JP5976716B2 - Thermosetting die bond film - Google Patents

Description

The present invention relates to a thermosetting die-bonding film used when a semiconductor element such as a semiconductor chip is fixed on an adherend such as a substrate or a lead frame. The present invention also relates to a dicing die bond film in which the thermosetting die bond film is laminated on the dicing film.

Conventionally, a silver paste is used for fixing a semiconductor chip to a lead frame or an electrode member in manufacturing a semiconductor device. Such a fixing process is performed by applying a paste-like adhesive on a die pad or the like of the lead frame, mounting a semiconductor chip thereon, and curing the paste-like adhesive layer.

However, paste adhesives have large variations in coating amount, coating shape, etc. due to their viscosity behavior and deterioration. As a result, the paste-like adhesive thickness that is formed is non-uniform,
The reliability of the bonding strength related to the semiconductor chip is poor. That is, when the application amount of the paste adhesive is insufficient, the bonding strength between the semiconductor chip and the electrode member is lowered, and the semiconductor chip is peeled off in the subsequent wire bonding process. On the other hand, when the application amount of the paste adhesive is too large, the paste adhesive is cast onto the semiconductor chip, resulting in poor characteristics, and the yield and reliability are lowered. Such a problem in the adhering process becomes particularly remarkable as the semiconductor chip becomes larger. Therefore, it is necessary to frequently control the amount of paste adhesive applied,
This hinders workability and productivity.

In this paste adhesive application step, there is a method in which the paste adhesive is separately applied to a lead frame or a formed chip. However, in this method, it is difficult to make the paste adhesive layer uniform, and a special apparatus and a long time are required for applying the paste adhesive. For this reason
There is disclosed a dicing die-bonding film that adheres and holds a semiconductor wafer in a dicing process and also provides an adhesive layer for chip fixation necessary for a mounting process (see, for example, Patent Document 1 below).

This type of dicing die-bonding film has a structure in which an adhesive layer (die-bonding film) is laminated on the dicing film. The dicing film has a structure in which an adhesive layer is laminated on a supporting substrate. This dicing die-bonding film is used as follows. That is, after the semiconductor wafer is diced while being held by the die bond film, the support base is stretched, the semiconductor chip is peeled off together with the die bond film, and these are individually collected. Further, the semiconductor chip is bonded and fixed to an adherend such as a BT substrate or a lead frame through a die bond film.

Here, since the conventional die-bonding film has a high storage elastic modulus under a die-bonding temperature (for example, 80 to 140 ° C.) during the die-bonding process, the conventional die-bonding film does not exhibit sufficient wettability with respect to the adherend and has an adhesive strength. May become smaller. As a result, there is a problem that the semiconductor chip falls off the adherend due to vibrations applied during the process or during conveyance between the processes and the curvature of the adherend.

Also, the wire bonding temperature during the wire bonding process (for example, 175 ° C.
) Since the high storage elastic modulus is exhibited even under the adhesive, the adhesive force may be insufficient. As a result, even when wire bonding is performed on a semiconductor chip bonded and fixed on a die bond film, shear deformation occurs on the bonding surface between the die bond film and the adherend due to ultrasonic vibration or heating, and wire bonding succeeds. There is a problem that the rate decreases.

Furthermore, in the molding process of sealing the semiconductor chip die-bonded to the adherend with a sealing (mold) resin, there is a problem that the semiconductor chip is washed away during the injection of the sealing resin and the yield is lowered. .

JP 60-57342 A

The present invention has been made in view of the above problems, and a thermosetting die-bonding film having both a storage elastic modulus and high adhesive force necessary for manufacturing a semiconductor device, and a dicing die bond provided with the thermosetting die-bonding film. The purpose is to provide a film.

The inventors of the present application have studied a thermosetting die-bonding film in order to solve the conventional problems. As a result, by controlling the storage elastic modulus within a predetermined numerical range, the thermosetting die-bonding film is found to exhibit good wettability and adhesiveness in each predetermined process for manufacturing a semiconductor device, The present invention has been completed.

That is, the thermosetting die-bonding film according to the present invention is a thermosetting die-bonding film used in manufacturing a semiconductor device, and includes at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler, and is 80 ° C. to 140 ° C. Storage modulus before thermosetting at 10 ° C. is 10
It is in the range of kPa to 10 MPa, and the storage elastic modulus before thermosetting at 175 ° C. is 0.1M.
It is in the range of Pa to 3 MPa.

With the above configuration, by setting the storage elastic modulus at 80 ° C. to 140 ° C. to 10 kPa to 10 MPa, the semiconductor chip is placed on the BT substrate via a thermosetting die bond film (hereinafter sometimes referred to as “die bond film”). When die-bonding to an adherend such as a lead frame or the like, the substrate exhibits sufficient wettability and prevents a decrease in adhesive strength. as a result,
It is possible to prevent the semiconductor chip from falling off the adherend due to vibrations applied during conveyance after die bonding or bending of the adherend.

Moreover, in the said structure, sufficient adhesive force can be maintained also in the case of the wire bonding with respect to a semiconductor chip by making the storage elastic modulus in 175 degreeC into 0.1 Mpa-3 Mpa. As a result, even when wire bonding is performed on a semiconductor chip bonded and fixed on a die bond film, shear deformation on the bonding surface between the die bond film and the adherend due to ultrasonic vibration or heating is prevented, and wire bonding is prevented. The success rate can be improved.

Furthermore, when the semiconductor chip die-bonded to the adherend is sealed with a sealing (mold) resin, the semiconductor chip can be prevented from being washed away during the injection of the sealing resin.

In the above configuration, the total weight of the epoxy resin and the phenol resin is X parts by weight,
The ratio X / Y when the weight of the acrylic copolymer is Y parts by weight is preferably 0.11 to 4. By setting the weight ratio X / Y of the total weight (X parts by weight) of the epoxy resin and the phenol resin and the weight of the acrylic copolymer (Y parts by weight) to 0.11 or more, 175
The storage elastic modulus at 260 ° C. after heat treatment at 1 ° C. for 1 hour can be made 0.1 MPa or more. As a result, even in a moisture-resistant solder reflow test used for reliability evaluation of semiconductor-related components, the occurrence of peeling of the die bond film can be prevented, and the reliability can be improved. On the other hand, by setting the X / Y to 4 or less, the mechanical strength of the die bond film as a film can be increased and the self-supporting property can be secured.

Moreover, in the said structure, B / (A + B) when the total weight of the said epoxy resin, a phenol resin, and an acrylic copolymer is A weight part, and the weight of a filler is B weight part,
It is preferable that it is 0.8 or less. By making the filler content 0.8 or less with respect to the total weight of the epoxy resin, phenol resin and acrylic copolymer, the storage elastic modulus is prevented from becoming too large, and wettability and adhesion to the adherend. Property can be maintained even better.

In the above configuration, the epoxy resin is an epoxy resin having an aromatic ring, the phenol resin is at least one of a phenol novolac resin, a phenol biphenyl resin, and a phenol aralkyl resin, and the acrylic copolymer is a carboxyl group. It is preferably at least one of a group-containing acrylic copolymer or an epoxy group-containing acrylic copolymer.

In the said structure, it is preferable that the average particle diameter of the said filler exists in the range of 0.005 micrometer-10 micrometers. By setting the average particle size of the filler to 0.005 μm or more, it is possible to suppress the storage elastic modulus from becoming too large and to maintain better wettability and adhesion to the adherend. On the other hand, by making the average particle size 10 μm or less, a reinforcing effect for the die bond film can be imparted and heat resistance can be improved.

Moreover, in the said structure, it is preferable that the weight average molecular weights of the said epoxy resin are in the range of 300-1500. By setting the weight average molecular weight of the epoxy resin to 300 or more, it is possible to prevent the mechanical strength, heat resistance, and moisture resistance of the die-bonded film after thermosetting from being lowered. On the other hand, by making the weight average molecular weight 1500 or less, it is possible to prevent the die-bonded film after thermosetting from becoming rigid and fragile.

Moreover, in the said structure, it is preferable that the weight average molecular weight of the said phenol resin exists in the range of 300-1500. By setting the weight average molecular weight of the phenol resin to 300 or more, sufficient toughness can be imparted to the cured product of the epoxy resin. On the other hand, by making the weight average molecular weight 1500 or less, it is possible to suppress high viscosity,
Good workability can be maintained.

Moreover, in the said structure, it is preferable that the weight average molecular weights of the said acrylic copolymer exist in the range of 100,000-1 million. By setting the weight average molecular weight of the acrylic copolymer to 100,000 or more, it is excellent in adhesion at high temperatures to the surface of an adherend such as a wiring board and the heat resistance can be improved. On the other hand, by making the weight average molecular weight 1 million or less, it can be easily dissolved in an organic solvent.

Moreover, in the said structure, it is preferable that a glass transition temperature exists in the range of 10 to 50 degreeC. By setting the glass transition temperature of the die bond film to 10 ° C. or more, it is possible to prevent the adhesive constituting the die bond film from protruding when the semiconductor chip is die bonded. On the other hand, by setting the glass transition temperature to 50 ° C. or lower, the wettability and adhesion to the adherend can be maintained better.

The dicing die-bonding film according to the present invention has a structure in which the thermosetting die-bonding film described in any one of the above is laminated on a dicing film in order to solve the above-described problems. .

The present invention has the following effects by the means described above.
That is, according to the present invention, the storage elastic modulus at 80 ° C. to 140 ° C. is 10 kPa to 10 MP.
Since the storage elastic modulus at 175 ° C. is in the range of 0.1 MPa to 3 MPa within the range of a, good wettability and adhesiveness can be exerted on adherends such as BT substrates and lead frames. . As a result, for example, when a semiconductor chip is die-bonded to an adherend via the thermosetting die-bonding film of the present invention, or when wire bonding is performed on a semiconductor chip after die bonding, the semiconductor die-bonded to the adherend Even when the chip is resin-sealed, the semiconductor chip can be continuously adhered and fixed to the adherend. That is, with the configuration of the present invention, a thermosetting die-bonding film capable of improving the yield and manufacturing a semiconductor device can be provided.

It is a cross-sectional schematic diagram which shows the dicing die-bonding film which concerns on one Embodiment of this invention. It is a cross-sectional schematic diagram which shows the other dicing die-bonding film which concerns on the said embodiment. It is a cross-sectional schematic diagram which shows the example which mounted the semiconductor chip through the die-bonding film in the said dicing die-bonding film. It is a cross-sectional schematic diagram which shows the example which mounted the semiconductor chip three-dimensionally through the die-bonding film in the said dicing die-bonding film. It is a cross-sectional schematic diagram which shows the example which mounted two semiconductor chips with the die-bonding film through the spacer using the said dicing die-bonding film.

The thermosetting die-bonding film of the present invention (hereinafter referred to as “die-bonding film”) will be described below by taking an embodiment of a dicing die-bonding film as an example. A dicing die-bonding film 10 according to the present embodiment has a structure in which a die-bonding film 3 is laminated on a dicing film (see FIG. 1). The dicing film has a structure in which an adhesive layer 2 is laminated on a substrate 1. The die bond film 3 is laminated on the adhesive layer 2 of the dicing film.

The die bond film 3 of the present invention includes at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler. 80 ° C. to 140 ° C. of the die bond film 3
The storage elastic modulus before thermosetting at ° C is in the range of 10 kPa to 10 MPa, preferably 10 kPa to 5 MPa, more preferably 10 kPa to 3 MPa. By setting the storage elastic modulus to 10 kPa or more, the mechanical strength as a film can be increased and the self-supporting property can be ensured. On the other hand, by setting the storage elastic modulus to 10 MPa or less, the wettability with respect to the adherend can be ensured and the adhesive force can be maintained. As a result, it is possible to prevent the semiconductor chip from falling off the adherend due to vibrations applied during conveyance after die bonding or the curvature of the adherend.

Further, the storage elastic modulus of the die bond film 3 before thermosetting at 175 ° C. is 0.1 MPa.
-3 MPa, preferably 0.5 kPa to 2.5 MPa, more preferably 0.
. 7 kPa to 2.3 MPa. By setting the storage elastic modulus before thermosetting at 175 ° C. within the above numerical range, it is possible to maintain a sufficient adhesive force even during wire bonding to a semiconductor chip. As a result, even when wire bonding is performed on a semiconductor chip bonded and fixed on a die bond film, shear deformation on the bonding surface between the die bond film and the adherend due to ultrasonic vibration or heating is prevented, and wire bonding is prevented. The success rate can be improved.

The glass transition temperature of the die bond film 3 is preferably 10 ° C to 50 ° C,
More preferably, the temperature is 20 ° C to 45 ° C. By setting the glass transition temperature to 10 ° C. or higher, it is possible to prevent the adhesive constituting the die bond film from protruding when the semiconductor chip is die bonded. On the other hand, by setting the glass transition temperature to 50 ° C. or lower, the wettability and adhesion to the adherend can be maintained better.

Further, when the total weight of the epoxy resin and the phenol resin is X parts by weight and the weight of the acrylic copolymer is Y parts by weight, the blending ratio X / Y (−) is preferably 0.11 to 4, and 0
. 11-1.5 are more preferable, 0.11-1.4 are still more preferable, 0.11-1 are especially preferable, and 0.11-0.5 are still more preferable. By setting the blending ratio X / Y to 0.11 or more, the storage elastic modulus at 260 ° C. after performing heat treatment at 175 ° C. for 1 hour is 0.1M.
It can be set to Pa or more, and the occurrence of peeling of the die-bonding film 3 can be prevented even in the moisture-resistant solder reflow test, and the reliability can be improved. On the other hand, by setting the blending ratio to 4 or less, the mechanical strength of the die bond film 3 as a film can be increased, and the self-supporting property can be secured.

The epoxy resin is not particularly limited as long as it is generally used as an adhesive composition, for example, bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type. , Biphenyl type, naphthalene type, fluorene type, phenol novolak type, orthocresol novolak type,
A bifunctional epoxy resin such as trishydroxyphenylmethane type or tetraphenylolethane type or a polyfunctional epoxy resin, or an epoxy resin such as hydantoin type, trisglycidyl isocyanurate type or glycidylamine type is used. These can be used alone or in combination of two or more. Among these epoxy resins, in the present invention, an epoxy resin having an aromatic ring such as a benzene ring, a biphenyl ring, and a naphthalene ring is particularly preferable. Specifically, for example, novolak type epoxy resin, xylylene skeleton-containing phenol novolak type epoxy resin, biphenyl skeleton containing novolak type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, tetramethylbiphenol type epoxy resin, triphenyl Examples include methane type epoxy resins. This is because these epoxy resins are rich in reactivity with a phenol resin as a curing agent and are excellent in heat resistance and the like. The epoxy resin contains little ionic impurities that corrode semiconductor elements.

The weight average molecular weight of the epoxy resin is preferably in the range of 300 to 1500, and more preferably in the range of 350 to 1000. When the weight average molecular weight is less than 300, the mechanical strength, heat resistance, and moisture resistance of the die-bonding film 3 after thermosetting may be lowered. On the other hand, if it is larger than 1500, the die-bonded film after thermosetting may become rigid and brittle. In addition, the weight average molecular weight in this invention means the polystyrene conversion value using the calibration curve by a standard polystyrene by the gel permeation chromatography method (GPC).

Furthermore, the phenol resin acts as a curing agent for the epoxy resin,
For example, phenol novolak resin, phenol biphenyl resin, phenol aralkyl resin, cresol novolak resin, tert-butylphenol novolak resin, novolak type phenol resin such as nonylphenol novolak resin, resol type phenol resin, polyoxystyrene such as polyparaoxystyrene, etc. It is done. These can be used alone or in combination of two or more. Of these phenol resins, biphenyl type phenol novolac resins and phenol aralkyl resins represented by the following chemical formula are preferred. This is because the connection reliability of the semiconductor device can be improved.

The n is preferably a natural number of 0 to 10, and more preferably a natural number of 0 to 5. By making it within the numerical range, the fluidity of the die bond film 3 can be ensured.

The weight average molecular weight of the phenol resin is preferably in the range of 300 to 1500, and more preferably in the range of 350 to 1000. When the weight average molecular weight is less than 300, the epoxy resin is not sufficiently cured by heat and sufficient toughness may not be obtained. On the other hand, when the weight average molecular weight is larger than 1500, the viscosity becomes high, and workability at the time of producing the die bond film may be lowered.

The mixing ratio of the epoxy resin and the phenol resin is preferably such that, for example, the hydroxyl group in the phenol resin is 0.5 to 2.0 equivalents per equivalent of epoxy group in the epoxy resin component. More preferred is 0.8 to 1.2 equivalents. That is, if the blending ratio of both is out of the above range, sufficient curing reaction does not proceed and the properties of the cured epoxy resin are likely to deteriorate.

The acrylic copolymer is not particularly limited, but in the present invention, a carboxyl group-containing acrylic copolymer and an epoxy group-containing acrylic copolymer are preferable. Examples of the functional group monomer used in the carboxyl group-containing acrylic copolymer include acrylic acid and methacrylic acid. The content of acrylic acid or methacrylic acid is adjusted so that the acid value is in the range of 1-4. The balance is 1 to 8 carbon atoms such as methyl acrylate and methyl methacrylate.
A mixture of alkyl acrylate, alkyl methacrylate, styrene, acrylonitrile, or the like having an alkyl group can be used. Among these, ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferable. The mixing ratio is preferably adjusted in consideration of the glass transition point (Tg) of the acrylic copolymer described later. Further, the polymerization method is not particularly limited, and for example, solution polymerization method, cage polymerization method, suspension polymerization method,
A conventionally known method such as an emulsion polymerization method can be employed.

Moreover, it does not specifically limit as another monomer component copolymerizable with the said monomer component, For example, an acrylonitrile etc. are mentioned. The amount of these copolymerizable monomer components used is
It is preferably in the range of 1 to 20% by weight with respect to the total monomer components. By incorporating other monomer components within the numerical range, modification of cohesive force, adhesiveness, etc. can be achieved.

The polymerization method of the acrylic copolymer is not particularly limited, and conventionally known methods such as a solution polymerization method, a cage polymerization method, a suspension polymerization method, and an emulsion polymerization method can be employed.

The glass transition point (Tg) of the acrylic copolymer is preferably -30 to 30 ° C, and more preferably -20 to 15 ° C. Heat resistance can be ensured by setting the glass transition point to -30 ° C or higher. On the other hand, when the temperature is 30 ° C. or less, the effect of preventing chip jump after dicing in a wafer having a rough surface state is improved.

The acrylic copolymer preferably has a weight average molecular weight of 100,000 to 1,000,000,
More preferably, it is 350,000 to 900,000. By setting the weight average molecular weight to 100,000 or more, it is excellent in adhesiveness at high temperature to the adherend surface, and heat resistance can also be improved. On the other hand, by making the weight average molecular weight 1 million or less, it can be easily dissolved in an organic solvent.

Examples of the filler include inorganic fillers and organic fillers. Inorganic fillers are preferred from the standpoints of improving handleability and thermal conductivity, adjusting melt viscosity, and imparting thixotropic properties.

The inorganic filler is not particularly limited, for example, silica, aluminum hydroxide, calcium hydroxide, magnesium hydroxide, antimony trioxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide,
Examples thereof include aluminum oxide, aluminum nitride, aluminum borate, boron nitride, crystalline silica, and amorphous silica. These can be used alone or in combination of two or more. From the viewpoint of improving thermal conductivity, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, amorphous silica and the like are preferable. Further, from the viewpoint of balance with the adhesiveness of the die bond film 3, silica is preferable. Examples of the organic filler include polyimide, polyamideimide, polyetheretherketone, polyetherimide, polyesterimide, nylon, and silicone. These can be used alone or in combination of two or more.

The average particle diameter of the filler is preferably 0.005 to 10 μm, and more preferably 0.05 to 1 μm. When the average particle size of the filler is 0.005 μm or more, the wettability with respect to the adherend can be improved, and a decrease in adhesiveness can be suppressed. On the other hand, the average particle size is 1
By making it 0 μm or less, the reinforcing effect on the die-bonding film 3 due to the addition of the filler can be enhanced, and the heat resistance can be improved. In addition, you may use it combining the fillers from which an average particle diameter differs mutually. The average particle size of the filler is, for example, a photometric particle size distribution meter (H
This is a value obtained from ORIBA, apparatus name: LA-910).

The shape of the filler is not particularly limited, and for example, a spherical or ellipsoidal shape can be used.

Further, when the total weight of the epoxy, phenol resin and acrylic copolymer is A parts by weight and the weight of the filler is B parts by weight, the ratio B / (A + B) is more than 0 and 0.8 or less. Is preferable, and it is more preferable that it is more than 0 and 7 or less. When the ratio is 0, there is no reinforcing effect due to the filler addition, and the heat resistance of the die bond film 3 tends to decrease. On the other hand, when the ratio exceeds 0.8, wettability and adhesion to the adherend may be deteriorated.

Moreover, another additive can be suitably mix | blended with die-bonding film 3, 3 'as needed. Examples of other additives include flame retardants, silane coupling agents, ion trapping agents, and the like.

Examples of the flame retardant include antimony trioxide, antimony pentoxide, brominated epoxy resin, and the like. These can be used alone or in combination of two or more.

Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and the like. These compounds can be used alone or in combination of two or more.

Examples of the ion trapping agent include hydrotalcites and bismuth hydroxide. These can be used alone or in combination of two or more.

The thermosetting acceleration catalyst for the epoxy resin and the phenol resin is not particularly limited, and for example, a salt composed of any one of a triphenylphosphine skeleton, an amine skeleton, a triphenylborane skeleton, a trihalogenborane skeleton, and the like is preferable.

Although the thickness (in the case of a laminated body) of the die-bonding film 3 is not specifically limited, For example, it is about 5-100 micrometers, Preferably it is about 5-50 micrometers.

In addition, a die-bonding film can be made into the structure which consists only of a single layer of an adhesive bond layer, for example. Alternatively, a thermoplastic resin having a different glass transition temperature and a thermosetting resin having a different thermosetting temperature may be appropriately combined to form a multilayer structure having two or more layers. In addition, since cutting water is used in the dicing process of the semiconductor wafer, the die-bonding film may absorb moisture and have a moisture content higher than that of the normal state. When bonded to a substrate or the like with such a high water content, water vapor may accumulate at the bonding interface at the stage of after-curing and float may occur. Therefore, the die bond film has a structure in which a core material having high moisture permeability is sandwiched between adhesive layers, so that water vapor diffuses through the film at the after-curing stage, and this problem can be avoided. . From this viewpoint, the die bond film may have a multilayer structure in which an adhesive layer is formed on one side or both sides of the core material.

Examples of the core material include films (for example, polyimide films, polyester films, polyethylene terephthalate films, polyethylene naphthalate films, polycarbonate films), resin substrates reinforced with glass fibers and plastic non-woven fibers, mirror silicon wafers, silicon substrates Or a glass substrate etc. are mentioned.

The die bond film 3 is preferably protected by a separator (not shown). The separator has a function as a protective material for protecting the die bond film until it is put into practical use. Further, the separator can be used as a support base material when transferring the die bond films 3, 3 ′ to the dicing film. The separator is peeled off when the workpiece is stuck on the die bond film. As the separator, a plastic film or paper surface-coated with a release agent such as polyethylene terephthalate (PET), polyethylene, polypropylene, a fluorine release agent, or a long-chain alkyl acrylate release agent can be used.

As the dicing die bond film according to the present invention, in addition to the die bond film 3 shown in FIG. 1, as shown in FIG.
The dicing die-bonding film 11 may be configured by stacking '.

The substrate 1 serves as a strength matrix for the dicing die-bonding films 10 and 11. For example, polyolefins such as low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolyprolene, polybutene, polymethylpentene,
Ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-
Butene copolymer, ethylene-hexene copolymer, polyester such as polyurethane, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyimide, polyetherimide, polyamide, wholly aromatic polyamide, polyphenylsulfide , Aramid (paper), glass, glass cloth, fluororesin, polyvinyl chloride, polyvinylidene chloride, cellulosic resin, silicone resin, metal (
Foil) and paper. When the pressure-sensitive adhesive layer 2 is an ultraviolet curable type, the substrate 1 is preferably one that is permeable to ultraviolet rays.

Moreover, as a material of the base material 1, polymers, such as the crosslinked body of the said resin, are mentioned. The plastic film may be used unstretched or may be uniaxially or biaxially stretched as necessary. According to the resin sheet to which heat shrinkability is imparted by stretching treatment or the like, the pressure-sensitive adhesive layer 2 and the die bond films 3, 3 are obtained by heat shrinking the base material 1 after dicing.
It is possible to facilitate the recovery of the semiconductor chip by reducing the bonding area with “.

The surface of the substrate 1 is chemically treated by conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, etc. in order to improve adhesion and retention with adjacent layers. Alternatively, a physical treatment or a coating treatment with a primer (for example, an adhesive substance described later) can be performed.

The base material 1 can be used by appropriately selecting the same kind or different kinds, and a blend of several kinds can be used as necessary. Moreover, in order to give the base material 1 antistatic ability, the thickness which consists of a metal, an alloy, these oxides, etc. on the said base material 1 is 30-500 mm.
A vapor deposition layer of a conductive material can be provided. The substrate 1 may be a single layer or two or more layers.

The thickness of the substrate 1 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm.

The pressure-sensitive adhesive layer 2 includes an ultraviolet curable pressure-sensitive adhesive. UV curable adhesive
The degree of crosslinking can be increased by irradiation with ultraviolet rays, and the adhesive strength can be easily reduced.
By irradiating only the part 2a corresponding to the semiconductor wafer attachment part of the pressure-sensitive adhesive layer 2 shown in FIG. 2A, it is possible to provide a difference in adhesive strength with the other part 2b.

Further, by curing the ultraviolet curable pressure-sensitive adhesive layer 2 in accordance with the die-bonding film 3 ′ shown in FIG. 2, the portion 2a in which the adhesive strength is remarkably reduced can be easily formed. Cured,
Since the die-bonding film 3 ′ is pasted on the portion 2 a having reduced adhesive strength, the adhesive layer 2
The interface between the portion 2a and the die-bonding film 3 ′ has a property of easily peeling off during pick-up. On the other hand, the portion not irradiated with ultraviolet rays has a sufficient adhesive force, and forms the portion 2b.

As described above, in the pressure-sensitive adhesive layer 2 of the dicing die-bonding film 10 shown in FIG.
The said part 2b currently formed with the uncured ultraviolet curing adhesive is the die-bonding film 3
It is possible to secure a holding force when dicing. Thus, the ultraviolet curable pressure-sensitive adhesive can support the die bond film 3 for fixing the semiconductor chip to the adherend with a good balance of adhesion and peeling. In the pressure-sensitive adhesive layer 2 of the dicing die bond film 11 shown in FIG. 2, the portion 2 b can fix the wafer ring 16. The adherend 6 is not particularly limited. For example, various substrates such as a BGA substrate, a lead frame, a semiconductor element,
A spacer etc. are mentioned.

As the ultraviolet curable pressure-sensitive adhesive, those having an ultraviolet curable functional group such as a carbon-carbon double bond and exhibiting adhesiveness can be used without particular limitation. Examples of the ultraviolet curable pressure-sensitive adhesive include an additive-type ultraviolet curable pressure-sensitive adhesive in which an ultraviolet curable monomer component or an oligomer component is blended with a general pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive. Can be illustrated.

The pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive based on an acrylic polymer from the standpoint of cleanability with an organic solvent such as ultrapure water or alcohol for electronic components that are difficult to contaminate semiconductor wafers and glass. Is preferred.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester , Octadecyl esters, eicosyl esters, etc., alkyl groups having 1 to 30 carbon atoms, especially 4 to 18 carbon linear or branched alkyl esters, etc.) and Meth) acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymers such as one or more was used as a monomer component of the cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. You may go out. As such a monomer component, for example,
Carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid and crotonic acid; acid anhydrides such as maleic anhydride and itaconic anhydride Monomer; (Meta)
2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) 10-hydroxydecyl acrylate,
Hydroxyl group-containing monomers such as (meth) acrylic acid 12-hydroxylauryl, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; styrene sulfonic acid,
Sulfonic acid group-containing monomers such as allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalenesulfonic acid; 2 -Phosphoric acid group-containing monomers such as hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be obtained by subjecting a single monomer or a mixture of two or more monomers to polymerization. The polymerization can be performed by any method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like. From the viewpoint of preventing contamination of a clean adherend, the content of the low molecular weight substance is preferably small. From this point, the number average molecular weight of the acrylic polymer is preferably 30.
It is about 10,000 or more, more preferably about 400,000 to 3 million.

In addition, an external cross-linking agent can be appropriately employed for the pressure-sensitive adhesive in order to increase the number average molecular weight of an acrylic polymer as a base polymer. Specific examples of the external crosslinking method include a method of adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them. When using an external crosslinking agent:
The amount to be used is appropriately determined depending on the balance with the base polymer to be crosslinked and further depending on the intended use as an adhesive. Generally, it is preferable to add about 5 parts by weight or less, and further 0.1 to 5 parts by weight with respect to 100 parts by weight of the base polymer. Furthermore, you may use additives, such as conventionally well-known various tackifier and anti-aging agent, other than the said component as needed to an adhesive.

Examples of the ultraviolet curable monomer component to be blended include urethane oligomer, urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and penta. Examples include erythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, and the like. Examples of the ultraviolet curable oligomer component include various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and the molecular weight is 100 to 300.
A value in the range of about 00 is appropriate. The blending amount of the ultraviolet curable monomer component and oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer, and the amount capable of reducing the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer. Generally, the amount is, for example, about 5 to 500 parts by weight, preferably about 40 to 150 parts by weight with respect to 100 parts by weight of the base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

In addition to the additive-type UV-curable pressure-sensitive adhesive described above, the UV-curable pressure-sensitive adhesive has a carbon-carbon double bond in the polymer side chain, main chain, or main chain terminal as a base polymer. Intrinsic ultraviolet curable pressure sensitive adhesives using Intrinsic UV curable pressure-sensitive adhesive does not need to contain an oligomer component or the like, which is a low molecular weight component, or does not contain much, so that the oligomer component or the like does not move through the pressure-sensitive adhesive over time and is stable. It is preferable because an adhesive layer having a layer structure can be formed.

As the base polymer having a carbon-carbon double bond, those having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, those having an acrylic polymer as a basic skeleton are preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

The method for introducing a carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, it is easy in molecular design to introduce a carbon-carbon double bond into a polymer side chain. . For example, after a monomer having a functional group is previously copolymerized with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into an ultraviolet curable carbon-carbon double bond. A method of performing condensation or addition reaction while maintaining the above.

Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups, and the like. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction. Moreover, the functional group may be on either side of the acrylic polymer and the compound as long as the acrylic polymer having the carbon-carbon double bond is generated by a combination of these functional groups. In the preferable combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. Further, as the acrylic polymer, those obtained by copolymerizing the above-exemplified hydroxy group-containing monomers, ether compounds of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like are used.

As the intrinsic ultraviolet curable pressure-sensitive adhesive, the base polymer (particularly acrylic polymer) having the carbon-carbon double bond can be used alone, but the ultraviolet curable monomer does not deteriorate the characteristics. Components and oligomer components can also be blended. The UV-curable oligomer component or the like is usually in the range of 30 parts by weight, preferably in the range of 0 to 10 parts by weight with respect to 100 parts by weight of the base polymer.

The ultraviolet curable pressure-sensitive adhesive contains a photopolymerization initiator when cured by ultraviolet rays or the like. Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2
-Hydroxy-2-propyl) ketone, α-hydroxy-α, α′-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, 1-hydroxycyclohexyl phenyl ketone and other α-ketol compounds; methoxyacetophenone, 2 , 2-Dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-
Acetophenone compounds such as [4- (methylthio) -phenyl] -2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; ketal compounds such as benzyldimethyl ketal; Aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; 1
-Photoactive oxime compounds such as phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime; benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4
Benzophenone compounds such as methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4 -Thioxanthone compounds such as diethylthioxanthone and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketone; acyl phosphinoxide; acyl phosphonate and the like. The compounding quantity of a photoinitiator is about 0.05-20 weight part with respect to 100 weight part of base polymers, such as an acryl-type polymer which comprises an adhesive.

Examples of the ultraviolet curable pressure-sensitive adhesive include photopolymerizable compounds such as addition polymerizable compounds having two or more unsaturated bonds and alkoxysilanes having an epoxy group disclosed in JP-A-60-196956. And a rubber-based pressure-sensitive adhesive and an acrylic pressure-sensitive adhesive containing a photopolymerization initiator such as a carbonyl compound, an organic sulfur compound, a peroxide, an amine, and an onium salt-based compound.

Examples of the method for forming the portion 2a on the pressure-sensitive adhesive layer 2 include a method in which after the ultraviolet curable pressure-sensitive adhesive layer 2 is formed on the substrate 1, the portion 2a is partially irradiated with ultraviolet rays to be cured. . The partial ultraviolet irradiation can be performed through a photomask on which a pattern corresponding to the portion 3b other than the semiconductor wafer bonding portion 3a is formed. Moreover, the method etc. of irradiating and hardening | curing an ultraviolet-ray spotly are mentioned. The ultraviolet curable pressure-sensitive adhesive layer 2 can be formed by transferring what is provided on the separator onto the substrate 1. Partial UV curing can also be performed on the UV curable pressure-sensitive adhesive layer 2 provided on the separator.

In the pressure-sensitive adhesive layer 2 of the dicing die-bonding film 10, a part of the pressure-sensitive adhesive layer 2 may be irradiated with ultraviolet rays so that the adhesive strength of the portion 2a <the adhesive strength of the other portion 2b.
That is, after forming the ultraviolet-curing pressure-sensitive adhesive layer 2 on the substrate 1, at least one side of the substrate 1 is shielded from all or part of the portion other than the portion corresponding to the semiconductor wafer pasting portion 3 a. By irradiating with ultraviolet rays, the portion corresponding to the semiconductor wafer pasting portion 3a can be cured to form the portion 2a with reduced adhesive strength. As the light shielding material, a material that can be a photomask on a support film can be produced by printing or vapor deposition. This
The dicing die-bonding film 10 of the present invention can be manufactured efficiently.

In the case where curing inhibition by oxygen occurs during ultraviolet irradiation, it is desirable to block oxygen (air) from the surface of the ultraviolet curable pressure-sensitive adhesive layer 2. Examples of the method include a method of coating the surface of the pressure-sensitive adhesive layer 2 with a separator, and a method of irradiating ultraviolet rays such as ultraviolet rays in a nitrogen gas atmosphere.

The thickness of the pressure-sensitive adhesive layer 2 is not particularly limited, but is preferably about 1 to 50 μm from the viewpoint of preventing chipping of the chip cut surface and compatibility of fixing and holding the adhesive layer. Preferably 2-30μ
m, more preferably 5 to 25 μm.

(Method for manufacturing semiconductor device)
Next, a method for manufacturing a semiconductor device using the dicing die bond film 10 according to the present embodiment will be described below.

First, as shown in FIG. 1, the semiconductor wafer 4 is pressure-bonded onto the semiconductor wafer attaching portion 3a of the adhesive layer 3 in the dicing die-bonding film 10, and this is adhered and held and fixed (mounting step). This step is performed while pressing with a pressing means such as a pressure roll.

Next, dicing of the semiconductor wafer 4 is performed. Thereby, the semiconductor wafer 4 is cut into a predetermined size and separated into individual pieces, and the semiconductor chip 5 is manufactured. Dicing is performed according to a conventional method from the circuit surface side of the semiconductor wafer 4, for example. Further, in this step, for example, a cutting method called full cut in which cutting is performed up to the dicing die bond film 10 can be adopted. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used. Further, since the semiconductor wafer is bonded and fixed by the dicing die-bonding film 10, chip chipping and chip jumping can be suppressed, and damage to the semiconductor wafer 4 can also be suppressed.

In order to peel off the semiconductor chip adhered and fixed to the dicing die bond film 10,
The semiconductor chip 5 is picked up. The pickup method is not particularly limited, and various conventionally known methods can be employed. For example, a method of pushing up the individual semiconductor chips 5 from the dicing die bond film 10 side with a needle and picking up the pushed-up semiconductor chips 5 with a pickup device may be mentioned.

Here, when the pressure-sensitive adhesive layer 2 is an ultraviolet curable type, the pickup is performed after the pressure-sensitive adhesive layer 2 is irradiated with ultraviolet rays. Thereby, the adhesive force with respect to the adhesive layer 3a of the adhesive layer 2 falls, and peeling of the semiconductor chip 5 becomes easy. As a result, the pickup can be performed without damaging the semiconductor chip. Conditions such as irradiation intensity and irradiation time at the time of ultraviolet irradiation are not particularly limited, and may be set as necessary. Moreover, the above-mentioned thing can be used as a light source used for ultraviolet irradiation.

Next, as shown in FIG. 3, the semiconductor chip 5 formed by dicing is die-bonded to the adherend 6 through the die-bonding film 3a. Die bonding is performed by pressure bonding. The conditions for die bonding are not particularly limited, and can be set as necessary. Specifically, for example, it can be performed within a die bonding temperature of 80 to 160 ° C., a bonding pressure of 5 N to 15 N, and a bonding time of 1 to 10 seconds.

Subsequently, the die-bonding film 3a is heat-treated to be thermally cured, and the semiconductor chip 5 and the adherend 6 are bonded. As the heat treatment conditions, the temperature is in the range of 80 to 180 ° C., and the heating time is 0.1 to 24 hours, preferably 0.1 to 4 hours, more preferably 0.1 to 1 hour. Preferably there is.

Next, the tip of the terminal portion (inner lead) of the adherend 6 and the electrode pad (on the semiconductor chip 5)
A wire bonding process is performed in which the bonding wire 7 is electrically connected to the wire (not shown). As the bonding wire 7, for example, a gold wire, an aluminum wire, a copper wire or the like is used. The temperature during wire bonding is 80 to 250 ° C., preferably 8
It is performed within the range of 0 to 220 ° C. The heating time is several seconds to several minutes. The connection is performed by a combination of vibration energy by ultrasonic waves and pressure energy by pressurization while being heated so as to be within the temperature range.

Here, it is preferable that the die-bonding film 3a after thermosetting has a shear adhesive force of 0.01 MPa or more at 175 ° C., and more preferably 0.01 to 5 MPa. By setting the shear adhesive force at 175 ° C. after thermosetting to 0.01 MPa or more, due to ultrasonic vibration or heating in the wire bonding step, the die bond film 3a and the semiconductor chip 5 or the adherend 6 It is possible to prevent shear deformation from occurring on the bonding surface. That is, the semiconductor element does not move due to ultrasonic vibration during wire bonding, thereby preventing the success rate of wire bonding from decreasing.

In addition, you may perform a wire bonding process, without thermosetting the die-bonding film 3 by heat processing. In this case, the shear bond strength of the die bond film 3a at 25 ° C. is preferably 0.2 MPa or more, more preferably 0.2 to 10 MPa, with respect to the adherend 6. Even if the wire bonding step is performed without thermosetting the die bond film 3a by setting the shear adhesive force to 0.2 MPa or more, the die bond film 3a and the semiconductor chip 5 are caused by ultrasonic vibration or heating in the step. Alternatively, shear deformation does not occur on the adhesion surface with the adherend 6. That is, the semiconductor element does not move due to ultrasonic vibration during wire bonding, thereby preventing the success rate of wire bonding from decreasing.

Further, the uncured die bond film 3a is not completely thermally cured even if the wire bonding process is performed. Furthermore, the shear bond strength of the die bond film 3a is 80 to 250.
Even within the temperature range of ° C., it is necessary to be 0.2 MPa or more. This is because if the shear adhesive force is less than 0.2 MPa within the temperature range, the semiconductor element moves due to ultrasonic vibration during wire bonding, and wire bonding cannot be performed, resulting in a decrease in yield.

Subsequently, a sealing step for sealing the semiconductor chip 5 with the sealing resin 8 is performed. This step is performed to protect the semiconductor chip 5 and the bonding wire 7 mounted on the adherend 6. This step is performed by molding a sealing resin with a mold. As the sealing resin 8, for example, an epoxy resin is used. Although the heating temperature at the time of resin sealing is normally performed at 175 degreeC for 60 to 90 second, this invention is not limited to this, For example, it can cure at 165 to 185 degreeC for several minutes. As a result, the sealing resin is cured, and when the die bond film 3a is not thermally cured, the die bond film 3a is also thermally cured. That is, in the present invention, even when the post-curing process described later is not performed, the die-bonding film 3a can be thermally cured and bonded in this process, and the number of manufacturing processes is reduced. And it can contribute to shortening of the manufacturing period of a semiconductor device.

In the post-curing step, the sealing resin 8 that is insufficiently cured in the sealing step is completely cured. Even in the case where the die bond film 3a is not thermally cured in the sealing process, the die bond film 3a is thermally cured together with the curing of the sealing resin 8 in this process, thereby allowing the adhesive fixing.
Although the heating temperature in this process changes with kinds of sealing resin, it exists in the range of 165-185 degreeC, for example, and heating time is about 0.5 to 8 hours.

Further, as shown in FIG. 4, the dicing die-bonding film of the present invention can also be suitably used when a plurality of semiconductor chips are stacked and three-dimensionally mounted. FIG. 4 is a schematic cross-sectional view showing an example in which a semiconductor chip is three-dimensionally mounted through a die bond film. In the case of the three-dimensional mounting shown in FIG. 4, first, at least one cut out so as to be the same size as the semiconductor chip.
After the two die-bonding films 3a are attached on the adherend 6, the semiconductor chip 5 is die-bonded through the die-bonding film 3a so that the wire-bonding surface is on the upper side. Next, the die bond film 13 is pasted while avoiding the electrode pad portion of the semiconductor chip 5. Further, another semiconductor chip 15 is die-bonded on the die-bonding film 13 so that the wire-bonding surface is on the upper side. Thereafter, the die bond films 3a and 13 are heated to be thermoset and bonded and fixed, thereby improving the heat resistance strength. As for the heating conditions, it is preferable that the temperature is in the range of 80 to 200 ° C. and the heating time is in the range of 0.1 to 24 hours, as described above.

In the present invention, the die bond films 3a and 13 may be simply die bonded without being thermally cured. Thereafter, wire bonding is performed without passing through a heating step, and the semiconductor chip is further sealed with a sealing resin, and the sealing resin can be after-cured.

Next, a wire bonding process is performed. Thereby, each electrode pad in the semiconductor chip 5 and the other semiconductor chip 15 and the adherend 6 are electrically connected by the bonding wire 7. In addition, this process is implemented without passing through the heating process of die-bonding films 3a and 13.

Subsequently, a sealing process for sealing the semiconductor chip 5 and the like with the sealing resin 8 is performed, and the sealing resin is cured. At the same time, when the thermosetting is not performed, the adherend 6 and the semiconductor chip 5 are bonded and fixed by the thermosetting of the die bond film 3a. Die bond film 1
3, the semiconductor chip 5 and another semiconductor chip 15 are also bonded and fixed. In addition, you may perform a postcure process after a sealing process.

Even in the case of three-dimensional mounting of semiconductor chips, since the heat treatment by heating the die bond films 3a and 13 is not performed, the manufacturing process can be simplified and the yield can be improved. In addition, since the adherend 6 is not warped, and the semiconductor chip 5 and other semiconductor chips 15 are not cracked, the semiconductor element can be made thinner.

Moreover, as shown in FIG. 5, it is good also as three-dimensional mounting which laminated | stacked the spacer via the die-bonding film between the semiconductor chips. FIG. 5 is a schematic cross-sectional view showing an example in which two semiconductor chips are three-dimensionally mounted with a die bond film via a spacer.

In the case of the three-dimensional mounting shown in FIG. 5, first, the die bond film 3, the semiconductor chip 5, and the die bond film 21 are sequentially laminated on the adherend 6 and die bonded. Furthermore, on the die bond film 21, the spacer 9, the die bond film 21, the die bond film 3a, and the semiconductor chip 5 are sequentially laminated and die bonded. Thereafter, the die bond films 3a and 21 are heated to be thermoset and bonded and fixed, thereby improving the heat resistance strength. As for the heating conditions, it is preferable that the temperature is in the range of 80 to 200 ° C. and the heating time is in the range of 0.1 to 24 hours, as described above.

In the present invention, the die bond films 3a and 21 may be simply die bonded without being thermally cured. Thereafter, wire bonding is performed without passing through a heating step, and the semiconductor chip is further sealed with a sealing resin, and the sealing resin can be after-cured.

Next, as shown in FIG. 5, a wire bonding process is performed. Thereby, the electrode pad in the semiconductor chip 5 and the adherend 6 are electrically connected by the bonding wire 7. In addition, this process is implemented without passing through the heating process of die-bonding films 3a and 21.

Subsequently, a sealing step of sealing the semiconductor chip 5 with the sealing resin 8 is performed, and the sealing resin 8 is cured, and when the die bond films 3a and 21 are uncured, by thermosetting these, Adhesive fixing is performed between the adherend 6 and the semiconductor chip 5 and between the semiconductor chip 5 and the spacer 9. Thereby, a semiconductor package is obtained. The sealing process is preferably a batch sealing method in which only the semiconductor chip 5 side is sealed on one side. Sealing is performed to protect the semiconductor chip 5 attached on the pressure-sensitive adhesive sheet, and the typical method is molding in a mold using the sealing resin 8. In that case, it is common to perform a sealing process simultaneously using the metal mold | die which consists of an upper metal mold | die and a lower metal mold | die which have a some cavity. The heating temperature during resin sealing is
For example, it is preferably within a range of 170 to 180 ° C. A post-curing step may be performed after the sealing step.

The spacer 9 is not particularly limited, and for example, a conventionally known silicon chip or polyimide film can be used. A core material can be used as the spacer. It does not specifically limit as a core material, A conventionally well-known thing can be used. Specifically, a film (for example, a polyimide film, a polyester film, a polyethylene terephthalate film, a polyethylene naphthalate film, a polycarbonate film, etc.), a resin substrate reinforced with glass fibers or plastic non-woven fibers, a mirror silicon wafer, a silicon substrate or A glass adherend can be used.

(Other matters)
When a semiconductor element is three-dimensionally mounted on the adherend, a buffer coat film is formed on the surface side where the circuit of the semiconductor element is formed. Examples of the buffer coat film include those made of a heat resistant resin such as a silicon nitride film or a polyimide resin.

Moreover, the die-bonding film used at each stage when the semiconductor element is three-dimensionally mounted is not limited to the one having the same composition, and can be appropriately changed according to the manufacturing conditions and applications.

Further, in the above-described embodiment, the mode in which the wire bonding process is performed collectively after laminating a plurality of semiconductor elements on the adherend has been described, but the present invention is not limited to this. . For example, it is possible to perform a wire bonding process every time a semiconductor element is stacked on an adherend.

Hereinafter, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in the examples are not intended to limit the scope of the present invention only to them, but are merely illustrative examples, unless otherwise specified. The term “parts” means parts by weight.

Example 1
Acrylic acid ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase ChemteX Corporation, Teisan Resin SG-7
08-6, 100 parts by weight average molecular weight), epoxy resin (manufactured by JER Corporation)
Epicoat 834, weight average molecular weight 470) 6.25 parts, phenol resin (Arakawa Chemical Co., Ltd., Tamanol 100S, weight average molecular weight 900) 12.5 parts, average particle size 500 nm spherical silica (manufactured by Admatechs Co., Ltd.) , SO-25R) was dissolved in methyl ethyl ketone to prepare an adhesive composition having a concentration of 20.7% by weight.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thus, a thermosetting die bond film A having a thickness of 40 μm was produced.

(Example 2)
Acrylic acid ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase ChemteX Corporation, Teisan Resin SG-7
08-6, 100 parts by weight average molecular weight), epoxy resin (manufactured by JER Corporation)
Epicoat 834, weight average molecular weight 470) 12.5 parts, phenol resin (Arakawa Chemical Co., Ltd., Tamanol 100S, weight average molecular weight 900) 12.5 parts, average particle diameter 500 nm spherical silica (manufactured by Admatechs Co., Ltd.) , SO-25R) was dissolved in methyl ethyl ketone to prepare an adhesive composition having a concentration of 21.5% by weight.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thus, a thermosetting die bond film B having a thickness of 40 μm was produced.

(Example 3)
Acrylic acid ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase ChemteX Corporation, Teisan Resin SG-7
08-6, 100 parts by weight average molecular weight), epoxy resin (manufactured by JER Corporation)
Epicoat 834, 7 parts by weight average molecular weight 470), phenol resin (Arakawa Chemical Co., Ltd.)
7 parts of Tamanol 100S, weight average molecular weight 900), and 85 parts of spherical silica (manufactured by Admatechs Co., Ltd., SO-25R) having an average particle diameter of 500 nm are dissolved in methyl ethyl ketone to give a concentration of 2
A 0.5 wt% adhesive composition was prepared.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thus, a thermosetting die bond film C having a thickness of 40 μm was produced.

Example 4
Acrylic acid ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase ChemteX Corporation, Teisan Resin SG-7
08-6, 100 parts by weight average molecular weight), epoxy resin (manufactured by JER Corporation)
Epicoat 834, 85 parts by weight average molecular weight 470), 47 parts phenol resin (Arakawa Chemical Co., Ltd., Tamanol 100S, weight average molecular weight 900), spherical silica with an average particle size of 500 nm (manufactured by Admatechs Co., Ltd., SO-25R) ) 232 parts are dissolved in methyl ethyl ketone,
An adhesive composition having a concentration of 21.0% by weight was prepared.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thereby, a thermosetting die-bonding film D having a thickness of 40 μm was produced.

(Example 5)
Acrylic acid ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase ChemteX Corporation, Teisan Resin SG-7
08-6, 100 parts by weight average molecular weight), epoxy resin (manufactured by JER Corporation)
Epicoat 834, 43 parts by weight average molecular weight 470), 23 parts by phenol resin (Arakawa Chemical Co., Ltd., Tamanol 100S, weight average molecular weight 900), spherical silica with an average particle size of 500 nm (manufactured by Admatechs Co., Ltd., SO-25R) ) 588 parts are dissolved in methyl ethyl ketone,
An adhesive composition having a concentration of 21.0% by weight was prepared.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thereby, a thermosetting die-bonding film D having a thickness of 40 μm was produced.

(Comparative Example 1)
In this comparative example 1, the thermosetting die-bonding film D which concerns on this comparative example 1 was produced like the example 1 except having changed the content of spherical silica into 1125 parts.

(Comparative Example 2)
Epoxy resin 1 with respect to 100 parts of an acrylic ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (Negami Kogyo Co., Ltd., Paracron W-197CM, weight average molecular weight 400,000) (Epicoat 100, manufactured by JER Corporation)
4, 250 parts of weight average molecular weight 1400), epoxy resin 2 (manufactured by JER Corporation, Epicoat 827, weight average molecular weight 370) 250 parts, phenol resin (manufactured by Mitsui Chemicals, Remix XLC-4L, weight average molecular weight 1385) ) 500 parts and 667 parts of spherical silica having an average particle diameter of 500 nm (manufactured by Admatechs Co., Ltd., SO-25R) were dissolved in methyl ethyl ketone to prepare an adhesive composition having a concentration of 21.4% by weight.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thereby, a thermosetting die bond film E having a thickness of 40 μm was produced.

(Comparative Example 3)
Acrylic acid ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase ChemteX Corporation, Teisan Resin SG-7
08-6, 100 parts by weight average molecular weight), epoxy resin (manufactured by JER Corporation)
Epicoat 834, 3.3 parts by weight average molecular weight 470), phenol resin (Arakawa Chemical Co., Ltd.)
Manufactured by TAMANOL 100S, weight average molecular weight 900) 1.9 parts, spherical silica having an average particle diameter of 500 nm (manufactured by Admatechs Co., Ltd., SO-25R) 45 parts dissolved in methyl ethyl ketone, and adhesion at a concentration of 20.9% by weight An agent composition was prepared.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thus, a thermosetting die bond film G having a thickness of 40 μm was produced.

(Comparative Example 4)
Acrylic acid ester polymer as an acrylic copolymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase ChemteX Corporation, Teisan Resin SG-7
08-6, 100 parts by weight average molecular weight), epoxy resin (manufactured by JER Corporation)
Epicoat 828, 300 parts by weight average molecular weight 370), phenol resin (Maywa Kasei Co., Ltd.)
Manufactured by MEH-7500-3S, weight average molecular weight 500) 165 parts, spherical silica having an average particle diameter of 500 nm (manufactured by Admatechs Co., Ltd., SO-25R) was dissolved in methyl ethyl ketone, and the concentration was 20.9% by weight. An adhesive composition was prepared.

After applying this adhesive composition solution onto a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, 130
Dry at 2 ° C. for 2 minutes. Thus, a thermosetting die bond film G having a thickness of 40 μm was produced.

(Measurement method of weight average molecular weight)
The weight average molecular weight of the acrylic copolymer is a value in terms of polystyrene by gel permeation chromatography. Gel permeation chromatography is TSK
G2000H HR, G3000H HR, G4000H HR, and GMH-H HR
4 columns (all manufactured by Tosoh Corporation) were used in series, tetrahydrofuran was used as the solution, a flow rate of 1 ml / min, a temperature of 40 ° C., and a sample concentration of 0.1 wt% tetrahydrofuran solution. The sample injection volume was 500 μl, and a differential refractometer was used as the detector.

(Measurement of storage elastic modulus at 80 ° C, 140 ° C and 175 ° C)
From the thermosetting die-bonding film of each Example and Comparative Example, thickness 200 μm, length 25 m
m (measurement length), cut into a 10 mm wide strip with a cutter knife, and using a solid viscoelasticity measuring device (RSAIII, manufactured by Rheometric Scientific Co., Ltd.), -50 to 30
The storage elastic modulus at 0 ° C. was measured. The measurement conditions were a frequency of 1 Hz and a heating rate of 10 ° C./mi.
n. The values of the storage elastic modulus E ₁ ′, E ₂ ′, E ₃ ′ at 80 ° C., 140 ° C., and 175 ° C. are shown in Table 1 below.

(Measurement of glass transition temperature (Tg))
As for the glass transition point of the thermosetting die-bonding film according to each example and comparative example, first, the storage elastic modulus was measured in the same manner as in the case of the storage elastic modulus. Furthermore, after measuring the loss modulus,
The glass transition temperature was determined by calculating the value of tan δ (G ″ (loss elastic modulus) / G ′ (storage elastic modulus)).

(Measurement of shear adhesive strength at room temperature)
About the thermosetting die-bonding film produced in the said Example and comparative example, the shear adhesive force with respect to a semiconductor element was measured as follows.

First, each thermosetting die bond film is bonded to a semiconductor chip (vertical 1
0 mm × width 10 mm × thickness 0.5 mm). Next, die attachment was performed on a BGA substrate under conditions of a die bonding temperature of 120 ° C., a bonding pressure of 0.1 MPa, and a bonding time of 1 second. Next, using a bond tester (manufactured by Daisy, dagy4000), the shear adhesive strength at room temperature was measured. The results are shown in Table 1 below.

(Measurement of shear adhesive strength at 175 ° C.)
About the thermosetting die-bonding film produced in the said Example and comparative example, the shear adhesive force with respect to a semiconductor element was measured as follows.

In the same manner as in the measurement of the shear adhesive strength at room temperature, a semiconductor chip (10 mm long × 1 horizontal) is formed on a BGA substrate via the thermosetting die-bonding film according to each example and comparative example.
(0 mm × thickness 0.5 mm) was die-attached. Next, bond tester (manufactured by Daisy, da
gy4000), and the shear adhesive strength at 175 ° C. was measured. The results are shown in Table 1 below.

(Evaluation of wire bonding)
Using the thermosetting die-bonding films prepared in the examples and comparative examples, the wire bonding property when wire bonding was performed on a mirror chip die-bonded on a BGA substrate was evaluated.

First, a silicon wafer with Al deposited on the surface was diced to produce a 10 mm square mirror chip. This mirror chip was die-bonded on the BGA substrate through a thermosetting die-bonding film. The die bonding was performed using a die bonder (SPA-300 manufactured by Shinkawa Co., Ltd.) under conditions of a temperature of 120 ° C., 0.1 MPa, and 1 second.

Next, using a wire bonding apparatus (manufactured by ASM, trade name: Eagle 60),
Wire bonding was performed 50 times on one side of the mirror chip with an Au wire having a diameter of 25 μm. The wire bonding conditions were an ultrasonic output time of 2.5 msec, an ultrasonic output of 0.75 W, a bond load of 60 g, and a stage temperature of 175 ° C. The wire bonding property was evaluated by confirming the positional deviation of the mirror chip and the occurrence of cracking of the chip. The case where no positional deviation and chip cracking occurred was marked with ◯, and the case where it occurred was marked with ×.

(Evaluation of moldability)
In the same manner as in the measurement of the shear adhesive force, a semiconductor chip (length 10 mm × width 10 mm × thickness 0) is formed on the BGA substrate via the thermosetting die-bonding film according to each example and comparative example.
. 5 mm) was die-attached. Next, using a molding machine (manufactured by TOWA Press, manual press Y-1), a molding temperature of 175 ° C., a clamp pressure of 184 kN, a transfer pressure of 5 kN, a time of 120 seconds, a sealing resin GE-100 (Nitto Denko Corporation) The sealing process was performed under the conditions of (manufactured).

Thereafter, the state of the semiconductor chip fixed on the BGA substrate was observed using an ultrasonic imaging device (manufactured by Hitachi Finetech, FS200II). The results are shown in Table 1. In Table 1, the case where there was no position shift or peeling due to peeling of the semiconductor chip was indicated as ◯, and the case where any one was confirmed was indicated as ×.

(result)
As can be seen from the results in Table 1 below, when the thermosetting die-bonding films of Examples 1 to 5 are used, the semiconductor chip after die-bonding does not fall off the BGA substrate during transportation. In addition, even during the wire bonding process, positional displacement and chip cracking due to shear deformation do not occur with respect to the BGA substrate, and as a result, the yield can be improved also during the wire bonding process.
Furthermore, the semiconductor chip was not washed away by the sealing resin even when sealing with the sealing resin. Thereby, it was confirmed that the thermosetting die-bonding film which concerns on a present Example has both the storage elastic modulus required for manufacture of a semiconductor device, and high adhesive force.

DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive layer 3, 3 ', 13, 21 Thermosetting die-bonding film 4 Semiconductor wafer 5 Semiconductor chip 6 Adhering body 7 Bonding wire 8 Sealing resin 9 Spacer 10, 11 Dicing die-bonding film 15 Semiconductor chip 16 Wafer ring

Claims (12)

A thermosetting die-bonding film used for manufacturing a semiconductor device,
It contains at least an epoxy resin, a phenol resin, an acrylic copolymer and a filler, and the storage elastic modulus before thermosetting at 80 ° C. and 140 ° C. is in the range of 10 kPa to 10 MPa, and the storage elastic modulus before thermosetting at 175 ° C. Within the range of 0.1 MPa to 3 MPa,
Does not contain a crosslinking agent other than the epoxy resin, the phenol resin and the acrylic copolymer,
A semiconductor chip (length 10 mm × width 10 mm × thickness 0.5 mm) was die-attached on a BGA substrate via a thermosetting die-bonding film, and the shear adhesive strength at 175 ° C. measured by a bond tester was 0.014 MPa or more. A thermosetting die-bonding film. The thermosetting according to claim 1, wherein the ratio X / Y when the total weight of the epoxy resin and the phenol resin is X parts by weight and the weight of the acrylic copolymer is Y parts by weight is 0.11-4. Die bond film. The total weight of the epoxy resin, phenol resin and acrylic copolymer is A part by weight,
The thermosetting die-bonding film according to claim 1 or 2, wherein B / (A + B) when the weight of the filler is B parts by weight is 0.8 or less. The epoxy resin is an epoxy resin having an aromatic ring, the phenol resin is at least one of a phenol novolac resin, a phenol biphenyl resin, or a phenol aralkyl resin, and the acrylic copolymer is a carboxyl group-containing acrylic copolymer or The thermosetting die-bonding film according to claim 1, which is at least one of an epoxy group-containing acrylic copolymer. The thermosetting die-bonding film according to any one of claims 1 to 4, wherein an average particle size of the filler is in a range of 0.005 µm to 10 µm. The thermosetting die-bonding film according to claim 1, wherein the epoxy resin has a weight average molecular weight in the range of 300 to 1500. The weight average molecular weight of the phenol resin is in the range of 300-1500.
The thermosetting die-bonding film according to any one of the above. The weight average molecular weight of the acrylic copolymer is in the range of 100,000 to 1,000,000.
8. The thermosetting die-bonding film according to any one of 7 above. The thermosetting die-bonding film according to any one of claims 1 to 8, wherein the glass transition temperature is in a range of 10C to 50C. The total weight of the epoxy resin, phenol resin and acrylic copolymer is A part by weight,
The thermosetting die-bonding film according to any one of claims 1 to 9, wherein B / (A + B) when the weight of the filler is B parts by weight is 0.31 or more.   A dicing die-bonding film having a structure in which the thermosetting die-bonding film according to claim 1 is laminated on a dicing film. The dicing film includes a base material and an adhesive layer laminated on the base material,
The pressure-sensitive adhesive layer includes a first portion in contact with the thermosetting die bond film and a second portion not in contact with the thermosetting die bond film,
The second part includes a fixing part for fixing the wafer ring,
The dicing die-bonding film according to claim 11, wherein the adhesive strength of the first portion is lower than the adhesive strength of the fixing portion.

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