something.

  In addition, the dicing tape-integrated die bonding sheet is required to have an adhesive property that can hold the wafer ring during dicing, while the peelability that allows the semiconductor wafer to be easily recovered by pip-up work after dicing. Is required. In this way, although different physical properties are required for the part where the wafer ring is scheduled to be attached and the part where the semiconductor wafer is scheduled to be attached, the dicing tape-integrated die bonding sheet satisfying such characteristics is required. It was difficult to get.

JP-A-2005-350520 JP 2006-111727 A

  The present invention has been made in view of the above-described problems of the prior art, and in a multilayer adhesive sheet that has been pre-cut with a film adhesive, the film without causing the adhesive film and the film adhesive to peel off. It is an object of the present invention to provide a multilayer adhesive sheet capable of peeling a state adhesive and a release substrate and sufficiently holding a wafer ring, and a method for producing the same.

  As a result of intensive studies to achieve the above object, the present inventors have arranged a peeling auxiliary film having an adhesive layer on both sides at a predetermined position of a multilayer adhesive sheet that has been precut with a film adhesive. The adhesive film and the film are made such that the adhesive force between the film adhesive and the adhesive film and the peeling auxiliary film is larger than the adhesive force between the peeling substrate and the peeling auxiliary film. It was found that a multilayer adhesive sheet capable of peeling the film-like adhesive and the peeling base material without being peeled off and sufficiently holding the wafer ring can be obtained. The invention has been completed.

That is, the multilayer adhesive sheet of the present invention is disposed so as to cover the release substrate, the film-like adhesive disposed on the surface of the release substrate and punched, and the film-like adhesive. A multilayer adhesive sheet comprising an adhesive film,
A peeling auxiliary film having a pressure-sensitive adhesive layer on both sides is disposed in a region including all or part of the film-like adhesive and a peripheral edge of the film-like adhesive between the pressure-sensitive adhesive film and the peeling substrate. A pressure-sensitive adhesive (Fa) between the adhesive and the pressure-sensitive adhesive film and the peeling auxiliary film is larger than a pressure-sensitive adhesive force (Fb) between the peeling substrate and the peeling auxiliary film. is there. In addition, the adhesive force in this invention means the value calculated | required by the measurement according to the method as described in JISZ0237.

  In the multilayer adhesive sheet of the present invention, the adhesive force (Fa) is preferably 0.2 N / cm or more, and the adhesive force (Fb) is preferably less than 0.2 N / cm.

  Furthermore, the multilayer adhesive sheet of the present invention preferably has a difference between the adhesive strength (Fa) and the adhesive strength (Fb) of 0.05 N / cm or more.

  Moreover, as the said peeling assistance film concerning this invention, the end of the said peeling assistance film is located in the area | region of 1-10 mm inside from the periphery of the said film adhesive, and the other end of the said peeling assistance film is the said It is preferable to arrange | position so that it may be located in the area | region of 1-25 mm outside from the periphery of a film adhesive.

  Furthermore, as thickness of the said peeling auxiliary | assistance film concerning this invention, it is preferable that it is 5-150 micrometers.

  Further, in the multilayer adhesive sheet of the present invention, it is preferable that the film adhesive has a substantially circular planar shape and the peeling assist film has a ring-shaped planar shape, In the case, it is preferable that the peeling assist film is disposed in a region including the entire periphery of the film adhesive. In addition, although the substantially circular shape in this invention contains a perfect circle, it means the shape containing an ellipse etc.

  Furthermore, in the multilayer adhesive sheet of the present invention, it is also preferred that the film adhesive has a substantially circular planar shape, and the peeling assist film has a tape-shaped planar shape, In this case, it is preferable that the peeling assist film is disposed in a region including a part of the periphery of the film adhesive.

The method for producing a multilayer adhesive sheet of the present invention is arranged so as to cover a release substrate, a film-like adhesive disposed on the surface of the release substrate and punched, and the film-like adhesive. A method for producing a multilayer adhesive sheet comprising an adhesive film,
The peeling auxiliary film having an adhesive layer on both sides is such that the adhesive force (Fa) between the film adhesive and the adhesive film and the peeling auxiliary film is an adhesive force between the peeling substrate and the peeling auxiliary film. (Fb) It is the method characterized by including the process arrange | positioned so that it may become larger.

In the step of disposing the peeling auxiliary film according to the present invention, the film adhesive has a substantially circular planar shape, and the peeling auxiliary film has a ring-shaped planar shape. In that case, the peeling assisting film is disposed in a region including the entire periphery of the film adhesive, and the step includes:
A step of disposing a peeling assisting film layer having an adhesive layer on both sides on the surface of the peeling substrate;
Forming a substantially circular hole in the peeling assisting film layer;
Placing a film adhesive layer on the surface of the peeling assist film layer so as to cover the hole;
Punching the film adhesive layer at a position outside the periphery of the hole to obtain the film adhesive;
Arranging an adhesive film layer so as to cover the surface of the film adhesive;
Stamping the adhesive film layer and the peeling assisting film layer at a position outside the periphery of the film adhesive to obtain the adhesive film and the peeling assisting film,
It is preferable that the multilayer adhesive sheet has a greater adhesive strength (Fa) than the adhesive strength (Fb).

Further, in the step of disposing the peeling auxiliary film according to the present invention, the film adhesive has a substantially circular planar shape, and the peeling auxiliary film has a tape-shaped planar shape. Form is also preferable, in that case, the peeling assisting film is disposed in a region including a part of the periphery of the film adhesive, the step,
The film-adhesive and the film-shaped adhesive between the pressure-sensitive adhesive film and the peeling substrate are formed so that the pressure-sensitive adhesive force (Fa) is larger than the pressure-sensitive adhesive force (Fb). The step is preferably a step of inserting into a region including a part of the periphery.

  In addition, without disposing the adhesive film and the film-like adhesive by disposing a peeling auxiliary film having an adhesive layer on both sides in a predetermined region of the multilayer adhesive sheet where the pre-cut processing of the film-like adhesive has been performed, About the reason why the multilayer adhesive sheet which can peel a film adhesive and a peeling base material is obtained, the present inventors guess as follows. That is, in the region where the peeling auxiliary film is interposed in the multilayer adhesive sheet of the present invention, the adhesive force between the peeling substrate and the peeling auxiliary film is the adhesive between the film adhesive and the adhesive film and the peeling auxiliary film. It is smaller than force. Therefore, in the peeling auxiliary film, when peeling the peeling substrate from the film adhesive before laminating the film adhesive on the semiconductor wafer, peeling of the peeling substrate from the film adhesive is easily started. be able to. Moreover, in the area | region including a part or all of the periphery of the film adhesive between a film adhesive and an adhesive film, and the said peeling base material, a peeling auxiliary | assistant film is a film adhesive and an adhesive film from a peeling base material. Since it sticks with strong adhesive force, interfacial peeling with a film adhesive and an adhesive film can be prevented. And since it becomes possible to perform the removal of a peeling base material favorably by making such a peeling auxiliary film a peeling starting point at the time of peeling a peeling base material from a film adhesive, the multilayer adhesion of the present invention In the sheet, the film-like adhesive and the peeling substrate can be peeled off without peeling off the adhesive film and the film-like adhesive. Moreover, since the peeling auxiliary | assistant film after peeling a peeling base material can be used for sticking of a wafer ring, the present inventors guess that the multilayer adhesive sheet of this invention can fully hold | maintain a wafer ring. To do.

  According to the present invention, in a multilayer adhesive sheet in which a pre-cut processing of a film adhesive is performed, the adhesive film and the film adhesive can be peeled off without releasing the adhesive film and the film adhesive. In addition, it is possible to provide a multilayer adhesive sheet that can sufficiently hold the wafer ring and a method for manufacturing the same.

It is a schematic plan view which shows suitable one Embodiment of the multilayer adhesive sheet of this invention. It is a schematic sectional side view which shows a cut surface at the time of cut | disconnecting the multilayer adhesive sheet shown in FIG. 1 along the A1-A1 line of FIG. (A) And (b) is the schematic plan view and schematic sectional side view which show other suitable one Embodiment of the multilayer adhesive sheet of this invention. It is a schematic sectional side view which shows the state which has arrange | positioned the peeling auxiliary | assistant film layer on the surface of a peeling base material. (A) And (b) is the schematic plan view and schematic sectional side view which show the state which formed the substantially circular hole in the peeling auxiliary | assistant film layer by stamping the peeling auxiliary | assistant film layer. It is a schematic sectional side view which shows the state which has arrange | positioned the film adhesive layer on the peeling auxiliary | assistant film layer. It is a schematic sectional side view which shows the state which stamped the film adhesive layer. It is a schematic sectional side view which shows the state which formed the film adhesive by punching a film adhesive layer. It is a schematic sectional side view which shows the state which has arrange | positioned the adhesion film layer on the surface of a film adhesive. (A) And (b) is the schematic plan view and schematic sectional side view which show the state which stamped and processed the adhesive film layer and the peeling auxiliary | assistant film layer. It is a schematic sectional side view which shows the state which formed the adhesive film and the peeling auxiliary | assistance film by punching an adhesive film layer and the peeling auxiliary | assistant film layer. It is a schematic sectional side view which shows the state of the sample at the time of performing the peeling test of a multilayer adhesive sheet.

  Hereinafter, the present invention will be described in detail with reference to preferred embodiments thereof.

First, the multilayer adhesive sheet of the present invention will be described. The multilayer adhesive sheet of the present invention includes a release substrate, a film adhesive disposed on the surface of the release substrate and punched, and an adhesive film disposed so as to cover the film adhesive A multilayer adhesive sheet comprising:
A peeling auxiliary film having a pressure-sensitive adhesive layer on both sides is disposed in a region including all or part of the film-like adhesive and a peripheral edge of the film-like adhesive between the pressure-sensitive adhesive film and the peeling substrate. A pressure-sensitive adhesive (Fa) between the adhesive and the pressure-sensitive adhesive film and the peeling auxiliary film is larger than a pressure-sensitive adhesive force (Fb) between the peeling substrate and the peeling auxiliary film. is there.

  The release substrate used in the present invention is a support for a film adhesive and an adhesive film, and is peeled from the film adhesive before laminating the film adhesive on a semiconductor wafer. . The thickness of such a peeling base material should just be in the range which does not impair workability | operativity at the time of the precut process, the lamination to a semiconductor wafer, etc., it is preferable that it is 40-100 micrometers, and there exists 50-70 micrometers. Is more preferable. Moreover, as said peeling base material, plastic films, such as a polyethylene terephthalate (PET), polyethylene, a polyimide, are mentioned, for example.

  The film adhesive used in the present invention is an adhesive formed into a film, and can be used as a die bonding material. The thickness of such a film adhesive is preferably 10 to 150 μm from the viewpoint of workability of punching.

  As the film adhesive, it is preferable to use an adhesive containing an epoxy resin from the viewpoint of improving electrical insulation, heat resistance, mechanical properties, adhesion, workability, reliability and the like. Epoxy resins include phenol novolac, orthocresol novolac, dicyclopentadiene, biphenyl, fluorene bisphenol A, triazine, naphthol, naphthalenediol, triphenylmethane, tetraphenyl, bisphenol A, Epoxy resins having a skeleton such as bisphenol F type, bisphenol AD type, bisphenol S type, and trimethylolmethane type can be used. These epoxy resins can be used individually by 1 type or in combination of 2 or more types.

  The film adhesive may further contain an epoxy resin curing agent. An epoxy resin curing agent refers to an agent that can cure an epoxy resin. As the epoxy resin curing agent, known curing agents such as amines, acid anhydrides, and polyhydric phenols can be used.

  The film adhesive may further contain a phenoxy resin from the viewpoint of developing film support while eliminating brittleness at room temperature. The phenoxy resin is a resin obtained from bisphenol and epichlorohydrin, such as a bisphenol A type phenoxy resin, and the number average molecular weight of the phenoxy resin is usually 10,000 or more. As the phenoxy resin, phenoxy resins such as bisphenol A type, bisphenol F type, and bisphenol A / F type can be used.

  The film adhesive may further contain silica as a filler from the viewpoint of low water absorption and low thermal expansion. As silica, it is preferable to use fine particle spherical silica having an average particle diameter of 3 to 20 μm. When the average particle size is less than 3 μm, silica is likely to aggregate, making it difficult to disperse in the epoxy resin, and since the specific surface area is increased, the contact area with the epoxy resin is increased, and the melt viscosity of the film adhesive is increased. Tend to increase. On the other hand, when the average particle diameter exceeds 20 μm, when a film-like adhesive layer is produced with a coating equipment such as a roll knife coater, silica tends to be a trigger and stripes tend to be generated on the film surface.

  The film adhesive may further contain an additive such as a coupling agent, an antioxidant, a flame retardant, and a colorant, and a stress relaxation agent such as butadiene rubber and silicone rubber, if necessary. Such a coupling agent is preferable in that it reinforces the interface with silica, exhibits high breaking strength, and can improve the adhesive strength. As such a coupling agent, it is preferable to use one containing an amino group or an epoxy group.

  The adhesive film used in the present invention is an adhesive film, and can be used as a dicing tape. As the pressure-sensitive adhesive film, for example, a film in which a pressure-sensitive adhesive layer such as an acrylic pressure-sensitive adhesive is coated on a base film such as polyolefin can be used. The thickness of the base film is preferably 25 to 100 μm, and the thickness of the adhesive layer is preferably 1 to 20 μm.

  The peeling auxiliary film used in the present invention has an adhesive layer on both sides, and can be attached to the peeling substrate, the film adhesive, the adhesive film and the wafer ring.

  The thickness of the peeling assist film is preferably 5 to 150 μm, and more preferably 25 to 130 μm. If the thickness of the peeling auxiliary film is less than the lower limit, the work of punching the peeling auxiliary film and the operation of attaching the peeling auxiliary film tend to be difficult. On the other hand, if the upper limit is exceeded, the film adhesive There is a tendency that voids are easily generated between the agent and the adhesive film and the release substrate.

  Further, the constitution of the peeling assist film may be an adhesive layer composed of the same component on both sides, an adhesive layer composed of a component having different surfaces, or a film composed of a single adhesive layer. Or the film which consists of two or more adhesion layers may be sufficient. Furthermore, in the case of a film comprising two or more adhesive layers, it may have a base material layer.

  The pressure-sensitive adhesive layer of the peeling auxiliary film can be attached to the peeling substrate, the film-like adhesive, the pressure-sensitive adhesive film, and a wafer ring to be described later, and a pressure-sensitive adhesive between the film-like adhesive to be described later. For example, acrylic polymer, silicone polymer, vinyl ester polymer, natural rubber, synthetic rubber (styrene-butadiene rubber, isobutylene rubber, styrene-isoprene block copolymer, styrene-butadiene) Block copolymers and the like). In addition, such an adhesive compound (hereinafter, also referred to as “adhesive”) can be used alone or in combination of two or more. From the viewpoint of the adhesive strength with the adhesive, it is preferable to use an acrylic polymer for the adhesive layer of the peeling assist film.

  Further, if necessary, various additives such as a tackifier, a curing agent, a plasticizer, a photopolymerizable compound, a photoinitiator, a foaming agent, a polymerization inhibitor, an antiaging agent, and a filler are added to the pressure sensitive adhesive. Can also be added.

  Such a tackifier may be any one that can improve the adhesive strength of the adhesive layer. For example, terpene resin, terpene phenol resin, alkylphenol resin, rosin resin, rosin ester resin Styrene resin, coumarone resin, coumarone indene resin, and such tackifiers can be used alone or in combination of two or more.

  In addition, as such a curing agent, any curing agent can be used as long as it can cure the pressure-sensitive adhesive. Isocyanate curing agent, epoxy curing agent, melamine curing agent, carbodiimide curing agent, oxazoline curing agent, amine curing. Agents, urea-based curing agents, and polyvalent metal-based curing agents. These curing agents can be used alone or in combination of two or more.

  Furthermore, there is no restriction | limiting in particular as a compounding quantity of this additive, What is necessary is just the quantity of the range which does not inhibit the adhesiveness of the said peeling auxiliary | assistant film.

  Moreover, it is preferable that it is 5-30 micrometers as thickness of the adhesion layer of the said peeling auxiliary | assistant film. When the thickness of the pressure-sensitive adhesive layer is less than the lower limit, it tends to be difficult to obtain stable adhesive force. On the other hand, when the thickness exceeds the upper limit, the release substrate due to protrusion from the cross-section of the pressure-sensitive adhesive layer, Contamination to the film adhesive, the pressure-sensitive adhesive film and the wafer ring tends to occur easily.

  The base material layer of the peeling assist film is not particularly limited as long as it can support the adhesive layer, and examples thereof include a plastic film, a rubber sheet, cloth, paper, and metal foil. Examples of such a plastic film include films made of polypropylene, polyethylene, PET, polystyrene, acrylonitrile-butadiene-styrene copolymer synthetic resin (ABS resin), polycarbonate, polyimide film, polyvinyl chloride, nylon, and polyvinyl alcohol. Examples of such cloth include woven cloth and non-woven cloth made of rayon, linen, cotton, and the like. Examples of such paper include craft paper, Japanese paper, and crepe paper. Moreover, as metal foil, the foil which consists of aluminum, copper, lead, and stainless steel is mentioned. Furthermore, regarding such a film etc., 1 type can be used individually or in combination of 2 or more types. Among such films and the like, it is preferable to use PET for the base material layer from the viewpoint of adhesive strength with the adhesive material and punching workability described later.

  Moreover, it is preferable that it is 15-70 micrometers as thickness of the base material layer of the said peeling auxiliary | assistant film. If the thickness of the base material layer of the peeling assist film is less than the lower limit, the work of stamping the peeling assist film and the work of attaching the peel assist film tend to be difficult, whereas, when the upper limit is exceeded, There is a tendency that voids are easily generated between the film adhesive and the pressure-sensitive adhesive film and the release substrate.

  As mentioned above, although the peeling base material used for the multilayer adhesive sheet of this invention, the film adhesive, the adhesive film, and the peeling auxiliary | assistant film were demonstrated, hereafter, the multilayer adhesive sheet of this invention is demonstrated, referring drawings. FIG. 1 is a schematic plan view showing a preferred embodiment of the multilayer adhesive sheet of the present invention. 2 is a schematic sectional side view showing a cut surface when the multilayer adhesive sheet shown in FIG. 1 is cut along the line A1-A1 of FIG.

  The multilayer adhesive sheet shown in FIG. 1 includes a peeling substrate 1, a film adhesive 2, a pressure-sensitive adhesive film 3, and a peeling auxiliary film 4. In the multilayer adhesive sheet shown in FIG. 1, the film adhesive 2 is stamped so as to have a planar shape. The planar shape of the film adhesive 2 is not particularly limited, but is preferably a planar shape that matches the planar shape of an adherend such as a semiconductor wafer, and is preferably substantially circular, for example.

  As shown in FIG. 2, the adhesive film 3 is disposed so as to cover the film adhesive 2. The planar shape of the pressure-sensitive adhesive film 3 is not particularly limited, but is preferably a planar shape that matches the planar shape of the film-like adhesive 2, and is preferably substantially circular, for example.

  As shown in FIG. 1 and FIG. 2, the peeling assist film 4 is a region including all or part of the periphery of the film adhesive 2 and the film adhesive 2 between the pressure-sensitive adhesive film 3 and the peeling substrate 1 ( In FIG. 1, the adhesive force (Fa) between the film adhesive 2 and the adhesive film 3 and the peeling auxiliary film 4 is the adhesive force between the peeling substrate 1 and the peeling auxiliary film 4. It arrange | positions so that it may become larger than (Fb).

  The adhesive force (Fa) is preferably 0.2 N / cm or more, and more preferably 0.3 N / cm or more. When the pressure-sensitive adhesive force (Fa) is less than the above, interfacial peeling between the film adhesive 2 and the pressure-sensitive adhesive film 3 tends to occur when the peeling substrate 1 is peeled off.

  Moreover, it is preferable that the said adhesive force (Fb) is less than 0.2 N / cm, and it is more preferable that it is 0.05-0.1 N / cm. When the adhesive force (Fb) is less than the above, it tends to be difficult to hold the wafer ring when the multilayer adhesive film of the present invention is used for dicing. When the material 1 is peeled, interfacial peeling between the film adhesive 2 and the pressure-sensitive adhesive film 3 tends to occur easily.

  Furthermore, the difference between the adhesive force (Fa) and the adhesive force (Fb) is preferably 0.05 N / cm or more, and more preferably 0.5 N / cm or more. When the difference between the pressure-sensitive adhesive force (Fa) and the pressure-sensitive adhesive force (Fb) is less than the above, interfacial peeling between the film adhesive 2 and the pressure-sensitive adhesive film 3 tends to occur when the peeling substrate 1 is peeled off. It is in.

  Moreover, it is preferable that the adhesive force of the peeling auxiliary | assistant film 4 and a wafer ring is 0.3-5.0 N / cm, especially when using the wafer ring which consists of stainless steel, it is 0.5-5.0 N / cm. It is preferable that it is 1.0 to 2.0 N / cm. When the adhesive strength is less than the above, it tends to be difficult to hold the wafer ring when the multilayer adhesive film of the present invention is used for dicing. On the other hand, when the upper limit is exceeded, the wafer ring is When peeled from the multilayer adhesive film, the pressure-sensitive adhesive or the like of the peeling auxiliary film 4 remains on the wafer ring and the workability tends to be lowered.

  Moreover, there is no restriction | limiting in particular as a method of adjusting the adhesive force between the peeling auxiliary | assistant film 4 and each member for satisfy | filling the above conditions in the relationship between the peeling auxiliary | assistant film 4 and the film adhesive 2, etc., well-known These methods can be appropriately selected and used. For example, in the peeling base material 1, in order to reduce the adhesive force with the peeling auxiliary | assistant film 4, the method of giving a silicone process, a long-chain alkyl process, a fluorine process, etc. is mentioned. Further, for example, in the peeling assist film 4, a method of adjusting the blending ratio of the pressure-sensitive adhesive when the pressure-sensitive adhesive layer is composed of two or more pressure-sensitive adhesives, and a monomer when the pressure-sensitive adhesive is composed of two or more types of monomers. Adjusting the polymerization ratio, adding the additive to the pressure-sensitive adhesive (adding the tackifier to the pressure-sensitive adhesive to improve the adhesive strength of the peeling assist film 4, and curing the adhesive And the like, and a method of adjusting the blending amount of the additive.

  Moreover, as the peeling auxiliary film 4, one end of the peeling auxiliary film 4 is located in an area of 1 to 10 mm inward from the periphery of the film adhesive 2, and the other end of the peeling auxiliary film 4 is the film adhesive 2. It is preferable to arrange | position so that it may be located in the area | region of 1-25 mm on the outer side from the periphery.

  If one end of the peeling auxiliary film 4 is less than 1 mm inward from the periphery of the film adhesive 2, the adhesion between the peeling auxiliary film 4 and the film adhesive 2 tends to be difficult, and on the other hand, it exceeds 10 mm. And since the peeling auxiliary | assistant film 4 will intervene in the sticking surface of the film adhesive 2 and a semiconductor wafer etc., it will become the tendency for sticking of a multilayer adhesive sheet, a semiconductor wafer, etc. to become difficult. Moreover, when the other end of the peeling auxiliary film 4 is less than 1 mm from the periphery of the film adhesive 2 to the outside, it tends to be difficult to attach the peeling auxiliary film 4 and the pressure-sensitive adhesive film 3. If it exceeds, the peeling auxiliary film 4 protrudes from the outer edge of the wafer ring, adheres to a part of the semiconductor processing apparatus, obstructs the conveyance, and the peeling auxiliary film 4 peels from the wafer ring starting from the protruding part. It tends to hinder the process.

  Further, when the film adhesive 2 has a substantially circular planar shape, the peripheral portion of the film adhesive 2 is formed between the film adhesive 2 and the pressure-sensitive adhesive film 3 when the peeling substrate 1 is peeled off. Since it becomes a peeling start point, as shown in FIG. 2, the peeling assisting film 4 has a ring-shaped planar shape, and the peeling assisting film 4 is disposed in a region including the entire periphery of the film adhesive 2. Preferably it is.

  As mentioned above, although suitable embodiment of the multilayer adhesive sheet of this invention was described, the multilayer adhesive sheet of this invention is not limited to the said embodiment. For example, when the film-like adhesive 2 has a substantially circular planar shape, the peeling direction of the peeling substrate 1 is one direction, and the film-like adhesive 2 is more than the peeling substrate 1 with respect to the peeling direction. Since the interfacial peeling between the film adhesive 2 and the pressure-sensitive adhesive film 3 occurs in the minute region where peeling starts, the peeling assisting film 4 may have a tape-like planar shape as shown in FIG. In that case, it is preferable that the peeling assist film 4 is disposed in a region including a part of the periphery of the film adhesive 2.

  Further, a straight line connecting two intersections between the peeling auxiliary film 4 and the peripheral edge of the film adhesive 2 and the center point of the film adhesive 2 and a fan shape defined on the peripheral edge of the film adhesive 2 by the two intersections. From the viewpoint that the central angle of the film-shaped adhesive 2 is arranged so as to sufficiently cover the area where the interface peeling between the film-shaped adhesive 2 and the pressure-sensitive adhesive film 3 occurs at the peripheral edge of the film-shaped adhesive 2. Moreover, it is preferable that it is 10 degrees or more from a viewpoint that a sticking surface sufficient to hold | maintain a wafer ring is easy to be obtained.

  Further, in the case where the peeling substrate 1 has a long sheet shape, peeling assistance is performed so that a straight line passing through the center point of the film adhesive 2 and parallel to the longitudinal direction of the peeling substrate 1 intersects with the peeling auxiliary film 4. It is preferable that the film 4 is disposed in a region including a part of the periphery of the film adhesive 2, and a straight line passing through the center point of the film adhesive 2 and parallel to the short direction of the peeling substrate 1 is symmetric. It is more preferable that the peeling assisting film 4 is disposed at two places in the region including a part of the peripheral edge of the film adhesive 2 so as to be substantially line symmetrical with respect to the axis. In this specification, “substantially line symmetry” means that 90% or more (preferably 95% or more) of figures overlap when folded around the axis of symmetry.

  In addition, when the multilayer adhesive sheet of the present invention is in the form of a long sheet, even when the multilayer adhesive sheet is wound in a roll shape, traces due to the steps of the film adhesive 2, the adhesive film 3, and the peeling assist film 4 are not generated. From the viewpoint that transfer and wrinkle generation can be prevented, film-like adhesion is provided on the surface of the peeling substrate 1 and on the outside where the film-like adhesive 2, the pressure-sensitive adhesive film 3, and the peeling auxiliary film 4 are arranged. It is preferable that a spacer is provided that is the same material as that of the agent 2, the adhesive film 3, and the peeling assisting film 4, and is disposed with the same thickness.

Next, the manufacturing method of the multilayer adhesive sheet of this invention is demonstrated. The method for producing a multilayer adhesive sheet of the present invention is arranged so as to cover a release substrate, a film-like adhesive disposed on the surface of the release substrate and punched, and the film-like adhesive. A method for producing a multilayer adhesive sheet comprising an adhesive film,
The peeling auxiliary film having an adhesive layer on both sides is such that the adhesive force (Fa) between the film adhesive and the adhesive film and the peeling auxiliary film is an adhesive force between the peeling substrate and the peeling auxiliary film. (Fb) It is the method characterized by including the process arrange | positioned so that it may become larger.

  Hereinafter, the separation assisting film is divided into a step of arranging the peeling assisting film in a region including all of the peripheral edge of the film adhesive and a step of disposing the peeling assisting film in a region including a part of the peripheral edge of the film adhesive. Each preferred embodiment will be described.

  First, the suitable embodiment of the process of arrange | positioning the said peeling auxiliary | assistance film concerning this invention in the area | region containing all the periphery of the said film adhesive is demonstrated.

As the step of disposing the peeling auxiliary film in a region including the entire periphery of the film adhesive, the film adhesive has a substantially circular planar shape, and the peeling auxiliary film is a ring shape. And when the peeling assisting film is disposed in a region including the entire periphery of the film adhesive, the process comprises:
A step of disposing a peeling assisting film layer having an adhesive layer on both sides on the surface of the peeling substrate;
Forming a substantially circular hole in the peeling assisting film layer;
Placing a film adhesive layer on the surface of the peeling assist film layer so as to cover the hole;
Punching the film adhesive layer at a position outside the periphery of the hole to obtain the film adhesive;
Arranging an adhesive film layer so as to cover the surface of the film adhesive;
Stamping the adhesive film layer and the peeling assisting film layer at a position outside the periphery of the film adhesive to obtain the adhesive film and the peeling assisting film,
It is preferable that the multilayer adhesive sheet has a greater adhesive strength (Fa) than the adhesive strength (Fb).

  4 to 11 are schematic views for explaining a preferred embodiment of a process of disposing the peeling assist film in a region including the entire periphery of the film adhesive. FIG. 4 is a schematic sectional side view showing a state in which the peeling assisting film layer is disposed on the surface of the peeling substrate, and FIG. 5 shows a substantially circular hole in the peeling assisting film layer by punching the peeling assisting film layer. FIG. 6 is a schematic plan view and a schematic sectional side view showing the formed state, FIG. 6 is a schematic sectional side view showing a state in which a film-like adhesive layer is disposed on the peeling auxiliary film layer, and FIG. 7 is a film-like adhesion. FIG. 8 is a schematic side sectional view showing a state in which the adhesive layer has been punched, FIG. 8 is a schematic side sectional view showing a state in which a film adhesive has been formed by punching the film adhesive layer, and FIG. FIG. 10 is a schematic cross-sectional side view showing a state in which an adhesive film layer is disposed on the surface of a film adhesive, and FIG. 10 is a schematic plan view and a schematic side cut showing a state in which the adhesive film layer and the peeling auxiliary film layer are punched out. A diagram, FIG. 11 is a schematic side sectional view showing a state of forming the adhesive film, and peeling auxiliary film by punching an adhesive film layer and the peeling assisting film layer.

  In the step of disposing a peeling assisting film layer having an adhesive layer on both surfaces on the surface of the peeling substrate, the method for disposing the peeling assisting film layer on the surface of the peeling substrate includes the film adhesive and the tackiness. It is only necessary that the adhesive force (Fa) between the film and the peeling assisting film be larger than the adhesive force (Fb) between the peeling substrate and the peeling assisting film. Can be used. For example, there is a method in which a varnish obtained by dissolving or dispersing a constituent component of the peeling assisting film layer in a solvent is applied on the surface of the peeling substrate so that the thickness after drying becomes a predetermined thickness, and then the solvent is dried. Can be mentioned. Such a varnish is obtained by uniformly dissolving or dispersing the pressure-sensitive adhesive or the like in an aromatic, ketone or ether organic solvent or a mixed solvent thereof. Is not particularly limited. Further, two or more varnishes having different constituent components may be laminated while being sequentially dried, and the base material layer may be further disposed.

  Moreover, as shown in FIG. 4, from the viewpoint of protecting the adhesive layer of the peeling assisting film layer 4 ′, the cover film layer 5 is peeled off using the peeling assisting film layer 4 ′ having the cover film layer 5 attached thereto. It is preferable to arrange | position on the surface of the peeling base material 1 without. As such a cover film layer 5, what is necessary is just the thing which does not impair the adhesiveness of peeling auxiliary | assistant film layer 4 ', For example, a PET film, a polyethylene film, and a polypropylene film can be used. Moreover, in order to improve the peelability of such a film from the adhesive layer of the peeling assisting film layer 4 ′, a silicone treatment, a long-chain alkyl treatment, or a fluorine treatment may be performed.

  In the step of forming a substantially circular hole in the peeling assist film layer, the method for forming the hole is not particularly limited, and a known film processing method can be used. For example, there is a method using a punching blade whose blade shape is substantially circular.

  In the case where the peeling assisting film layer 4 ′ with the cover film layer 5 is used, as shown in FIG. 5, the cover film layer 5 is the periphery of a substantially circular hole formed in the peeling assisting film layer 4 ′. It is preferable that the punching is performed at an outer position, and it is more preferable that a region of 1 to 10 mm is punched outward from the peripheral edge of the hole.

  In the step of arranging the film-like adhesive layer on the surface of the peeling auxiliary film layer so as to cover the hole, the method for arranging the film-like adhesive layer is not particularly limited, but the peeling aid is not limited. From the viewpoint of ensuring flatness in order to arrange the film and the film-like adhesive layer without generating wrinkles or voids, as shown in FIG. 6, the film-like adhesive layer 2 provided with the support film layer 6. It is preferable to arrange 'on the surface of the release substrate 1 so that the surface where the adhesive is exposed is opposed.

  The film-like adhesive layer 2 ′ provided with the support film layer 6 has a predetermined thickness after drying, for example, a varnish obtained by dissolving or dispersing the constituents of the film-like adhesive 2 in a solvent. A method of drying the solvent after application so as to have a thickness can be employed. Such a varnish is obtained by uniformly dissolving or dispersing necessary components such as an epoxy resin in an aromatic, ketone, ether or other organic solvent or a mixed solvent thereof. The viscosity of is not particularly limited. Moreover, as the support film layer 6, the thing similar to the said cover film layer 5 can be used.

  Moreover, it replaces with the said method using film-form adhesive layer 2 'provided with the support film layer 6 previously, as a method of arrange | positioning a film-form adhesive layer, the said varnish is dried on the surface of the said peeling base material. A method may be employed in which the solvent is dried after direct application so that the thickness becomes a predetermined thickness.

  In the step of punching the film adhesive layer at a position outside the peripheral edge of the hole to obtain the film adhesive, as shown in FIG. After punching out the film-like adhesive layer 2 'at a position outside the periphery of the hole formed in', the film-like adhesive is removed by removing the unnecessary film-like adhesive layer 2 'as shown in FIG. Get 2. In addition, when the film adhesive 2 ′ provided with the support film layer 6 in advance is used, the support film layer 6 is removed together with the unnecessary film adhesive layer 2 ′ in this step as shown in FIG. There is a need. Although not shown in the figure, when the peeling auxiliary film layer 4 ′ with the cover film layer 5 is used, it is necessary to remove the cover film layer 5 in this step.

  Further, the position outside the peripheral edge of the hole punched by the punching blade 7 is not particularly limited, but it is preferably a position of 1 to 10 mm outward from the peripheral edge of the hole.

  In the step of arranging the pressure-sensitive adhesive film layer so as to cover the surface of the film-like adhesive, the surface of the pressure-sensitive adhesive film layer 3 ′ having the pressure-sensitive adhesive layer is opposed to the film-like adhesive 2, and the film-like adhesive 2 The adhesive film layer 3 ′ is disposed so as to cover the surface. A method for such arrangement is not particularly limited, and a known film lamination method can be used.

  In the step of punching out the pressure-sensitive adhesive film layer and the peeling auxiliary film layer at a position outside the periphery of the film adhesive to obtain the pressure-sensitive adhesive film and the peeling auxiliary film, as shown in FIG. After punching the outer edge of the film adhesive 2 with a blade 7 into a ring shape, unnecessary portions of the adhesive film layer 3 ′ and the peeling auxiliary film layer 4 ′ are removed, although not shown in the drawing. By doing so, the adhesive film 3 and the peeling auxiliary film 4 are obtained.

  As such punching, a known method can be used without any particular limitation, but from the viewpoint of removing the unnecessary portion, cutting with a punching blade in the peeling substrate 1 at the time of punching is performed. The depth is preferably 0.5 to 25 μm.

  In addition, the multilayer adhesive film obtained by the manufacturing method of this invention including the process of arrange | positioning the said peeling auxiliary | assistant film in the area | region which includes the whole periphery of the said film adhesive WHEREIN: The punching process of a film adhesive layer is carried out. The punching blade never reaches the release substrate, and the film adhesive does not bite into the notch of the release substrate. It is excellent in that the film adhesive and the peeling substrate can be peeled without doing.

  Next, a preferred embodiment of the step of disposing the peeling assist film according to the present invention in a region including a part of the periphery of the film adhesive will be described.

As the step of disposing the peeling auxiliary film in a region including a part of the periphery of the film adhesive, the film adhesive has a substantially circular planar shape, and the peeling auxiliary film is a tape. The peeling assisting film is disposed in a region including a part of the peripheral edge of the film adhesive, and the step includes:
The film-adhesive and the film-shaped adhesive between the pressure-sensitive adhesive film and the peeling substrate are formed so that the pressure-sensitive adhesive force (Fa) is larger than the pressure-sensitive adhesive force (Fb). The step is preferably a step of inserting into a region including a part of the periphery.

  In the step of inserting into the region including a part of the periphery of the film adhesive between the film adhesive and the pressure-sensitive adhesive film and the peeling substrate, the method for inserting a peeling auxiliary film is the film The adhesive force (Fa) between the adhesive and the pressure-sensitive adhesive film and the peeling auxiliary film should be larger than the pressure-sensitive adhesive force (Fb) between the peeling base material and the peeling auxiliary film. A multilayer adhesive sheet comprising a film adhesive disposed on the surface of the release substrate and punched, and a pressure-sensitive adhesive film disposed so as to cover the film adhesive. Is preferably peeled off from the film-like adhesive and the pressure-sensitive adhesive film, and the peeling auxiliary film is attached to a part of the periphery of the film-like adhesive as shown in FIG. Arbitrariness.

  As the multilayer adhesive sheet, known materials can be used without any particular limitation, but materials produced by the production method described below are preferably used. That is, after disposing a film-like adhesive layer on the surface of the release substrate, the film-like adhesive layer is punched using a rotary precutting device to obtain a release substrate with a film-like adhesive. Furthermore, after placing the adhesive film layer so as to cover the film adhesive obtained by punching, multilayer adhesive produced by a manufacturing method in which the adhesive film layer is punched using a rotary pre-cut processing device It is preferable to use a sheet.

  As the multilayer adhesive sheet, a commercially available product such as an existing multilayer adhesive sheet, a so-called dicing tape-integrated die bonding sheet may be used. In such a case, in a commercial product or the like, the adhesive film (dicing tape) and the film adhesive (die bonding sheet) are not peeled off, and the film adhesive (die bonding sheet) and the peeling substrate are peeled off. It is effective in that it becomes possible.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example.

Example 1
First, a varnish containing an epoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., a varnish for producing a multilayer adhesive sheet “NEX-130E4X”) is prepared, on the surface of a release substrate (material: PET, thickness: 50 μm). After application, the solvent was dried to produce a film adhesive layer. By disposing a support film layer (material: PET, thickness: 25 μm) on the surface of the obtained film adhesive layer, a three-layer sheet including a film adhesive layer having a thickness of 60 μm was obtained.

  Next, the obtained three-layer sheet is mounted on a rotary pre-cut processing apparatus, and a punching blade for film adhesive (punching diameter: 220 mm, punching blade height: 15 μm) is used. Then, the film-like adhesive layer and the support film layer were punched from the support film layer side, and then unnecessary portions and the support film layer in the film-like adhesive layer were removed to obtain a release substrate with a film-like adhesive. In addition, the setting position in the depth direction of the punching blade in the precut processing apparatus is the depth of cut of the cut portion by the punching blade when only a PET film (peeling substrate) having a thickness of 50 μm is placed on the punching table. Was adjusted to a position such that was about 10 μm.

  Next, after laminating an adhesive film layer (pressure-sensitive dicing tape, thickness: 105 μm) from the side on which the film adhesive is disposed, the adhesive film layer is mounted from the adhesive film layer side after being mounted on a rotary pre-cut processing device. Was punched out using a punching blade for punching film (diameter of punching: 269.5 mm), and then unnecessary portions in the adhesive film layer were removed.

  Furthermore, from the release substrate with a film adhesive laminated with an adhesive film, confirm that the film adhesive is not attached to the release substrate and that the film adhesive layer and the adhesive film layer do not peel. However, the peeling base material was peeled about 50 mm inward from the periphery of the adhesive film. On the surface of the film-like adhesive layer and the pressure-sensitive adhesive film layer exposed by peeling off the peeling substrate, a peeling auxiliary film having a pressure-sensitive adhesive layer on both surfaces (product name “4591HM”, thickness: 0.082 mm, width) : 25mm, length: 30mm) is attached so that one end of the peeling aid film is 3mm inward from the periphery of the film adhesive and the other end is 22mm outward from the periphery of the film adhesive A multilayer adhesive sheet was obtained. The adhesive strength between the peeling assist film and the film adhesive is 3 N / cm, the adhesive strength between the peeling assist film and the adhesive film is 0.56 N / cm, and the adhesion between the peeling assist film and the release substrate. The force is 0.06 N / cm, and these are values obtained by measurement according to the method described in JIS Z0237. That is, the adhesive strength is determined by using a universal auxiliary testing machine (product name “RTA-250”, manufactured by Orientec Co., Ltd.), a pulling auxiliary film (width: 10 mm) attached to a film adhesive or the like at a pulling speed of 500 mm / It is a value measured by peeling in 90 ° direction in minutes.

(Comparative Example 1)
A multilayer adhesive sheet was produced in the same manner as in Example 1 except that the peeling assist film was not used.

(Multilayer adhesive sheet peel test)
About the multilayer adhesive sheet obtained in Example 1 and Comparative Example 1, the peeling test was performed by the method shown below, and the peelability between the film adhesive and the peeling substrate was evaluated.

  As shown in FIG. 12, in the multilayer adhesive sheet obtained in Example 1, a straight line and an adhesive that pass through the center point of the film adhesive 2 and the peeling auxiliary film 4 and are parallel to the longitudinal direction of the peeling substrate 1. Using the point where the peripheral edge of the film 3 intersects as a starting point of peeling, the pressure-sensitive adhesive film 3 is peeled at a peeling speed of 1 m / min so that the tensile angle of the pressure-sensitive adhesive film 3 (the angle formed by bending of the pressure-sensitive adhesive film) is 30 °. A peeling test of the multilayer adhesive sheet was performed by peeling off from the peeling substrate 1. When the film-like adhesive 2 was all attached to the pressure-sensitive adhesive film 3, it was judged that peeling was good, and when the film-like adhesive 2 was even partially adhered to the peeling substrate 1, it was judged as peeling failure. Further, the same peel test as described above was performed for those stored for 14 days at a temperature of 23 ° C. and those stored for 28 days at a temperature of 23 ° C.

  Moreover, in the multilayer adhesive sheet obtained in Comparative Example 1, a peel test of the multilayer adhesive sheet was performed in the same manner as in Example 1 except that an arbitrary position was used as the peeling start point.

  About the multilayer adhesive sheet (Example 1) of this invention, the film adhesive and the peeling base material were able to be peeled, without peeling an adhesive film and a film adhesive. On the other hand, since the multilayer adhesive sheet obtained in Comparative Example 1 does not include a peeling auxiliary film, the pressure-sensitive adhesive film and the film-like adhesive peel when the film-like adhesive and the peeling substrate are peeled off. It was confirmed that the film adhesive adhered to the release substrate.

  As described above, according to the present invention, in the multilayer adhesive sheet in which the pre-cut processing of the film adhesive is performed, the adhesive film and the film adhesive are not peeled off, and the film adhesive and the release substrate are removed. It is possible to provide a multilayer adhesive sheet and a method for producing the same that can sufficiently hold the wafer ring.

  DESCRIPTION OF SYMBOLS 1 ... Peeling base material, 2 ... Film adhesive, 2 '... Film adhesive layer, 3 ... Adhesive film, 3' ... Adhesive film layer, 4 ... Peeling auxiliary film, 4 '... Peeling auxiliary film layer, 5 ... Cover film layer, 6 ... support film layer, 7 ... punching blade.

Claims (10)

A multilayer adhesive sheet comprising a release substrate, a film adhesive disposed on the surface of the release substrate and punched, and an adhesive film disposed so as to cover the film adhesive. And
A peeling auxiliary film having a pressure-sensitive adhesive layer on both sides is disposed in a region including all or part of the film-like adhesive and a peripheral edge of the film-like adhesive between the pressure-sensitive adhesive film and the peeling substrate. Multilayer adhesive, characterized in that the adhesive force (Fa) between the adhesive and the adhesive film and the peeling auxiliary film is larger than the adhesive force (Fb) between the peeling substrate and the peeling auxiliary film Sheet.   The multilayer adhesive sheet according to claim 1, wherein the adhesive force (Fa) is 0.2 N / cm or more and the adhesive force (Fb) is less than 0.2 N / cm.   The multilayer adhesive sheet according to claim 1 or 2, wherein a difference between the adhesive force (Fa) and the adhesive force (Fb) is 0.05 N / cm or more.   One end of the peeling auxiliary film is located in a region of 1 to 10 mm inward from the periphery of the film adhesive, and the other end of the peeling auxiliary film is 1 to 25 mm outward from the periphery of the film adhesive. The multilayer adhesive sheet according to any one of claims 1 to 3, wherein the peeling assisting film is disposed so as to be located in a region.   The multilayer adhesive sheet according to any one of claims 1 to 4, wherein the peeling assist film has a thickness of 5 to 150 µm.   The film adhesive has a substantially circular planar shape, and the peeling assist film has a ring-shaped planar shape, and the peeling assist film covers the entire periphery of the film adhesive. It arrange | positions in the area | region to include, The multilayer adhesive sheet as described in any one of Claims 1-5 characterized by the above-mentioned.   The film-like adhesive has a substantially circular planar shape, and the peeling assist film has a tape-shaped planar shape, and the peeling assist film is a part of the periphery of the film adhesive. The multilayer adhesive sheet according to claim 1, wherein the multilayer adhesive sheet is disposed in a region including Manufacture of a multilayer adhesive sheet comprising a release substrate, a film adhesive disposed on the surface of the release substrate and stamped, and an adhesive film disposed to cover the film adhesive A method,
The film-like adhesion is applied to a region including all or part of the peripheral edge of the film-like adhesive between the film-like adhesive and the pressure-sensitive adhesive film and the peeling substrate. Including a step of disposing an adhesive and an adhesive force (Fa) between the adhesive film and the peeling auxiliary film to be larger than an adhesive force (Fb) between the peeling substrate and the peeling auxiliary film. A method for producing a multilayer adhesive sheet. In the step of disposing the peeling auxiliary film, the film-like adhesive has a substantially circular planar shape, and the peeling auxiliary film has a ring-shaped planar shape, Arranged in a region including the entire periphery of the film adhesive,
A step of disposing a peeling assisting film layer having an adhesive layer on both sides on the surface of the peeling substrate;
Forming a substantially circular hole in the peeling assisting film layer;
Placing a film adhesive layer on the surface of the peeling assist film layer so as to cover the hole;
Punching the film adhesive layer at a position outside the periphery of the hole to obtain the film adhesive;
Arranging an adhesive film layer so as to cover the surface of the film adhesive;
Stamping the adhesive film layer and the peeling assisting film layer at a position outside the periphery of the film adhesive to obtain the adhesive film and the peeling assisting film,
The method for producing a multilayer adhesive sheet according to claim 8, wherein a multilayer adhesive sheet having a larger adhesive strength (Fa) than the adhesive strength (Fb) is obtained. In the step of disposing the peeling assisting film, the film-like adhesive has a substantially circular planar shape, and the peeling assisting film has a tape-shaped planar shape. Arranged in a region including a part of the periphery of the film adhesive, the step,
The film-adhesive and the film-shaped adhesive between the pressure-sensitive adhesive film and the peeling substrate are formed so that the pressure-sensitive adhesive force (Fa) is larger than the pressure-sensitive adhesive force (Fb). The method for producing a multilayer adhesive sheet according to claim 8, wherein the method is a step of inserting into a region including a part of the periphery.