JP7264593B2 - Semiconductor back adhesion film and dicing tape integrated semiconductor back adhesion film - Google Patents

Description

TECHNICAL FIELD The present invention relates to a semiconductor back adhesion film and a dicing tape-integrated semiconductor back adhesion film. More particularly, the present invention relates to a semiconductor back-surface adhesive film and a dicing tape-integrated semiconductor back-surface adhesive film that can be used in the manufacturing process of semiconductor devices.

2. Description of the Related Art In manufacturing a semiconductor device having a flip-chip mounted semiconductor chip, a semiconductor back surface adhesive film is sometimes used as a film for forming a protective film on the so-called back surface of the chip. Moreover, such a semiconductor back surface adhesive film may be provided in a form integrated with a dicing tape (see Patent Documents 1 and 2).

JP 2011-151360 A WO2014/092200

The semiconductor back adhesion film is usually produced by a roll-to-roll method, on which a plurality of substantially circular semiconductor back adhesion films are punched out in the same shape as the semiconductor wafer on a long separator. Manufactured in place. When used, the semiconductor back adhesion film manufactured in this way is transported in the longitudinal direction by transport rolls, and the separator is bent in the opposite direction to the semiconductor back adhesion film, thereby separating the semiconductor back adhesion film from the separator. It is used by floating the end and peeling it off from here.

In recent years, a semiconductor device called a so-called Fan-out type panel level package (PLP) has been adopted. In this case, for example, a larger square-shaped semiconductor back contact film than conventional ones is used, corresponding to the size and shape of the substrate of the fan-out type PLP. However, when the semiconductor back contact film having such a shape is peeled off from the elongated separator, the floated tip may be caught and wrinkled. Similarly, in the case of using the dicing tape-integrated semiconductor back contact film, wrinkles are generated when a plurality of square dicing tape-integrated semiconductor back contact films are separated from each of the long separators. sometimes entered.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a film that adheres to the back surface of a semiconductor and that is less likely to wrinkle when peeled off from the separator.

As a result of intensive studies by the present inventors in order to achieve the above object, the planar projected area is 22500 mm ² or more, and the planar projected shape has at least one curved portion with a curvature radius R1 of 0.5 to 10 mm. It has been found that the use of a non-circular semiconductor back adhesion film makes it possible to prevent wrinkles from forming when the film is peeled off from the separator. The present invention has been completed based on these findings.

That is, the present invention provides a semiconductor back contact film having a planar projected area of 22500 mm ² or more and a planar projected shape having at least one rounded portion with a radius of curvature R1 of 0.5 to 10 mm. offer. A semiconductor back surface adhesive film having such a structure can be used in the manufacturing process of a semiconductor device.

As described above, the semiconductor back adhesion film of the present invention has a planar projected area of 22500 mm ² or more. The planar projected shape is non-circular and has at least one rounded portion with a radius of curvature R1 of 0.5 to 10 mm. The semiconductor back contact film of the present invention having such a configuration is relatively larger than conventional ones corresponding to circular semiconductor wafers of up to 12 inches or less, and has a non-circular shape. It is possible to make it difficult for wrinkles to appear when peeling off. For example, by arranging the semiconductor back adhesion film so that the curved portion having the radius of curvature R1 of 0.5 to 10 mm is in the direction of movement during transportation of the long separator, wrinkles are less likely to occur when peeled from the separator. can do.

In the semiconductor back adhesion film of the present invention, the plan projection shape is a quadrangle having a minor axis to major axis ratio [major axis/minor axis] of 1 to 10 and at least one corner of which is processed into the rounded portion. is preferred. When the semiconductor back adhesion film of the present invention has such a structure, wrinkles are less likely to occur when the film is peeled off from the separator.

Further, the present invention comprises a dicing tape having a laminated structure including a substrate and an adhesive layer, and the semiconductor back adhesive film peelably adhered to the adhesive layer in the dicing tape, and the dicing The tape provides a dicing tape-integrated semiconductor back contact film having a planar projected area larger than that of the semiconductor back contact film and a planar projected shape having rounded portions. The dicing tape-integrated semiconductor back contact film having such a structure can be used in the manufacturing process of semiconductor devices.

As described above, the dicing tape-integrated semiconductor back adhesive film of the present invention is a dicing tape having a laminated structure including a base material and an adhesive layer, and is releasably adhered to the adhesive layer of the dicing tape. The dicing tape has a planar projected area larger than that of the semiconductor back adhesive film, and has a rounded portion in a planar projected shape. The dicing tape-integrated semiconductor back adhesive film having such a structure allows a frame for dicing to be attached to the surface of the adhesive layer during dicing, and wrinkles are less likely to occur when peeled off from the separator. .

The planar projected shape of the dicing tape with no rounded portion formed is similar to the planar projected shape of the semiconductor back adhesive film with no rounded portion formed, and the similarity ratio [former/latter] in the similar shape is 1.01 or more. is preferably When the dicing tape-integrated semiconductor back adhesive film of the present invention has such a structure, it can be used for dicing as it is after sticking a dicing frame onto the adhesive layer of the dicing tape.

The ratio [R2/R1] of the radius of curvature R2 of the round portion of the dicing tape to the radius of curvature R1 is preferably 0.5-100. When the dicing tape-integrated semiconductor back contact film of the present invention has such a structure, the dicing frame can be fixed without causing waste in the dicing tape, and even if there is a difference in the area of the dicing tape and the back contact film, the back contact can be achieved. The back contact film is less likely to be wrinkled in the process of bonding the film and the dicing tape, and less likely to be wrinkled in the process of bonding the dicing tape to the substrate or frame. Moreover, it is excellent in workability.

The semiconductor back contact film of the present invention and the dicing tape-integrated semiconductor back contact film of the present invention are relatively large and have a non-circular shape, but are less likely to wrinkle when peeled from the separator. For example, by arranging the semiconductor back adhesion film so that the radiused portion having the radius of curvature R1 within a specific range is in the direction of travel when the long separator is transported, wrinkles are less likely to occur when peeled from the separator. be able to.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic top view (planar projection view) showing an embodiment of a semiconductor back adhesion film of the present invention; FIG. 2 is a front cross-sectional view of the semiconductor back adhesion film of the present invention shown in FIG. 1; 1 is a schematic top view (planar projection view) showing an embodiment of the dicing tape-integrated semiconductor back contact film of the present invention. FIG. FIG. 4 is a top view (planar projection view) of the dicing tape-integrated semiconductor back contact film of the present invention shown in FIG. 3, viewed from the semiconductor back contact film side. FIG. 4 is a front cross-sectional view of the dicing tape-integrated semiconductor back contact film of the present invention shown in FIG. 3 ; It is the schematic (front sectional view) which shows one Embodiment of a sticking process. It is a schematic diagram (front sectional view) which shows one Embodiment of a dicing process. It is a schematic diagram (front sectional view) which shows one Embodiment of a pick-up process. It is a schematic diagram (front sectional view) which shows one Embodiment of a flip-chip mounting process.

[Semiconductor back adhesion film]
The semiconductor back adhesion film of the present invention (sometimes simply referred to as "back adhesion film") has a planar projected area of 22,500 mm ² or more, and a planar projected shape having a radius of curvature R1 of 0.5 to 10 mm. is non-circular with at least one In this specification, the "front surface" of a semiconductor (workpiece) refers to the surface on which bumps for flip-chip mounting of the workpiece are formed, and the "back surface" refers to the opposite side of the surface, that is, the side on which bumps are formed. shall mean the side that is not The "back surface adhesive film" refers to a film used in close contact with the back surface of a semiconductor, and includes a film (semiconductor back surface protective film) for forming a protective film on the back surface (so-called back surface) of a semiconductor chip. Further, in this specification, the rounded portion having the radius of curvature R1 of 0.5 to 10 mm may be referred to as "rounded portion X".

The planar projected shape of the back contact film of the present invention is a non-circular shape having at least one rounded portion X. As such a planar projection shape, for example, a shape in which at least one corner of a polygon (for example, a triangle, a quadrangle such as a square or rectangle, a hexagon, an octagon, etc.) is processed into a rounded portion X, A shape other than a circular shape, such as a shape having a straight portion extending in the traveling direction (for example, a semicircle, a fan shape, etc.) in which the corners of the ends of the straight portion are processed into rounded portions X, may be mentioned. Above all, at least one corner (in particular, all corners) of the polygon is processed into a rounded portion X from the viewpoint of being able to handle relatively large substrates and to minimize the waste portion after use. The shape is preferable, and more preferably a shape in which at least one corner (particularly all corners) of a quadrangle (especially a square) is processed into a rounded portion X.

One embodiment of the back contact film of the present invention is described below. FIG. 1 is a top view (planar projection view) showing one embodiment of the back contact film of the present invention. As shown in FIG. 1, a plurality of back contact films 10 of the present invention are arranged in one direction F on a long separator (long release liner) 30 . The shape (planar projected shape) of the back adhesion film 10 of the present invention shown in FIG. be. When peeling the back contact film 10 of the present invention from the long separator 30, for example, the long separator 30 is conveyed in one direction F, and from the end of the back contact film 10 of the present invention on the one direction F side. The long separator 30 is warped to the opposite side of the back contact film 10 of the present invention so as to be peeled off, thereby peeling off the back contact film 10 of the present invention from the end. The rear adhesive film 10 of the present invention shown in FIG. 1 is arranged so that the rounded portions 10a and 10c are the ends in one direction F, and when peeled from the long separator 30, the one direction F is the traveling direction. It is conveyed by the long separator 30 so that it becomes. The back contact film 10 of the present invention has a size slightly larger than the workpiece so as to correspond to the substrate or the like on which the semiconductor chip, which is the workpiece to be bonded, is rearranged.

The planar projected area of the back adhesion film of the present invention is 22,500 mm ² or more, preferably 23,225 mm ² or more, and more preferably 32,400 mm ² or more. Since the planar projected area is 22500 mm ² or more, it is possible to handle relatively large substrates. In addition, when the conventional back adhesion film has a planar projection area of 22,500 mm ² or more, wrinkles are particularly likely to occur during peeling, but the back adhesion film of the present invention generates wrinkles during peeling even if the planar projection area is 22,500 mm ² or more. can be made difficult. The planar projected area is, for example, 400000 mm ² or less, preferably 360000 mm ² or less. The planar projected area is, for example, the area of the back adhesion film 10 of the present invention in the planar projection view shown in FIG.

The curvature radius R1 of the rounded portion X is 0.5 to 10 mm, preferably 0.55 to 9.5 mm, and more preferably 0.6 to 9.0 mm. When the radius of curvature R1 is 0.5 mm or more, wrinkles are less likely to occur during peeling even if the planar projected area is relatively large. Further, by setting the radius of curvature R1 to 10 mm or less, it is possible to minimize the waste portion after use. When the back contact film of the present invention has a plurality of rounded portions, at least one rounded portion may be the rounded portion X, and when it has other rounded portions, the radius of curvature of the curved portion is the radius of curvature R1. It may be out of range.

When the planar projection shape of the back contact film of the present invention is a square with at least one rounded corner, the planar projection shape has a short side to long side ratio [long side/short side ] is 1 to 10. It is preferable that at least one corner of a quadrangle (especially a rectangle or a square) is processed into the rounded portion. The ratio is preferably 1-6, more preferably 1-3. When the above ratio is within the above range, wrinkles are less likely to occur during separation from the separator.

(adhesive layer)
The back adhesion film of the present invention includes at least an adhesive layer having a surface to be adhered to the back surface of the work. The adhesive layer may have thermosetting properties so that it can be adhered to the back surface of the work and protected by heat curing after being attached to the back surface of the work. If the adhesive layer is non-thermosetting, the adhesive layer adheres to and protects the back surface of the work by adhesion (wettability) at the interface due to pressure sensitivity or chemical bonding. Is possible. The adhesive layer may have a single layer structure or a multilayer structure.

The adhesive layer and the adhesive composition (resin composition) forming the adhesive layer preferably contain a thermoplastic resin. When the adhesive layer has thermosetting properties, the adhesive layer and the adhesive composition forming the adhesive layer may contain a thermosetting resin and a thermoplastic resin, or may react with a curing agent. It may also contain thermoplastic resins having thermosetting functional groups that are capable of forming bonds through bonding. When the adhesive layer contains a thermoplastic resin having a thermosetting functional group, the resin composition need not contain a thermosetting resin (epoxy resin, etc.).

The thermoplastic resin in the adhesive layer has, for example, a binder function. Examples of the thermoplastic resin include acrylic resin, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin. , polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), polyamideimide resin , fluororesins, and the like. Only one kind of the thermoplastic resin may be used, or two or more kinds thereof may be used. As the thermoplastic resin, an acrylic resin is preferable from the viewpoint that it contains few ionic impurities and has high heat resistance.

The acrylic resin is a polymer containing structural units derived from acrylic monomers (monomer components having a (meth)acryloyl group in the molecule) as polymer structural units. The acrylic resin is preferably a polymer containing the largest proportion of structural units derived from (meth)acrylic acid ester. In addition, acrylic resin may use only 1 type, and may use 2 or more types. In the present specification, "(meth)acrylic" means "acrylic" and/or "methacrylic" (one or both of "acrylic" and "methacrylic"), and the same applies to others. .

Examples of the (meth)acrylic acid esters include hydrocarbon group-containing (meth)acrylic acid esters that may have an alkoxy group. Hydrocarbon group-containing (meth)acrylic acid esters include (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, (meth)acrylic acid aryl esters, and the like. Examples of the (meth)acrylic acid alkyl esters include (meth)acrylic acid methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester (lauryl ester), tridecyl ester, tetradecyl ester , hexadecyl ester, octadecyl ester, eicosyl ester and the like. Examples of the (meth)acrylic acid cycloalkyl esters include cyclopentyl esters and cyclohexyl esters of (meth)acrylic acid. Examples of the (meth)acrylic acid aryl esters include phenyl esters and benzyl esters of (meth)acrylic acid. Examples of the hydrocarbon group-containing (meth)acrylic acid ester having an alkoxy group include those in which one or more hydrogen atoms in the hydrocarbon group in the above hydrocarbon group-containing (meth)acrylic acid ester are substituted with an alkoxy group, Examples thereof include 2-methoxymethyl ester, 2-methoxyethyl ester and 2-methoxybutyl ester of (meth)acrylic acid. The hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group may be used alone or in combination of two or more.

The above-mentioned acrylic resin has a configuration derived from other monomer components copolymerizable with a hydrocarbon group-containing (meth) acrylic acid ester that may have an alkoxy group for the purpose of improving cohesive strength, heat resistance, etc. May contain units. Examples of other monomer components include carboxy group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, acrylamide, acrylonitrile, and other functional group-containing monomers. A monomer etc. are mentioned. Examples of the carboxy group-containing monomers include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of the acid anhydride monomer include maleic anhydride and itaconic anhydride. Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate and the like. Examples of the glycidyl group-containing monomer include glycidyl (meth)acrylate and methylglycidyl (meth)acrylate. Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, (meth) ) acryloyloxynaphthalenesulfonic acid and the like. Examples of the phosphoric acid group-containing monomer include 2-hydroxyethyl acryloyl phosphate and the like. Only one kind of the other monomer component may be used, or two or more kinds thereof may be used.

The acrylic resin that can be contained in the adhesive layer is appropriately selected from butyl acrylate, ethyl acrylate, acrylonitrile, and acrylic acid from the viewpoint of achieving both adhesiveness to the workpiece and good splittability during dicing. It is preferably a copolymer of selected monomers.

When the adhesive layer contains a thermosetting resin together with a thermoplastic resin, examples of the thermosetting resin include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting resins. A polyimide resin etc. are mentioned. Only one type of the thermosetting resin may be used, or two or more types may be used. Epoxy resin is preferable as the thermosetting resin because it tends to contain less ionic impurities that may cause corrosion of the semiconductor chip. Phenol resin is preferable as a curing agent for epoxy resin.

Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, and biphenyl type epoxy resin. Epoxy resins, naphthalene type epoxy resins, fluorene type epoxy resins, phenol novolak type epoxy resins, cresol novolac type epoxy resins such as ortho cresol novolak type epoxy resins, trishydroxyphenylmethane type epoxy resins, tetraphenylolethane type epoxy resins, etc. Polyfunctional epoxy resins may be mentioned. Only one kind of the epoxy resin may be used, or two or more kinds thereof may be used. Among them, phenol novolak type epoxy resin, ortho-cresol novolac type epoxy resin, biphenyl type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylene epoxy resin, etc. A roll ethane type epoxy resin is preferred.

Phenolic resins that can act as curing agents for epoxy resins include, for example, novolak-type phenolic resins such as phenol novolac resins, phenol aralkyl resins, cresol novolac resins, tert-butylphenol novolac resins, and nonylphenol novolak resins. Examples of the phenol resin include resol-type phenol resin and polyoxystyrene such as polyparaoxystyrene. Only one kind of the phenol resin may be used, or two or more kinds thereof may be used.

From the viewpoint of sufficiently advancing the curing reaction between the epoxy resin and the phenolic resin in the adhesive layer, the phenolic resin preferably contains 0.00 hydroxyl group per equivalent of the epoxy group in the epoxy resin component. It is contained in an amount of 5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.

When the adhesive layer contains a thermosetting resin, the content of the thermosetting resin is 5 to 60% by mass with respect to the total mass of the adhesive layer from the viewpoint of properly curing the adhesive layer. It is preferably 10 to 50 mass %, more preferably 10 to 50 mass %.

When the adhesive layer contains a thermoplastic resin having a thermosetting functional group, for example, a thermosetting functional group-containing acrylic resin can be used as the thermoplastic resin. The acrylic resin in this thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from a hydrocarbon group-containing (meth)acrylic acid ester as a structural unit having the largest mass ratio. Examples of the hydrocarbon group-containing (meth)acrylic acid ester include those exemplified as the hydrocarbon group-containing (meth)acrylic acid ester that forms the acrylic resin as the thermoplastic resin that can be contained in the adhesive layer. are mentioned. On the other hand, the thermosetting functional group in the thermosetting functional group-containing acrylic resin includes, for example, glycidyl group, carboxyl group, hydroxy group, isocyanate group and the like. Among them, a glycidyl group and a carboxy group are preferable. That is, as the thermosetting functional group-containing acrylic resin, a glycidyl group-containing acrylic resin and a carboxy group-containing acrylic resin are particularly preferable. In addition, it is preferable to contain a curing agent together with the thermosetting functional group-containing acrylic resin. things are mentioned. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a polyphenol-based compound as the curing agent, and for example, the various phenolic resins described above can be used.

The adhesive layer preferably contains a thermosetting catalyst (thermosetting accelerator). When the thermosetting catalyst is included, the curing reaction of the resin component can be sufficiently advanced and the curing reaction rate can be increased in curing the adhesive layer. Examples of the thermosetting catalyst include imidazole-based compounds, triphenylphosphine-based compounds, amine-based compounds, and trihalogen borane-based compounds. Examples of imidazole compounds include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl- 4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole Lithium trimellitate, 2,4-diamino-6-[2′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-undecylimidazolyl-(1 ')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6- [2′-Methylimidazolyl-(1′)]-ethyl-s-triazineisocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and the like mentioned. Examples of triphenylphosphine compounds include triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, tri(nonylphenyl)phosphine, diphenyltolylphosphine, tetraphenylphosphonium bromide, methyltriphenylphosphonium, methyltriphenyl phosphonium chloride, methoxymethyltriphenylphosphonium, benzyltriphenylphosphonium chloride and the like. Triphenylphosphine-based compounds also include compounds having both a triphenylphosphine structure and a triphenylborane structure. Examples of such compounds include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-triborate, benzyltriphenylphosphonium tetraphenylborate, triphenylphosphinetriphenylborane and the like. Examples of amine compounds include monoethanolamine trifluoroborate and dicyandiamide. Trihalogen borane compounds include, for example, trichloroborane. The thermosetting catalyst may contain only one type, or may contain two or more types.

The adhesive layer may contain a filler. By including a filler, it is easy to adjust physical properties such as elastic modulus, yield point strength, and breaking elongation of the adhesive layer. Examples of fillers include inorganic fillers and organic fillers. Constituent materials of the inorganic filler include, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, nitride Examples include silicon, boron nitride, crystalline silica, amorphous silica, and the like. Further, examples of constituent materials of the inorganic filler include single metals such as aluminum, gold, silver, copper and nickel, alloys, amorphous carbon, graphite and the like. Examples of constituent materials of the organic filler include polymethyl methacrylate (PMMA), polyimide, polyamideimide, polyetheretherketone, polyetherimide, and polyesterimide. The above fillers may contain only one type, or may contain two or more types.

The filler may have various shapes such as spherical, needle-like, and flake-like. The average particle diameter of the filler is preferably 30-500 nm, more preferably 40-400 nm, and more preferably 50-300 nm. That is, the adhesive layer preferably contains nanofillers. When a nano-filler having such a particle diameter is contained as a filler, the splitting property of the back adhesive film that is to be broken into small pieces is improved. The average particle size of the filler can be determined using, for example, a photometric particle size distribution meter (trade name “LA-910”, manufactured by HORIBA, Ltd.). When the adhesive layer contains a filler, the filler content is preferably 10% by mass or more, more preferably 15% by mass or more, and more preferably 20% by mass or more. The above content is preferably 50% by mass or less, more preferably 47% by mass or less, and more preferably 45% by mass or less.

The adhesive layer may contain a coloring agent. Examples of the coloring agent in the adhesive layer include those exemplified as coloring agents that can be contained in the laser mark layer described later. From the viewpoint of ensuring high contrast between the laser marking location on the back adhesive film side of the laser mark layer and other locations and realizing good visibility of the marking information, the coloring agent is a black color. It is preferably an agent. Only one kind of the coloring agent may be used, or two or more kinds thereof may be used. In addition, from the viewpoint of achieving the above-described good visibility of information marked by laser marking, the content of the coloring agent in the adhesive layer is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably. is 2% by mass or more. The above content is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less.

The adhesive layer may contain other components as needed. Examples of other components include flame retardants, silane coupling agents, ion trapping agents, and the like. Examples of the flame retardant include aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, metal hydroxides such as composite metal hydroxides, phosphazene compounds, antimony trioxide, Examples include antimony oxide and brominated epoxy resins. Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane and the like. Examples of the ion trapping agent include hydrotalcites, bismuth hydroxide, hydrous antimony oxide (eg, "IXE-300" manufactured by Toagosei Co., Ltd.), zirconium phosphate of a specific structure (eg, manufactured by Toagosei Co., Ltd.) "IXE-100"), magnesium silicate (eg "Kyoward 600" manufactured by Kyowa Chemical Industry Co., Ltd.), aluminum silicate (eg "Kyoward 700" manufactured by Kyowa Chemical Industry Co., Ltd.), and the like. Compounds that can form complexes with metal ions can also be used as ion trapping agents. Examples of such compounds include triazole-based compounds, tetrazole-based compounds, and bipyridyl-based compounds. Among these, triazole compounds are preferred from the viewpoint of the stability of the complex formed with metal ions. Examples of such triazole compounds include 1,2,3-benzotriazole, 1-{N,N-bis(2-ethylhexyl)aminomethyl}benzotriazole, carboxybenzotriazole, 2-(2-hydroxy- 5-methylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-t-butylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3-t-butyl-5-methylphenyl )-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-t-amylphenyl)benzotriazole, 2-(2-hydroxy-5-t-octylphenyl)benzotriazole, 6-(2 -benzotriazolyl)-4-t-octyl-6'-t-butyl-4'-methyl-2,2'-methylenebisphenol, 1-(2',3'-hydroxypropyl)benzotriazole, 1- (1,2-dicarboxydiethyl)benzotriazole, 1-(2-ethylhexylaminomethyl)benzotriazole, 2,4-di-t-pentyl-6-{(H-benzotriazol-1-yl)methyl}phenol , 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy, octyl -3-[3-t-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-ethylhexyl-3-[3-t-butyl-4-hydroxy -5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-( 1,1,3,3-tetramethylbutyl)phenol, 2-(2H-benzotriazol-2-yl)-4-t-butylphenol, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2- (2-hydroxy-5-t-octylphenyl)-benzotriazole, 2-(3-t-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3, 5-di-t-amylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-t-butylphenyl)-5-chloro-benzotriazole, 2-[2-hydroxy-3,5-di (1,1-dimethylbenzyl)phenyl]-2H-benzotriazole, 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl ) phenol], 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, methyl-3-[3-(2H-benzotriazol-2-yl)- 5-t-butyl-4-hydroxyphenyl]propionate and the like. Also, prescribed hydroxyl group-containing compounds such as quinol compounds, hydroxyanthraquinone compounds, and polyphenol compounds can be used as ion trapping agents. Specific examples of such hydroxyl group-containing compounds include 1,2-benzenediol, alizarin, anthralphine, tannin, gallic acid, methyl gallate, and pyrogallol. Only one kind of the other components may be used, or two or more kinds thereof may be used.

The tensile storage modulus (before curing) of the adhesive layer at 23° C. is not particularly limited, but is preferably 0.5 GPa or more, more preferably 0.75 GPa or more, and still more preferably 1 GPa or more. When the tensile storage elastic modulus is 0.5 GPa or more, it can be prevented from adhering to the carrier tape. The upper limit of the tensile storage modulus at 23°C is, for example, 50 GPa. The tensile storage modulus can be adjusted by the type and content of the resin component, the type and content of the filler, and the like.

The thickness of the adhesive layer is, for example, 2-200 μm, preferably 4-160 μm, more preferably 6-100 μm, still more preferably 10-80 μm.

The back contact film of the present invention may have a single-layer structure comprising the adhesive layer, or may have a multilayer structure. The back contact film of the present invention, which has a multi-layer structure, has a laminated structure including, for example, the adhesive layer described above and a laser mark layer to which imprinted information can be applied by laser marking. The back adhesive film having such a multilayer structure has a laminated structure in which the adhesive layer is heat-cured by heat treatment at 120° C. for 2 hours, while the laser mark layer is not substantially heat-cured. be able to. In the back contact film of the present invention, the layer that is not substantially thermoset by heat treatment at 120° C. for 2 hours includes an already cured thermosetting layer.

FIG. 2 shows an embodiment in which the back contact film of the present invention has a multilayer structure including an adhesive layer and a laser marking layer. 2 corresponds to a front cross-sectional view of the back contact film of the present invention shown in FIG. As shown in FIG. 2 , a plurality of back contact films 10 are arranged in one direction F on a long separator 30 . The back contact film 10 has a multi-layer structure including an adhesive layer 11 and a laser mark layer 12, and the laser mark layer 12 is adhered to the long separator 30 in a detachable manner. In FIG. 2, the adhesive layer 11 and the laser mark layer 12 may have a reverse positional relationship (that is, the adhesive layer 11 is releasably adhered to the long separator 30). When the adhesive layer 11 and the laser mark layer 12 have the positional relationship shown in FIG. 2, the back adhesion film 10 can be adhered to the back surface of the work and heat-cured for use. On the other hand, when the positional relationship between the adhesive layer 11 and the laser mark layer 12 is opposite to that shown in FIG. 2, it can be preferably used for producing a dicing tape-integrated back adhesion film described later. Moreover, although the back contact film 10 shown in FIG. 1 has the adhesive layer 11 on the surface, the surface may be the laser mark layer 12 similarly.

(laser mark layer)
When the back contact film of the present invention has a multilayer structure having an adhesive layer and a laser mark layer, laser marking is applied to the surface of the laser mark layer during the manufacturing process of the semiconductor device. In the dicing tape-integrated back adhesive film, the laser mark layer is preferably located on the dicing tape side in the back adhesive film and adheres to the dicing tape and its adhesive layer. Also, the laser mark layer is preferably a thermosetting layer (a thermoset layer) in which a thermosetting component is thermoset. The laser mark layer is formed by curing a thermosetting resin composition layer formed from a resin composition forming the laser mark layer.

The laser mark layer and the resin composition forming the laser mark layer preferably contain a thermoplastic resin. When the laser mark layer is a thermosetting layer (that is, a thermosetting layer or a thermoset layer), the resin composition forming the laser mark layer or the laser mark layer is a thermosetting resin and a thermoplastic resin. or a thermoplastic resin having a thermosetting functional group capable of reacting with a curing agent to form a bond.

The thermoplastic resin has, for example, a binder function in the laser mark layer, and examples of the thermoplastic resin include those exemplified as thermoplastic resins that can be contained in the adhesive layer. Only one kind of the thermoplastic resin may be used, or two or more kinds thereof may be used. As the thermoplastic resin, an acrylic resin is preferable from the viewpoint that it contains few ionic impurities and has high heat resistance.

The acrylic resin that can be contained in the laser mark layer and the resin composition includes butyl acrylate, ethyl acrylate, acrylonitrile, and It is preferably a copolymer of monomers appropriately selected from acrylic acid.

When a thermosetting resin is included together with a thermoplastic resin, examples of the thermosetting resin include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, thermosetting polyimide resins, and the like. be done. Only one type of the thermosetting resin may be used, or two or more types may be used. Epoxy resin is preferable as the thermosetting resin because it tends to contain less ionic impurities that may cause corrosion of the semiconductor chip. Phenol resin is preferable as a curing agent for epoxy resin.

Examples of the epoxy resin include those exemplified as the epoxy resin that the adhesive layer may contain. Only one kind of the epoxy resin may be used, or two or more kinds thereof may be used.

Phenolic resins that can act as curing agents for epoxy resins include those exemplified as the phenolic resins that the adhesive layer can contain above. Only one type of the phenol resin may be used, or two or more types may be used.

In the laser mark layer and the resin composition, from the viewpoint of sufficiently advancing the curing reaction between the epoxy resin and the phenol resin, the phenol resin has a hydroxyl group in the phenol resin per equivalent of the epoxy group in the epoxy resin component. is preferably contained in an amount of 0.5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.

When the laser mark layer and the resin composition contain a thermosetting resin, the content of the thermosetting resin is preferably 5 to 60% by mass with respect to the total mass of the laser mark layer and the resin composition. More preferably, it is 10 to 50% by mass.

When the laser mark layer and the resin composition contain a thermoplastic resin having a thermosetting functional group, the thermoplastic resin is exemplified as the thermosetting functional group-containing acrylic resin that the adhesive layer may contain. things are mentioned. In addition, it is preferable to contain a curing agent together with the thermosetting functional group-containing acrylic resin. Examples of the curing agent include those exemplified as cross-linking agents that can be contained in the radiation-curable adhesive for forming the adhesive layer described later. are mentioned. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a polyphenol-based compound as the curing agent, and for example, the various phenolic resins described above can be used.

The laser mark layer and the resin composition preferably contain a thermosetting catalyst (thermosetting accelerator). When the thermosetting catalyst is included, the curing reaction of the resin component can be sufficiently advanced and the curing reaction rate can be increased in curing the resin composition. Examples of the thermosetting catalyst include those exemplified as the thermosetting catalyst that the adhesive layer may contain. The thermosetting catalyst may contain only one type, or may contain two or more types.

The laser mark layer and the resin composition may contain a filler. By including a filler, it is easy to adjust physical properties such as elastic modulus, yield point strength, and breaking elongation of the laser mark layer. Examples of the filler include those exemplified as the filler that the adhesive layer may contain. The above fillers may contain only one type, or may contain two or more types.

The filler may have various shapes such as spherical, needle-like, and flake-like. The average particle size of the filler is preferably 30-500 nm, more preferably 40-400 nm, and more preferably 50-300 nm. That is, the laser mark layer and the resin composition preferably contain a nanofiller. When a nano-filler having such a particle diameter is contained as a filler, the back adhesive film that is to be broken into small pieces is more excellent in splitting and splitting properties. When the laser mark layer or the resin composition contains a filler, the content of the filler is preferably 10% by mass or more, more preferably 15% by mass or more, and more preferably 20% by mass or more. The above content is preferably 50% by mass or less, more preferably 47% by mass or less, and more preferably 45% by mass or less.

The laser mark layer and the resin composition may contain a colorant. When a coloring agent is contained, excellent marking properties and appearance properties can be exhibited, and various information such as character information and graphic information can be imparted by laser marking. In addition, by appropriately selecting the color of the coloring agent, it is possible to improve the visibility of the information (character information, graphic information, etc.) provided by marking. Furthermore, by selecting a coloring agent, it becomes possible to color-code by product.

The coloring agent may be a pigment or a dye. Examples of coloring agents include black coloring agents, cyan coloring agents, magenta coloring agents, and yellow coloring agents. A black colorant is preferable from the viewpoint of engraving information on the laser mark layer by laser marking and having excellent visibility of the information. The coloring agent may contain only one kind, or may contain two or more kinds.

Black colorants include, for example, carbon black, graphite (graphite), copper oxide, manganese dioxide, azo pigments such as azomethine azo black, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite, magnetite, Chromium oxide, iron oxide, molybdenum disulfide, composite oxide-based black dyes, anthraquinone-based organic black dyes, azo-based organic black dyes, and the like can be mentioned. Examples of carbon black include furnace black, channel black, acetylene black, thermal black and lamp black. As a black colorant, C.I. I. Solvent Black 3, 7, 22, 27, 29, 34, 43, 70; C.I. I. Direct Black 17, 19, 22, 32, 38, 51, 71; C.I. I. Acid Black 1, 2, 24, 26, 31, 48, 52, 107, 109, 110, 119, 154; C.I. I. Disperse Black 1, 3, 10, 24; C.I. I. Pigment Black 1, 7 and the like are also included.

Examples of cyan colorants include C.I. I. Solvent Blue 25, 36, 60, 70, 93, 95; C.I. I. Acid Blue 6, 45; C.I. I. Pigment Blue 1, 2, 3, 15, 15:1, 15:2, 15:3, 15:4, 15:5, 15:6, 16, 17, 17:1, 18, 22, 25, 56, 60, 63, 65, 66; C.I. I. Bat Blue 4; 60, C.I. I. Pigment Green 7 and the like.

Examples of magenta colorants include C.I. I. Solvent Red 1, 3, 8, 23, 24, 25, 27, 30, 49, 52, 58, 63, 81, 82, 83, 84, 100, 109, 111, 121, 122; C.I. I. disperse thread 9;C. I. Solvent Violet 8, 13, 14, 21, 27; C.I. I. Disperse Violet 1; C.I. I. Basic red 1, 2, 9, 12, 13, 14, 15, 17, 18, 22, 23, 24, 27, 29, 32, 34, 35, 36, 37, 38, 39, 40; C.I. I. Basic Violet 1, 3, 7, 10, 14, 15, 21, 25, 26, 27, 28 and the like. Examples of magenta colorants include C.I. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 39, 40, 41, 42, 48: 1, 48:2, 48:3, 48:4, 49, 49:1, 50, 51, 52, 52:2, 53:1, 54, 55, 56, 57:1, 58, 60, 60:1, 63, 63:1, 63:2, 64, 64:1, 67, 68, 81, 83, 87, 88, 89, 90, 92, 101, 104, 105, 106, 108, 112, 114, 122, 123, 139, 144, 146, 147, 149, 150, 151, 163, 166, 168, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185 , 187, 190, 193, 202, 206, 207, 209, 219, 222, 224, 238, 245; I. Pigment Violet 3, 9, 19, 23, 31, 32, 33, 36, 38, 43, 50; C.I. I. Batred 1, 2, 10, 13, 15, 23, 29, 35 and the like.

Examples of yellow colorants include C.I. I. Solvent Yellow 19, 44, 77, 79, 81, 82, 93, 98, 103, 104, 112, 162; I. Pigment Orange 31, 43; C.I. I. Pigment Yellow 1, 2, 3, 4, 5, 6, 7, 10, 11, 12, 13, 14, 15, 16, 17, 23, 24, 34, 35, 37, 42, 53, 55, 65, 73, 74, 75, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 108, 109, 110, 113, 114, 116, 117, 120, 128, 129, 133, 138, 139 , 147, 150, 151, 153, 154, 155, 156, 167, 172, 173, 180, 185, 195; I. Bat Yellow 1, 3, 20 and the like.

The content of the coloring agent is, for example, 0.5% by mass with respect to the total mass of the laser mark layer or the resin composition, from the viewpoint of realizing high visibility of the information engraved on the laser mark layer by laser marking. Above, preferably 1% by mass or more, more preferably 2% by mass or more. The above content is, for example, 10% by mass or less, preferably 8% by mass or less, and more preferably 5% by mass or less.

The laser mark layer and the resin composition may contain other components as necessary. Examples of the other components include flame retardants, silane coupling agents, ion trapping agents, and the like, which are exemplified as other components that the adhesive layer may contain. Only one kind of the other components may be used, or two or more kinds thereof may be used.

The tensile storage modulus (after curing) of the laser mark layer at 23° C. is not particularly limited, but is preferably 0.5 GPa or more, more preferably 0.75 GPa or more, and still more preferably 1 GPa or more. When the tensile storage elastic modulus is 0.5 GPa or more, it can be prevented from adhering to the carrier tape. Also, the back surface of the work can be more strongly protected after heat curing. The upper limit of the tensile storage modulus at 23°C is, for example, 50 GPa. The tensile storage modulus can be adjusted by the type and content of the resin component, the type and content of the filler, and the like.

When the back contact film of the present invention has a multilayer structure having an adhesive layer and a laser marking layer, the ratio of the thickness of the laser marking layer to the thickness of the adhesive layer is preferably 1 or more, more preferably 1.5. 5 or more, more preferably 2 or more. The above ratio is, for example, 8 or less.

When a laser mark layer is provided, the thickness of the laser mark layer is, for example, 2-180 μm, preferably 4-160 μm.

The thickness of the back contact film of the present invention is, for example, 2 to 200 μm, preferably 4 to 160 μm, more preferably 6 to 100 μm, still more preferably 10 to 80 μm. When the thickness is 2 μm or more, the back surface of the work can be more strongly protected. When the thickness is 200 μm or less, the workpiece after the back contact can be made thinner.

The peeling force (peeling angle of 180°, peeling speed of 300 mm/min) of the back adhesion film of the present invention to the peeling-treated surface of the separator is not particularly limited, but is preferably 0.4 N/100 mm or less, more preferably. It is 0.35 N/100 mm or less, more preferably 0.3 N/100 mm or less. When the peeling force is 0.4 N/100 mm or less, the back contact film of the present invention can be more easily peeled off from the separator. The peel force is preferably as small as possible, but is, for example, 0.01 N/100 mm or more.

[Dicing tape-integrated semiconductor back adhesion film]
The back adhesive film of the present invention includes a dicing tape having a laminated structure including a substrate and an adhesive layer, and the back adhesive film of the present invention peelably adhered to the adhesive layer of the dicing tape. In other words, it may be used as a dicing tape-integrated semiconductor back adhesion film (sometimes referred to as "dicing tape-integrated back adhesion film"). The dicing tape-integrated back contact film may be referred to as "the dicing tape-integrated back contact film of the present invention". When the back contact film of the present invention is used as a dicing tape-integrated back contact film, wrinkles can be made less likely to occur when attached to a substrate and a frame.

The dicing tape in the dicing tape-integrated back contact film preferably has a planar projected area larger than that of the back contact film of the present invention. In this case, during dicing, a frame for dicing can be attached to the surface of the pressure-sensitive adhesive layer.

The dicing tape preferably has a rounded portion in its plan projection shape. In this case, the dicing tape-integrated back contact film of the present invention can be more easily peeled off from the separator.

When the planar projected shape of the dicing tape has a curved portion, the radius of curvature R2 of the rounded portion is not particularly limited, but is preferably 0.5 to 50 mm, more preferably 0.7 to 40 mm, and still more preferably 0.7 mm to 40 mm. 9 to 30 mm. When the curvature radius R2 is 0.5 mm or more, wrinkles are less likely to occur during peeling even if the planar projected area is relatively large. Further, when the radius of curvature R2 is 50 mm or less, the waste portion after use can be minimized.

The ratio [R2/R1] of the radius of curvature R2 to the radius of curvature R1 is preferably 0.5-100, more preferably 0.8-50, still more preferably 1-30. If the above ratio is within the above range, the frame can be fixed without causing waste in the dicing tape, and even if there is a difference in the area of the dicing tape and the back adhesion film, the back adhesion is achieved in the bonding process of the back adhesion film and the dicing tape. The film is less likely to wrinkle, and the dicing tape is less likely to be wrinkled in the process of laminating the substrate or frame. Moreover, it is excellent in workability.

Assuming that the planar projection shape having the rounded portion of the dicing tape and the back adhesive film of the present invention is a shape in which at least one corner is rounded, before the at least one corner is rounded is sometimes referred to as a "planar projection shape without rounded portions". It is preferable that the planar projection shape of the dicing tape with no rounded portion formed thereon is similar to the planar projected shape with no rounded portion formed on the back contact film of the present invention. In this case, wrinkles are less likely to occur when peeled from the separator. Also, the portion of the dicing tape that is discarded after use can be minimized. When the planar projected shape of the unformed rounded portion in the back adhesive film and the dicing tape of the present invention is a similar shape, the planar projected shape of the unformed rounded portion is, for example, a polygon.

When the planar projected shape without rounded portions is a similar shape, the similarity ratio [former/latter] in the similar shape is not particularly limited, but is preferably 1.01 or more, more preferably 1.03 or more. , and more preferably 1.05 or more. When the similarity ratio is 1.01 or more, the adhesive layer of the dicing tape can be used as it is for dicing after the dicing frame is adhered onto the adhesive layer. The similarity ratio is, for example, 2.0 or less, preferably 1.8 or less.

When the planar projected shape of the dicing tape has a rounded portion and the planar projected shape without the rounded portion is similar, the curved portion and the rounded portion X in the dicing tape are similar shapes without the curved portion. Corresponding angles are preferred.

In the dicing tape-integrated back adhesive film, the peel strength (peel angle 180°, peel speed 300 mm/min, after curing) of the back adhesive film of the present invention to the pressure-sensitive adhesive layer is not particularly limited, but is 10 N/20 mm or less. is preferred, and more preferably 5 N/20 mm or less. When the peeling force is 10 N/20 mm or less, the chip can be easily picked up from the dicing tape during pickup. The peel force is preferably 0.02 N/20 mm or more, more preferably 0.05 N/20 mm or more. When the peeling force is 0.02 N/20 mm or more, the back adhesive film after curing becomes difficult to peel from the dicing tape during dicing.

An embodiment of the dicing tape-integrated back contact film of the present invention will be described with reference to FIGS. FIG. 3 is a top view (planar projection view) showing an embodiment of the dicing tape-integrated back contact film of the present invention. FIG. 4 is a top view (planar projection view) of the dicing tape-integrated back contact film of the present invention shown in FIG. 3, viewed from the back contact film side. FIG. 5 is a front cross-sectional view of the dicing tape-integrated back contact film 1 of the present invention shown in FIG. As shown in FIG. 3, a plurality of dicing tape-integrated back contact films 1 are arranged in one direction F on a long separator 30 . As shown in FIG. 4, the planar projection shape of the back contact film 10 in the dicing tape-integrated back contact film 1 is 10a in which all the corners of a square, which is a planar projection shape with no rounded portion formed, are rounded portions X. Shapes machined to 10b, 10c, and 10d. The planar projected shape of the dicing tape 20 in the dicing tape-integrated back adhesive film 1 is a square, which is a planar projected shape with no rounded portions, and all the corners are rounded portions 20a, 20b, 20c, and 20d. It is a machined shape. In the dicing tape-integrated back contact film 1 of the present invention, the back contact film 10 and the dicing tape 20 have similar shapes in plan projection shape without rounded portions formed. When peeling the dicing tape-integrated back adhesion film 1 of the present invention from the long separator 30, for example, the long separator 30 is conveyed in one direction F, and the dicing tape-integrated back adhesion film 1 of the present invention is removed. The long separator 30 is warped to the side opposite to the side of the dicing tape-integrated back adhesion film 1 of the present invention so as to be peeled off from the end on the one direction F side, whereby the dicing tape of the present invention is peeled off from the end. The integrated back contact film 1 is peeled off.

(Base material)
The base material in the dicing tape is an element that functions as a support in the dicing tape or the dicing tape-integrated back adhesive film. Substrates include, for example, plastic substrates (especially plastic films). The substrate may be a single layer or a laminate of the same or different substrates.

Examples of the resin constituting the plastic substrate include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, and homopolypropylene. , polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene- Polyolefin resins such as butene copolymers and ethylene-hexene copolymers; polyurethanes; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); polycarbonates; polyimides; polyamide such as aramid and wholly aromatic polyamide; polyphenyl sulfide; fluorine resin; polyvinyl chloride; polyvinylidene chloride; cellulose resin; Good heat shrinkability is secured in the base material, and in the expansion process for widening the separation distance between semiconductor chips after dicing, it is easy to maintain the chip separation distance using a dicing tape or partial heat shrinkage of the base material. From a viewpoint, the substrate preferably contains an ethylene-vinyl acetate copolymer or polyvinyl chloride as a main component. In addition, let the main component of a base material be a component which occupies the largest mass ratio in a structural component. Only one kind of the above resin may be used, or two or more kinds thereof may be used. When the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer as described later, the substrate preferably has radiation transparency.

When the substrate is a plastic film, the plastic film may be non-oriented, or may be oriented in at least one direction (uniaxial direction, biaxial direction, etc.). When oriented in at least one direction, the plastic film is heat shrinkable in at least one direction. If the substrate or frame is heat-shrinkable, even if wrinkles occur when the substrates or frames are bonded together, the wrinkles can be reduced by heat-shrinking in the subsequent heat treatment. In order for the substrate and the dicing tape to have isotropic heat shrinkability, the substrate is preferably a biaxially oriented film. The plastic film oriented in at least one direction can be obtained by stretching an unstretched plastic film in at least one direction (uniaxial stretching, biaxial stretching, etc.). The base material and the dicing tape preferably have a thermal shrinkage rate of 1 to 30%, more preferably 2 to 25%, and more preferably 2 to 25% in a heat treatment test performed at a heating temperature of 100 ° C. and a heating time of 60 seconds. It is preferably 3 to 20%, particularly preferably 5 to 20%. It is preferable that the above-mentioned thermal shrinkage rate is the thermal shrinkage rate in at least one of the MD direction and the TD direction. In addition, the above heat shrinkage rate is obtained by cutting out a strip-shaped test piece having a length of 150 mm in the MD direction and a width of 25 mm from the dicing tape, and inserting two marked lines at intervals of 100 mm on the test piece. Before measuring the distance between the marked lines), then using a known tensile tester, suspend the test piece on the pole, heat the test piece at 100 ° C. for 60 seconds in a dryer, then cool it, The interval (inter-marked distance after heating) can be measured and obtained as the inter-marked distance (%) after heating with respect to the inter-marked distance before heating.

The surface of the adhesive layer side of the base material may be subjected to corona discharge treatment, plasma treatment, sand mat processing, ozone exposure treatment, flame exposure treatment, high voltage shock treatment, etc. for the purpose of enhancing adhesion and retention with the adhesive layer. Physical treatments such as exposure treatments and ionizing radiation treatments; chemical treatments such as chromic acid treatments; In addition, in order to impart antistatic properties, a conductive deposition layer containing metals, alloys, oxides thereof, or the like may be provided on the substrate surface. The surface treatment for enhancing adhesion is preferably applied to the entire surface of the adhesive layer side of the substrate.

The thickness of the substrate is preferably 40 μm or more, more preferably 50 μm or more, and still more preferably 50 μm or more, from the viewpoint of ensuring strength for the substrate to function as a support in the dicing tape and the dicing tape-integrated back adhesive film. is at least 55 μm, particularly preferably at least 60 μm. From the viewpoint of achieving appropriate flexibility in the dicing tape and the dicing tape-integrated back adhesion film, the thickness of the substrate is preferably 200 μm or less, more preferably 180 μm or less, and even more preferably 150 μm or less. be.

(Adhesive layer)
The adhesive layer in the dicing tape is an adhesive layer that can intentionally reduce the adhesive force (adhesive force reduction type adhesive layer) by external action during the use process of the dicing tape integrated back adhesive film. It may be an adhesive layer (adhesive force non-reducing type adhesive layer) whose adhesive force is hardly or not reduced by an external action during the use process of the dicing tape-integrated back adhesive film. It can be appropriately selected according to the method, conditions, etc., for singulating the workpiece to be singulated using the dicing tape-integrated back contact film. The pressure-sensitive adhesive layer may have a single layer structure or a multilayer structure.

When the adhesive layer is an adhesive layer that can reduce adhesive strength, the adhesive layer exhibits relatively high adhesive strength and relatively low adhesive strength during the manufacturing process and use process of the back adhesive film with integrated dicing tape. It is possible to properly use the state indicating the force. For example, when the back adhesive film is attached to the adhesive layer of the dicing tape in the manufacturing process of the dicing tape-integrated back adhesive film, or when the dicing tape-integrated back adhesive film is used in the dicing process, the adhesive layer While it is possible to suppress or prevent the back adhesion film from floating from the adhesive layer by utilizing the state of exhibiting high adhesive strength, after that, the semiconductor chip is removed from the dicing tape of the back adhesion film integrated with the dicing tape. In the pick-up process for picking up, the pick-up can be easily performed by reducing the adhesive strength of the adhesive layer.

Examples of the adhesive that forms such an adhesive force-reducing adhesive layer include a radiation-curable adhesive and a heat-foamable adhesive. As the adhesive for forming the adhesive force-reducing adhesive layer, one kind of adhesive may be used, or two or more kinds of adhesives may be used.

As the radiation-curable adhesive, for example, an adhesive that is cured by irradiation with electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, or X-rays can be used. Adhesives (ultraviolet curable adhesives) can be particularly preferably used.

As the radiation-curable adhesive, for example, an additive containing a base polymer such as an acrylic polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond type radiation curable adhesives.

The acrylic polymer is a polymer containing structural units derived from an acrylic monomer (a monomer component having a (meth)acryloyl group in the molecule) as a structural unit of the polymer. The above acrylic polymer is preferably a polymer containing the largest proportion of constituent units derived from (meth)acrylic acid ester in terms of mass ratio. In addition, acrylic polymer may use only 1 type, and may use 2 or more types.

Examples of the (meth)acrylic acid esters include hydrocarbon group-containing (meth)acrylic acid esters that may have an alkoxy group. As the hydrocarbon group-containing (meth)acrylic acid ester optionally having an alkoxy group, the hydrocarbons optionally having an alkoxy group exemplified as the constituent units of the acrylic resin that the adhesive layer may contain Group-containing (meth)acrylic acid esters may be mentioned. The hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group may be used alone or in combination of two or more. As the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group, 2-ethylhexyl acrylate and lauryl acrylate are preferable. In order to appropriately express the basic properties such as adhesiveness of the (meth)acrylic acid ester containing a hydrocarbon group which may have an alkoxy group in the adhesive layer, all the monomer components for forming the acrylic polymer , the ratio of the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group is preferably 40% by mass or more, more preferably 60% by mass or more.

The acrylic polymer is derived from other monomer components that can be copolymerized with the hydrocarbon group-containing (meth)acrylic acid ester that may have an alkoxy group for the purpose of improving cohesive strength, heat resistance, etc. It may contain a structural unit that Examples of the other monomer component include other monomers exemplified as structural units of the acrylic resin that the adhesive layer may contain. Only one kind of the other monomer component may be used, or two or more kinds thereof may be used. In order to appropriately express the basic properties such as adhesiveness of the (meth)acrylic acid ester containing a hydrocarbon group which may have an alkoxy group in the adhesive layer, all the monomer components for forming the acrylic polymer , the total ratio of the other monomer components is preferably 60% by mass or less, more preferably 40% by mass or less.

The acrylic polymer may contain a structural unit derived from a polyfunctional monomer copolymerizable with the monomer component forming the acrylic polymer in order to form a crosslinked structure in the polymer skeleton. Examples of the polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, penta Erythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylate (e.g. polyglycidyl (meth)acrylate), polyester Examples thereof include monomers having a (meth)acryloyl group and other reactive functional groups in the molecule such as (meth)acrylate and urethane (meth)acrylate. Only one kind of the polyfunctional monomer may be used, or two or more kinds thereof may be used. In order to appropriately express the basic properties such as adhesiveness of the (meth)acrylic acid ester containing a hydrocarbon group which may have an alkoxy group in the adhesive layer, all the monomer components for forming the acrylic polymer is preferably 40% by mass or less, more preferably 30% by mass or less.

Acrylic polymers are obtained by subjecting one or more monomer components including acrylic monomers to polymerization. Polymerization methods include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.

The acrylic polymer can be obtained by polymerizing raw material monomers for forming it. Polymerization techniques include, for example, solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization. The mass average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably 200,000 to 3,000,000. When the weight average molecular weight is 100,000 or more, the amount of low-molecular-weight substances in the pressure-sensitive adhesive layer tends to be small, and contamination of the back adhesive film, semiconductor wafer, and the like can be further suppressed.

The pressure-sensitive adhesive layer or the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer may contain a cross-linking agent. For example, when an acrylic polymer is used as the base polymer, the acrylic polymer can be crosslinked to further reduce low-molecular-weight substances in the pressure-sensitive adhesive layer. Also, the mass average molecular weight of the acrylic polymer can be increased. Examples of the cross-linking agent include polyisocyanate compounds, epoxy compounds, polyol compounds (such as polyphenol compounds), aziridine compounds, and melamine compounds. When a cross-linking agent is used, the amount used is preferably about 5 parts by mass or less, more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the base polymer.

Examples of the radiation-polymerizable monomer component include urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta ( meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate and the like. Examples of the radiation-polymerizable oligomer component include various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene oligomers, and those having a molecular weight of about 100 to 30,000 are preferred. The content of the radiation-polymerizable monomer component and oligomer component in the radiation-curable adhesive that forms the adhesive layer is, for example, 5 to 500 parts by mass, preferably 40 to 150 parts by mass, with respect to 100 parts by mass of the base polymer. It is about a part by mass. Further, as the additive-type radiation-curable pressure-sensitive adhesive, for example, one disclosed in JP-A-60-196956 may be used.

As the radiation-curable pressure-sensitive adhesive, an internal radiation-curable adhesive containing a base polymer having a radiation-polymerizable carbon-carbon double bond or other functional group in the polymer side chain, in the polymer main chain, or at the polymer main chain end. Also included are adhesives. The use of such an internal radiation-curable adhesive tends to suppress unintended changes in adhesive properties over time due to migration of low-molecular-weight components within the formed adhesive layer.

An acrylic polymer is preferable as the base polymer contained in the internal radiation-curable pressure-sensitive adhesive. As a method for introducing a radiation polymerizable carbon-carbon double bond into an acrylic polymer, for example, a raw material monomer containing a monomer component having a first functional group is polymerized (copolymerized) to obtain an acrylic polymer. After that, a compound having a second functional group capable of reacting with the first functional group and a radiation polymerizable carbon-carbon double bond is added to an acrylic polymer while maintaining the radiation polymerizability of the carbon-carbon double bond. Condensation reaction or addition reaction method can be used.

Combinations of the first functional group and the second functional group include, for example, a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, An isocyanate group, a hydroxy group, and the like can be mentioned. Among these, a combination of a hydroxy group and an isocyanate group, and a combination of an isocyanate group and a hydroxy group are preferred from the viewpoint of ease of reaction tracking. Among them, it is technically difficult to produce a polymer having a highly reactive isocyanate group, and on the other hand, from the viewpoint of ease of production and availability of an acrylic polymer having a hydroxy group, the first functional group is A preferred combination is a hydroxy group and the second functional group is an isocyanate group. Compounds having an isocyanate group and a radiation-polymerizable carbon-carbon double bond, that is, radiation-polymerizable unsaturated functional group-containing isocyanate compounds include, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- α,α-dimethylbenzyl isocyanate and the like. Further, as the acrylic polymer having a hydroxy group, those containing structural units derived from the above-mentioned hydroxy group-containing monomers and ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. are mentioned.

The radiation-curable adhesive preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, camphorquinone, halogenated ketone, acylphosphinate, acylphosphonate and the like. Examples of the α-ketol compounds include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxy propiophenone, 1-hydroxycyclohexylphenyl ketone, and the like. Examples of the acetophenone compounds include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio)-phenyl]-2 -Morpholinopropane-1 and the like. Examples of the benzoin ether compounds include benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether. Examples of the ketal compounds include benzyl dimethyl ketal. Examples of the aromatic sulfonyl chloride compounds include 2-naphthalenesulfonyl chloride. Examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime. Examples of the benzophenone-based compounds include benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone. Examples of the thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropyl. thioxanthone and the like. The content of the photopolymerization initiator in the radiation-curable adhesive is, for example, 0.05 to 20 parts by weight with respect to 100 parts by weight of the base polymer.

The heat-expandable pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (foaming agent, heat-expandable microspheres, etc.) that foams or expands when heated. Examples of the foaming agent include various inorganic foaming agents and organic foaming agents. Examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, and azides. Examples of the organic foaming agent include alkane hydrochlorides such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; and paratoluene. Hydrazine compounds such as sulfonyl hydrazide, diphenylsulfone-3,3'-disulfonyl hydrazide, 4,4'-oxybis(benzenesulfonylhydrazide), allylbis(sulfonylhydrazide); p-toluylenesulfonyl semicarbazide, 4,4'- Semicarbazide compounds such as oxybis (benzenesulfonyl semicarbazide); triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; N,N'-dinitrosopentamethylenetetramine, N,N'-dimethyl- Examples include N-nitroso compounds such as N,N'-dinitrosoterephthalamide. Examples of the heat-expandable microspheres include microspheres having a structure in which a substance that easily gasifies and expands upon heating is encapsulated in the shell. Isobutane, propane, pentane, and the like are examples of substances that easily gasify and expand when heated. Thermally expandable microspheres can be produced by encapsulating a substance that is easily gasified and expanded by heating in a shell-forming substance by a coacervation method, an interfacial polymerization method, or the like. As the shell-forming substance, a substance exhibiting thermal melting properties and a substance capable of bursting due to the action of thermal expansion of the enclosed substance can be used. Examples of such substances include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, and the like.

Examples of the non-reducing adhesive layer include a pressure-sensitive adhesive layer. In the pressure-sensitive adhesive layer, an adhesive layer formed from the radiation-curable adhesive described above with respect to the adhesive force-reducing adhesive layer is cured by irradiation in advance and has a certain adhesive force. An adhesive layer is included. As the adhesive that forms the non-adhesion-reducing adhesive layer, one kind of adhesive may be used, or two or more kinds of adhesives may be used. Further, the entire adhesive layer may be a non-adhesive force-reducing adhesive layer, or a part thereof may be a non-adhesive force-reducing adhesive layer. For example, when the adhesive layer has a single-layer structure, the entire adhesive layer may be a non-adhesive force-reducing adhesive layer, or a specific portion of the adhesive layer (for example, a dicing frame to be attached) A region outside the central region) is a non-adhesive force-reducing adhesive layer, and other portions (for example, a central region that is a semiconductor wafer divided body or a semiconductor wafer adhesion target region) It may be a pressure-sensitive adhesive layer capable of reducing the pressure-sensitive adhesive force. Further, when the adhesive layer has a laminated structure, all the adhesive layers in the laminated structure may be non-adhesive pressure-reducing adhesive layers, or some of the adhesive layers in the laminated structure may have non-adhesive strength. It may be a reduced pressure-sensitive adhesive layer.

The pressure-sensitive adhesive layer (irradiated radiation-curable pressure-sensitive adhesive layer) formed by pre-curing the pressure-sensitive adhesive layer (radiation-unexposed radiation-curable pressure-sensitive adhesive layer) formed from a radiation-curable pressure-sensitive adhesive by irradiation with radiation Even if the adhesive strength is reduced by irradiation, it exhibits adhesiveness due to the contained polymer component, and it is possible to exhibit the minimum adhesive strength required for the adhesive layer of the dicing tape in the dicing process or the like. When a radiation-cured pressure-sensitive adhesive layer that has been exposed to radiation is used, the entire pressure-sensitive adhesive layer may be the irradiated radiation-curing pressure-sensitive adhesive layer in the surface spreading direction of the pressure-sensitive adhesive layer, and a part of the pressure-sensitive adhesive layer may be It may be a radiation-curable pressure-sensitive adhesive layer that has been exposed to radiation, and the other portion may be a radiation-curable pressure-sensitive adhesive layer that has not been exposed to radiation. In this specification, the term "radiation-curable pressure-sensitive adhesive layer" refers to a pressure-sensitive adhesive layer formed from a radiation-curable pressure-sensitive adhesive. It includes both the radiation-cured radiation-curable pressure-sensitive adhesive layer after the agent layer has been cured by irradiation.

As the pressure-sensitive adhesive for forming the pressure-sensitive pressure-sensitive adhesive layer, a known or commonly used pressure-sensitive pressure-sensitive adhesive can be used, and an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferably used. can be done. When the pressure-sensitive adhesive layer contains an acrylic polymer as a pressure-sensitive adhesive, the acrylic polymer may be a polymer containing the structural unit derived from (meth)acrylic acid ester as the largest structural unit in terms of mass ratio. preferable. As the acrylic polymer, for example, the acrylic polymer described as the acrylic polymer that can be contained in the additive-type radiation-curable pressure-sensitive adhesive can be employed.

The pressure-sensitive adhesive layer or the pressure-sensitive adhesive that forms the pressure-sensitive adhesive layer includes, in addition to the components described above, known or commonly used pressure-sensitive adhesive layers such as cross-linking accelerators, tackifiers, anti-aging agents, and coloring agents (pigments, dyes, etc.). Additives used in may be blended. Examples of the coloring agent include compounds that are colored by exposure to radiation. When a compound that is colored by irradiation is contained, only the irradiated portion can be colored. The compound that is colored by exposure to radiation is a compound that is colorless or light-colored before exposure to radiation and becomes colored by exposure to radiation, and examples thereof include leuco dyes. The amount of the compound that is colored by exposure to radiation is not particularly limited and can be appropriately selected.

The thickness of the pressure-sensitive adhesive layer is not particularly limited. From the viewpoint of balancing, it is preferably about 1 to 50 μm, more preferably 2 to 30 μm, and still more preferably 5 to 25 μm.

The dicing tape-integrated back contact film of the present invention preferably has a size and shape corresponding to a semiconductor wafer to be processed in the manufacturing process of a semiconductor device or an aggregate of semiconductor chips obtained by separating the semiconductor wafer into individual pieces. The planar projected area of the dicing tape-integrated back adhesive film of the present invention is, for example, preferably 22725 mm ² or more, more preferably 23457 mm ² or more, and still more preferably 32724 mm ² or more. The planar projected area is, for example, 800000 mm ² or less, preferably 720000 mm ² or less. In the dicing tape-integrated back contact film of the present invention, when the planar projected area of the dicing tape is the same as or larger than the planar projected area of the back contact film of the present invention, the planar projection of the dicing tape-integrated back contact film of the present invention is The area is the same as the plane projected area of the dicing tape.

The back contact film of the present invention and the dicing tape-integrated back contact film of the present invention may have a separator on the back contact film surface. Specifically, each back contact film of the present invention or each dicing tape-integrated back contact film may be in the form of a sheet having a separator, as shown in FIGS. Alternatively, the separator may be elongated, a plurality of back contact films or a plurality of dicing tape-integrated back contact films may be placed thereon, and the separator may be wound to form a roll. The separator is an element for covering and protecting the back contact film of the present invention (the surface of the back contact film 10 in the embodiments shown in FIGS. 1, 2, 3, and 5), and the back contact film of the present invention or the is peeled off from the sheet when using the dicing tape-integrated back adhesion film. Examples of the separator include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film and paper surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent.

The thickness of the separator is, for example, 10-200 μm, preferably 15-150 μm, more preferably 20-100 μm. When the thickness is 10 μm or more, the separator is less likely to break due to cuts during processing of the separator. When the thickness is 200 μm or less, the dicing tape-integrated back contact film can be easily peeled off from the separator when it is attached to the substrate and frame.

[Method for producing back adhesion film]
The back contact film 10, which is one embodiment of the back contact film of the present invention, is produced, for example, as follows.

In producing the back contact film 10 shown in FIGS. 1 and 2, first, the adhesive layer 11 and the laser mark layer 12 are separately produced. The adhesive layer 11 is formed by applying a resin composition (adhesive composition) for forming the adhesive layer 11 on the separator to form a resin composition layer, and then removing the solvent and curing by heating. It can be made by solidifying the material layer. In producing the adhesive layer 11, the heating temperature is, for example, 90 to 150° C., and the heating time is, for example, 1 to 2 minutes. Examples of methods for applying the resin composition include roll coating, screen coating, and gravure coating. On the other hand, the laser mark layer 12 is formed by coating the resin composition for forming the laser mark layer 12 on the separator to form a resin composition layer, and then removing the solvent and curing by heating to solidify the resin composition layer. It can be made by In producing the laser mark layer 12, the heating temperature is, for example, 90 to 160° C., and the heating time is, for example, 2 to 4 minutes. As described above, the adhesive layer 11 and the laser mark layer 12 can be produced in a form in which each is accompanied by a separator. Then, the exposed surfaces of the adhesive layer 11 and the laser mark layer 12 are adhered to each other, and punching is performed so as to obtain the desired planar projected shape and planar projected area, thereby forming the adhesive layer 11 and the laser mark layer 12 . A back contact film 10 having a laminated structure of

[Manufacturing method of dicing tape-integrated back adhesion film]
The dicing tape-integrated back adhesion film 1, which is one embodiment of the dicing tape-integrated back adhesion film of the present invention, is produced, for example, as follows.

The dicing tape 20 of the dicing tape-integrated back adhesive film 1 shown in FIGS. For example, the base material 21 made of resin can be obtained by forming a film by a known or commonly used film forming method. Examples of the film-forming method include a calendar film-forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, a dry lamination method, and the like. The substrate 21 is subjected to surface treatment as necessary. In the formation of the adhesive layer 22, for example, after preparing an adhesive composition (adhesive) for forming the adhesive layer, first, the composition is applied on the substrate 21 or on the separator to form an adhesive composition. form a layer. Examples of methods for applying the pressure-sensitive adhesive composition include roll coating, screen coating, gravure coating, and the like. Next, the pressure-sensitive adhesive composition layer is heated to remove the solvent, if necessary, and to cause a cross-linking reaction, if necessary. The heating temperature is, for example, 80 to 150° C., and the heating time is, for example, 0.5 to 5 minutes. When the pressure-sensitive adhesive layer 22 is formed on the separator, the pressure-sensitive adhesive layer 22 with the separator is attached to the base material 21, and then the desired planar projection shape (for example, a shape similar to the back adhesive film 10) is formed. shape) and planar projected area, and then the separator is peeled off. As a result, the dicing tape 20 having a laminated structure of the substrate 21 and the adhesive layer 22 is produced.

Next, the laser mark layer 12 side of the rear adhesion film 10 obtained above is adhered to the adhesive layer 22 side of the dicing tape 20 . The bonding temperature is, for example, 30 to 50° C., and the bonding pressure (linear pressure) is, for example, 0.1 to 20 kgf/cm. When the pressure-sensitive adhesive layer 22 is the radiation-curable pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer 22 may be irradiated with radiation such as ultraviolet rays before the bonding, or the substrate 21 may be exposed after the bonding. The pressure-sensitive adhesive layer 22 may be irradiated with radiation such as ultraviolet rays from the side. Alternatively, such radiation irradiation may not be performed in the manufacturing process of the dicing tape-integrated back adhesive film 1 (in this case, the adhesive layer 22 is cured by radiation during the use process of the dicing tape-integrated back adhesive film 1. Is possible). When the adhesive layer 22 is of an ultraviolet curing type, the amount of ultraviolet irradiation for curing the adhesive layer 22 is, for example, 50 to 500 mJ/cm ² . In the dicing tape-integrated back adhesive film 1, the area (irradiated area R) where irradiation is performed as a measure to reduce the adhesive force of the adhesive layer 22 is, for example, as shown in FIG. This is the area within the mating area excluding its periphery.

As described above, for example, the back contact film 10 shown in FIGS. 1 and 2 and the dicing tape-integrated back contact film 1 shown in FIGS. 3 to 5 can be produced.

[Method for manufacturing a semiconductor device]
A semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention. Specifically, a step of attaching the back surface of the workpiece to the back surface adhesive film side (especially the adhesive layer side) of the dicing tape-integrated back surface adhesive film of the present invention (sticking step), and cutting an object including at least the workpiece. A semiconductor device can be manufactured by a manufacturing method including a step of obtaining individualized semiconductor chips (a dicing step). 6 to 9 show steps in a method of manufacturing a semiconductor device using the dicing tape-integrated back contact film 1 shown in FIGS.

(Affixing process)
In the sticking step, the work to be stuck on the back contact film side (especially the adhesive layer side) of the dicing tape-integrated back contact film of the present invention may be a semiconductor wafer or a plurality of workpieces such as those shown in FIG. A sealed body in which a back surface and/or a side surface of each semiconductor chip is sealed with a resin is exemplified. Then, for example, as shown in FIG. 6B, the sealing body 40 held by the wafer processing tape T1 is attached to the back adhesive film 10 (in particular, the adhesive layer 11) of the dicing tape integrated back adhesive film 1. Paste against. In the sealing body 40 , the side surfaces of the semiconductor chip 41 are sealed with a sealing resin 42 . A substrate 43 having bumps 44 for flip-chip mounting is connected to the surface of the sealing body 40 . Thereafter, as shown in FIG. 6C, the wafer processing tape T1 is peeled off from the sealing body 40. Next, as shown in FIG.

(Thermal curing process)
When the back contact film of the present invention has a thermosetting adhesive layer, it is preferable to have a step of thermally curing the adhesive layer in the back contact film (thermosetting step) after the attaching step. For example, in the thermosetting step, heat treatment is performed to thermoset the adhesive layer 11 . The heating temperature is preferably 80 to 200°C, more preferably 100 to 150°C. The heating time is preferably 0.5 to 5 hours, more preferably 1 to 3 hours. Specifically, the heat treatment is performed at 120° C. for 2 hours, for example. In the heat curing step, the heat curing of the adhesive layer 11 increases the adhesion between the back adhesion film 10 of the dicing tape-integrated back adhesion film 1 and the sealing body 40, and the dicing tape-integrated back adhesion film 1 and its back surface are formed. The fixing and holding force of the adhesive film 10 against the sealing body is increased. In addition, when the back contact film of the present invention does not have a thermosetting adhesive layer, it may be subjected to a baking treatment at, for example, 50 to 100° C. for several hours, thereby improving the wettability of the adhesive layer interface. and the fixing and holding force for the sealing body is increased.

(Laser marking process)
When the back adhesion film of the present invention has a laser mark layer, the method for manufacturing a semiconductor device includes a step of performing laser marking by irradiating the laser mark layer with a laser from the substrate side of the dicing tape (laser marking step). It is preferred to have The laser marking process is preferably performed after the thermosetting process. Specifically, in the laser marking process, for example, laser marking is performed by irradiating the laser mark layer 12 with a laser from the base material 21 side of the dicing tape 20 . By this laser marking process, various information such as character information and graphic information can be marked on each semiconductor chip. In the laser marking process, a plurality of semiconductor chips can be collectively and efficiently laser marked in one laser marking process. Examples of lasers used in the laser marking process include gas lasers and solid-state lasers. Examples of gas lasers include carbon dioxide lasers (CO ₂ lasers) and excimer lasers. Examples of solid-state lasers include Nd:YAG lasers.

(Dicing process)
In the dicing process, for example, as shown in FIG. 7, a frame (dicing frame) 51 for pressing and fixing the dicing tape onto the adhesive layer of the dicing tape-integrated back adhesive film is attached, and a holder 52 of the dicing machine is attached. After being held by the dicing machine, cutting is performed by a dicing blade provided in the dicing machine. In FIG. 7, the cut portion is schematically represented by a thick line. In the dicing process, the sealing body 40 is separated into individual semiconductor chips 41, and the back contact film 10 of the dicing tape-integrated back contact film 1 is cut into small pieces 10'. As a result, the sealing body 40' with the film 10' for forming the adhesion film on the back surface of the chip, that is, the sealing body 40' with the film 10' is obtained.

(Radiation irradiation step)
The method for manufacturing a semiconductor device may include a step of irradiating the pressure-sensitive adhesive layer with radiation from the substrate side (radiation irradiation step). When the pressure-sensitive adhesive layer of the dicing tape is a layer formed of a radiation-curable pressure-sensitive adhesive, instead of the above-described radiation irradiation in the manufacturing process of the dicing tape-integrated back adhesive film, after the above-described dicing step, The pressure-sensitive adhesive layer may be irradiated with radiation such as ultraviolet rays from the substrate side. The dose is, for example, 50-500 mJ/cm ² . The area where the dicing tape-integrated back adhesive film is irradiated as a measure to reduce the adhesive force of the adhesive layer (irradiated area R shown in FIG. 5) is, for example, the peripheral edge of the adhesive layer in the back adhesive film bonding area. This is the area excluding the part.

(Pickup process)
It is preferable that the method for manufacturing a semiconductor device includes a step of picking up the sealing body with the film (pickup step). The pick-up step includes, for example, a cleaning step of washing the sealing body 40' side of the dicing tape 20 with the sealing body 40' with the film 10' using a cleaning liquid such as water, or a cleaning process of cleaning the sealing body 40' with the film 10'. An expansion process for widening the separation distance between ' may be performed after passing through if necessary. For example, as shown in FIG. 8, the sealing body 40' with the film 10' is picked up from the dicing tape 20. Then, as shown in FIG. For example, in a state where the dicing tape 20 with the dicing frame 51 is held by the holder 52 of the apparatus, the pin of the pick-up mechanism is attached to the sealing body 40' with the film 10' to be picked up at the lower side of the dicing tape 20 in the drawing. After the member 53 is lifted and pushed up through the dicing tape 20 , it is sucked and held by the suction jig 54 . In the pick-up process, the pushing speed of the pin member 53 is, for example, 1 to 100 mm/sec, and the pushing amount of the pin member 53 is, for example, 50 to 3000 μm.

(Flip chip mounting process)
It is preferable that the manufacturing method of the semiconductor device includes a process (flip-chip process) of flip-chip mounting the sealing body 40' with the film after the pick-up process. For example, as shown in FIG. 9, a sealing body 40' with a film 10' is flip-chip mounted on a mounting board 61. As shown in FIG. Examples of the mounting board 61 include a lead frame, a TAB (Tape Automated Bonding) film, and a wiring board. By flip chip mounting, the semiconductor chip 41 is electrically connected to the mounting substrate 61 via the bumps 44 . Specifically, the substrate 43 (electrode pad) that the semiconductor chip 41 has on the circuit forming surface side and the terminal portion (not shown) of the mounting substrate 61 are electrically connected via the bumps 44 . The bumps 44 are solder bumps, for example. A thermosetting underfill agent 63 is interposed between the chip 41 and the mounting board 61 .

As described above, a semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention.

EXAMPLES The present invention will be described in more detail with reference to Examples below, but the present invention is not limited to these Examples.

Example 1
<Preparation of back adhesion film>
(laser mark layer)
Acrylic resin (trade name “Teisan Resin SG-P3”, mass average molecular weight 850,000, glass transition temperature Tg 12 ° C., manufactured by Nagase ChemteX Corporation) 100 parts by mass, epoxy resin E ₁ (trade name “KI- 3000-4", manufactured by Tohto Kasei Co., Ltd.), 20 parts by mass of epoxy resin E ₂ (trade name "JER YL980", manufactured by Mitsubishi Chemical Corporation), and phenol resin (trade name "MEH7851-SS", Meiwa Kasei Co., Ltd.) 75 parts by mass, filler (trade name “SO-25R”, silica, average particle size 0.5 μm, Admatechs Co., Ltd.) 175 parts by mass, black dye (trade name “OIL BLACK BS", manufactured by Orient Chemical Industry Co., Ltd.) 15 parts by mass and 20 parts by mass of thermosetting catalyst Z ₁ (trade name "Curesol 2PZ" manufactured by Shikoku Kasei Kogyo Co., Ltd.) are added to methyl ethyl ketone and mixed to form a solid. A resin composition having a concentration of 30% by mass was obtained. Next, using an applicator, the resin composition is applied onto the silicone release-treated surface of a long PET separator (50 μm thick) having a silicone release-treated surface to form a resin composition layer. formed. Next, this composition layer was heated at 130° C. for 2 minutes to remove the solvent and thermally cured to prepare a 18 μm-thick laser mark layer (thermally cured layer) on a long PET separator.

(adhesive layer)
100 parts by mass of acrylic resin (trade name “Teisan Resin SG-P3”, manufactured by Nagase ChemteX Corporation) and 50 parts by mass of epoxy resin E ₁ (trade name “KI-3000-4”, manufactured by Tohto Kasei Co., Ltd.) , epoxy resin E ₂ (trade name “JER YL980”, manufactured by Mitsubishi Chemical Corporation) 20 parts by mass, phenol resin (trade name “MEH7851-SS”, manufactured by Meiwa Kasei Co., Ltd.) 75 parts by mass, filler (trade name "SO-25R", manufactured by Admatechs Co., Ltd.) 175 parts by mass, black dye (trade name "OIL BLACK BS", manufactured by Orient Chemical Industry Co., Ltd.) 15 parts by mass, and thermosetting catalyst Z ₂ (trade name " CUAZOL 2PHZ" (manufactured by Shikoku Kasei Co., Ltd.) and 7 parts by mass were added to methyl ethyl ketone and mixed to obtain a resin composition having a solid content concentration of 36% by mass. Next, using an applicator, the resin composition is applied onto the silicone release-treated surface of a long PET separator (50 μm thick) having a silicone release-treated surface to form a resin composition layer. formed. Next, this composition layer was heated at 130° C. for 2 minutes to remove the solvent, and an adhesive layer (thermosetting adhesive layer) having a thickness of 7 μm was formed on a long PET separator.

The laser mark layer on the elongated PET separator prepared as described above and the adhesive layer on the elongated PET separator were laminated using a laminator. Specifically, under the conditions of a temperature of 100° C. and a pressure of 0.85 MPa, the exposed surfaces of the laser mark layer and the adhesive layer were bonded together to produce a film. The film obtained as described above was shaped into a square (the ratio of the short side to the long side [long side/short side] is 1) in plan view, and all the corners have the radius of curvature shown in Table 1. It was punched so as to have a planar projected area of the shape processed into the shape. As described above, the back contact film of Example 1 was produced.

Examples 2-4
A back contact film was produced in the same manner as in Example 1, except that the planar projection shape was a square shape in which all corners were processed into rounded portions having the curvature radii shown in Table 1.

Example 5
In the same manner as in Example 1, except that the planar projection shape was a rectangle with a [long side/short side] of 10 and all corners were processed into rounded portions having a radius of curvature shown in Table 1. , to prepare a back adhesion film.

Comparative example 1
A back contact film was produced in the same manner as in Example 1, except that the corners of the square projected from the plane were not rounded.

Example 6
<Preparation of dicing tape>
100 parts by mass of 2-ethylhexyl acrylate, 19 parts by mass of 2-hydroxyethyl acrylate, and a polymerization initiator in a reaction vessel equipped with a cooling tube, a nitrogen inlet tube, a thermometer, and a stirring device. A mixture containing 0.4 parts by mass of benzoyl oxide and 80 parts by mass of toluene as a polymerization solvent was stirred at 60° C. for 10 hours under a nitrogen atmosphere (polymerization reaction). As a result, a polymer solution containing the acrylic polymer _P1 was obtained. Next, a mixture containing a polymer solution containing this acrylic polymer _P1 , 2-methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was heated at 50° C. for 60 hours in an air atmosphere. (addition reaction). In the reaction solution, the amount of MOI compounded was 12 parts by mass with respect to 100 parts by mass of the acrylic polymer P ₁ , and the amount of dibutyltin dilaurate compounded with respect to 100 parts by mass of the acrylic polymer P ₁ was 0.2 parts by mass. 06 parts by mass. By this addition reaction, a polymer solution containing an acrylic polymer _P2 having methacrylate groups in side chains was obtained. Next, in the polymer solution, 2 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization initiator ₍ Trade name "Irgacure 369" manufactured by BASF) and toluene were added and mixed to obtain an adhesive composition having a solid content concentration of 28% by mass. Next, an applicator was used to apply the pressure-sensitive adhesive composition onto the silicone release-treated surface of a PET separator (thickness: 50 μm) having a surface subjected to silicone release treatment to form a pressure-sensitive adhesive composition layer. . Next, this composition layer was heated at 120° C. for 2 minutes to remove the solvent, thereby forming a 30 μm-thick pressure-sensitive adhesive layer on the PET separator. Next, using a laminator, a polypropylene film (trade name “SC040PP1-BL”, thickness 40 μm, manufactured by Kurashiki Boseki Co., Ltd.) as a substrate was laminated on the exposed surface of the pressure-sensitive adhesive layer at room temperature. This bonded body was then stored at 23° C. for 72 hours. A dicing tape was produced as described above.

<Preparation of dicing tape integrated back adhesion film>
A back contact film was produced in the same manner as in Example 1, except that punching was performed so as to have the radius of curvature and planar projected area shown in Table 2. Next, after peeling the long PET separator on the laser mark layer side from the back adhesive film and peeling the PET separator from the dicing tape obtained as described above, the adhesive layer exposed on the dicing tape and the surface of the back adhesive film exposed by peeling off the PET separator were laminated using a laminator. Next, the dicing tape bonded to the back surface adhesive film in this way was treated with a rounded portion having a radius of curvature shown in Table 2 and a similarity ratio so that the center of the dicing tape and the center of the back surface adhesive film coincided. I punched it out to make it look like this. As described above, a dicing tape-integrated back contact film having a laminated structure including a dicing tape and a back contact film was produced. The back contact film and the dicing tape have similar planar projected shapes (squares) without rounded portions.

Examples 7-9, Reference Example 1, and Comparative Examples 2-3
In the same manner as in Example 6, except that the planar projection shape of each of the back adhesive film and the dicing tape was a shape in which all the corners of the square were processed into rounded portions having the radius of curvature shown in Table 2, A rear adhesion film and a dicing tape-integrated rear adhesion film were produced. Note that the back adhesive films of Comparative Examples 2 and 3 and the dicing tapes of Example 9 and Comparative Example 2 had a plan projection shape having no rounded portion. Further, the back contact film and the dicing tape in the back contact film integrated with the dicing tape have similar planar projected shapes (squares) with no radiused portions, and the similarity ratios are shown in Table 2, respectively.

Example 10
Regarding the planar projection shape of the dicing tape, all the corners of a rectangle having a diameter of 1.01 times the short side and 1.1 times the long side of the planar projection shape (square) with no curved portion formed on the back adhesion film A dicing tape-integrated back contact film was produced in the same manner as in Example 6, except that the shape was processed into a curved portion having the radius of curvature shown in Table 2.

<Evaluation>
The back contact films and the dicing tape-integrated back contact films obtained in Examples, Reference Examples, and Comparative Examples were evaluated as follows. Results are shown in Tables 1 and 2.

(1) Peeling evaluation 1 (discarded part of back adhesion film)
Regarding the back adhesion films obtained in Examples 1 to 5 and Comparative Example 1, the back adhesion film including the long PET separator and the rounded part having the curvature radius R1 shown in Table 1 was left, and the back adhesion film in the peripheral part was left. , and when the separator located on the opposite side of the long PET separator through the back adhesive film is peeled off and removed, the back adhesive film including the rounded portion is lifted and peeled off from the long PET separator. Regarding the presence or absence of wrinkles, the case where the back contact film was wrinkled was evaluated as x, and the case where it was not wrinkled was evaluated as ◯. The results are shown in the column of "peeling evaluation 1" in Table 1.

(2) Peeling evaluation 2 (back adhesion film)
For the back contact film including the rounded portion provided with the long PET separator obtained in the peel evaluation 1, one side of the back contact film was partially peeled from the long PET separator. At this time, x was given when the back contact film was wrinkled, and ◯ was given when it was not wrinkled. The results are shown in the column of "peeling evaluation 2" in Table 1.

(3) Peeling evaluation (back adhesion film integrated with dicing tape)
For the dicing tape-integrated back adhesion films obtained in Examples 6-10, Reference Example 1, and Comparative Examples 2-3, one side of the dicing tape-integrated back adhesion film was partially peeled from the long PET separator. At the same time, it was attached to one side of the frame, and continuously peeled off from the PET separator and attached to the frame by a roll. At this time, x was given when the dicing tape-integrated back contact film was wrinkled, and ◯ was given when it was not wrinkled. The results are shown in the column of "peeling evaluation 3" in Table 2.

1 dicing tape integrated back adhesive film 10 back adhesive film 11 adhesive layer 12 laser mark layer 20 dicing tape 21 base material 22 adhesive layer 30 long separator 40 sealing body 41 semiconductor chip 42 sealing resin 43 substrate 44 bump

Claims (5)

A polygonal shape having a planar projected area of 32400 mm ² or more, and a polygonal shape in which the corners of at least one end of a straight line portion are processed into rounded portions having a curvature radius R1 of 0.5 to 10 mm, or The corner of the end of the straight portion has a shape having a straight portion processed into the rounded portion,
A semiconductor back contact film for a fan-out type panel level package , arranged on the separator so as to be separated from the separator from the linear portion. 2. The semiconductor according to claim 1, wherein said planar projection shape is a shape in which at least one corner of a quadrangle having a short side to long side ratio [long side/short side] of 1 to 10 is processed into said rounded portion. Back adhesion film. a dicing tape having a laminated structure including a substrate and an adhesive layer;
The semiconductor back surface adhesive film according to claim 1 or 2, which is releasably adhered to the adhesive layer in the dicing tape,
A dicing tape-integrated semiconductor back contact film, wherein the dicing tape has a planar projected area larger than that of the semiconductor back contact film, and has a rounded portion in a planar projected shape. The planar projected shape of the dicing tape with no rounded portion formed is similar to the planar projected shape of the semiconductor back adhesive film with no rounded portion formed, and the similarity ratio [former/latter] in the similar shape is 1.01 or more. 4. The dicing tape-integrated semiconductor back adhesion film according to claim 3, wherein: 5. The dicing tape-integrated semiconductor back-surface adhesive film according to claim 3, wherein the ratio [R2/R1] of the radius of curvature R2 of the round portion of the dicing tape to the radius of curvature R1 is 0.5-100.

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