JP2005167182A - Pressure-sensitive adhesive sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which can easily peel off a protective film without weakening adhesive strength of the pressure-sensitive adhesive and can adequately glue a dicing ring to a dicing-ring mounting part and provide an easy dicing process. <P>SOLUTION: An adhesive 2 of a prescribed planar shape, a pressure-sensitive adhesive 3 that covers the adhesive 2, has a size somewhat larger than that of the adhesive 2, and has a peripheral edge part that does not overlap the adhesive 2, and a base film 4 that overlaps the pressure-sensitive adhesive 3, are laminated in this order on a surface of a protective film 1, or a pressure-sensitive adhesive 5 of a prescribed planar shape and the base film 4 that overlaps the pressure-sensitive adhesive 5 are laminated in this order on the surface of the protective film, to form the pressure-sensitive adhesive sheet for manufacturing semiconductor devices, wherein a tape-shaped small piece 6 is placed in a part of the peripheral edge part to form a starting point for the peeling that enables easily to peel and remove the protective film 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an adhesive sheet (dicing die bond sheet) that is suitably used when manufacturing a semiconductor device.

  Conventionally, silver paste has been mainly used for joining a semiconductor chip and a support member such as a lead frame. However, with the recent miniaturization and high performance of semiconductor chips, the lead frames used are also required to be miniaturized and densified. With silver paste, squeezing and tilting of the semiconductor chip during wire bonding are required. The above-mentioned demands cannot be dealt with because of problems such as occurrence of defects, difficulty in controlling the film thickness of the adhesive layer, and generation of voids in the adhesive layer.

  Therefore, in recent years, instead of silver paste, an adhesive film (also referred to as a film-like adhesive, a film-like die-bonding material, etc.) has been used as a so-called individual piece attaching method or a wafer back surface attaching method. Yes. When a semiconductor device is manufactured by the former method of attaching individual pieces, an individual piece of adhesive film is cut out from a roll-like (reel-like) adhesive film by cutting or punching, and then the individual piece is attached to a lead frame. An element film (semiconductor chip) previously cut and separated (diced) in a dicing process is placed on a lead frame with an adhesive film and bonded (die-bonded) to produce a lead frame with a semiconductor chip. A semiconductor device is obtained through a wire bonding process, a sealing process, and the like. However, in this case, a dedicated assembly device that cuts out pieces of the adhesive film from the roll-like adhesive film and adheres it to the lead frame is required. Therefore, the manufacturing cost is higher than the method using silver paste. become.

  On the other hand, in the case of manufacturing a semiconductor device by the latter wafer back surface pasting method, an adhesive film is first pasted on the back surface of the semiconductor wafer, and further a dicing tape is pasted thereon, and then an adhesive film is attached by dicing. The semiconductor wafer is separated into individual pieces, and the individual pieces of the obtained semiconductor chip with an adhesive film are picked up and affixed to a lead frame. Thereafter, the semiconductor device is obtained through processes such as heating, curing, and wire bonding. In this method, in order to join the semiconductor chip with the adhesive film to the lead frame, an apparatus for separating the adhesive film into pieces is not required, and the conventional silver paste assembling apparatus is used as it is or a heating plate is added. Therefore, the manufacturing cost can be kept relatively low. However, this method also requires two pasting steps, that is, pasting of an adhesive film and subsequent pasting of a dicing tape before the dicing step.

  Therefore, two types of methods have been devised so that two attaching steps are not required and only one attaching step is required. One is a two-layer “adhesive adhesive sheet (dicing die bond sheet)” in which an adhesive film and dicing tape are pasted together, and the other is a “viscous adhesive sheet” that combines the functions of a dicing tape and a die bond film. An “adhesive sheet” has been developed (see Patent Documents 1 and 2). In patent document 1, it aims at making the expandability and pick-up after a dicing process easy by maintaining the elasticity modulus after the radiation curing in a radiation curing type adhesive layer in a predetermined range. In Patent Document 2, it is easy to pick up by using the adhesive strength reduction between the support and the adhesive layer by curing the adhesive layer of the photopolymerizable low molecular weight compound and the peelability due to the surface tension of the light-transmitting support. The aim is.

Recently, a two-layered adhesive sheet as shown in FIG. 4, that is, a large number of disk-shaped adhesives (die bond materials) 2 are formed in an island shape on the long protective film 1. On top of that, a disk-shaped pressure-sensitive adhesive 3 that is slightly larger than the adhesive (die-bonding material) 2 and a base film 4 that overlaps the disk-shaped pressure-sensitive adhesive 3 are sequentially laminated. An adhesive sheet having a four-layer structure of “4” has been developed. When this adhesive sheet is used, the protective film 1 is first peeled off and the adhesive 2 is exposed (the adhesive is also exposed in a belt-like ring shape), and then a dicing ring mounting portion (a belt-like circle) A ring for dicing is placed on the ring-shaped adhesive), a semiconductor wafer is placed on the semiconductor wafer mounting portion on the inner side, and the semiconductor wafer is diced into a semiconductor chip with an adhesive film, and then, The semiconductor chip with the adhesive film is picked up, placed on a lead frame, heated and bonded (die-bonded), subsequently wire-bonded, and sealed using a sealing material to manufacture a semiconductor device.
Also, a single-layered adhesive sheet, that is, a “protective” in which a large number of disc-like adhesives (dicing die bond materials) 5 and a base film 4 overlapping therewith are sequentially laminated on a long protective film 1. An adhesive sheet having a three-layer structure of “film 1 / adhesive 5 / base film 4” has been developed. When this adhesive sheet is used, the protective film 1 is first peeled off and the adhesive 5 is exposed, followed by placing a dicing ring and placing the semiconductor wafer on the semiconductor wafer mounting portion. The semiconductor wafer is diced into individual semiconductor chips with an adhesive film, and then the semiconductor chip with an adhesive film is picked up, placed on a lead frame, and heated and bonded (die-bonded). Subsequently, wire bonding and sealing with a sealing material are performed to manufacture a semiconductor device.

Japanese Patent No. 3348923 Patent 198707034

  By the way, the pressure-sensitive adhesive and pressure-sensitive adhesive of the pressure-sensitive adhesive sheet shown in FIG. 4 and FIG. 8 need to have a relatively strong pressure since the dicing ring must be bonded in the dicing process. However, if the adhesive strength is too strong, it is difficult to peel off the protective film 1, and it takes time for the peeling, or a peeling failure tends to occur. The object of the present invention is to provide a pressure-sensitive adhesive sheet with improved such problems, that is, the protective film can be easily peeled off without weakening the pressure-sensitive adhesive strength of the pressure-sensitive adhesive and the pressure-sensitive adhesive. It is to provide a pressure-sensitive adhesive sheet in which a dicing ring is sufficiently adhered (adhered) to a pressure-sensitive adhesive (dicing ring mounting portion) and a pressure-sensitive adhesive, and the subsequent dicing step and the like can be easily performed.

In order to achieve the above object, as a result of various studies, the present inventors have conceived that the protective film can be easily peeled off by positively creating a peeling start point in the adhesive sheet. It came to be completed.
That is, in the case of the two-layered adhesive sheet according to the present invention, the adhesive (die-bonding material) 2 having a predetermined plan view shape and the adhesive 2 are covered on one side of the protective film 1. And a base material film 4 that overlaps the pressure-sensitive adhesive 3 in this order, and a pressure-sensitive adhesive 3 having a peripheral portion (being a ring mounting portion for dicing) that does not overlap with the adhesive 2. It is a laminated adhesive sheet for manufacturing semiconductor devices (dicing die bond sheet),
A peeling start point for facilitating peeling / removing of the protective film 1 is formed on a part of the peripheral edge portion. The adhesive sheet for manufacturing a semiconductor device (dicing die bond sheet).
Further, in the case of the single-layered adhesive sheet according to the present invention, the adhesive film (dicing die bond material) 5 having a predetermined plan view shape on one side of the protective film 1 and the base film 4 overlapping therewith, It is an adhesive sheet for manufacturing semiconductor devices (dicing die bond sheet) laminated in order,
A peeling start point for easily peeling and removing the protective film 1 is formed on a part of the peripheral edge portion.

Hereinafter, the present invention will be described in more detail.
The two-layered adhesive sheet of the present invention has a sheet-like protective film 1 having a width of about 30 cm, an adhesive 2 thereon, a size larger than the adhesive 2, and an adhesive 2 Can be provided in the form of a “label” as a set of a pressure-sensitive adhesive 3 having a non-overlapping peripheral edge and a base film 4 that overlaps and protects the pressure-sensitive adhesive 3. As a set, the agent 2, the adhesive 3, and the base film 4
The single-layered adhesive sheet has a sheet-like protective film 1 having a width of about 30 cm, an adhesive 5 thereon, and a base material that overlaps and protects the adhesive 5. The film 4 can be provided as a set in the form of a “tape (or sheet)” in which a large number of islands are arranged on one side of the long protective film 1 and wound into a roll.

  Moreover, the planar view shape of the adhesive 2 of the two-layered adhesive sheet of the present invention in the adhesive 2 or the single-layered adhesive sheet is preferably circular, substantially circular, or semiconductor wafer shape. is there.

  Further, in the adhesive sheet of the present invention, when this is irradiated with high energy rays such as radiation and ultraviolet rays, the adhesive force of the adhesive 3 is reduced and the adhesive sheet 2 is easily peeled off at the interface between the adhesive 2 and the adhesive 3. Alternatively, it is preferable that the adhesive strength of the adhesive 5 is reduced and the adhesive 5 is easily peeled off at the interface between the adhesive 5 and the base film 4.

  As the protective film 1 used in the present invention, a film having heat resistance that does not impair mechanical properties by heat treatment from room temperature to about 80 ° C. is used. Specifically, polyester films such as polyethylene terephthalate film, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyolefin films such as polyvinyl acetate films, plastics such as polyvinyl chloride films and polyimide films A film is preferably used, and paper, non-woven fabric, metal foil, and the like can be used. These base materials can be used in a multilayer structure.

Moreover, in order to improve the adhesiveness of the base film 4 and the adhesive 3, or the base film 4 and the adhesive 5, the surface of the base film 4 is subjected to a conventional surface treatment such as chromic acid treatment. Chemical or physical treatment such as ozone exposure, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, etc. may be applied.
Moreover, in order to raise the peelability of the protective film 1, it is preferable to process the peeling surface with mold release agents, such as a silicone type release agent, a fluorine-type release agent, and a long-chain alkyl acrylate type release agent.
Further, as the protective film 1, a film made of a fluororesin and having a low surface energy can be used.
Specific examples of the protective film 1 include, for example, A-63 (mold release treatment agent: modified silicone type) manufactured by Teijin Ltd. and S-31 (mold release treatment agent) manufactured by Teijin Ltd. : Pt silicone).

  The thickness of the protective film 1 can be appropriately selected as long as the workability is not impaired. Usually, it is 100 micrometers or less, Preferably it is 10-75 micrometers, More preferably, it is 25-50 micrometers.

  As the adhesive 2 and the adhesive 5 used in the present invention, the semiconductor chip as an adherend is protected from thermal shock and the like. Preferably, the reliability JEDEC Level 3 (temperature 30 ° C., RH 60%, 192) A material satisfying 265 ° C IR reflow after time moisture absorption is used. It selects suitably from well-known various thermosetting adhesives, photocurable adhesives, thermoplastic adhesives, oxygen reactive adhesives, etc. Examples of such an adhesive 2 include a die attach film HS-232 manufactured by Hitachi Chemical Co., Ltd.

  The planar view shape of the adhesive 2 and the adhesive 5 is required to have at least a size (width) on which a semiconductor wafer (about 20 cm) is placed, and a shape that allows easy attachment of the semiconductor wafer is preferable. There are a circular shape, a substantially circular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, an octagonal shape, a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line), and the like. However, in order to reduce a waste portion other than the semiconductor wafer mounting portion, a circular shape or a wafer shape is preferable.

  The layer thicknesses of the adhesive 2 and the adhesive 5 are usually 1 to 200 μm, preferably 3 to 150 μm, and more preferably 10 to 100 μm. If it is thinner than 1 μm, it will be difficult to ensure sufficient die-bonding adhesive force, or the stress relaxation effect will tend to be poor, and if it is thicker than 200 μm, it will be uneconomical and will not meet the demand for miniaturization of semiconductor devices. There is a trend and no characteristic advantage.

  As the pressure-sensitive adhesive 3 used in the present invention, those having adhesive strength at room temperature and having necessary adhesion to the adherend (for example, acrylic resin, various synthetic rubbers, natural rubber, polyimide resin, etc.) are used. Can be used. Preferably, those that are cured by high energy rays such as ultraviolet rays and radiation or heat (that is, those that lower the adhesive force), particularly those that are cured by high energy rays, and those that are cured by ultraviolet rays are particularly preferred.

  Various types of pressure-sensitive adhesives that are cured by such high energy rays (or ultraviolet rays) have been conventionally known. Among them, those whose adhesive strength is reduced by irradiation with high energy rays (or ultraviolet rays) can be appropriately selected and used. In the case of curing using energy rays, it is necessary to contain an energy ray curing adhesive component.

  In addition, as such an adhesive (however, with a base film), there exists dicing tape FS-8801 etc. by Furukawa Electric Co., Ltd., for example.

The shape of the pressure-sensitive adhesive 3 in plan view is one size larger than the shape of the adhesive 2 in plan view so that it can completely cover the adhesive 2, and the peripheral portion that does not overlap with the adhesive 2 (the dicing ring is mounted). The shape is not particularly limited as long as the shape has a mounting portion. There are circular, substantially circular, quadrangular, pentagonal, hexagonal, octagonal, and wafer shapes. However, the preferable shape is circular because of the relationship with the preferable shape (circular or wafer shape) of the adhesive 2 described above.
The peripheral edge that does not overlap with the adhesive 2 is wide enough to place and fix the dicing ring. When the planar view is a belt-like annular shape, the width is about 3 cm.

  The layer thickness of the pressure-sensitive adhesive 3 is usually 1 to 100 μm, preferably 2 to 20 μm, and more preferably 3 to 10 μm. If it is thinner than 1 μm, it will be difficult to secure a sufficient adhesive force, and the semiconductor chip may be scattered during dicing. If it is thicker than 100 μm, it will be uneconomical and there will be no advantage in characteristics.

  As the base film 4, a base similar to the film or sheet used for the protective film 1 can be used. For example, polyester film such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polyolefin film such as polymethylpentene film, polyvinyl acetate film, plastic film such as polyvinyl chloride film, polyimide film, etc. Yes, it may have a multilayer structure. In addition, the thickness of the base film 4 can be appropriately selected as long as the workability is not impaired. When a high energy ray (in particular, ultraviolet ray) curable adhesive is used as the above-mentioned pressure-sensitive adhesive, it is used with a thickness that does not impede transmission of the high-energy ray. Usually, it is 10-500 micrometers, Preferably it is 50-200 micrometers.

  According to the adhesive sheet for manufacturing a semiconductor device of the present invention, the protective film 1 can be easily made using the peeling starting point provided on the adhesive sheet without weakening the adhesive force of the adhesive 3 and the adhesive 5. In addition, the dicing ring is sufficiently adhered (adhered) to the pressure-sensitive adhesive (dicing ring mounting portion), and the subsequent dicing process can be easily performed.

  Hereinafter, the dicing die-bonding sheet having a two-layer structure according to the present invention will be described more specifically with reference to the accompanying drawings.

FIG. 1 is a dicing die bond sheet of the first embodiment according to the present invention.
Adhesive (3 + 4) with a base film cut into a disk shape having a diameter of about 26 cm (for example, dicing tape FS-8801 manufactured by Furukawa Electric Co., Ltd.) and one size smaller than the above adhesive with a base film ( A disc-shaped film adhesive 2 (for example, a die attach film manufactured by Hitachi Chemical Co., Ltd., HS-232) cut to a diameter of about 20 cm is bonded together with the center aligned, and then the adhesive 2 Naflon tape 6 having a width of about 2 cm and a length of about 4 cm (for example, TOMBO9001, 0.08 mmt manufactured by NICHIAS CORPORATION) ) And a protective film 1 (manufactured by Teijin Ltd., A-63, mold release treatment: modified silicone) is pressed onto the protective film. 1 / adhesive (die bond material) 2 / adhesive 3/4-layer of the substrate film 4 to produce an integrated dicing die-bonding sheet (Figure 1). In this dicing die bond sheet, the protective film 1 can be easily peeled off using the Naflon tape 6 as a peeling starting point. Further, the laminating property (a semiconductor wafer can be attached without involving air) and the dicing property (not causing abnormalities such as chip skipping and chipping during dicing) are also good.

The size of the tape-shaped piece 6 (in plan view) is not limited to the above dimension, and may be any size that is appropriate for the separation starting point. Usually, the width is about 1 to 3 cm and the length is about 2 to 6 cm.
Further, the thickness of the tape-shaped piece 6 is not particularly limited, but is preferably the same as or approximately the same as the thickness of the adhesive (die bond material) layer. The material of the tape-shaped piece is not particularly limited. The adhesive strength may be slightly, but those having no adhesive strength such as paper and fluorine-based sheets are preferable.

The peeling start point is obtained by irradiating a part of a belt-like annular peripheral part (dicing ring mounting part) where the adhesive 2 and the adhesive 3 do not overlap with each other in advance with high-energy rays, and sticking the adhesive of the part. It can also be formed by reducing the force. FIG. 2 shows an example thereof (the dicing die bond sheet of the second embodiment).
A four-layer integrated sheet of protective film 1 / adhesive (die bond material) 2 / adhesive 3 / base film 4 is produced in the same manner as in the first embodiment except that no tape-shaped piece is used. Thereafter, the adhesive 2 and the adhesive 3 are not overlapped with each other by irradiating a part of the belt-like annular peripheral portion (the dicing ring mounting portion) of the adhesive with ultraviolet rays, and the adhesive strength ( (Adhesion force) is reduced (FIG. 2). In this dicing die bond sheet, the protective film 1 can be easily peeled off. Also, the laminating property and the dicing property are good.
In addition, by irradiation with ultraviolet rays, a material having an adhesive strength of 10 to 200 N / cm with a width of 1 cm before irradiation can be reduced to 3/4 or less after irradiation.

Moreover, the peeling start point can also be formed by folding in part a part of the pressure-sensitive adhesive 3 and its base film 4, that is, the pressure-sensitive adhesive with a base film. FIG. 3 shows this example (the dicing die bond sheet of the third embodiment).
Halfway, a three-layer integrated sheet of adhesive (die bond material) 2 / adhesive 3 / base film 4 is produced in the same manner as in the first embodiment. Next, after folding a part of the belt-like annular peripheral portion (ring mounting portion for dicing) of the pressure-sensitive adhesive in which the adhesive 2 and the pressure-sensitive adhesive 3 do not overlap, a protective film (manufactured by Teijin Ltd., A-63, a modified silicone type) is pressed to produce a dicing die bond sheet (FIG. 3). Since the back side of the adhesive with a base film turned back does not have adhesiveness, this is a starting point for peeling. In this dicing die bond sheet, the protective film 1 can be easily peeled off. Also, the laminating property and the dicing property are good.

  Moreover, although not shown in figure, a peeling start point is mold release property about a part of surface of the protective film 1 corresponding to the strip | belt-shaped annular periphery (dicing ring mounting part) where the adhesive 2 and the adhesive 3 do not overlap. It is also possible to form by making it stronger than other parts.

Further, the dicing die bond sheet having a single layer structure will be specifically described. FIG. 5 shows a dicing die bond sheet according to a fourth embodiment of the present invention.
A part of the adhesive (5 + 4) with a base film cut into a disk having a diameter of about 26 cm and a Naflon tape 6 having a width of about 2 cm and a length of about 4 cm (for example, TOMBO9001, 0.08 mmt manufactured by NICHIAS Corporation) ) And a protective film 1 (manufactured by Teijin Ltd., A-63, mold release treatment agent: modified silicone type) is pressed over the protective film 1 / adhesive (dicing die bond material) 5 / A three-layer integrated dicing die-bonding sheet of the base film 4 is produced (FIG. 5). In this dicing die bond sheet, the protective film 1 can be easily peeled off using the Naflon tape 6 as a peeling starting point. Further, the laminating property (a semiconductor wafer can be attached without involving air) and the dicing property (not causing abnormalities such as chip skipping and chipping during dicing) are also good.

The size of the tape-shaped piece 6 (in plan view) is not limited to the above dimension, and may be any size that is appropriate for the separation starting point. Usually, the width is about 1 to 3 cm and the length is about 2 to 6 cm.
Further, the thickness of the tape-shaped piece 6 is not particularly limited, but is preferably the same as or approximately the same as the thickness of the adhesive (die bond material) layer. The material of the tape-shaped piece is not particularly limited. The adhesive strength may be slightly, but those having no adhesive strength such as paper and fluorine-based sheets are preferable.

The peeling start point can also be formed by irradiating a part of the dicing ring placement planned part of the adhesive 5 with a high energy ray in advance and reducing the adhesive strength of the adhesive of that part. it can. FIG. 6 shows an example thereof (dicing die bond sheet of the fifth embodiment).
A three-layer integrated dicing die bond sheet of protective film 1 / adhesive (dicing die bond material) 5 / base film 4 is prepared in the same manner as in the first embodiment except that no tape-shaped piece is used. . After that, a part of the dicing ring placement planned portion of the adhesive 5 is irradiated with ultraviolet rays to reduce the adhesive force (adhesion) of the irradiated adhesive of the irradiated part (FIG. 6). In this dicing die bond sheet, the protective film 1 can be easily peeled off. Also, the laminating property and the dicing property are good.
In addition, by irradiation with ultraviolet rays, a material having an adhesive strength of 10 to 200 N / cm with a width of 1 cm before irradiation can be reduced to 3/4 or less after irradiation.

Moreover, the peeling start point can also be formed by folding in part a part of the adhesive 5 and its base film 4, that is, the base film-attached adhesive. FIG. 7 shows this example (the dicing die bond sheet of the sixth embodiment).
A half-layer integrated dicing die bond sheet of protective film 1 / adhesive (dicing die bond material) 5 / base film 4 is produced until the middle in the same manner as in the first example. Next, after part of the adhesive 5 is folded back, a protective film (A-63, modified silicone type, manufactured by Teijin Ltd.) is pressed from above to produce a dicing die bond sheet (FIG. 8). Since the back side of the folded adhesive with a base film does not have tackiness, this is the starting point for peeling. In this dicing die bond sheet, the protective film 1 can be easily peeled off. Also, the laminating property and the dicing property are good.
Moreover, although not shown in figure, the peeling starting point is formed by making mold release property stronger than another part about a part of surface of the protective film 1 corresponding to the ring mounting plan part of the adhesive 5 for dicing. It can also be made.

It is a dicing die-bonding sheet having a two-layer structure according to the first embodiment of the present invention, in which (A) is a plan view and (B) is an AA cross-sectional view. It is a top view in the dicing die-bonding sheet of the 2 layer structure of the 2nd example concerning the present invention. It is a top view of the dicing die-bonding sheet of the 3rd example concerning the present invention. It is the dicing die-bonding sheet | seat of the two-layer structure of a prior art example, (A) is a top view, (B) is AA sectional drawing. It is a dicing die bond sheet of the single layer composition of the 4th example concerning the present invention, (a) is a top view and (b) is an AA sectional view. It is a top view in the dicing die-bonding sheet | seat of the 2 layer structure of 5th Example which concerns on this invention. It is a top view of the dicing die-bonding sheet of the 6th example concerning the present invention. It is the dicing die-bonding sheet | seat of the single layer structure of a prior art example, (A) is a top view, (B) is BB sectional drawing.

Explanation of symbols

1: Protective film 2: Adhesive (die bond material)
3: Adhesive 4: Base film 5: Adhesive (dicing die bond material)
6: Tape-shaped pieces

Claims (6)

An adhesive having a predetermined plan view shape on one side of the protective film, a pressure-sensitive adhesive that covers the adhesive, is slightly larger than the adhesive, and has a peripheral edge that does not overlap the adhesive; and the adhesive Adhesive sheet for manufacturing semiconductor device, or adhesive film having a predetermined plan view shape on one side of a protective film, and a base material overlapping the adhesive It is an adhesive sheet for manufacturing semiconductor devices in which films are laminated in this order,
A pressure-sensitive adhesive sheet for manufacturing a semiconductor device, wherein a peeling starting point that facilitates peeling and removal of a protective film is formed on a part of the peripheral edge. Adhesive and pressure-sensitive adhesive and base film, or adhesive and base film as a set, a large number of islands are arranged on one side of a long protective film, and rolled into a roll, The pressure-sensitive adhesive sheet for manufacturing a semiconductor device according to claim 1. The peeling starting point is formed by sandwiching a tape-shaped piece having no adhesive force between the adhesive at the peripheral edge or between the adhesive and the protective film. The adhesive sheet for semiconductor device manufacture as described. The peeling start point is formed by irradiating a part of the peripheral edge with a high energy ray in advance and reducing the adhesive force of the adhesive or the adhesive of the part. Item 3. An adhesive sheet for manufacturing a semiconductor device according to Item 2. 3. The adhesive starting point for manufacturing a semiconductor device according to claim 1 or 2, wherein the peeling starting point is formed by previously folding an adhesive or an adhesive and a part of its base film inward. Sheet. 3. The semiconductor device according to claim 1, wherein the separation starting point is formed by making the releasability of a part of the surface of the protective film corresponding to the peripheral edge part stronger than the other part. Adhesive sheet for manufacturing.

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