JP2005162818A - Dicing die bond sheet - Google Patents

Dicing die bond sheet Download PDF

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JP2005162818A
JP2005162818A JP2003401592A JP2003401592A JP2005162818A JP 2005162818 A JP2005162818 A JP 2005162818A JP 2003401592 A JP2003401592 A JP 2003401592A JP 2003401592 A JP2003401592 A JP 2003401592A JP 2005162818 A JP2005162818 A JP 2005162818A
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adhesive
film
dicing
dicing die
pressure
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Suzushi Furuya
涼士 古谷
Michio Uruno
道生 宇留野
Takayuki Matsuzaki
隆行 松崎
Maiko Kaneda
麻衣子 金田
Michio Masuno
道夫 増野
Teiichi Inada
禎一 稲田
Keisuke Okubo
恵介 大久保
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing die bond sheet from which a protecting film can easily be peeled without weakening the sticking force of a sticky agent and which can sufficiently stick a dicing ring and facilitates the subsequent dicing process, and the like. <P>SOLUTION: This dicing die bond sheet prepared by laminating an adhesive (die bonding material) 2 having a prescribed planar view shape, a sticking agent which covers the adhesive 2, has a larger size than that of the adhesive 2, and has a peripheral portion (used as a dicing ring-loading portion) not overlapping with the adhesive, and a substrate film overlapping with the sticking agent in this order to one side of a protecting film 1 is characterized in that a projected portion projected in a state contacting with or approaching the outer periphery of the sticking agent at at least one position on the planar view is formed in the outer periphery of the adhesive 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、半導体装置を製造する際に好適に使用されるダイシングダイボンドシートに関するものである。   The present invention relates to a dicing die bond sheet that is suitably used when manufacturing a semiconductor device.

従来、半導体チップとリードフレーム等の支持部材との接合には銀ペーストが主に使用されていた。しかし、近年の半導体チップの小型化・高性能化に伴い、使用されるリードフレームも小型化・細密化が要求されるようになり、銀ペーストでは、ワイヤボンディング時においてハミ出しや半導体チップの傾きに起因する不具合が発生したり、あるいは接着剤層の膜厚の制御が困難であったり、接着剤層にボイドが発生する等の理由で、上記要求に対処しきれなくなってきた。   Conventionally, silver paste has been mainly used for joining a semiconductor chip and a support member such as a lead frame. However, with the recent miniaturization and high performance of semiconductor chips, the lead frames used are also required to be miniaturized and densified. With silver paste, squeezing and tilting of the semiconductor chip during wire bonding are required. The above-mentioned demands cannot be dealt with because of problems such as occurrence of defects, difficulty in controlling the film thickness of the adhesive layer, and generation of voids in the adhesive layer.

そこで、近年は、銀ペーストに代えて接着フィルム（フィルム状接着剤、フィルム状ダイボンド材、等ともいう。）を、いわゆる個片貼付け方式として、あるいはウェハ裏面貼付け方式で使用するようになってきている。前者の個片貼付け方式で半導体装置を製造する場合、ロール状（リール状）の接着フィルムからカッティングあるいはパンチングによって接着フィルムの個片を切り出した後、この個片をリードフレームに貼り付け、得られた接着フィルム付きリードフレームに、予めダイシング工程にて切断分離（ダイシング）した素子小片（半導体チップ）を載置し接合（ダイボンド）して半導体チップ付きリードフレームを作製し、その後、必要に応じてワイヤボンド工程、封止工程などを経て半導体装置とする。しかし、この場合は、ロール状の接着フィルムから接着フィルムの個片を切り出し、これをリードフレームへ接着させる専用の組立装置が必要なことから、銀ペーストを使用する方法に比べて製造コストが割高になる。   Therefore, in recent years, instead of silver paste, an adhesive film (also referred to as a film-like adhesive, a film-like die-bonding material, etc.) has been used as a so-called individual piece attaching method or a wafer back surface attaching method. Yes. When a semiconductor device is manufactured by the former method of attaching individual pieces, an individual piece of adhesive film is cut out from a roll-like (reel-like) adhesive film by cutting or punching, and then the individual piece is attached to a lead frame. An element film (semiconductor chip) previously cut and separated (diced) in a dicing process is placed on a lead frame with an adhesive film and bonded (die-bonded) to produce a lead frame with a semiconductor chip. A semiconductor device is obtained through a wire bonding process, a sealing process, and the like. However, in this case, a dedicated assembly device that cuts out pieces of the adhesive film from the roll-like adhesive film and adheres it to the lead frame is required. Therefore, the manufacturing cost is higher than the method using silver paste. become.

一方、後者のウェハ裏面貼付け方式で半導体装置を製造する場合は、まず半導体ウェハ（現在の主流は直径約２０ｃｍ）の裏面に接着フィルムを貼り付け、更にこの上にダイシングテープを貼り合わせ、その後、ダイシングによって接着フィルムが付いた状態で半導体ウェハを個片化し、得られた接着フィルム付き半導体チップの各個片をピックアップし、これをリードフレームに貼り付け、その後、加熱、硬化、ワイヤボンドなどの工程を経て半導体装置とする。この方法では、接着フィルム付き半導体チップをリードフレームに接合するために、接着フィルムを個片化する装置を必要とせず、従来の銀ペースト用の組立装置をそのままあるいは熱盤を付加するなどの装置の一部改良で済むため、製造コストを比較的安く抑えることができる。しかし、この方法も、ダイシング工程までに、接着フィルムの貼付と、それに続くダイシングテープの貼付との二つの貼付工程が必要である。   On the other hand, when manufacturing a semiconductor device by the latter wafer back surface pasting method, first, an adhesive film is pasted on the back surface of a semiconductor wafer (currently about 20 cm in diameter), and further a dicing tape is pasted thereon, The semiconductor wafer is separated into pieces with the adhesive film attached by dicing, and each piece of the obtained semiconductor chip with the adhesive film is picked up and attached to the lead frame, and then the process of heating, curing, wire bonding, etc. After that, a semiconductor device is obtained. In this method, in order to join the semiconductor chip with the adhesive film to the lead frame, an apparatus for separating the adhesive film into pieces is not required, and the conventional silver paste assembling apparatus is used as it is or a heating plate is added. Therefore, the manufacturing cost can be kept relatively low. However, this method also requires two pasting steps, that is, pasting of an adhesive film and subsequent pasting of a dicing tape before the dicing step.

そこで、二つの貼付工程を要せず一つの貼付工程で済むようにするために、予め接着フィルムとダイシングテープとを貼り合わせた（あるいは、一つのシートでダイシング工程及びダイボンド工程の両方に使用できるシート）「ダイシングダイボンドシート」が開発されている（特許文献１参照）。特許文献１では、放射線硬化型粘着剤層における放射線硬化後の弾性率を所定の範囲に維持して、ダイシング工程後のエキスパンディング性及びピックアップ性を容易にすることが狙いである。   Therefore, an adhesive film and a dicing tape are pasted together in advance so that two attaching steps are not required and one attaching step is sufficient (or one sheet can be used for both the dicing step and the die bonding step). Sheet) A “dicing die bond sheet” has been developed (see Patent Document 1). In patent document 1, it aims at making the expandability and pick-up property after a dicing process easy by maintaining the elasticity modulus after the radiation curing in a radiation curing type adhesive layer in a predetermined range.

また、図７（ａ）、（ｂ）に示すようなダイシングダイボンドシート、すなわち、保護フィルム１の上にディスク状の接着剤（ダイボンド材）２を形成し、その上に前記接着剤（ダイボンド材）よりも一回り大きいディスク状の基材フィルム付き粘着剤３（図７（ｂ）で言えば、下側が粘着剤、上側が基材フィルム）を積層した「保護フィルム／接着剤／粘着剤／基材フィルム」の４層構造を有するダイシングダイボンドシートが開発されている。このダイシングダイボンドシートを使用する場合は、保護フィルム１を先ず剥がして除くとともに接着剤２を露出させ（図７（ｃ））、続いて、ダイシング用リング載置部（帯状円環状の粘着剤）の上にダイシング用リング６を載置し、その内側の半導体ウェハ搭載部２ａに半導体ウェハ４を載置し（図７（ｄ））、半導体ウェハをダイシングし、個片化した接着フィルム付き半導体チップとし（図７（ｅ））、その後、この接着フィルム付き半導体チップをピックアップし、リードフレーム上に載置し、加熱・接合（ダイボンド）し、引き続いて、ワイヤボンドし、封止材を用いて封止し、半導体装置を製造する。   Further, a dicing die bond sheet as shown in FIGS. 7A and 7B, that is, a disk-shaped adhesive (die bond material) 2 is formed on the protective film 1, and the adhesive (die bond material) is formed thereon. ), A disc-shaped adhesive film 3 with a base material film (in FIG. 7 (b), the lower side is an adhesive and the upper side is a base film) "protective film / adhesive / adhesive / A dicing die bond sheet having a four-layer structure of “base film” has been developed. When this dicing die-bonding sheet is used, the protective film 1 is first peeled off and the adhesive 2 is exposed (FIG. 7C), and then the dicing ring mounting portion (band-shaped annular adhesive) The dicing ring 6 is placed on the semiconductor wafer, and the semiconductor wafer 4 is placed on the inner semiconductor wafer mounting portion 2a (FIG. 7D). The semiconductor wafer with the adhesive film is diced into individual pieces. Then, the semiconductor chip with the adhesive film is picked up, placed on the lead frame, heated and bonded (die-bonded), then wire-bonded, and the sealing material is used. The semiconductor device is manufactured.

特開平７−０４５５５７号公報Japanese Patent Laid-Open No. 7-045557

ところで、上記図７に示したダイシングダイボンドシートの基材フィルム付き粘着剤３の粘着剤は、ダイシング工程においてダイシング用リング６と充分に貼り付かなくてはならないため、比較的強い粘着力が必要である。しかし、粘着力が強すぎると保護フィルム１を剥がすことが難しくなり、剥離に時間が掛かったり、あるいは剥離不良になりやすい。本発明の目的は、このような問題点を改善したダイシングダイボンドシート、すなわち、前記粘着剤の粘着力を弱めることなく、保護フィルム１を容易に剥離させることができ、したがって、粘着剤（ダイシング用リング載置部）にダイシング用リング６を充分に貼り付かせ（密着させ）、その後のダイシング工程等を容易に行えるダイシングダイボンドシートを提供することである。   By the way, since the adhesive of the adhesive 3 with the base film of the dicing die bond sheet shown in FIG. 7 must be sufficiently adhered to the dicing ring 6 in the dicing process, a relatively strong adhesive force is required. is there. However, if the adhesive strength is too strong, it is difficult to peel off the protective film 1, and it takes time for the peeling, or a peeling failure tends to occur. The object of the present invention is a dicing die-bonding sheet with improved such problems, that is, the protective film 1 can be easily peeled off without weakening the adhesive strength of the adhesive, and therefore, the adhesive (for dicing) It is to provide a dicing die bond sheet in which the dicing ring 6 is sufficiently adhered (closely attached) to the ring mounting portion and the subsequent dicing process and the like can be easily performed.

上記目的を達成するために、本発明者らは種々検討した結果、ダイシングダイボンドシート中に、（粘着力が強い）粘着剤と保護フィルムとが直接に接していない部分を積極的につくり出し、その部分を剥離起点とすれば保護フィルムを容易に剥がせるのではと着想し、本発明を完成するに至った。   In order to achieve the above object, as a result of various studies, the present inventors have actively created a portion where the adhesive and the protective film are not in direct contact with the dicing die bond sheet. The idea was that the protective film could be easily peeled off if the portion was the starting point of peeling, and the present invention was completed.

すなわち、本発明は、保護フィルム１の片面に、所定平面視形状の接着剤（ダイボンド材）２と、前記接着剤２を覆い、前記接着剤２よりも一回り広く大きく、そして前記接着剤２とは重なり合わない周縁部（ダイシング用リング載置部となる）を有する粘着剤と、前記粘着剤に重なり合う基材フィルムとを、この順に積層したダイシングダイボンドシートであって、
前記接着剤２の外周部においては、少なくとも一箇所で、粘着剤の外周部に平面視で接し若しくは近接するように突き出た突出部が剥離起点を形成しているダイシングダイボンドシートである。 That is, the present invention covers the adhesive (die-bonding material) 2 having a predetermined plan view shape on one side of the protective film 1 and the adhesive 2, and is slightly larger than the adhesive 2, and the adhesive 2 Is a dicing die bond sheet in which a pressure-sensitive adhesive having a peripheral portion that does not overlap (becomes a dicing ring mounting portion) and a base film that overlaps the pressure-sensitive adhesive are laminated in this order,
In the outer peripheral portion of the adhesive 2, the dicing die bond sheet is formed such that a protruding portion that protrudes so as to be in contact with or close to the outer peripheral portion of the adhesive in at least one place forms a separation starting point.

ここで、本発明のダイシングダイボンドシートの幅は、半導体ウェハの大きさ（幅）よりも大きい幅で、通常は、２０〜５０ｃｍ程度であり、保護フィルム（シート）１上の接着剤２と、この接着剤２よりも一回り広く大きく、そして接着剤２とは重なり合わない周縁部を有する粘着剤と、その粘着剤に重なり合う基材フィルムとを一組とする「ラベル状」の形態として提供することもでき、また、上記接着剤と上記粘着剤と上記基材フィルムとを一組として、これらが長尺の保護フィルム１の片面に島状に多数配されてロール状に巻かれた「テープ状（又はシート状）」の形態として提供することもできる。   Here, the width of the dicing die bond sheet of the present invention is larger than the size (width) of the semiconductor wafer, usually about 20 to 50 cm, and the adhesive 2 on the protective film (sheet) 1; Provided in the form of a “label” that consists of a pair of a pressure-sensitive adhesive having a peripheral portion that does not overlap with the adhesive 2 and a base film that overlaps the pressure-sensitive adhesive. In addition, the adhesive, the pressure-sensitive adhesive, and the base film as a set, a large number of these are arranged in an island shape on one side of the long protective film 1 and rolled into a roll. It can also be provided as a “tape (or sheet)” form.

また、本発明のダイシングダイボンドシートでは、接着剤２の平面視形状は、好ましくは円形、略円形又は半導体ウェハ形状である。   In the dicing die bond sheet of the present invention, the shape of the adhesive 2 in a plan view is preferably a circle, a substantially circle, or a semiconductor wafer.

また、本発明のダイシングダイボンドシートでは、これに放射線や紫外線等の高エネルギー線を照射すると、粘着剤の粘着力が低下し、接着剤と粘着剤との界面で剥がれやすくなるものが好ましい。   Moreover, in the dicing die-bonding sheet of the present invention, it is preferable that when this is irradiated with high energy rays such as radiation and ultraviolet rays, the adhesive strength of the pressure-sensitive adhesive is reduced and the adhesive and the pressure-sensitive adhesive are easily peeled off.

以下、本発明をさらに詳しく説明する。
本発明で用いる保護フィルム１としては、ポリエチレンテレフタレートフィルム等のポリエステル系フィルム、ポリテトラフルオロエチレンフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、ポリメチルペンテンフィルム、ポリビニルアセテートフィルム等のポリオレフィン系フィルム、ポリ塩化ビニルフィルム、ポリイミドフィルムなどのプラスチックフィルム等が好ましく用いられ、紙、不織布、金属箔なども使用できる。また、その剥離面はシリコーン系剥離剤、フッ素系剥離剤、長鎖アルキルアクリレート系剥離剤などの離型剤で処理することが好ましい。また、保護フィルム１の厚みは、作業性を損なわない範囲で適宜に選択できる。通常は１００μｍ以下、好ましくは１０〜７５μｍ、更に好ましくは２５〜５０μｍである。 Hereinafter, the present invention will be described in more detail.
As the protective film 1 used in the present invention, a polyester film such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyolefin film such as a polyvinyl acetate film, a polyvinyl chloride film, A plastic film such as a polyimide film is preferably used, and paper, non-woven fabric, metal foil and the like can also be used. The release surface is preferably treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent. Moreover, the thickness of the protective film 1 can be suitably selected in the range which does not impair workability | operativity. Usually, it is 100 micrometers or less, Preferably it is 10-75 micrometers, More preferably, it is 25-50 micrometers.

本発明で用いる接着剤２としては、半導体チップの接着（接合）に使用されている公知の種々の熱硬化性接着剤、光硬化性接着剤、熱可塑性接着剤あるいは酸素反応性接着剤等を用いることができる。これらは、単独で用いても２種類以上を組み合わせてもよい。   Examples of the adhesive 2 used in the present invention include various known thermosetting adhesives, photocurable adhesives, thermoplastic adhesives, oxygen reactive adhesives, and the like used for bonding (bonding) semiconductor chips. Can be used. These may be used alone or in combination of two or more.

接着剤２の平面視形状は、半導体ウェハの貼付が容易であればよく、円形、略円形、四角形、五角形、六角形、八角形、ウェハ形状（円の外周の一部が直線である形状）等がある。ただ、半導体ウェハ搭載部以外の無駄部分を少なくするためには、円形やウェハ形状が好ましい。   The shape of the adhesive 2 in plan view is not limited as long as it is easy to attach a semiconductor wafer, and is circular, substantially circular, quadrangular, pentagonal, hexagonal, octagonal, or wafer shape (a part of the outer periphery of the circle is a straight line). Etc. However, in order to reduce a waste portion other than the semiconductor wafer mounting portion, a circular shape or a wafer shape is preferable.

接着剤２の層厚みは、通常は１〜２００μｍ、好ましくは３〜１５０μｍ、更に好ましくは１０〜１００μｍである。１μｍよりも薄いと十分なダイボンド接着力を確保するのが困難になり、２００μｍよりも厚いと不経済で特性上の利点もない。   The layer thickness of the adhesive 2 is usually 1 to 200 μm, preferably 3 to 150 μm, and more preferably 10 to 100 μm. If it is thinner than 1 μm, it will be difficult to ensure sufficient die-bonding adhesive strength, and if it is thicker than 200 μm, it will be uneconomical and will not have any advantage in characteristics.

本発明で用いる粘着剤としては、紫外線や放射線等の高エネルギー線や熱によって硬化する（すなわち、粘着力を低下させる）ものが好ましく、中でも高エネルギー線によって硬化するものが好ましく、更には紫外線によって硬化するものが特に好ましい。   The pressure-sensitive adhesive used in the present invention is preferably one that is cured by high energy rays such as ultraviolet rays or radiation or heat (that is, the adhesive force is reduced), and among them, one that is cured by high energy rays is preferred, and further, by ultraviolet rays. Those that cure are particularly preferred.

そのような高エネルギー線（又は紫外線）によって硬化する粘着剤は、従来から種々のタイプが知られている。その中から、高エネルギー線（又は紫外線）の照射によって、その粘着力が接着剤２の粘着力よりも低くなるものを適宜選んで用いることができる。   Various types of pressure-sensitive adhesives that are cured by such high energy rays (or ultraviolet rays) have been conventionally known. Among them, a material whose adhesive strength becomes lower than that of the adhesive 2 when irradiated with high energy rays (or ultraviolet rays) can be appropriately selected and used.

なお、粘着剤中の含有成分としては、例えば、ジオール基を有する化合物、イソシアネート化合物、ウレタン（メタ）アクリレート化合物、ジアミン化合物、尿素メタクリレート化合物、側鎖にエチレン性不飽和基を有する高エネルギー線重合性共重合体等がある。これらは単独で又は２種以上を組み合わせて使用できる。   Examples of the components contained in the pressure-sensitive adhesive include, for example, a compound having a diol group, an isocyanate compound, a urethane (meth) acrylate compound, a diamine compound, a urea methacrylate compound, and a high energy ray polymerization having an ethylenically unsaturated group in the side chain. Sex copolymers and the like. These can be used alone or in combination of two or more.

粘着剤の平面視形状は、接着剤２の平面視形状よりも一回り広く大きくて、接着剤２を覆い尽くすことができる形状で、接着剤２と重なり合わない周縁部（ダイシング用リング載置部となる）を有する形状であれば、特に制限されない。円形、略円形、四角形、五角形、六角形、八角形、ウェハ形状等がある。ただ、前記した接着剤２の好ましい形状（円形やウェハ形状）との関係から、好ましい形状は円形である。   The shape of the pressure-sensitive adhesive in plan view is larger than the shape of the adhesive 2 in plan view, and is a shape that can completely cover the adhesive 2, and the peripheral portion that does not overlap with the adhesive 2 (ring mounting for dicing) If it is a shape which has a part), it will not be restrict | limited in particular. There are circular, substantially circular, quadrangular, pentagonal, hexagonal, octagonal, and wafer shapes. However, the preferable shape is circular because of the relationship with the preferable shape (circular or wafer shape) of the adhesive 2 described above.

粘着剤の層厚みは、通常は１〜１００μｍ、好ましくは２〜２０μｍ、更に好ましくは３〜１０μｍである。１μｍよりも薄いと十分な粘着力を確保するのが困難になり、ダイシング時に半導体チップが飛散する恐れがあり、１００μｍよりも厚いと不経済で特性上の利点もない。   The layer thickness of the pressure-sensitive adhesive is usually 1 to 100 μm, preferably 2 to 20 μm, more preferably 3 to 10 μm. If it is thinner than 1 μm, it will be difficult to secure a sufficient adhesive force, and the semiconductor chip may be scattered during dicing. If it is thicker than 100 μm, it will be uneconomical and there will be no advantage in characteristics.

基材フィルムとしては、保護フィルム１に用いたフィルムもしくはシートと同様な基材を用いることができる。例えば、ポリエチレンテレフタレートフィルム等のポリエステル系フィルム、ポリテトラフルオロエチレンフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、ポリメチルペンテンフィルム、ポリビニルアセテートフィルム等のポリオレフィン系フィルム、ポリ塩化ビニルフィルム、ポリイミドフィルムなどのプラスチックフィルム等である。なお、基材フィルムの厚みは、通常１０〜５００μｍ、好ましくは５０〜２００μｍである。   As the substrate film, a substrate similar to the film or sheet used for the protective film 1 can be used. For example, polyester film such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyolefin film such as polyvinyl acetate film, plastic film such as polyvinyl chloride film, polyimide film, etc. is there. In addition, the thickness of a base film is 10-500 micrometers normally, Preferably it is 50-200 micrometers.

本発明のダイシングダイボンドシートを用いて半導体装置を製造する場合は、次のようにして行う。
（ｉ）接着剤２の外周部に形成した剥離起点を利用して保護フィルム１を剥離・除去し、接着剤を露出させる。
（ii）ダイシング用リング載置部（帯状円環状の粘着剤）にダイシング用リング６を載置するとともに、露出させた接着剤２の半導体ウェハ搭載部２ａに半導体ウェハ４を貼り付ける。
（iii）半導体ウェハ４の上方側から、接着剤２と粘着剤との界面までダイシングする。このとき、接着剤２と粘着剤との正確な界面まででなくとも、粘着剤側に１〜５０μｍ程度（ダイシング後のピックアップ工程で、基材フィルムが横向きに引き伸ばされた時などに切れ込みが原因でフィルムが破れない程度に）深く切り込んでもよい；
（iv）紫外線を照射し、上記接着剤２と上記粘着剤と間の接着力を低下させる；
（ｖ）各々の半導体チップを接着剤２が付いた状態でピックアップし、この接着剤付き半導体チップをリードフレーム等の支持部材の上に載置し、加熱・接着する；
（vi）ワイヤボンドする；
（vii）封止材を用いて封止して、半導体装置を得る。 When manufacturing a semiconductor device using the dicing die-bonding sheet of this invention, it carries out as follows.
(I) The protective film 1 is peeled and removed using the peeling starting point formed on the outer peripheral portion of the adhesive 2 to expose the adhesive.
(Ii) The dicing ring 6 is mounted on the dicing ring mounting portion (band-like annular pressure-sensitive adhesive), and the semiconductor wafer 4 is attached to the exposed semiconductor wafer mounting portion 2a of the adhesive 2.
(Iii) Dicing from the upper side of the semiconductor wafer 4 to the interface between the adhesive 2 and the adhesive. At this time, even if it is not up to the exact interface between the adhesive 2 and the pressure-sensitive adhesive, about 1 to 50 μm on the pressure-sensitive adhesive side (cause of notches when the base film is stretched sideways in the pickup process after dicing) You can cut deeply (so that the film does not break)
(Iv) irradiating with ultraviolet rays to reduce the adhesive force between the adhesive 2 and the pressure-sensitive adhesive;
(V) Pick up each semiconductor chip with the adhesive 2 attached, place the semiconductor chip with the adhesive on a support member such as a lead frame, and heat and bond;
(Vi) wire bond;
(Vii) A semiconductor device is obtained by sealing with a sealing material.

（作用）
後述する図１〜図３のＡ−Ｂ断面図に示すように、接着剤（ダイボンド材）２の外周部にて外方へ向けて突き出ている突出部では、保護フィルム１は粘着剤とは直接に触れておらず、粘着力の弱い接着剤（ダイボンド材）２と直接に接している。そのため、この突出部先端を剥離起点とすれば、ダイシングダイボンドシートから保護フィルム１を容易に剥離することが可能となる。 (Function)
As shown in the AB cross-sectional views of FIGS. 1 to 3 described later, the protective film 1 is an adhesive at the protruding portion protruding outward at the outer peripheral portion of the adhesive (die bond material) 2. It is not in direct contact, and is in direct contact with the adhesive (die bond material) 2 having a low adhesive strength. Therefore, if this protrusion part front-end | tip is made into a peeling start point, it will become possible to peel the protective film 1 easily from a dicing die-bonding sheet.

本発明のダイシングダイボンドシートによれば、粘着剤における粘着力を弱めることなく、保護フィルム１を容易に剥離させることができ、したがって、粘着剤（ダイシング用リング載置部）にダイシング用リング６を充分に密着させ、その後のダイシング工程等を容易に行える。   According to the dicing die-bonding sheet of the present invention, the protective film 1 can be easily peeled without weakening the adhesive strength of the adhesive, and therefore the dicing ring 6 is attached to the adhesive (dicing ring mounting portion). Adhering sufficiently, the subsequent dicing process and the like can be easily performed.

図面を参照しながら本発明を更に具体的に説明する。
図１は本発明の第一実施例のダイシングダイボンドシートである。四角いシート状の保護フィルム１の片面（上面）に、ディスク状の接着剤（ダイボンド材）２の層が形成され、その上に、同心円的に、その接着剤を完全に覆う一回り広く大きいディスク状の基材フィルム付き粘着剤３がその粘着剤層を下側にして形成され、接着剤と重なり合わない粘着剤の周縁部の下側（保護フィルム側）は帯状円環状でダイシング用リング載置部となっている（図１のＣ−Ｄ断面図）。このシートの特徴的なところは、接着剤２の外周部が、一箇所にて粘着剤の外周部に平面視で接するように突き出て突出部を形成していることである（図１の平面図及びＡ−Ｂ断面図）。なお、この接着剤２における突出部の先端では、Ａ−Ｂ断面図に見るように、粘着剤は保護フィルム１に触れておらず、（粘着力の弱い）接着剤２が保護フィルム１に接しているので、ここを剥離起点とすれば、保護フィルム１をダイシングダイボンドシートから容易に剥がし始めることができる。そうすれば、その後は、粘着剤が保護フィルム１に接している部分があっても保護フィルム１は容易に剥がせるのである。 The present invention will be described more specifically with reference to the drawings.
FIG. 1 shows a dicing die bond sheet according to a first embodiment of the present invention. A disk-shaped adhesive (die-bonding material) 2 layer is formed on one surface (upper surface) of a square sheet-like protective film 1, and a concentrically and completely larger disk covering the adhesive completely. Is formed with the pressure-sensitive adhesive layer on the lower side, and the lower side (protective film side) of the peripheral edge of the pressure-sensitive adhesive that does not overlap with the adhesive is a belt-like annular ring mounted on a dicing ring It is a mounting part (CD sectional view of FIG. 1). A characteristic feature of this sheet is that the outer peripheral portion of the adhesive 2 protrudes so as to come into contact with the outer peripheral portion of the adhesive in a plan view at one place to form a protruding portion (the flat surface in FIG. 1). Figure and A-B sectional view). Note that at the tip of the protruding portion of the adhesive 2, as shown in the cross-sectional view taken along the line AB, the adhesive does not touch the protective film 1, and the adhesive 2 (having weak adhesive force) is in contact with the protective film 1. Therefore, if this is taken as the peeling start point, the protective film 1 can be easily peeled off from the dicing die bond sheet. Then, after that, even if there is a part where the adhesive is in contact with the protective film 1, the protective film 1 can be easily peeled off.

図２は本発明の第二実施例のダイシングダイボンドシートであり、図３は本発明の第三実施例のダイシングダイボンドシートである。いずれも、第一実施例の変形である。基材フィルム付き粘着剤３の突出部の先端は、接着剤２の外周部に比べて少しハミ出していてもよく（図２）、あるいは寸足らずに近接していてもよい（図３）。接着剤２の突出部の先端付近で、粘着剤と保護フィルム１とが直接に触れていなければよい。   FIG. 2 shows a dicing die bond sheet according to the second embodiment of the present invention, and FIG. 3 shows a dicing die bond sheet according to the third embodiment of the present invention. Both are modifications of the first embodiment. The tip of the protruding portion of the pressure-sensitive adhesive 3 with a base film may protrude slightly from the outer peripheral portion of the adhesive 2 (FIG. 2), or may be close without being short (FIG. 3). The pressure-sensitive adhesive and the protective film 1 may not be in direct contact with each other in the vicinity of the tip of the protruding portion of the adhesive 2.

図４はダイシングダイボンドシートにおける接着剤２及び粘着剤（又は、基材フィルム付き粘着剤３）の種々の平面視形状（６種）を示した。例えば、接着剤２も粘着剤も円形の例、接着剤２は円形で粘着剤は四角形又は六角形の例、接着剤２は方形、略方形又はウェハ形状（円の外周の一部が直線である形状）で粘着剤は四角形又は六角形の例などである。   FIG. 4 shows various planar shapes (six types) of the adhesive 2 and the pressure-sensitive adhesive (or the pressure-sensitive adhesive 3 with a base film) in the dicing die-bonding sheet. For example, the adhesive 2 and the adhesive are both circular, the adhesive 2 is circular and the adhesive is square or hexagonal, the adhesive 2 is square, substantially square, or wafer-shaped (a part of the outer circumference of the circle is a straight line) For example, the adhesive may be a square or hexagon.

なお、接着剤２の平面視形状は、上記以外であっても、半導体ウェハの貼付が容易であれば、五角形、六角形、八角形等でも構わない。但し、半導体ウェハ搭載部以外の無駄部分を少なくするためには、好ましくは円形やウェハ形状（円の外周の一部が直線である形状）である。
また、このとき、接着剤２において外方へ突き出た突出部の数は一個でも、（対向するような）二個でも、あるいは３〜４個でもよい。 In addition, the plan view shape of the adhesive 2 may be other than the above, and may be a pentagon, a hexagon, an octagon, or the like as long as the semiconductor wafer can be easily attached. However, in order to reduce a waste portion other than the semiconductor wafer mounting portion, it is preferably a circle or a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line).
At this time, the number of protruding portions protruding outward in the adhesive 2 may be one, two (as opposed to each other), or three to four.

また、粘着剤（又は、基材フィルム付き粘着剤３）の平面視形状は、円形やウェハ形状以外にも、五角形、八角形、菱形形状、星型等の形状でもよく、ダイシング用リングを粘着（密着）させる形がとれる形状であれば構わない。ただ、現在の半導体ウェハ及びダイシング用リングの形状を考慮すると、円形もしくは略円形が好ましく、接着剤２の平面視形状に相似な形状が更に好ましい。   Further, the shape of the pressure-sensitive adhesive (or pressure-sensitive adhesive 3 with a base film) in plan view may be a pentagon, octagon, rhombus, star, or the like in addition to a circle or a wafer. Any shape can be used as long as it can be in close contact. However, considering the shape of the current semiconductor wafer and dicing ring, a circular shape or a substantially circular shape is preferable, and a shape similar to the shape of the adhesive 2 in plan view is more preferable.

接着剤２と、それより一回り大きな粘着剤の、各々の平面視大きさについては、半導体ウェハやダイシング用リングの大きさに左右されて自ずと決まってくるが、粘着剤は、その外周の５０％以上、好ましくは７０％以上、更に好ましくは９０％以上が、接着剤２の外周の外側にあることが好ましい。接着剤２と粘着剤とが重なり合わない部分の粘着剤の周縁部（通常は、帯状円環状）における保護フィルム側はダイシング用リング載置部となる。   The size of each of the adhesive 2 and the pressure-sensitive adhesive that is slightly larger than that is determined depending on the size of the semiconductor wafer and the dicing ring. % Or more, preferably 70% or more, more preferably 90% or more is preferably outside the outer periphery of the adhesive 2. The protective film side in the peripheral part (usually a belt-like annular shape) of the pressure-sensitive adhesive where the adhesive 2 and the pressure-sensitive adhesive do not overlap is a dicing ring mounting part.

次に、本発明のダイシングダイボンドシートの製造法について説明する。
ダイシングダイボンドシートの製造法では、先ずは、保護フィルムの上に部分的に接着剤を形成できる方法でなければならない。そのような方法としては、保護フィルム上に全面的に接着剤原料ワニスを塗布（塗工）したのち硬化させ、その後、打ち抜き加工を施して不要部分を取り除く方法がある。また、保護フィルムに何らかの塗布阻害用のコーティング処理を部分的にしたのち、接着剤原料ワニスを塗布し（コーティング処理部には接着剤原料ワニスは塗布されず）、その後硬化するなどの方法でも構わない。ただし、作業の簡便さを考慮すると、前者の方法が好ましい。
上記保護フィルム上の接着剤を覆う一回り大きな（広い）粘着剤を部分的に形成する方法も、上記接着剤の形成方法と同様な方法で、粘着剤層を形成させ、その後、打ち抜き加工する方法で行うことができる。 Next, the manufacturing method of the dicing die bond sheet of this invention is demonstrated.
In the manufacturing method of a dicing die-bonding sheet, first, it must be a method which can form an adhesive partially on a protective film. As such a method, there is a method in which an adhesive raw material varnish is applied (coated) on the entire surface of the protective film and then cured, and thereafter, punching is performed to remove unnecessary portions. Alternatively, after partially applying a coating treatment for inhibiting coating to the protective film, an adhesive raw material varnish is applied (the adhesive raw material varnish is not applied to the coating portion) and then cured. Absent. However, the former method is preferable in consideration of the convenience of work.
The method of partially forming a slightly larger (wide) pressure-sensitive adhesive covering the adhesive on the protective film is the same as the method of forming the adhesive, and the pressure-sensitive adhesive layer is formed and then punched. Can be done by the method.

図５は、本発明におけるダイシングダイボンドシートの第１の製造法を説明する図である。順に説明する。
（１）保護フィルム１の片面に、接着剤層（ダイボンド材層）２を形成させる（Ｉ）。
（２）所定の平面視形状（図では円形）で、その外周部においては、少なくとも一箇所で外方に突き出た突出部を有する接着剤２を形成でき、かつ、その他の不要な接着剤を除去可能にする切り込み（細溝）を、金型５やカッターを用いて、接着剤層２の上方側から、保護フィルム１と接着剤層２との界面に達する深さに形成する（打抜き加工）（II）。
（３）不要な接着剤２を剥離・除去すると（IIIｂ）、保護フィルム１上に所定の平面視形状で突出部を有する略円形の接着剤（ダイボンド材）２を島状に多数形成させた接着剤（ダイボンド材）付き保護フィルムを得る（IIIａ）。 FIG. 5 is a diagram illustrating a first manufacturing method of the dicing die bond sheet in the present invention. These will be described in order.
(1) An adhesive layer (die bond material layer) 2 is formed on one side of the protective film 1 (I).
(2) Adhesive 2 having a predetermined plan view shape (circular in the figure) and having a protruding portion protruding outward at at least one place on the outer periphery thereof, and other unnecessary adhesives A notch (thin groove) that can be removed is formed from the upper side of the adhesive layer 2 to a depth reaching the interface between the protective film 1 and the adhesive layer 2 using a mold 5 or a cutter (punching process). ) (II).
(3) When unnecessary adhesive 2 is peeled and removed (IIIb), a large number of substantially circular adhesives (die bond materials) 2 having protrusions in a predetermined plan view shape are formed on the protective film 1 in an island shape. A protective film with an adhesive (die bond material) is obtained (IIIa).

（４）図示しないが、別途、基材フィルムの片面に粘着剤層を形成させた基材フィルム付き粘着剤（粘着フィルム）３を用意する。
（５）同じく図示しないが、この基材フィルム付き粘着剤３に、上記各々の接着剤よりも一回り広く大きい形状で、その外周部においては、前記接着剤２の突出部の先端に平面視で接し若しくは近接する基材フィルム付き粘着剤３を形成でき、かつ、その他の不要な基材フィルム付き粘着剤３を除去可能にする切り込みを、基材フィルム付き粘着剤３の片側から形成する。
（６）上記（３）で得られた接着剤（ダイボンド材）付き保護フィルムと、上記（５）で得られた切り込み入り基材フィルム付き粘着剤とを、保護フィルム及び基材フィルムを外側にし（接着剤と粘着剤とが各々向かい合うようにし）、かつ、位置合せしながら貼り合わせ、その後に、不要部分の基材フィルム付き粘着剤を剥離・除去する。そうして、保護フィルム上に所定形状の接着剤２及び基材フィルム付き粘着剤３を多数、島状に形成させたダイシングダイボンドシートを得る（IVａ、IVｂ）。 (4) Although not shown in the figure, separately, an adhesive (adhesive film) 3 with a base film in which an adhesive layer is formed on one side of the base film is prepared.
(5) Although not shown in the figure, the pressure-sensitive adhesive with a base film 3 has a shape that is slightly larger than each of the above-mentioned adhesives, and in the outer peripheral portion, the tip of the protruding portion of the adhesive 2 is seen in a plan view. The adhesive 3 with the base film that is in contact with or close to each other can be formed, and a notch that makes it possible to remove the other unnecessary adhesive 3 with the base film is formed from one side of the adhesive 3 with the base film.
(6) The protective film with the adhesive (die-bonding material) obtained in (3) above and the adhesive with the notched base film obtained in (5) above are disposed with the protective film and the base film on the outside. (Adhesive and pressure-sensitive adhesive face each other) and are bonded together while being aligned, and thereafter, the unnecessary portion of the pressure-sensitive adhesive with a base film is peeled off and removed. Thus, a dicing die-bonding sheet is obtained in which a large number of adhesives 2 and adhesives 3 with a base film having a predetermined shape are formed in an island shape on the protective film (IVa, IVb).

図６は、本発明におけるダイシングダイボンドシートの別の製造法（第２の製造法）を説明する図である。図５の場合と同様にして、順に説明する。
（１）保護フィルム１の片面に、接着剤層（ダイボンド材層）２を形成させる（Ｉ）。
（２）所定の平面視形状（図では円形）で、その外周部においては、少なくとも一箇所で外方に突き出た突出部を有する接着剤２を形成でき、かつ、その他の不要な接着剤を除去可能にする切り込み（細溝）を、金型５やカッターを用いて、保護フィルム１と接着剤層２との界面に達する深さに形成する（打抜き加工）（II）。
（３）不要な接着剤を剥離・除去し（IIIｂ）、保護フィルム１上に所定の平面視形状で突出部を有する円形の接着剤（ダイボンド材）２を島状に多数形成させた接着剤付き保護フィルムを得る（IIIａ）。 FIG. 6 is a diagram for explaining another manufacturing method (second manufacturing method) of the dicing die bond sheet in the present invention. Similar to the case of FIG.
(1) An adhesive layer (die bond material layer) 2 is formed on one side of the protective film 1 (I).
(2) Adhesive 2 having a predetermined plan view shape (circular in the figure) and having a protruding portion protruding outward at at least one place on the outer periphery thereof, and other unnecessary adhesives Cuts (thin grooves) that can be removed are formed to a depth that reaches the interface between the protective film 1 and the adhesive layer 2 using a mold 5 or a cutter (punching process) (II).
(3) Unnecessary adhesive is removed and removed (IIIb), and an adhesive in which a large number of circular adhesives (die-bonding materials) 2 having protrusions in a predetermined plan view shape are formed on the protective film 1 in an island shape. A protective film is obtained (IIIa).

（４）その７から基材フィルム付き粘着剤（粘着フィルム）３を、その粘着面が内側に向くようにして貼り合わせる（IVａ、IVｂ）。
（５）突出部を有する円形の接着剤２を覆う所定形状で、外周部においては、前記接着剤２の突出部の先端に平面視で接し若しくは近接する基材フィルム付き粘着剤を形成でき、かつ、その他の不要な基材フィルム付き粘着剤部を除去可能にする切り込み（細溝）を、金型５やカッターを用い、その上方側から、粘着剤と保護フィルム１との界面に達する深さに形成する（再度の打抜き加工）（Ｖａ）。
（６）不要な基材フィルム付き粘着剤部を剥離・除去し（Ｖｂ）、保護フィルム上に所定形状の接着剤２及び基材フィルム付き粘着剤３を多数、島状に形成させたダイシングダイボンドシート（VIａ、VIｂ）を得る。 (4) From No. 7, the adhesive with a base film (adhesive film) 3 is bonded so that the adhesive surface faces inward (IVa, IVb).
(5) In a predetermined shape covering the circular adhesive 2 having a protruding portion, in the outer peripheral portion, the adhesive with a base film can be formed in contact with or close to the tip of the protruding portion of the adhesive 2 in a plan view, And the depth which reaches the interface of an adhesive and the protective film 1 from the upper side using the metal mold | die 5 or a cutter, and making the cut | incision (thin groove | channel) which makes it possible to remove other unnecessary adhesive parts with a base film. Formed again (against punching) (Va).
(6) Unnecessary adhesive part with base film is peeled and removed (Vb), and a large number of adhesives 2 and adhesives 3 with base film are formed in an island shape on the protective film. Sheets (VIa, VIb) are obtained.

本発明の第一実施例のダイシングダイボンドシート。左側が平面図、右上側がＡ−Ｂ断面図、右下側がＣ−Ｄ断面図である。The dicing die-bonding sheet of the first embodiment of the present invention. The left side is a plan view, the upper right side is an AB cross-sectional view, and the lower right side is a CD cross-sectional view. 本発明の第二実施例のダイシングダイボンドシート。左側が平面図、右上側がＡ−Ｂ断面図、右下側がＣ−Ｄ断面図である。The dicing die-bonding sheet of the second embodiment of the present invention. The left side is a plan view, the upper right side is an AB cross-sectional view, and the lower right side is a CD cross-sectional view. 本発明の第三実施例のダイシングダイボンドシート。左側が平面図、右上側がＡ−Ｂ断面図、右下側がＣ−Ｄ断面図である。The dicing die-bonding sheet of the third embodiment of the present invention. The left side is a plan view, the upper right side is an AB cross-sectional view, and the lower right side is a CD cross-sectional view. 本発明のダイシングダイボンドシートにおける種々の変形例の平面図（６種）。The top view (six types) of the various modifications in the dicing die-bonding sheet of the present invention. 本発明におけるダイシングダイボンドシートの第１の製造法を説明する説明図。Explanatory drawing explaining the 1st manufacturing method of the dicing die-bonding sheet in this invention. 本発明におけるダイシングダイボンドシートの第２の製造法を説明する説明図。Explanatory drawing explaining the 2nd manufacturing method of the dicing die-bonding sheet in this invention. 従来例のダイシングダイボンドシート、及びこれを用いたダイシング工程までの説明図。（ａ）はダイシングダイボンドシートの平面図、（ｂ）は（ａ）のＡ−Ｂ断面図であり、（ｂ）〜（ｅ）はダイシング工程までを説明する断面図である。The dicing die-bonding sheet | seat of a prior art example, and explanatory drawing to the dicing process using this. (A) is a top view of a dicing die-bonding sheet, (b) is an AB cross-sectional view of (a), and (b) to (e) are cross-sectional views illustrating a dicing process.

符号の説明Explanation of symbols

１：保護フィルム
２：接着剤（接着剤層）
２ａ：半導体ウェハ搭載部
３：基材フィルム付き粘着剤（基材フィルム付き粘着剤層）
４：半導体ウェハ
５：金型
６：ダイシング用リング
1: Protective film 2: Adhesive (adhesive layer)
2a: Semiconductor wafer mounting part 3: Adhesive with base film (adhesive layer with base film)
4: Semiconductor wafer 5: Mold 6: Ring for dicing

Claims (4)

保護フィルムの片面に、所定平面視形状の接着剤と、前記接着剤を覆い、前記接着剤よりも一回り広く大きく、そして前記接着剤とは重なり合わない周縁部を有する粘着剤と、前記粘着剤に重なり合う基材フィルムとを、この順に積層したダイシングダイボンドシートであって、
前記接着剤の外周部においては、少なくとも一箇所で、粘着剤の外周部に平面視で接し若しくは近接するように突き出た突出部が剥離起点を形成しているダイシングダイボンドシート。 An adhesive having a predetermined plan view shape on one side of the protective film, a pressure-sensitive adhesive that covers the adhesive, is slightly larger than the adhesive, and has a peripheral edge that does not overlap the adhesive; and the adhesive It is a dicing die bond sheet in which the base film overlapping the agent is laminated in this order,
A dicing die bond sheet in which a protruding portion protruding so as to be in contact with or close to the outer peripheral portion of the pressure-sensitive adhesive in a plan view forms a separation starting point at least at one position on the outer peripheral portion of the adhesive. 前記接着剤と前記粘着剤と前記基材フィルムとを一組として、これらが長尺の保護フィルムの片面に島状に多数配されロール状に巻かれている、請求項１のダイシングダイボンドシート。 The dicing die-bonding sheet according to claim 1, wherein the adhesive, the pressure-sensitive adhesive, and the base film are used as a set, and many of these are arranged in an island shape on one side of a long protective film and wound in a roll shape. 接着剤の平面視形状は円形、略円形又は半導体ウェハ形状である、請求項１又は２のダイシングダイボンドシート。 The dicing die-bonding sheet according to claim 1 or 2, wherein the shape of the adhesive in a plan view is a circle, a substantially circle, or a semiconductor wafer shape. 高エネルギー線を照射すると粘着剤の接着力が低下し、接着剤と粘着剤との界面で剥がしやすくなる、請求項１〜３のいずれかのダイシングダイボンドシート。
The dicing die-bonding sheet according to any one of claims 1 to 3, wherein when a high energy ray is irradiated, the adhesive strength of the pressure-sensitive adhesive is reduced, and the adhesive is easily peeled off at the interface between the adhesive and the pressure-sensitive adhesive.
JP2003401592A 2003-12-01 2003-12-01 Dicing die bond sheet Pending JP2005162818A (en)

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