JP2014090116A - Dicing and die bonding film with separator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dicing and die bonding film with a separator, capable of easily peeling a dicing and die bonding film off from a separator.SOLUTION: The dicing and die bonding film with a separator formed by laminating a separator, a die bonding film having a projected extension piece on an outside at the periphery in plan view, and dicing film in this order.

Description

  The present invention relates to a dicing die-bonding film with a separator.

  Conventionally, in a manufacturing process of a semiconductor device, a dicing die bond film in which a thermosetting die bond film is laminated on a dicing film is used (for example, see Patent Document 1). In the manufacturing process of a semiconductor device using this dicing die bond film, first, a semiconductor wafer is bonded and fixed to the dicing die bond film, and dicing is performed in that state. As a result, the semiconductor wafer is separated into a predetermined size and becomes a semiconductor chip. Next, in order to peel the semiconductor chip fixed to the dicing die-bonding film from the dicing film, the semiconductor chip is picked up. Thereafter, the semiconductor chip picked up together with the die bond film is fixed to an adherend such as a substrate via the die bond film.

  In the dicing die-bonding film as described above, a dicing film and a die-bonding film each punched into a circle or the like according to the size of the semiconductor wafer are laminated. The dicing die-bonding film is arranged on a long separator with a predetermined interval with the die-bonding film as a bonding side. At the time of bonding to the semiconductor wafer, the dicing die-bonding film is peeled off from the separator using a wafer mount device or the like, and then bonded to the semiconductor wafer.

JP 2008-218571 A

  In general, the separator is subjected to a release treatment with a release agent or the like in order to improve the peelability of the dicing die-bonding film. However, when the dicing die-bonding film is peeled from the separator, the peeling between the separator and the die-bonding film does not proceed well, and the die-bonding film remains on the separator and only the dicing film is peeled off. is there.

  This invention is made | formed in view of the said problem, and it aims at providing the dicing die-bonding film with a separator with easy peeling of the dicing die-bonding film from a separator.

  As a result of studying to solve the above problems, the present inventors have found that the above problems can be solved by adopting the following configuration, and have completed the present invention.

That is, the present invention includes a separator,
A die-bonding film having an outwardly protruding extension piece at the outer periphery in plan view;
A dicing film with a separator in which a dicing film is laminated in this order.

  In the dicing die-bonding film with separator (hereinafter also referred to as “film with separator”), the die-bonding film has an outwardly protruding extension piece (hereinafter also simply referred to as “extension piece”) at the outer peripheral portion in plan view. .)), When peeling from the side where the extended piece is formed, this extended piece becomes a starting point of peeling, and as a result, the dicing die-bonding film can be easily peeled from the separator. . On the other hand, when the die bond film does not have an extended piece, the region where the die bond film peels off becomes closer to a straight line, and the stress that the die bond film receives from the separator at the beginning of peeling (the die bond film is attracted to the separator side). The stress to be applied (hereinafter, also referred to as “attractive stress”) may become large, and a conventional peeling defect may occur.

  In the said film with a separator, it is preferable that the said extension piece has a taper-shaped front-end | tip part. Thereby, the contact area of the front-end | tip part of an extending piece and a separator becomes small, the attraction stress from a separator can be reduced, and a dicing die-bonding film can be peeled more easily.

  In the said film with a separator, it is preferable that the said extension piece has a V-shaped front-end | tip part. By making the tip of the extension piece V-shaped, it is possible to reduce the attraction stress from the separator while maintaining the mechanical strength of the extension piece, and a simple structure in which the tip is formed in a straight line Therefore, the extension piece can be easily formed.

  In the said film with a separator, it is preferable that the internal angle of the said V-shaped front-end | tip part is 30 degrees or more and 90 degrees or less. Thereby, the attraction stress from the separator can be further reduced, and the dicing die-bonding film can be peeled off more favorably from the separator.

  In the film with a separator, the minimum difference in the root portion of the extending piece in the direction perpendicular to the extending direction of the extending piece is an intermediate portion between the root portion and the tip portion of the extending piece. It is preferable that the distance is smaller than the maximum difference distance. In this way, by making the base of the extended piece narrowed, even if the tip (and the middle part) of the extended piece remains on the separator side at the time of peeling, the peeling progressed beyond the root. In the case of peeling stress (attracting stress that the middle part receives from the separator from the tip of the extension piece and the area beyond the root part (that is, the area other than the extension piece of the die bond film. (Also referred to as “base part”) is summed with the stress to be pulled up), and the root part is cut. As a result, it is possible to provide a new starting point for peeling of the base portion in the vicinity of the cut portion of the extended piece, and to suppress the occurrence of peeling defects as much as possible.

  In the said film with a separator, it is preferable that the minimum difference distance of the said base part is 1 mm or less. Thereby, the cutting of the root portion when the peeling proceeds beyond the root portion can be promoted, and new peeling from the base portion can be easily promoted.

  In the film with a separator, the separator may be a long separator. By disposing a plurality of dicing die-bonding films at a predetermined interval on the long separator, a continuous operation is possible and the manufacturing efficiency of the semiconductor device can be improved.

  In the said film with a separator, it is preferable that the said extension piece is arrange | positioned along the longitudinal direction of the said long separator. When the dicing die-bonding film is continuously peeled from the dicing die-bonding film with the long separator being fed, if the extending piece is arranged along the longitudinal direction of the long separator, the peeling direction is long. Since it is parallel to the longitudinal direction of the scale separator, continuous peeling can be performed efficiently.

  In the separator-attached film, the die bond film has two points on the outer periphery sandwiching two extension starting points of the extension pieces on the outer periphery in a part of the outer periphery of the die bond film in a plan view. A taper-like extension portion having an extension start point and two extension start points of the extension piece as extension tip points is formed, and the two extension start points of the extension piece and the extension point are formed. Two line segments respectively connecting the two extension starting points of the extension part pass through one of the two extension starting points of the extension piece and the three extension starting points of the extension part. It is preferable to be located inside the arc. In this form, so to speak, it has a two-stage configuration of a relatively large extending portion in which the outer peripheral shape of the die bond film itself is tapered, and a relatively small extending piece connected to the tip portion of the extending portion. ing. By adopting such a configuration, when the dicing die-bonding film is peeled from the separator, even if the peeling on the extension piece does not proceed, the peeling is at the root (or extension starting point) of the extension piece. When exceeding the above, it is possible to induce peeling at the extended portion in which the attraction stress from the separator is reduced by making the taper shape, and it is possible to suppress the occurrence of unexpected peeling failure as much as possible. .

  In the film with a separator, it is preferable that the two line segments connecting the extension start point of the extension part and the extension tip point (that is, the extension start point of the extension piece) are straight lines. Thereby, formation of an extension part becomes easy and the attraction stress from a separator can be reduced efficiently.

  In the film with a separator, the angle formed by the two line segments is preferably 120 ° or more and 175 ° or less. With this configuration, an effective area for attaching a semiconductor wafer in a die bond film can be sufficiently ensured while enabling an effective reduction of the attractive stress from the separator.

  The dicing film has a base material and an adhesive layer laminated on the base material, and the die bond film may be laminated on the adhesive layer of the dicing film.

It is a cross-sectional schematic diagram which shows the dicing die-bonding film with a separator which concerns on one Embodiment of this invention. FIG. 1B is a perspective plan view showing a die bond film of the dicing die bond film with a separator shown in FIG. 1A. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on one Embodiment of this invention. It is a cross-sectional schematic diagram which shows 1 process of the manufacturing process of the semiconductor device using the dicing die-bonding film with a separator concerning one embodiment of the present invention. It is a cross-sectional schematic diagram which shows the example which mounted the semiconductor chip through the die-bonding film in the dicing die-bonding film with a separator shown to FIG. 1A. It is an enlarged plan view which shows a part of die-bonding film which concerns on other embodiment of this invention. It is a perspective top view which shows the die-bonding film of the dicing die-bonding film with a separator concerning other embodiments of the present invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention. It is a partially expanded plan view which shows the extension piece of the die-bonding film which concerns on another embodiment of this invention.

<First Embodiment>
[Dicing die bond film with separator]
The dicing die-bonding film with a separator according to the first embodiment which is an embodiment of the present invention will be described below. FIG. 1A is a schematic cross-sectional view showing a dicing die-bonding film with a separator according to an embodiment of the present invention, and FIG. 1B is a perspective plan view thereof. 2 is a partially enlarged plan view showing an extended piece of the die bond film shown in FIG. 1B.

  As shown to FIG. 1A and 1B, the dicing die-bonding film 10 with a separator has the structure by which the die-bonding film 3 and the dicing film 11 of planar view circular shape were laminated | stacked in this order on the long separator 14. FIG. These die bond film 3 and dicing film 11 constitute a dicing die bond film 12. In FIG. 1B, for the sake of explanation, the dicing film 11 is not shown, and only the long separator 14 and the die bond film 3 laminated thereon are shown. The dicing film 11 is configured by laminating the pressure-sensitive adhesive layer 2 on the substrate 1, and the die-bonding film 3 having a diameter smaller than that of the dicing film 11 is laminated on the pressure-sensitive adhesive layer 2. The dicing film 11 is laminated on the separator 14 so that the pressure-sensitive adhesive layer 2 and the die bond film 3 face each other. In addition, the part beyond the outer periphery of the die-bonding film 3 of the dicing film 11 does not need to contact the separator 14 as shown in FIG. 1A, and may contact.

  Although not shown, in the dicing die-bonding film 10 with a separator of this embodiment, a plurality of dicing die-bonding films 12 are arranged on the long separator 14 at a predetermined interval. Thereby, peeling of the dicing die-bonding film 12 from the separator 14 and subsequent bonding with the semiconductor wafer can be performed continuously, and the manufacturing efficiency of the semiconductor device can be improved. From the viewpoint of enabling continuous feeding, the long separator-attached dicing die-bonding film 10 may be a wound body wound in a roll shape. Moreover, the dicing die-bonding film with a separator may be in a form in which a plurality of die-bonding films are arranged at a predetermined interval on a long separator, and a long dicing film is laminated so as to cover the plurality of die-bonding films. Good.

(Separator)
The long separator 14 has a function as a protective material for protecting the die bond film 3 until it is put into practical use. Further, the long separator 14 can also be used as a support base material when the die bond film 3 is transferred to the pressure-sensitive adhesive layer 2. The long separator 14 is peeled off when a workpiece is stuck on the die bond film 3. Examples of the material of the long separator 14 include polyethylene terephthalate (PET), polyethylene, polypropylene, a plastic film or paper whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent. it can. The separator may be a long object as in the present embodiment, or may have a substantially circular shape with the same size as the dicing film 11 in plan view.

  The thickness of the long separator 14 is not particularly limited, but is preferably 25 to 100 μm, more preferably 25 to 75 μm, and still more preferably 35 to 60 μm. By setting it as the said range, while being able to maintain the intensity | strength as a protective material, the winding body of the dicing die-bonding film 10 with a separator can be produced easily.

(Die bond film)
As shown in FIG. 1B, the die-bonding film 3 has an extending piece 3a that protrudes outward at the outer peripheral portion in plan view. In addition, the dicing film 11 is laminated | stacked so that the whole die-bonding film including this extension piece 3a may be covered. In addition, as shown to FIG. 1B, the die-bonding film 3 may have one extension piece 3a, and may have two or more two or more.

(Extended piece)
As shown in FIG. 2, the extension piece 3 a is formed so as to project outwardly from the two extension starting points E _a and E _a on the outer periphery along the extension direction Z. The extension starting points E _a and E _a are points at which the extension starts from the outer periphery of the base portion of the die bond film 3 toward the outside. A portion of the die bond film 3 opposite to the extension piece 3 _a across the extension starting points E _a and E _a serves as a base portion of the die bond film 3. Extension pieces 3a is a plan view rhombic, origin extending Some acute tip E _a, has a shape as cut by a line segment passing through the E _a, specifically The tip is tapered in a V shape from the root portion including the rising portion from the circular outer periphery of the die bond film along the extending direction Z, through the middle portion swelled in the direction perpendicular to the extending direction Z It has a shape that reaches the part. By making the tip of the extended piece 3a V-shaped, it is possible to reduce the attraction stress from the separator 14 while maintaining the mechanical strength of the extended piece 3a. Further, since the tip portion can be a simple structure formed with a straight line, the extending piece can be easily formed.

  The inner angle α of the V-shaped tip is not particularly limited, but the upper limit is preferably 90 ° or less, more preferably 75 ° or less, from the viewpoint of ease of peeling of the dicing die-bonding film 12 from the separator 14. . The lower limit of the inner angle α is preferably 30 ° or more, and more preferably 45 ° or more.

The minimum difference distance d _min (that is, the distance between the extension starting points E _a and E _{a in} the present embodiment) of the base portion of the extension piece in the direction perpendicular to the extension direction Z of the extension piece 3a is It is preferable to be smaller than the maximum difference d _max of the intermediate part between the root part and the tip part of the protruding piece 3a (that is, the distance between the apexes of the obtuse tip part of the present embodiment). By forming the root portion of the extension piece 3a to be narrower than the intermediate portion, even if the tip portion (and the intermediate portion) of the extension piece 3a remains on the separator 14 side at the time of peeling, the peeling is rooted. When proceeding beyond the part, the peeling stress concentrates on the base part, and the cutting of the base part can be promoted. As a result, a new peeling starting point of the die bond film 3 can be provided in the vicinity of the cut portion of the extending piece 3a, and the occurrence of peeling defects can be suppressed as much as possible.

From the viewpoint of promoting cutting at the root portion at the time of peeling, the minimum difference distance d _min of the root portion is preferably 1 mm or less. The lower limit of the minimum difference distance d _min is preferably 0.5 mm or more from the viewpoint of the mechanical strength of the root portion.

The ratio (d _min / d _max ) of the minimum passing distance d _min of the root portion to the maximum passing distance d _max of the intermediate portion is to ensure the mechanical strength of the extended piece and to promote cutting at the time of peeling of the root portion. From the viewpoint of balance, 0.7 or less is preferable, and 0.5 or less is more preferable.

The extension amount h from the base portion of the extension piece 3a is not particularly limited as long as the extension piece 3a can act as a separation starting point of the dicing die bond film 12, but is preferably 1 to 10 mm, more preferably 3 to 5 mm. . The extension amount h is obtained as a distance between a straight line passing through the extension starting points E _a and E _a and a straight line passing through the most distal point of the extension piece 3a and perpendicular to the extension direction Z. If the straight line passing through the extension starting points E _a and E _a is not perpendicular to the extending direction Z, the bisection point of the line segment connecting the extension starting points E _a and E _a with the straight line and the end point of the extending piece 3a The distance between the straight line perpendicular to the extending direction Z is calculated.

Extending volume _{h mid} from the base portion of the intermediate portion of the extending piece 3a, although not particularly limited, but is preferably 0.5 to 10 mm, 0.5 to 5 mm is more preferable. Note that the extension amount h _mid of the intermediate portion is the distance between the straight line passing through the extension starting points E _a and E _a and the straight line passing through two points giving the maximum difference distance d _max of the intermediate portion of the extension piece 3a. As required. When the straight line passing through the extension starting points E _a and E _a or the straight line passing through the two points giving the maximum difference distance d _max at the intermediate portion of the extending piece 3a is not perpendicular to the extending direction Z, the extension starting points E _a and E the two points which gives the maximum distance across distance d _max of the intermediate portion of the bisection point and the extension piece 3a of the line segment connecting with straight lines _a as the distance between the bisection point of a line segment connecting a straight line Ask.

  As shown in FIG. 1B, the extension piece 3 a is preferably disposed along the longitudinal direction X of the long separator 14. When the dicing die bond film 12 is continuously peeled from the long separator-attached film 10 that has been fed, the extending direction 3a is arranged along the longitudinal direction X of the long separator 14, and the peeling direction. Since it becomes parallel to the longitudinal direction X of the long separator 14, continuous peeling can be performed efficiently.

  Furthermore, when the extended piece is arrange | positioned along the longitudinal direction X of the long separator 14, the both ends of the die-bonding film 3 along the longitudinal direction X of the long separator 14 (die-bonding film 3 illustrated in FIG. 1B) It is preferable that the extending piece is provided at the left end where the extending piece 3a is provided and the right end where the extending piece on the opposite side is not provided. Thereby, continuous peeling of the dicing die-bonding film 12 becomes possible without questioning the feeding direction of the dicing die-bonding film 10 with a long separator as a wound body.

(Component materials of die bond film)
Examples of the layer structure of the die bond film 3 include a single-layer adhesive layer as in this embodiment, and a multilayer structure in which an adhesive layer is formed on one or both sides of the core material. Examples of the core material include a film (for example, a polyimide film, a polyester film, a polyethylene terephthalate film, a polyethylene naphthalate film, and a polycarbonate film), a resin substrate reinforced with glass fibers or plastic non-woven fibers, a silicon substrate, a glass substrate, or the like. Is mentioned.

  Examples of the adhesive composition that constitutes the die bond film 3 include a combination of a thermoplastic resin and a thermosetting resin.

  Examples of the thermosetting resin include phenol resin, amino resin, unsaturated polyester resin, epoxy resin, polyurethane resin, silicone resin, and thermosetting polyimide resin. These resins can be used alone or in combination of two or more. In particular, an epoxy resin containing a small amount of ionic impurities or the like that corrode semiconductor elements is preferable. Moreover, as a hardening | curing agent of an epoxy resin, a phenol resin is preferable.

  The epoxy resin is not particularly limited as long as it is generally used as an adhesive composition, for example, bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type. Biphenyl type, naphthalene type, fluorene type, phenol novolac type, orthocresol novolak type, trishydroxyphenylmethane type, tetraphenylolethane type, etc., bifunctional epoxy resin or polyfunctional epoxy resin, or hydantoin type, trisglycidyl isocyanurate Type or glycidylamine type epoxy resin is used. These can be used alone or in combination of two or more. Of these epoxy resins, novolac type epoxy resins, biphenyl type epoxy resins, trishydroxyphenylmethane type resins or tetraphenylolethane type epoxy resins are particularly preferred. This is because these epoxy resins are rich in reactivity with a phenol resin as a curing agent and are excellent in heat resistance and the like.

  The phenol resin acts as a curing agent for the epoxy resin. For example, a novolac type phenol such as a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a phenol biphenyl resin, or a nonylphenol novolak resin. Examples thereof include resins, resol type phenol resins, polyoxystyrenes such as polyparaoxystyrene. These can be used alone or in combination of two or more. Of these phenol resins, phenol novolac resins and phenol aralkyl resins are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.

  The mixing ratio of the epoxy resin and the phenol resin is preferably such that, for example, the hydroxyl group in the phenol resin is 0.5 to 2.0 equivalents per 1 equivalent of the epoxy group in the epoxy resin component. . More preferred is 0.8 to 1.2 equivalents. That is, if the blending ratio of both is out of the above range, sufficient curing reaction does not proceed and the properties of the cured epoxy resin are likely to deteriorate.

  Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, heat Examples thereof include plastic polyimide resins, polyamide resins such as 6-nylon and 6,6-nylon, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamideimide resins, and fluorine resins. These thermoplastic resins can be used alone or in combination of two or more. Of these thermoplastic resins, an acrylic resin that has few ionic impurities and high heat resistance and can ensure the reliability of the semiconductor element is particularly preferable.

  The acrylic resin is not particularly limited, and includes one or two or more esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms, particularly 4 to 18 carbon atoms. Examples thereof include a polymer (acrylic copolymer) as a component. Examples of the alkyl group include a methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, t-butyl group, isobutyl group, amyl group, isoamyl group, hexyl group, heptyl group, cyclohexyl group, 2- Examples include ethylhexyl group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, lauryl group, tridecyl group, tetradecyl group, stearyl group, octadecyl group, and eicosyl group.

  Further, the other monomer forming the polymer is not particularly limited, and examples thereof include glycidyl group-containing monomers such as glycidyl acrylate and glycidyl methacrylate, acrylic acid, methacrylic acid, carboxyethyl acrylate, and carboxypentyl. Carboxyl group-containing monomers such as acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic anhydride, 2-hydroxyethyl (meth) acrylate, (meta ) 2-hydroxypropyl acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, (meth Acry Hydroxyl group-containing monomers such as acid 12-hydroxylauryl or (4-hydroxymethylcyclohexyl) -methyl acrylate, styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) Sulfonic acid group-containing monomers such as acrylamide propanesulfonic acid, sulfopropyl (meth) acrylate or (meth) acryloyloxynaphthalene sulfonic acid, phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate, styrene monomers, or Acrylonitrile is mentioned.

  Moreover, a filler can be suitably mix | blended with the die-bonding film 3 according to the use. The blending of the filler enables imparting conductivity, improving thermal conductivity, adjusting the elastic modulus, and the like. Examples of the filler include inorganic fillers and organic fillers, and inorganic fillers are preferable from the viewpoints of characteristics such as improvement in handleability, improvement in thermal conductivity, adjustment of melt viscosity, and imparting thixotropic properties. The inorganic filler is not particularly limited, and examples thereof include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, and aluminum borate whisker. , Boron nitride, crystalline silica, amorphous silica and the like. These can be used alone or in combination of two or more. From the viewpoint of improving thermal conductivity, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, and amorphous silica are preferable. Further, from the viewpoint that the above properties are well balanced, crystalline silica or amorphous silica is preferable. In addition, a conductive substance (conductive filler) may be used as the inorganic filler for the purpose of imparting conductivity and improving thermal conductivity. Examples of the conductive filler include metal powder in which silver, aluminum, gold, cylinder, nickel, conductive alloy and the like are made into a spherical shape, needle shape and flake shape, metal oxide such as alumina, amorphous carbon black, graphite and the like. The filler may have an average particle size of 0.1 to 80 μm. In addition, the average particle diameter of a filler is the value calculated | required with the photometric type particle size distribution meter (The product made from HORIBA, apparatus name; LA-910).

  The filler content is preferably 5 parts by weight or more and 10 parts by weight or more and 95 parts by weight or less with respect to 100 parts by weight in total of the thermosetting resin component, the thermoplastic resin component, and the filler. More preferably, it is 20 parts by weight or more and 90 parts by weight or less.

  In addition to the said filler, another additive can be suitably mix | blended with the die-bonding film 3 as needed. Examples of other additives include flame retardants, silane coupling agents, ion trapping agents, and the like. Examples of the flame retardant include antimony trioxide, antimony pentoxide, brominated epoxy resin, and the like. These can be used alone or in combination of two or more. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and the like. These compounds can be used alone or in combination of two or more. Examples of the ion trapping agent include hydrotalcites and bismuth hydroxide. These can be used alone or in combination of two or more.

  The thickness of the die bond film 3 (total thickness in the case of a laminate) is not particularly limited, but can be selected, for example, from a range of 1 to 200 μm, preferably 5 to 100 μm, more preferably 10 to 80 μm. .

(Base material)
The substrate 1 is preferably one having ultraviolet transparency, and serves as a strength matrix of the dicing film 11. For example, polyolefins such as low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolyprolene, polybutene, polymethylpentene, ethylene-acetic acid Vinyl copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, Polyester such as polyurethane, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyimide, polyetherimide, polyamide, wholly aromatic polyamide, polyphenylsulfur De, aramid (paper), glass, glass cloth, fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, metal (foil), paper, and the like.

  Moreover, as a material of the base material 1, polymers, such as the crosslinked body of the said resin, are mentioned. The plastic film may be used unstretched or may be uniaxially or biaxially stretched as necessary. According to the resin sheet to which heat shrinkability is imparted by stretching or the like, the adhesive area between the pressure-sensitive adhesive layer 2 and the die bond film 3 is reduced by thermally shrinking the base material 1 after dicing, so that a semiconductor chip (semiconductor element) ) Can be easily collected.

  In addition, the surface of the substrate 1 is subjected to conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, etc., in order to improve adhesion and retention with adjacent layers. A chemical or physical treatment or a coating treatment with a primer (for example, an adhesive substance described later) can be applied. The base material 1 can be used by appropriately selecting the same kind or different kinds, and a blend of several kinds can be used as necessary.

  The thickness of the substrate 1 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm.

(Adhesive layer)
It does not restrict | limit especially as an adhesive used for formation of the adhesive layer 2, For example, common pressure sensitive adhesives, such as an acrylic adhesive and a rubber adhesive, can be used. The pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive based on an acrylic polymer from the standpoint of cleanability with an organic solvent such as ultrapure water or alcohol for electronic components that are difficult to contaminate semiconductor wafers and glass. Is preferred.

  Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester , Octadecyl esters, eicosyl esters, etc., alkyl groups having 1 to 30 carbon atoms, especially 4 to 18 carbon linear or branched alkyl esters, etc.) and Meth) acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymers such as one or more was used as a monomer component of the cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. You may go out. Examples of such monomer components include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate , 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate,
Hydroxyl group-containing monomers such as (meth) acrylic acid 12-hydroxylauryl, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; styrenesulfonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid Sulfonic acid group-containing monomers such as (meth) acrylamide propanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid; phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile, etc. Is mentioned. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

  Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

  The acrylic polymer can be obtained by subjecting a single monomer or a mixture of two or more monomers to polymerization. The polymerization can be performed by any method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like. From the viewpoint of preventing contamination of a clean adherend, the content of the low molecular weight substance is preferably small. From this point, the number average molecular weight of the acrylic polymer is preferably 300,000 or more, more preferably about 400,000 to 3,000,000.

  In addition, an external cross-linking agent can be appropriately employed for the pressure-sensitive adhesive in order to increase the number average molecular weight of an acrylic polymer as a base polymer. Specific examples of the external crosslinking method include a method of adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, it is preferable to add about 5 parts by weight or less, and further 0.1 to 5 parts by weight with respect to 100 parts by weight of the base polymer. Furthermore, you may use additives, such as conventionally well-known various tackifier and anti-aging agent, other than the said component as needed to an adhesive.

  The pressure-sensitive adhesive layer 2 can be formed of a radiation curable pressure-sensitive adhesive. A radiation-curable pressure-sensitive adhesive can easily reduce its adhesive strength by increasing the degree of crosslinking by irradiation with radiation such as ultraviolet rays. By curing the radiation-curable pressure-sensitive adhesive layer 2 by radiation irradiation, the interface between the pressure-sensitive adhesive layer 2 and the die-bonding film 3 that has been cured and has reduced adhesive strength easily peels off during pick-up.

  As the radiation-curable pressure-sensitive adhesive, those having a radiation-curable functional group such as a carbon-carbon double bond and exhibiting adhesiveness can be used without particular limitation. As the radiation curable pressure sensitive adhesive, for example, an addition type radiation curable pressure sensitive adhesive in which a radiation curable monomer component or an oligomer component is blended with a general pressure sensitive pressure sensitive adhesive such as an acrylic pressure sensitive adhesive or a rubber pressure sensitive adhesive. An agent can be illustrated.

  Examples of the radiation curable monomer component to be blended include urethane oligomer, urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaerythritol. Examples include stall tetra (meth) acrylate, dipentaerystol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, and the like. Examples of the radiation curable oligomer component include various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight in the range of about 100 to 30,000 are suitable. The compounding amount of the radiation-curable monomer component or oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer, and the amount capable of reducing the adhesive strength of the pressure-sensitive adhesive layer. Generally, the amount is, for example, about 5 to 500 parts by weight, preferably about 40 to 150 parts by weight with respect to 100 parts by weight of the base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

  In addition to the additive-type radiation curable adhesive described above, the radiation curable pressure-sensitive adhesive has a carbon-carbon double bond in the polymer side chain or main chain or at the main chain terminal as a base polymer. Intrinsic radiation curable pressure sensitive adhesives using Intrinsic radiation curable adhesives do not need to contain oligomer components, which are low molecular components, or do not contain many, so they are stable without the oligomer components moving through the adhesive over time. It is preferable because an adhesive layer having a layered structure can be formed.

  As the base polymer having a carbon-carbon double bond, those having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, those having an acrylic polymer as a basic skeleton are preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

  The method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, the carbon-carbon double bond can be easily introduced into the polymer side chain for easy molecular design. . For example, after a monomer having a functional group is previously copolymerized with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation curable carbon-carbon double bond. A method of performing condensation or addition reaction while maintaining the above.

  Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups, and the like. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction. Moreover, the functional group may be on either side of the acrylic polymer and the compound as long as the acrylic polymer having the carbon-carbon double bond is generated by a combination of these functional groups. In the preferable combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. Further, as the acrylic polymer, those obtained by copolymerizing the above-exemplified hydroxy group-containing monomers, ether compounds of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like are used.

As the intrinsic radiation curable pressure-sensitive adhesive, the base polymer (particularly acrylic polymer) having the carbon-carbon double bond can be used alone, but the radiation curable monomer does not deteriorate the characteristics. Components and oligomer components can also be blended. The radiation-curable oligomer component or the like is usually in the range of 30 parts by weight, preferably in the range of 0 to 10 parts by weight with respect to 100 parts by weight of the base polymer.

The radiation curable pressure-sensitive adhesive contains a photopolymerization initiator when cured by ultraviolet rays or the like. Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α′-dimethylacetophenone, 2-methyl-2-hydroxypropio Α-ketol compounds such as phenone and 1-hydroxycyclohexyl phenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-
Acetophenone compounds such as [4- (methylthio) -phenyl] -2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; ketal compounds such as benzyldimethyl ketal; Aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; photoactive oxime compounds such as 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime; benzophenone, benzoylbenzoic acid, 3, Benzophenone compounds such as 3′-dimethyl-4-methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4- Examples thereof include thioxanthone compounds such as dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketone; acyl phosphinoxide; acyl phosphonate. The compounding quantity of a photoinitiator is about 0.05-20 weight part with respect to 100 weight part of base polymers, such as an acryl-type polymer which comprises an adhesive.

  Examples of radiation curable pressure-sensitive adhesives include photopolymerizable compounds such as addition polymerizable compounds having two or more unsaturated bonds and alkoxysilanes having an epoxy group disclosed in JP-A-60-196956. And a rubber-based pressure-sensitive adhesive and an acrylic pressure-sensitive adhesive containing a photopolymerization initiator such as a carbonyl compound, an organic sulfur compound, a peroxide, an amine, and an onium salt-based compound.

  In the case where curing is inhibited by oxygen during irradiation, it is desirable to block oxygen (air) from the surface of the radiation curable pressure-sensitive adhesive layer 2 by some method. For example, a method of coating the surface of the pressure-sensitive adhesive layer 2 with a separator, a method of irradiating ultraviolet rays or the like in a nitrogen gas atmosphere, and the like can be mentioned.

  The thickness of the pressure-sensitive adhesive layer 2 is not particularly limited, but is preferably about 1 to 50 μm from the viewpoint of preventing chipping of the chip cut surface and compatibility of fixing and holding the adhesive layer. Preferably it is 2-30 micrometers, Furthermore, 5-25 micrometers is preferable.

[Manufacturing method of dicing die-bonding film with separator]
The dicing film with a separator 10 according to the present embodiment is produced, for example, as follows.
First, the base material 1 can be formed by a conventionally known film forming method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method. When coloring the base material 1, the said coloring material is added.

  Next, after a pressure-sensitive adhesive composition solution is applied onto the substrate 1 to form a coating film, the coating film is dried under predetermined conditions (heat-crosslinked as necessary), and the pressure-sensitive adhesive layer 2 is formed. Form. It does not specifically limit as a coating method, For example, roll coating, screen coating, gravure coating, etc. are mentioned. As drying conditions, for example, the drying temperature is 80 to 150 ° C. and the drying time is 0.5 to 5 minutes. Moreover, after apply | coating an adhesive composition on a separator and forming a coating film, the coating film may be dried on the said drying conditions, and the adhesive layer 2 may be formed. Then, the adhesive layer 2 is bonded together with the separator on the base material 1. Thereby, the dicing film 11 is produced.

The die bond film 3 is produced as follows, for example.
First, an adhesive composition solution that is a material for forming the die bond film 3 is prepared. As described above, the adhesive composition solution contains the adhesive composition, filler, and other various additives.

  Next, the adhesive composition solution is applied on the base separator so as to have a predetermined thickness to form a coating film, and then the coating film is dried under a predetermined condition to form a die bond film precursor. It does not specifically limit as a coating method, For example, roll coating, screen coating, gravure coating, etc. are mentioned. As drying conditions, for example, the drying temperature is 70 to 160 ° C. and the drying time is 1 to 5 minutes. Moreover, after apply | coating an adhesive composition solution on a separator and forming a coating film, a coating film may be dried on the said drying conditions, and a die-bonding film precursor may be formed. Then, a die bond film precursor is bonded together with a separator on a base material separator.

  Next, the obtained die bond film precursor is die-cut or cut so as to have a predetermined plan view shape, and a die bond film 3 having an extended piece is produced.

  Subsequently, the separator is peeled off from each of the dicing film 11 and the die bond film 3, and the die bond film 3 and the pressure-sensitive adhesive layer 2 are bonded to each other so as to be a bonding surface. Bonding can be performed by, for example, pressure bonding. At this time, the lamination temperature is not particularly limited, and is preferably 30 to 50 ° C., for example, and more preferably 35 to 45 ° C. Moreover, a linear pressure is not specifically limited, For example, 0.1-20 kgf / cm is preferable and 1-10 kgf / cm is more preferable.

  Finally, the base material separator on the die bond film 3 is peeled off and bonded to the separator to obtain the dicing film 10 with a separator according to the present embodiment. In the present embodiment, a long separator 14 is used as a separator, and a plurality of dicing die bond films 12 are bonded to the separator 14 at a predetermined interval. Such a long film 10 with a separator can be rolled up and used as a wound body.

[Method for Manufacturing Semiconductor Device]
Hereinafter, the case where the dicing die-bonding film 10 with a separator is used will be described as an example with reference to FIGS. 1B, 3, and 4. FIG. 3 is a schematic cross-sectional view showing one step of a manufacturing process of a semiconductor device using a dicing die-bonding film with a separator according to the present embodiment, and FIG. 4 is a die bonding in the dicing die-bonding film with a separator shown in FIG. 1A. It is a cross-sectional schematic diagram which shows the example which mounted the semiconductor chip through the film.

  As shown in FIG. 1B, the separator-attached film 10 is continuously paid out in the payout direction Y. Next, the dicing die-bonding film 12 is peeled from the long separator 14 by a known wafer mounting apparatus, and the semiconductor wafer 4 is pressure-bonded to the peeled dicing die-bonding film 12 as shown in FIG. Peeling is performed from the side on which the extended piece 3a of the die bond film 3 is formed. Thereby, the extension piece 3a becomes a peeling start point, and the dicing die-bonding film 12 can be easily peeled off. Further, by forming the extending piece 3a along the longitudinal direction X of the long separator 14, the separation starting point can always be positioned at the front end side in the feeding direction Y. Therefore, the dicing / die bonding film 12 that has been fed out. Can be started at a fixed position on the long separator 14, and a complicated operation for peeling can be suppressed.

  The affixing step is performed while pressing with a pressing means such as a pressure roll. The attaching temperature at the time of mounting is not specifically limited, For example, it is preferable to exist in the range of 20-80 degreeC.

  Next, dicing of the semiconductor wafer 4 is performed. Thereby, the semiconductor wafer 4 is cut into a predetermined size and separated into individual pieces, and the semiconductor chip 5 is manufactured (see FIG. 4). Dicing is performed according to a conventional method from the circuit surface side of the semiconductor wafer 4, for example. Further, in this step, for example, a cutting method called full cut for cutting up to the die bond film 3 can be adopted. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used. Further, since the semiconductor wafer 4 is bonded and fixed by the dicing die bond film 12, chip chipping and chip jump can be suppressed, and damage to the semiconductor wafer 4 can also be suppressed.

  In order to peel off the semiconductor chip 5 adhered and fixed to the dicing die bond film 12, the semiconductor chip 5 is picked up. The pickup method is not particularly limited, and various conventionally known methods can be employed. For example, there is a method of pushing up each semiconductor chip 5 from the dicing film 11 side with a needle and picking up the pushed semiconductor chip 5 with a pickup device.

  Here, when the pressure-sensitive adhesive layer 2 is an ultraviolet curable type, the pickup is performed after the pressure-sensitive adhesive layer 2 is irradiated with ultraviolet rays. Thereby, the adhesive force with respect to the die-bonding film 3 of the adhesive layer 2 falls, and peeling of the semiconductor chip 5 becomes easy. As a result, the pickup can be performed without damaging the semiconductor chip 5. Conditions such as irradiation intensity and irradiation time at the time of ultraviolet irradiation are not particularly limited, and may be set as necessary. Moreover, as a light source used for ultraviolet irradiation, a high-pressure mercury lamp, a microwave excitation lamp, a chemical lamp, or the like can be used.

  The picked-up semiconductor chip 5 is bonded and fixed to the adherend 6 via the die bond film 3 (die bond). Examples of the adherend 6 include a lead frame, a TAB film, a substrate, and a separately manufactured semiconductor chip. The adherend 6 may be, for example, a deformable adherend that can be easily deformed or a non-deformable adherend (such as a semiconductor wafer) that is difficult to deform.

  A conventionally well-known thing can be used as said board | substrate. As the lead frame, a metal lead frame such as a Cu lead frame or a 42 Alloy lead frame, or an organic substrate made of glass epoxy, BT (bismaleimide-triazine), polyimide, or the like can be used. However, the present invention is not limited to this, and includes a circuit board that can be used by mounting a semiconductor element and electrically connecting the semiconductor element.

  When the die-bonding film 3 is a thermosetting type, the semiconductor chip 5 is bonded and fixed to the adherend 6 by heat curing to improve the heat resistance strength. The heating temperature can be 80 to 200 ° C, preferably 100 to 175 ° C, more preferably 100 to 140 ° C. The heating time can be 0.1 to 24 hours, preferably 0.1 to 3 hours, more preferably 0.2 to 1 hour. In addition, what the semiconductor chip 5 adhere | attached and fixed to the board | substrate etc. via the die-bonding film 3 can use for a reflow process.

  The shear bond strength of the die-bonding film 3 after thermosetting is preferably 0.2 MPa or more with respect to the adherend 6, more preferably 0.2 to 10 MPa. When the shear bond strength of the die bond film 3 is at least 0.2 MPa or more, the die bond film 3 and the semiconductor chip 5 or the adherend 6 are bonded by ultrasonic vibration or heating in the wire bonding process. Less shear deformation occurs on the adhesive surface. That is, the semiconductor element is less likely to move due to ultrasonic vibration during wire bonding, thereby preventing the success rate of wire bonding from decreasing.

  In addition, the manufacturing method of the semiconductor device which concerns on this embodiment performs wire bonding, without passing through the thermosetting process by the heat processing of the die-bonding film 3, Furthermore, the semiconductor chip 5 is sealed with sealing resin, The said sealing The resin may be after-cured. In this case, the shear adhesive force at the time of temporary fixing of the die bond film 3 is preferably 0.2 MPa or more, more preferably 0.2 to 10 MPa with respect to the adherend 6. When the shear bonding force at the time of temporary fixing of the die bond film 3 is at least 0.2 MPa or more, even if the wire bonding step is performed without passing through the heating step, the die bond film is subjected to ultrasonic vibration or heating in the step. 3 and the semiconductor chip 5 or the adherend 6 are less likely to cause shear deformation. That is, the semiconductor element is less likely to move due to ultrasonic vibration during wire bonding, thereby preventing the success rate of wire bonding from decreasing.

  The wire bonding is a step of electrically connecting the tip of the terminal portion (inner lead) of the adherend 6 and an electrode pad (not shown) on the semiconductor chip 5 with a bonding wire 7. As the bonding wire 7, for example, a gold wire, an aluminum wire, a copper wire or the like is used. The temperature at the time of wire bonding is 80 to 250 ° C, preferably 80 to 220 ° C. The heating time is several seconds to several minutes. The connection is performed by a combination of vibration energy by ultrasonic waves and crimping energy by applying pressure while being heated so as to be within the temperature range. This step may be performed without thermosetting the die bond film 3.

  The sealing step is a step of sealing the semiconductor chip 5 with the sealing resin 8. This step is performed to protect the semiconductor chip 5 and the bonding wire 7 mounted on the adherend 6. This step is performed by molding a sealing resin with a mold. As the sealing resin 8, for example, an epoxy resin is used. Although the heating temperature at the time of resin sealing is normally performed at 175 degreeC for 60 to 90 second, this invention is not limited to this, For example, it can cure at 165 to 185 degreeC for several minutes. Thereby, the sealing resin is cured, and the semiconductor chip 5 and the adherend 6 are fixed through the die bond film 3. That is, in the present invention, even when the post-curing step described later is not performed, the die bonding film 3 can be fixed in this step, and the number of manufacturing steps can be reduced and the semiconductor device manufacturing period can be reduced. It can contribute to shortening.

  In the post-curing step, the sealing resin 8 that is insufficiently cured in the sealing step is completely cured. Even if the die bond film 3 is not completely thermoset in the sealing step, the die bond film 3 can be completely thermoset together with the sealing resin 8 in this step. Although the heating temperature in this process changes with kinds of sealing resin, it exists in the range of 165-185 degreeC, for example, and heating time is about 0.5 to 8 hours.

Second Embodiment
The die-bonding film according to the first embodiment has an extending piece that extends outward from the outer periphery. The die bond film according to the second embodiment has a taper-like extension part as one region of the base part of the die bond film, and the extension piece described in the first embodiment is connected to the tip part. ing. Hereinafter, this aspect will be described.

As shown in FIG. 5A, in the film with a separator of the present embodiment, the die bond film 23 includes two extending portions of the extending piece 3a on the outer periphery in a part of the outer periphery of the die bond film 23 in a plan view. Two points on the outer circumference sandwiching the protruding points E _a and E _a are defined as extended starting points E _A and E _A , and the two extended starting points E _a and E _a of the extending piece 3a are defined as extended tip points. A tapered extension portion 3A is formed. Extending piece extending two points out the starting point _E a of 3a, _{E a} and extension of 2 points out the starting point _E A of the extended portion 3A, _{E A} and connecting each of the two line segments _L A, _{L A} is extended piece It is located on the inner side of arcs C _A and C _A passing through one of the two extension starting points E _a and E _a of 3a and the two extension starting points E _A and E _A of the extension part 3A. . Therefore, the die-bonding film 23 has a relatively large extending portion 3A having a tapered shape and a relatively small extending piece 3a connected to the tip portion of the extending portion 3A. As a result, when the dicing die bond film is peeled off from the separator, even if the peeling on the extension piece 3a does not proceed, the peeling is the root of the extension piece 3a (or the extension starting point E _a , E _a ). When exceeding the above, it is possible to induce peeling in the extending portion 3A in which the attraction stress from the separator is reduced by using a taper shape, and to suppress the occurrence of unexpected peeling defects as much as possible. it can.

The two line segments L _A and L _A connecting the extension starting points E _A and E _A of the extending part 3A and the extension tip points (that is, the extension starting points E _a and E _a of the extension pieces) Any of a straight line, a curved line, or a combination thereof may be used as long as it is located inside C _A and C _A (on the center of gravity side of the die bond film). When the two line segments L _A and L _A are curved, as long as they are located on the inner side of the arcs C _A and C _A , even if they are curved outwardly with respect to the center of gravity of the die bond film, There may be. Among these, the two line segments L _A and L _A are preferably straight lines. Thereby, formation of extension part 3A becomes easy, and attraction stress from a separator can be reduced efficiently.

When the two line segments L _A and L _A are straight lines, the angle β formed by these is preferably 120 ° or more and 175 ° or less, and more preferably 130 ° or more and 160 ° or less. By setting the internal angle β of the distal end portion of the extending portion 3A within the above range, the semiconductor wafer 4 (see FIG. 3) in the die bond film 23 can be attached while efficiently reducing the attractive stress from the separator. A sufficient effective area can be secured.

  As shown in FIG. 5B, the extension piece 3a and the extension portion 3A are preferably arranged along the longitudinal direction X of the long separator 14 for the same reason as in the first embodiment. In particular, as shown in FIG. 5B, extending pieces 3a, 3a ′ and extending portions 3A, 3A ′ are provided at both ends of the die bond film 23 along the longitudinal direction X of the long separator 14. preferable.

<Other embodiments>
The modification of the extension piece which concerns on other embodiment of this invention is shown to FIG. When the die bond film has the extended pieces 33a to 33m shown in FIGS. 6A to 6M, the dicing die bond film can be easily peeled from the separator. The structural features of the extending pieces in the first embodiment can be similarly applied to the extending pieces 33a to 33m.

  Hereinafter, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in this example are not intended to limit the gist of the present invention only to those unless otherwise limited. In the following, “parts” means parts by weight.

[Example 1]
(Production of die bond film)
The following (a) to (d) were dissolved or dispersed in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 25% by weight. In addition, the following number of parts (a) to (d) refers to the number of solids.
(A) Epoxy resin (Nippon Kayaku Co., Ltd., EPPN-501HY) 11 parts (b) Phenol resin (Maywa Kasei Co., Ltd., MEH7851M) 14 parts (c) Acrylic rubber (manufactured by Nagase ChemteX, SG- P3) 100 parts (d) Spherical silica (manufactured by Admatechs, 67 parts SO-E2)

  The adhesive composition solution was applied on a release film (separator) made of a polyethylene terephthalate film having a thickness of 50 μm after the silicone release treatment, and then dried at 130 ° C. for 2 minutes. Thus, a die bond film precursor having a thickness of 25 μm was produced.

  The produced die bond film precursor is punched out so as to have a circular shape with a base portion having a diameter of 330 mm, and has an extended piece having the shape shown in FIG. 2, and according to the present embodiment having the plan view shape of FIG. 1B as a whole. A die bond film was prepared. Details of the shape of the extended piece are shown in Table 1.

(Preparation of dicing die bond film with separator)
Next, the die-bonding film having the extended piece was transferred to a dicing film (manufactured by Nitto Denko Corporation, trade name “DU-2187G”). The transfer was performed so that the pressure-sensitive adhesive layer of the dicing film and the die bond film face each other. This laminate was punched out in a circular shape so that the dicing film had a diameter of 370 mm to obtain a dicing die-bonding film with a separator of this example.

[Example 2]
The die bond film precursor produced in the same manner as in Example 1 was punched out so that the base portion had a circular shape with a diameter of 330 mm and had the extension piece and the extension portion having the shape shown in FIG. 5A. A dicing die-bonding film with a separator was produced in the same manner as in Example 1 except that a die-bonding film having a plan view shape was produced. The shape of the extended piece was the same as in Example 1. Details of the shape of the extended piece are shown in Table 1.

[Example 3]
A dicing die-bonding film with a separator was produced in the same manner as in Example 1 except that the shape of the extended piece was changed to the shape shown in FIG. 6M. Details of the shape of the extended piece are shown in Table 1.

[Example 4]
A dicing die-bonding film with a separator was produced in the same manner as in Example 1 except that the shape of the extended piece was changed to the shape shown in FIG. 6C. Details of the shape of the extended piece are shown in Table 1.

[Comparative Example 1]
A dicing die-bonding film with a separator was prepared in the same manner as in Example 1 except that no extended piece was provided on the die-bonding film and the shape in plan view was a circle having a diameter of 330 mm. Details of the shape of the extended piece are shown in Table 1.

<Evaluation of separator peelability>
Using a wafer mounter (trade name “MA3000II” manufactured by Nitto Seiki Co., Ltd.), the separator was peeled off from the dicing die-bonding films with separators of Examples and Comparative Examples. In Examples 1 to 4, peeling was performed from the side where the extended piece was provided. When the die bond film is peeled off from the dicing film (when the die bond film remains in the separator), the part where the dicing film has peeled has reached the expected bonding area of the 12-inch wafer in the die bond film and evaluated as defective, The defect rate {(number of defects / total number of samples) × 100 (%)} was determined with 50 samples. The results are shown in Table 1.

<Result>
From the results in Table 1, it can be seen that the dicing die-bonding film can be easily peeled from the separator by providing an outwardly protruding extension piece on the outer periphery of the die-bonding film.

DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive layer 3 Die bond film 3a, 33a-33l Extension piece 3A Extension part 4 Semiconductor wafer 5 Semiconductor chip 6 Adhering body 7 Bonding wire 8 Sealing resin 10 Dicing die-bonding film with separator 11 Dicing film 12 Dicing die bond film 14 Separator

Claims (12)

A separator;
A die-bonding film having an outwardly protruding extension piece at the outer periphery in plan view;
Dicing die-bonding film with separator, in which dicing film is laminated in this order.   The dicing die-bonding film with a separator according to claim 1, wherein the extending piece has a tapered tip portion.   The dicing die-bonding film with a separator according to claim 2, wherein the extending piece has a V-shaped tip.   The dicing die-bonding film with a separator according to claim 3, wherein an inner angle of the V-shaped tip is 30 ° or more and 90 ° or less.   The minimum passing distance of the base part of the extending piece in the direction perpendicular to the extending direction of the extending piece is smaller than the maximum passing distance of the intermediate part between the root part and the tip part of the extending piece. The dicing die-bonding film with a separator according to any one of claims 1 to 4.   The dicing die-bonding film with a separator according to claim 5, wherein a minimum distance of the root portion is 1 mm or less.   The dicing die-bonding film with a separator according to claim 1, wherein the separator is a long separator.   The dicing die-bonding film with a separator according to claim 7, wherein the extending piece is disposed along a longitudinal direction of the long separator. In the die bond film, in a part of the outer periphery of the die bond film in plan view, two points on the outer periphery sandwiching the two extension start points of the extension piece on the outer periphery are used as the extension start points, and A taper-like extension part having two extension starting points of the extension piece as extension tip points is formed,
Two line segments connecting the two extension start points of the extension piece and the two extension start points of the extension part are either one of the two extension start points of the extension piece and the extension point. The dicing die-bonding film with a separator according to any one of claims 1 to 8, wherein the dicing die-bonding film with a separator according to any one of claims 1 to 8 is located on the inner side of an arc passing through three of the two extension starting points of the protruding portion.   The dicing die-bonding film with a separator according to claim 9, wherein the two line segments are straight lines.   The dicing die-bonding film with a separator according to claim 10, wherein an angle formed by the two line segments is 120 ° or more and 175 ° or less. The dicing film has a base material and an adhesive layer laminated on the base material,
The dicing film with a separator according to any one of claims 1 to 11, wherein the die bond film is laminated on the pressure-sensitive adhesive layer of the dicing film.

Images