JP7211804B2 - Semiconductor back adhesion film - Google Patents

Description

The present invention relates to a semiconductor backside adhesive film. More particularly, the present invention relates to a semiconductor backside adhesive film that can be used in the manufacturing process of semiconductor devices.

2. Description of the Related Art In recent years, a flip-chip type semiconductor device in which a semiconductor element such as a semiconductor chip is mounted on a substrate by flip-chip bonding has been widely used. In a flip-chip type semiconductor device, a semiconductor back surface adhesive film is sometimes used as a film for forming a protective film on the back surface of a semiconductor element in order to prevent damage to the semiconductor element (Patent Documents 1 and 2). reference).

JP 2011-151360 A WO2014/092200

A conventional semiconductor back contact film usually contains a coloring agent so as to allow marking information to be imparted by laser marking, and thus has a light-shielding property. By the way, in recent years, silicon layers have been made thinner. Along with this, there is also a demand for a thinner semiconductor back adhesion film. However, when silicon is thinned, there is a problem that the wavelength of light transmitted from infrared rays to visible light is widened. In addition, in semiconductor back adhesion films, most of the coloring agents that absorb visible light and are used for laser marking do not absorb near-infrared rays. There is a problem that the light shielding property is deteriorated. If the light-shielding property of the semiconductor back adhesion film is poor, light is likely to pass through. Therefore, the transmission of light may adversely affect the circuit surface of the semiconductor, such as noise, and the circuit surface may be obscured by using an infrared microscope or the like. There were times when confidentiality could not be maintained.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor back adhesion film which is excellent in laser marking properties and infrared shielding properties.

As a result of intensive studies to achieve the above object, the present inventors have found that a semiconductor back adhesive film having a total light transmittance of 20% or less in the wavelength range of 500 to 1300 nm has excellent laser marking properties and infrared shielding properties. I found it to be excellent. The present invention has been completed based on these findings.

That is, the present invention provides a semiconductor back contact film having a total light transmittance of 20% or less in the wavelength range of 500 to 1300 nm. A semiconductor back surface adhesive film having such a structure can be used in the manufacturing process of a semiconductor device.

As described above, the semiconductor back adhesion film of the present invention has a total light transmittance of 20% or less in the wavelength range of 500 to 1300 nm. Since the semiconductor back adhesion film of the present invention having such a structure has a low total light transmittance over the wavelength range from visible light to infrared light, it is excellent in laser marking properties and can sufficiently absorb infrared light. , excellent infrared shielding.

The semiconductor back adhesion film of the present invention preferably has a difference of 2 or less between the total light absorbance at a wavelength of 500 nm and the total light absorbance at a wavelength of 1300 nm. By having such a structure, the semiconductor back contact film of the present invention can shield visible light and infrared light equally, and is equally excellent in laser marking and infrared shielding properties.

The semiconductor back adhesion film of the present invention preferably contains an infrared absorber having a maximum absorption wavelength of 850 nm or more in the wavelength range of 500 to 2000 nm. With such a configuration, the total light transmittance at a wavelength of 1300 nm tends to be low.

In the semiconductor back adhesion film of the present invention, the content of the infrared absorbing agent is preferably 0.2 to 30% by mass. With such a configuration, the total light transmittance at a wavelength of 1300 nm tends to be low.

The semiconductor back adhesion film of the present invention preferably contains a visible light absorbing dye having a maximum absorbance in the wavelength range of 350 to 700 nm. With such a configuration, the total light transmittance at a wavelength of 500 nm tends to be low. In addition, when laser marking is performed with a dicing tape, air bubbles are less likely to occur between the semiconductor back adhesive film and the dicing tape, and the appearance after laser marking is excellent.

In the semiconductor back adhesion film of the present invention, the content of the visible light absorbing dye is preferably 0.05 to 10% by mass. With such a configuration, the total light transmittance at a wavelength of 500 nm tends to be low. Moreover, good printability (printing with good visibility) can be obtained. Furthermore, air bubbles are less likely to occur between the back adhesive film and the dicing tape when laser marking is performed with the dicing tape.

The semiconductor back adhesion film of the present invention preferably contains an epoxy resin and an acrylic resin. By having such a structure, the adhesiveness of the semiconductor back surface adhesive film to the work and the good splitting property at the time of dicing are compatible, and the adhesiveness to the work can be made stronger by heat curing. In addition, the content of ionic impurities and the like that can cause corrosion of semiconductor chips tends to decrease.

The semiconductor back adhesion film of the present invention preferably contains a filler. By having such a structure, it is easy to adjust physical properties such as elastic modulus, yield point strength, and breaking elongation of the semiconductor back contact film. In addition, it suppresses irregular reflection of the light beam irradiated during laser marking, has excellent infrared shielding properties, and enables marking information to be given more clearly by laser marking.

The semiconductor back adhesion film of the present invention is excellent in laser marking properties and infrared shielding properties. Therefore, by using the semiconductor back surface adhesive film of the present invention, laser marking can be clearly performed even when the semiconductor wafer is thinned, and furthermore, when the semiconductor is irradiated with infrared rays, It is possible to prevent the circuit surface from being adversely affected and the circuit surface from being seen.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic (front sectional drawing) which shows one Embodiment of the semiconductor back adhesion film of this invention. FIG. 3 is a schematic diagram (front cross-sectional view) showing another embodiment of the semiconductor back adhesion film of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view (front cross-sectional view) showing an embodiment of a dicing tape-integrated semiconductor back contact film of the present invention; It is the schematic (front sectional view) which shows one Embodiment of a sticking process. It is a schematic diagram (front sectional view) which shows one Embodiment of a dicing process. It is a schematic diagram (front sectional view) which shows one Embodiment of a pick-up process. It is a schematic diagram (front sectional view) which shows one Embodiment of a flip-chip mounting process.

[Semiconductor back adhesion film]
The semiconductor back adhesive film of the present invention (sometimes simply referred to as "back adhesive film") has a total light transmittance of 20% or less in the wavelength range of 500 to 1300 nm. In this specification, the "front surface" of a semiconductor (workpiece) refers to the surface on which bumps for flip-chip mounting of the workpiece are formed, and the "back surface" refers to the opposite side of the surface, that is, the side on which bumps are formed. shall mean the side that is not The "back surface adhesive film" refers to a film used in close contact with the back surface of a semiconductor, and includes a film (semiconductor back surface protective film) for forming a protective film on the back surface (so-called back surface) of a semiconductor chip. In addition, in this specification, the "back adhesion film" is a film that adheres to the back surface of the workpiece even after it is mounted on the semiconductor device, and is peeled off during the manufacturing process of the semiconductor device, such as a dicing tape or a separator, which will be described later. layer is not included. The back contact film of the present invention may have a single layer structure or a multilayer structure.

The back adhesion film of the present invention has a total light transmittance of 20% or less, preferably 18% or less, more preferably 16% or less in the wavelength range of 500 to 1300 nm. When the total light transmittance is 20% or less, the back contact film of the present invention has a low total light transmittance over the wavelength range from visible light to infrared light, so that it is excellent in laser marking properties and absorbs infrared light. Absorbs well and has excellent infrared shielding properties. The total light transmittance can be measured using a known spectrophotometer.

The back adhesion film of the present invention preferably has a total light absorbance at a wavelength of 500 nm and a total light absorbance at a wavelength of 1300 nm of 0.8 or more, more preferably 1.0 or more. When the total light absorbance at a wavelength of 500 nm is 0.8 or more, the amount of visible light absorbed increases, resulting in excellent laser marking properties. When the total light absorbance at a wavelength of 1300 nm is 0.8 or more, the absorption amount of infrared rays is increased, and the infrared shielding property is excellent. The total light absorbance can be measured using a known spectrophotometer.

In the back adhesion film of the present invention, the difference between the total light absorbance at a wavelength of 500 nm and the total light absorbance at a wavelength of 1300 nm [|1300 nm-500 nm|absorbance difference] is preferably 2 or less, more preferably 1.95 or less. More preferably, it is 1.9 or less. When the difference in total light absorbance is 2 or less, the back contact film of the present invention can shield visible light and infrared light equally, and the laser marking and infrared shielding properties are equally excellent. The total light absorbance can be measured using a known spectrophotometer.

The back contact film and the composition (resin composition) forming the back contact film of the present invention preferably contain a thermoplastic resin. When the back adhesion film has thermosetting properties, the back adhesion film of the present invention and the resin composition may contain a thermosetting resin and a thermoplastic resin, or react with a curing agent to form a bond. It may also contain a thermoplastic resin having a thermosetting functional group to obtain. When the back adhesion film of the present invention contains a thermoplastic resin having a thermosetting functional group, the resin composition need not contain a thermosetting resin (such as an epoxy resin).

The thermoplastic resin in the back contact film of the present invention has, for example, a binder function. Examples of the thermoplastic resin include acrylic resin, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin. , polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), polyamideimide resin , fluororesins, and the like. Only one kind of the thermoplastic resin may be used, or two or more kinds thereof may be used. As the thermoplastic resin, an acrylic resin is preferable from the viewpoint that it contains few ionic impurities and has high heat resistance.

The acrylic resin is a polymer containing structural units derived from acrylic monomers (monomer components having a (meth)acryloyl group in the molecule) as polymer structural units. The acrylic resin is preferably a polymer containing the largest proportion of structural units derived from (meth)acrylic acid ester. In addition, acrylic resin may use only 1 type, and may use 2 or more types. In the present specification, "(meth)acrylic" means "acrylic" and/or "methacrylic" (one or both of "acrylic" and "methacrylic"), and the same applies to others. .

Examples of the (meth)acrylic acid esters include hydrocarbon group-containing (meth)acrylic acid esters that may have an alkoxy group. Hydrocarbon group-containing (meth)acrylic acid esters include (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, (meth)acrylic acid aryl esters, and the like. Examples of the (meth)acrylic acid alkyl esters include (meth)acrylic acid methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester (lauryl ester), tridecyl ester, tetradecyl ester , hexadecyl ester, octadecyl ester, eicosyl ester and the like. Examples of the (meth)acrylic acid cycloalkyl esters include cyclopentyl esters and cyclohexyl esters of (meth)acrylic acid. Examples of the (meth)acrylic acid aryl esters include phenyl esters and benzyl esters of (meth)acrylic acid. Examples of the hydrocarbon group-containing (meth)acrylic acid ester having an alkoxy group include those in which one or more hydrogen atoms in the hydrocarbon group in the above hydrocarbon group-containing (meth)acrylic acid ester are substituted with an alkoxy group, Examples thereof include 2-methoxymethyl ester, 2-methoxyethyl ester and 2-methoxybutyl ester of (meth)acrylic acid. The hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group may be used alone or in combination of two or more.

The above-mentioned acrylic resin has a configuration derived from other monomer components copolymerizable with a hydrocarbon group-containing (meth) acrylic acid ester that may have an alkoxy group for the purpose of improving cohesive strength, heat resistance, etc. May contain units. Examples of other monomer components include carboxy group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, acrylamide, acrylonitrile, and other functional group-containing monomers. A monomer etc. are mentioned. Examples of the carboxy group-containing monomers include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of the acid anhydride monomer include maleic anhydride and itaconic anhydride. Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate and the like. Examples of the glycidyl group-containing monomer include glycidyl (meth)acrylate and methylglycidyl (meth)acrylate. Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, (meth) ) acryloyloxynaphthalenesulfonic acid and the like. Examples of the phosphoric acid group-containing monomer include 2-hydroxyethyl acryloyl phosphate and the like. Only one kind of the other monomer component may be used, or two or more kinds thereof may be used.

The acrylic resin that can be contained in the back contact film of the present invention includes butyl acrylate, ethyl acrylate, acrylonitrile, and acrylic acid, from the viewpoint of achieving both adhesion to a work and good splittability during dicing of the back contact film. It is preferably a copolymer of monomers appropriately selected from

When the back adhesion film of the present invention contains a thermosetting resin together with a thermoplastic resin, examples of the thermosetting resin include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, A thermosetting polyimide resin etc. are mentioned. Only one type of the thermosetting resin may be used, or two or more types may be used. Epoxy resin is preferable as the thermosetting resin because it tends to contain less ionic impurities that may cause corrosion of the semiconductor chip. Phenol resin is preferable as a curing agent for epoxy resin.

Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, and biphenyl type epoxy resin. Epoxy resins, naphthalene type epoxy resins, fluorene type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins such as ortho cresol novolac type epoxy resins, trishydroxyphenylmethane type epoxy resins, tetraphenylolethane type epoxy resins, etc. Polyfunctional epoxy resins can be mentioned. Only one type of the epoxy resin may be used, or two or more types may be used. Among them, phenol novolak type epoxy resin, ortho-cresol novolak type epoxy resin, biphenyl type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylene epoxy resin, etc. A roll ethane type epoxy resin is preferred.

Phenolic resins that can act as curing agents for epoxy resins include, for example, novolak-type phenolic resins such as phenol novolac resins, phenol aralkyl resins, cresol novolac resins, tert-butylphenol novolac resins, and nonylphenol novolak resins. Examples of the phenol resin include resol-type phenol resin and polyoxystyrene such as polyparaoxystyrene. Only one kind of the phenol resin may be used, or two or more kinds thereof may be used.

In the back adhesion film of the present invention, from the viewpoint of sufficiently advancing the curing reaction between the epoxy resin and the phenol resin, the phenol resin preferably has hydroxyl groups in the phenol resin per equivalent of epoxy groups in the epoxy resin component. is contained in an amount of 0.5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.

When the back adhesion film of the present invention contains a thermosetting resin, the content of the thermosetting resin is, from the viewpoint of properly curing the back adhesion film, with respect to the total mass of the back adhesion film of the present invention. 5 to 60% by mass is preferable, and 10 to 50% by mass is more preferable.

When the back adhesion film of the present invention contains a thermoplastic resin having a thermosetting functional group, for example, a thermosetting functional group-containing acrylic resin can be used as the thermoplastic resin. The acrylic resin in this thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from a hydrocarbon group-containing (meth)acrylic acid ester as a structural unit having the largest mass ratio. Examples of the hydrocarbon group-containing (meth)acrylic acid ester include hydrocarbon group-containing (meth)acrylic acid esters that form the acrylic resin as the thermoplastic resin that can be included in the back adhesion film of the present invention. and hydrocarbon group-containing (meth)acrylic acid esters. On the other hand, the thermosetting functional group in the thermosetting functional group-containing acrylic resin includes, for example, glycidyl group, carboxyl group, hydroxy group, isocyanate group and the like. Among them, a glycidyl group and a carboxy group are preferable. That is, as the thermosetting functional group-containing acrylic resin, a glycidyl group-containing acrylic resin and a carboxy group-containing acrylic resin are particularly preferable. In addition, it is preferable to contain a curing agent together with the thermosetting functional group-containing acrylic resin. things are mentioned. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a polyphenol-based compound as the curing agent, and for example, the various phenolic resins described above can be used.

When the back contact film of the present invention contains a thermosetting resin, it preferably contains a thermosetting catalyst (thermosetting accelerator). When the thermosetting catalyst is included, the curing reaction of the resin component can be sufficiently advanced and the curing reaction speed can be increased in curing the back adhesion film. Examples of the thermosetting catalyst include imidazole-based compounds, triphenylphosphine-based compounds, amine-based compounds, and trihalogen borane-based compounds. Examples of imidazole compounds include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl- 4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole Lithium trimellitate, 2,4-diamino-6-[2′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-undecylimidazolyl-(1 ')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6- [2′-Methylimidazolyl-(1′)]-ethyl-s-triazineisocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and the like mentioned. Examples of triphenylphosphine compounds include triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, tri(nonylphenyl)phosphine, diphenyltolylphosphine, tetraphenylphosphonium bromide, methyltriphenylphosphonium, methyltriphenyl phosphonium chloride, methoxymethyltriphenylphosphonium, benzyltriphenylphosphonium chloride and the like. Triphenylphosphine-based compounds also include compounds having both a triphenylphosphine structure and a triphenylborane structure. Examples of such compounds include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-triborate, benzyltriphenylphosphonium tetraphenylborate, triphenylphosphinetriphenylborane and the like. Examples of amine compounds include monoethanolamine trifluoroborate and dicyandiamide. Trihalogen borane compounds include, for example, trichloroborane. The thermosetting catalyst may contain only one type, or may contain two or more types.

The back contact film of the present invention may contain a filler. By including a filler, it is easy to adjust the physical properties such as the elastic modulus of the back contact film, the strength at yield point, and the elongation at break. In addition, it suppresses irregular reflection of the light beam irradiated during laser marking, has excellent infrared shielding properties, and enables marking information to be given more clearly by laser marking. Examples of fillers include inorganic fillers and organic fillers. Constituent materials of the inorganic filler include, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, nitride Examples include silicon, boron nitride, crystalline silica, amorphous silica, and the like. Further, examples of constituent materials of the inorganic filler include single metals such as aluminum, gold, silver, copper and nickel, alloys, amorphous carbon, graphite and the like. Examples of constituent materials of the organic filler include polymethyl methacrylate (PMMA), polyimide, polyamideimide, polyetheretherketone, polyetherimide, and polyesterimide. The above fillers may contain only one type, or may contain two or more types.

The filler may have various shapes such as spherical, needle-like, and flake-like. The average particle size of the filler is preferably 10 µm or less, more preferably 8 µm or less, and even more preferably 7 µm or less. The average particle size is preferably 0.1 μm or more, more preferably 0.2 μm or more. When the average particle diameter is 10 μm or less, irregular reflection of light rays irradiated during laser marking is suppressed, and infrared shielding properties are excellent, and marking information can be more clearly imparted by laser marking. In addition, the back contact film, which is to be broken into small pieces, is more excellent in splitting properties. In the present specification, the average particle size of the filler can be determined using, for example, a photometric particle size distribution meter (trade name “LA-910”, manufactured by HORIBA, Ltd.).

The content of the filler is preferably 10% by mass or more, more preferably 15% by mass or more, and more preferably 20% by mass or more, relative to the total mass of the back contact film of the present invention. The above content is preferably 50% by mass or less, more preferably 47% by mass or less, and more preferably 45% by mass or less.

The back contact film of the present invention may contain a coloring agent. The coloring agent may be a pigment or a dye. Examples of coloring agents include black coloring agents, cyan coloring agents, magenta coloring agents, and yellow coloring agents. A black coloring agent is preferable from the viewpoint of ensuring a high contrast between a laser-marked portion of the back contact film and other portions and realizing good visibility of the marked information. The coloring agent may contain only one kind, or may contain two or more kinds.

Examples of black colorants include carbon black, carbon nanotubes, graphite (graphite), copper oxide, manganese dioxide, azo pigments such as azomethine azo black, aniline black, perylene black, titanium black, cyanine black, activated carbon, and ferrite. , magnetite, chromium oxide, iron oxide, molybdenum disulfide, complex oxide-based black dyes, anthraquinone-based organic black dyes, and azo-based organic black dyes. Examples of carbon black include furnace black, channel black, acetylene black, thermal black and lamp black. As a black colorant, C.I. I. Solvent Black 3, 7, 22, 27, 29, 34, 43, 70; C.I. I. Direct Black 17, 19, 22, 32, 38, 51, 71; C.I. I. Acid Black 1, 2, 24, 26, 31, 48, 52, 107, 109, 110, 119, 154; C.I. I. Disperse Black 1, 3, 10, 24; C.I. I. Pigment Black 1, 7 and the like are also included.

Examples of cyan colorants include C.I. I. Solvent Blue 25, 36, 60, 70, 93, 95; C.I. I. Acid Blue 6, 45; C.I. I. Pigment Blue 1, 2, 3, 15, 15:1, 15:2, 15:3, 15:4, 15:5, 15:6, 16, 17, 17:1, 18, 22, 25, 56, 60, 63, 65, 66; C.I. I. Bat Blue 4; 60, C.I. I. Pigment Green 7 and the like.

Examples of magenta colorants include C.I. I. Solvent Red 1, 3, 8, 23, 24, 25, 27, 30, 49, 52, 58, 63, 81, 82, 83, 84, 100, 109, 111, 121, 122; C.I. I. disperse thread 9;C. I. Solvent Violet 8, 13, 14, 21, 27; C.I. I. Disperse Violet 1; C.I. I. Basic red 1, 2, 9, 12, 13, 14, 15, 17, 18, 22, 23, 24, 27, 29, 32, 34, 35, 36, 37, 38, 39, 40; C.I. I. Basic Violet 1, 3, 7, 10, 14, 15, 21, 25, 26, 27, 28 and the like. Examples of magenta colorants include C.I. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 39, 40, 41, 42, 48: 1, 48:2, 48:3, 48:4, 49, 49:1, 50, 51, 52, 52:2, 53:1, 54, 55, 56, 57:1, 58, 60, 60:1, 63, 63:1, 63:2, 64, 64:1, 67, 68, 81, 83, 87, 88, 89, 90, 92, 101, 104, 105, 106, 108, 112, 114, 122, 123, 139, 144, 146, 147, 149, 150, 151, 163, 166, 168, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185 , 187, 190, 193, 202, 206, 207, 209, 219, 222, 224, 238, 245; I. Pigment Violet 3, 9, 19, 23, 31, 32, 33, 36, 38, 43, 50; C.I. I. Bat Red 1, 2, 10, 13, 15, 23, 29, 35 and the like.

Examples of yellow colorants include C.I. I. Solvent Yellow 19, 44, 77, 79, 81, 82, 93, 98, 103, 104, 112, 162; I. Pigment Orange 31, 43; C.I. I. Pigment Yellow 1, 2, 3, 4, 5, 6, 7, 10, 11, 12, 13, 14, 15, 16, 17, 23, 24, 34, 35, 37, 42, 53, 55, 65, 73, 74, 75, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 108, 109, 110, 113, 114, 116, 117, 120, 128, 129, 133, 138, 139 , 147, 150, 151, 153, 154, 155, 156, 167, 172, 173, 180, 185, 195; I. Bat Yellow 1, 3, 20 and the like.

As the coloring agent, among others, a visible light absorbing dye is preferable. When a visible light absorbing dye is used as the coloring agent, air bubbles are less likely to occur between the back adhesive film and the dicing tape when laser marking is performed with a dicing tape, resulting in an excellent appearance after laser marking. The visible light absorbing dye is preferably a dye having a maximum absorbance in the wavelength range of 350 to 700 nm. Examples of the visible light absorbing dye include anthraquinone dyes, perinone dyes, perylene dyes, quinoline dyes, quinacridone dyes, benzimidazolone dyes, azo dyes, isoindolinone dyes, and isoindoline dyes. , dioxazine-based dyes, phthalocyanine-based dyes, and the like. Only one type of the visible light absorbing dye may be used, or two or more types may be used.

The content of the colorant is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and still more preferably 0.15% by mass or more, relative to the total mass of the back adhesion film of the present invention. be. The above content is preferably 8% by mass or less, more preferably 6% by mass or less, and even more preferably 4% by mass or less. When the content is 0.05% by mass or more, the total light transmittance at a wavelength of 500 nm of the back contact film of the present invention tends to be low. Moreover, good printability (printing with good visibility) can be obtained. When the content is 8% by mass or less, air bubbles are less likely to occur between the back adhesive film and the dicing tape when laser marking is performed with the dicing tape.

The back contact film of the present invention preferably contains an infrared absorbing agent having a maximum absorption wavelength of 850 nm or more in the wavelength range of 500 to 2000 nm. Only 1 type may be used for the said infrared absorber, and 2 or more types may be used for it.

Examples of the infrared absorbing agent include pigments (infrared absorbing pigments) and dyes (infrared absorbing dyes) having a maximum absorption wavelength of 850 nm or more in the wavelength range of 500 to 2000 nm. Examples of the infrared absorbing pigment include indium tin oxide, antimony tin oxide, zinc oxide, lead white, lithopone, titanium oxide, chromium oxide, iron oxide, aluminum oxide, precipitated barium sulfate, barite powder, red lead, iron oxide. Red, yellow lead, zinc yellow (type 1 zinc yellow, type 2 zinc yellow), ultramarine blue, Prussian blue (potassium ferrocyanide), zircon gray, praseodymium yellow, chrome titanium yellow, chrome green, peacock, victoria green , Prussian blue, vanadium-zirconium blue, chrome-tin pink, ceramic red, salmon pink, titanium black, tungsten compounds, metal borides, and the like. Black pigments such as metal oxides containing metal elements such as Co, Cr, Cu, Mn, Ru, Fe, Ni, Sn, Ti, Ag, and Al, and metal nitrogen compounds are also included. Only one type of the infrared absorbing pigment may be used, or two or more types may be used.

Examples of the infrared absorbing dyes include cyanine dyes, phthalocyanine dyes, naphthalocyanine dyes, immonium dyes, aminoum dyes, quinolium dyes, pyrylium dyes, Ni complex dyes, pyrrolopyrrole dyes, copper complexes, quaterrylene dyes, and azo dyes. , anthraquinone dyes, dimonium dyes, squarylium dyes, porphyrin dyes, and the like. Only one type of the infrared absorbing dye may be used, or two or more types may be used.

As the infrared absorbing agent having a maximum absorption wavelength of 850 nm or more in the wavelength region of 500 to 2000 nm, infrared absorbing pigments are particularly preferred from the viewpoint of improving the infrared shielding property of the back adhesion film of the present invention and decreasing the average transmittance. is preferred. The average particle size of the infrared absorbing pigment is preferably 10 nm or more, more preferably 20 nm or more, and still more preferably 40 nm or more. When the average particle size of the infrared absorbing pigment is 10 nm or more, infrared rays can be absorbed more efficiently, and the infrared shielding property of the back contact film of the present invention is further improved. The average particle diameter is preferably 10 μm or less from the viewpoint of suppressing diffuse reflection of visible light for laser marking.

The content of the infrared absorbing agent is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass or more, relative to the total mass of the back contact film of the present invention. . The above content is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 10% by mass or less. When the content is 0.5% by mass or more, the total light transmittance at a wavelength of 1300 nm of the back contact film of the present invention tends to be low. When the content is 30% by mass or less, the amount to be blended can be suppressed and the cost can be reduced. Moreover, in the case of an infrared absorbing pigment, roughening of the film surface can be suppressed.

The back contact film of the present invention may contain other components as necessary. Examples of other components include flame retardants, silane coupling agents, ion trapping agents, and the like. Examples of the flame retardant include aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, metal hydroxides such as composite metal hydroxides, phosphazene compounds, antimony trioxide, Examples include antimony oxide and brominated epoxy resins. Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane and the like. Examples of the ion trapping agent include hydrotalcites, bismuth hydroxide, hydrous antimony oxide (eg, "IXE-300" manufactured by Toagosei Co., Ltd.), zirconium phosphate of a specific structure (eg, manufactured by Toagosei Co., Ltd.) "IXE-100"), magnesium silicate (eg "Kyoward 600" manufactured by Kyowa Chemical Industry Co., Ltd.), aluminum silicate (eg "Kyoward 700" manufactured by Kyowa Chemical Industry Co., Ltd.), and the like. Compounds that can form complexes with metal ions can also be used as ion trapping agents. Examples of such compounds include triazole-based compounds, tetrazole-based compounds, and bipyridyl-based compounds. Among these, triazole compounds are preferred from the viewpoint of the stability of the complex formed with metal ions. Examples of such triazole compounds include 1,2,3-benzotriazole, 1-{N,N-bis(2-ethylhexyl)aminomethyl}benzotriazole, carboxybenzotriazole, 2-(2-hydroxy- 5-methylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-t-butylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3-t-butyl-5-methylphenyl )-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-t-amylphenyl)benzotriazole, 2-(2-hydroxy-5-t-octylphenyl)benzotriazole, 6-(2 -benzotriazolyl)-4-t-octyl-6'-t-butyl-4'-methyl-2,2'-methylenebisphenol, 1-(2',3'-hydroxypropyl)benzotriazole, 1- (1,2-dicarboxydiethyl)benzotriazole, 1-(2-ethylhexylaminomethyl)benzotriazole, 2,4-di-t-pentyl-6-{(H-benzotriazol-1-yl)methyl}phenol , 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy, octyl -3-[3-t-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-ethylhexyl-3-[3-t-butyl-4-hydroxy -5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-( 1,1,3,3-tetramethylbutyl)phenol, 2-(2H-benzotriazol-2-yl)-4-t-butylphenol, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2- (2-hydroxy-5-t-octylphenyl)-benzotriazole, 2-(3-t-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3, 5-di-t-amylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-t-butylphenyl)-5-chloro-benzotriazole, 2-[2-hydroxy-3,5-di (1 ,1-dimethylbenzyl)phenyl]-2H-benzotriazole, 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol ], 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, methyl-3-[3-(2H-benzotriazol-2-yl)-5- and t-butyl-4-hydroxyphenyl]propionate. Specific hydroxyl group-containing compounds such as quinol compounds, hydroxyanthraquinone compounds, and polyphenol compounds can also be used as ion trapping agents. Specific examples of such hydroxyl group-containing compounds include 1,2-benzenediol, alizarin, anthralphine, tannin, gallic acid, methyl gallate, and pyrogallol. Only one kind of the other components may be used, or two or more kinds thereof may be used.

When the back contact film of the present invention has a multi-layer structure, it has a laminated structure including an adhesive layer having a surface to be adhered to the back surface of the work and a laser mark layer capable of imparting marking information by laser marking. You may have The adhesive layer may have thermosetting properties so that it can be adhered to the back surface of the work and protected by heat curing after being attached to the back surface of the work. If the adhesive layer is non-thermosetting, the adhesive layer adheres to and protects the back surface of the work by adhesion (wettability) at the interface due to pressure sensitivity or chemical bonding. It is possible. The surface of the laser mark layer is subjected to laser marking during the manufacturing process of the semiconductor device. The back adhesive film having such a laminated structure has a laminated structure in which the adhesive layer is heat-cured by heat treatment at 120° C. for 2 hours, while the laser mark layer is not substantially heat-cured. can take In the back contact film of the present invention, the layer that is not substantially thermoset by heat treatment at 120° C. for 2 hours includes an already cured thermosetting layer. Each of the adhesive layer and the laser mark layer may have a single layer structure or a multilayer structure.

The laser mark layer is preferably a thermosetting layer (a thermoset layer) in which a thermosetting component is thermoset. The laser mark layer is formed by curing a thermosetting resin composition layer formed from a resin composition forming the laser mark layer.

When the back contact film of the present invention has a multilayer structure having an adhesive layer and a laser marking layer, the ratio of the thickness of the laser marking layer to the thickness of the adhesive layer is preferably 1 or more, more preferably 1.5. 5 or more, more preferably 2 or more. The above ratio is, for example, 10 or less.

The thickness of the back contact film of the present invention is, for example, 2 to 200 μm, preferably 4 to 160 μm, more preferably 6 to 100 μm, still more preferably 10 to 80 μm. When the thickness is 2 μm or more, the back surface of the work can be more strongly protected. When the thickness is 200 μm or less, the workpiece after the back contact can be made thinner.

FIG. 1 shows an embodiment in which the back contact film of the present invention has a multilayer structure. As shown in FIG. 1, the back contact film 10 of the present invention is placed on a separator 30 . The back contact film 10 of the present invention has a multilayer structure including an adhesive layer 11 and a laser mark layer 12, and the laser mark layer 12 is adhered to the separator 30 in a detachable manner. In FIG. 1, the adhesive layer 11 and the laser mark layer 12 may have a reverse positional relationship (that is, the adhesive layer 11 is releasably adhered to the separator 30). When the adhesive layer 11 and the laser mark layer 12 have the positional relationship shown in FIG. 1, the back adhesion film 10 of the present invention can be applied to the back surface of the work and heat-cured for use. On the other hand, when the positional relationship between the adhesive layer 11 and the laser mark layer 12 is opposite to that shown in FIG. 1, it can be preferably used for producing a dicing tape-integrated back adhesion film described later.

FIG. 2 shows an embodiment in which the back contact film of the present invention has a single layer structure. As shown in FIG. 2, the back contact film 10 of the present invention is placed on the separator 30 . The back adhesion film 10 of the present invention can be applied to the back surface of a work and heat-cured for use.

[Dicing tape-integrated semiconductor back adhesion film]
The back adhesive film of the present invention includes a dicing tape having a laminated structure including a substrate and an adhesive layer, and the back adhesive film of the present invention peelably adhered to the adhesive layer of the dicing tape. In other words, it may be used as a dicing tape-integrated semiconductor back adhesion film (sometimes referred to as "dicing tape-integrated back adhesion film"). The dicing tape-integrated back contact film may be referred to as "the dicing tape-integrated back contact film of the present invention". When the back contact film of the present invention is used as a dicing tape-integrated back contact film, wrinkles are less likely to occur when attached to a substrate.

One embodiment of the dicing tape-integrated back contact film of the present invention will be described with reference to FIG. The dicing tape-integrated back contact film 1 shown in FIG. 3 uses the back contact film 10 of the present invention shown in FIG. The dicing tape-integrated back contact film 1 can be used in the process of obtaining a semiconductor chip with a chip-equivalent size film for forming a semiconductor chip back contact film. It has a laminated structure including the dicing tape 20 .

(Base material)
The base material in the dicing tape is an element that functions as a support in the dicing tape or the dicing tape-integrated back adhesive film. Substrates include, for example, plastic substrates (especially plastic films). The substrate may be a single layer or a laminate of the same or different substrates.

Examples of the resin constituting the plastic substrate include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, and homopolypropylene. , polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene- Polyolefin resins such as butene copolymers and ethylene-hexene copolymers; polyurethanes; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); polycarbonates; polyimides; polyamide such as aramid and wholly aromatic polyamide; polyphenyl sulfide; fluorine resin; polyvinyl chloride; polyvinylidene chloride; cellulose resin; Good heat shrinkability is secured in the base material, and in the expansion process for widening the separation distance between semiconductor chips after dicing, it is easy to maintain the chip separation distance using a dicing tape or partial heat shrinkage of the base material. From a viewpoint, the substrate preferably contains an ethylene-vinyl acetate copolymer or polyvinyl chloride as a main component. In addition, let the main component of a base material be a component which occupies the largest mass ratio in a structural component. Only one kind of the above resin may be used, or two or more kinds thereof may be used. When the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer as described later, the substrate preferably has radiation transparency.

When the substrate is a plastic film, the plastic film may be non-oriented, or may be oriented in at least one direction (uniaxial direction, biaxial direction, etc.). When oriented in at least one direction, the plastic film is heat shrinkable in at least one direction. In order for the substrate and the dicing tape to have isotropic heat shrinkability, the substrate is preferably a biaxially oriented film. The plastic film oriented in at least one direction can be obtained by stretching an unstretched plastic film in at least one direction (uniaxial stretching, biaxial stretching, etc.). The base material and the dicing tape preferably have a thermal shrinkage rate of 1 to 30%, more preferably 2 to 25%, and more preferably 2 to 25% in a heat treatment test performed at a heating temperature of 100 ° C. and a heating time of 60 seconds. It is preferably 3 to 20%, particularly preferably 5 to 20%. It is preferable that the thermal shrinkage rate is the thermal shrinkage rate in at least one of the MD direction and the TD direction.

The adhesive layer side surface of the base material may be subjected to corona discharge treatment, plasma treatment, sand mat treatment, ozone exposure treatment, flame exposure treatment, high voltage shock treatment, etc. for the purpose of enhancing adhesion and retention with the adhesive layer. Physical treatment such as exposure treatment and ionizing radiation treatment; chemical treatment such as chromic acid treatment; and surface treatment such as easy-adhesion treatment with a coating agent (undercoating agent). Moreover, in order to impart antistatic properties, a conductive deposition layer containing a metal, an alloy, an oxide thereof, or the like may be provided on the substrate surface. The surface treatment for enhancing adhesion is preferably applied to the entire surface of the adhesive layer side of the substrate.

The thickness of the substrate is preferably 40 μm or more, more preferably 50 μm or more, and still more preferably 50 μm or more, from the viewpoint of ensuring strength for the substrate to function as a support in the dicing tape and the dicing tape-integrated back adhesive film. is at least 55 μm, particularly preferably at least 60 μm. From the viewpoint of achieving appropriate flexibility in the dicing tape and the dicing tape-integrated back adhesion film, the thickness of the substrate is preferably 200 μm or less, more preferably 180 μm or less, and even more preferably 150 μm or less. be.

(Adhesive layer)
The adhesive layer in the dicing tape is an adhesive layer that can intentionally reduce the adhesive force (adhesive force reduction type adhesive layer) by external action during the use process of the dicing tape integrated back adhesive film. It may be an adhesive layer (adhesive force non-reducing type adhesive layer) whose adhesive force is hardly or not reduced by an external action during the use process of the dicing tape-integrated back adhesive film. It can be appropriately selected according to the method, conditions, etc., for singulating the workpiece to be singulated using the dicing tape-integrated back contact film. The pressure-sensitive adhesive layer may have a single layer structure or a multilayer structure.

When the adhesive layer is an adhesive layer that can reduce adhesive strength, the adhesive layer exhibits relatively high adhesive strength and relatively low adhesive strength during the manufacturing process and use process of the back adhesive film with integrated dicing tape. It is possible to use properly the state indicating the force. For example, when bonding the back adhesive film to the adhesive layer of the dicing tape in the manufacturing process of the dicing tape integrated back adhesive film, or when the dicing tape integrated back adhesive film is used in the dicing process, the adhesive layer While it is possible to suppress or prevent the back adhesion film from floating from the adhesive layer by utilizing the state of exhibiting a relatively high adhesive strength, after that, the semiconductor chip is removed from the dicing tape of the back adhesion film integrated with the dicing tape. In the pick-up process for picking up, the pick-up can be easily performed by reducing the adhesive strength of the adhesive layer.

Examples of the adhesive that forms such an adhesive force-reducing adhesive layer include a radiation-curable adhesive and a heat-foamable adhesive. As the adhesive for forming the adhesive force-reducing adhesive layer, one kind of adhesive may be used, or two or more kinds of adhesives may be used.

As the radiation-curable adhesive, for example, an adhesive that is cured by irradiation with electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, or X-rays can be used. Adhesives (ultraviolet curable adhesives) can be particularly preferably used.

As the radiation-curable adhesive, for example, an additive containing a base polymer such as an acrylic polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond type radiation curable adhesives.

The above acrylic polymer is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth)acryloyl group in the molecule) as a structural unit of the polymer. The acrylic polymer is preferably a polymer containing the largest proportion of structural units derived from (meth)acrylic acid ester. In addition, acrylic polymer may use only 1 type, and may use 2 or more types.

Examples of the (meth)acrylic acid esters include hydrocarbon group-containing (meth)acrylic acid esters that may have an alkoxy group. As the hydrocarbon group-containing (meth)acrylic acid ester optionally having an alkoxy group, the hydrocarbons optionally having an alkoxy group exemplified as the structural units of the acrylic resin that the back adhesion film may contain. Group-containing (meth)acrylic acid esters may be mentioned. The hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group may be used alone or in combination of two or more. As the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group, 2-ethylhexyl acrylate and lauryl acrylate are preferable. In order to appropriately express the basic properties such as adhesiveness of the (meth)acrylic acid ester containing a hydrocarbon group which may have an alkoxy group in the adhesive layer, all the monomer components for forming the acrylic polymer , the ratio of the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group is preferably 40% by mass or more, more preferably 60% by mass or more.

The acrylic polymer is derived from other monomer components that can be copolymerized with the hydrocarbon group-containing (meth)acrylic acid ester that may have an alkoxy group for the purpose of improving cohesive strength, heat resistance, etc. It may contain a structural unit that Examples of the above-mentioned other monomer components include other monomers exemplified as structural units of the acrylic resin that can be contained in the above-mentioned back adhesion film. Only one kind of the other monomer component may be used, or two or more kinds thereof may be used. In order to appropriately express the basic properties such as adhesiveness of the (meth)acrylic acid ester containing a hydrocarbon group which may have an alkoxy group in the adhesive layer, all the monomer components for forming the acrylic polymer , the total ratio of the other monomer components is preferably 60% by mass or less, more preferably 40% by mass or less.

The acrylic polymer may contain a structural unit derived from a polyfunctional monomer copolymerizable with the monomer component forming the acrylic polymer in order to form a crosslinked structure in the polymer skeleton. Examples of the polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, penta Erythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylate (e.g. polyglycidyl (meth)acrylate), polyester Examples thereof include monomers having a (meth)acryloyl group and other reactive functional groups in the molecule such as (meth)acrylate and urethane (meth)acrylate. Only one kind of the polyfunctional monomer may be used, or two or more kinds thereof may be used. In order to appropriately express the basic properties such as adhesiveness of the (meth)acrylic acid ester containing a hydrocarbon group which may have an alkoxy group in the adhesive layer, all the monomer components for forming the acrylic polymer is preferably 40% by mass or less, more preferably 30% by mass or less.

Acrylic polymers are obtained by subjecting one or more monomer components including acrylic monomers to polymerization. Polymerization methods include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.

The acrylic polymer can be obtained by polymerizing raw material monomers for forming it. Polymerization techniques include, for example, solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization. The mass average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably 200,000 to 3,000,000. When the weight-average molecular weight is 100,000 or more, the amount of low-molecular-weight substances in the pressure-sensitive adhesive layer tends to be small, and contamination of the back adhesive film, semiconductor wafer, and the like can be further suppressed.

The pressure-sensitive adhesive layer or the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer may contain a cross-linking agent. For example, when an acrylic polymer is used as the base polymer, the acrylic polymer can be crosslinked to further reduce low-molecular-weight substances in the pressure-sensitive adhesive layer. Also, the mass average molecular weight of the acrylic polymer can be increased. Examples of the cross-linking agent include polyisocyanate compounds, epoxy compounds, polyol compounds (such as polyphenol compounds), aziridine compounds, and melamine compounds. When a cross-linking agent is used, the amount used is preferably about 5 parts by mass or less, more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the base polymer.

Examples of the radiation-polymerizable monomer component include urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta ( meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate and the like. Examples of the radiation-polymerizable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based oligomers, and those having a molecular weight of about 100 to 30,000 are preferred. The content of the radiation-polymerizable monomer component and oligomer component in the radiation-curable adhesive that forms the adhesive layer is, for example, 5 to 500 parts by mass, preferably 40 to 150 parts by mass, with respect to 100 parts by mass of the base polymer. It is about a part by mass. Further, as the additive-type radiation-curable pressure-sensitive adhesive, for example, one disclosed in JP-A-60-196956 may be used.

As the radiation-curable pressure-sensitive adhesive, an internal radiation-curable adhesive containing a base polymer having a radiation-polymerizable carbon-carbon double bond or other functional group in the polymer side chain, in the polymer main chain, or at the polymer main chain end. Also included are adhesives. The use of such an internal radiation-curable adhesive tends to suppress unintended changes in adhesive properties over time due to migration of low-molecular-weight components within the formed adhesive layer.

An acrylic polymer is preferable as the base polymer contained in the internal radiation-curable pressure-sensitive adhesive. As a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer, for example, an acrylic polymer is obtained by polymerizing (copolymerizing) raw material monomers containing a monomer component having a first functional group. After that, a compound having a second functional group capable of reacting with the first functional group and a radiation polymerizable carbon-carbon double bond is added to an acrylic polymer while maintaining the radiation polymerizability of the carbon-carbon double bond. Condensation reaction or addition reaction method can be used.

Combinations of the first functional group and the second functional group include, for example, a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, An isocyanate group, a hydroxy group, and the like can be mentioned. Among these, a combination of a hydroxy group and an isocyanate group, and a combination of an isocyanate group and a hydroxy group are preferred from the viewpoint of ease of reaction tracking. Among them, it is technically difficult to produce a polymer having a highly reactive isocyanate group, and on the other hand, from the viewpoint of ease of production and availability of an acrylic polymer having a hydroxy group, the first functional group is A preferred combination is a hydroxy group and the second functional group is an isocyanate group. Compounds having an isocyanate group and a radiation-polymerizable carbon-carbon double bond, that is, radiation-polymerizable unsaturated functional group-containing isocyanate compounds include, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- α,α-dimethylbenzyl isocyanate and the like. Further, as the acrylic polymer having a hydroxy group, those containing structural units derived from the above-mentioned hydroxy group-containing monomers and ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. is mentioned.

The radiation-curable adhesive preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, camphorquinone, halogenated ketone, acylphosphinate, acylphosphonate and the like. Examples of the α-ketol compounds include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxy propiophenone, 1-hydroxycyclohexylphenyl ketone, and the like. Examples of the acetophenone compounds include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio)-phenyl]-2 -morpholinopropan-1-one and the like. Examples of the benzoin ether compounds include benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether. Examples of the ketal compounds include benzyl dimethyl ketal. Examples of the aromatic sulfonyl chloride compounds include 2-naphthalenesulfonyl chloride. Examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime. Examples of the benzophenone-based compounds include benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone. Examples of the thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropyl. thioxanthone and the like. The content of the photopolymerization initiator in the radiation-curable adhesive is, for example, 0.05 to 20 parts by weight with respect to 100 parts by weight of the base polymer.

The heat-expandable pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (foaming agent, heat-expandable microspheres, etc.) that foams or expands when heated. Examples of the foaming agent include various inorganic foaming agents and organic foaming agents. Examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, and azides. Examples of the organic foaming agent include alkane hydrochlorides such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; and paratoluene. Hydrazine compounds such as sulfonyl hydrazide, diphenylsulfone-3,3'-disulfonyl hydrazide, 4,4'-oxybis(benzenesulfonylhydrazide), allylbis(sulfonylhydrazide); p-toluylenesulfonyl semicarbazide, 4,4'- Semicarbazide compounds such as oxybis (benzenesulfonyl semicarbazide); triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; N,N'-dinitrosopentamethylenetetramine, N,N'-dimethyl- Examples include N-nitroso compounds such as N,N'-dinitrosoterephthalamide. Examples of the heat-expandable microspheres include microspheres having a structure in which a substance that easily gasifies and expands upon heating is encapsulated in the shell. Isobutane, propane, pentane, and the like are examples of substances that easily gasify and expand when heated. Thermally expandable microspheres can be produced by encapsulating a substance that is easily gasified and expanded by heating in a shell-forming substance by a coacervation method, an interfacial polymerization method, or the like. As the shell-forming substance, a substance exhibiting thermal melting properties and a substance capable of bursting due to the action of thermal expansion of the enclosed substance can be used. Examples of such substances include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, and the like.

Examples of the non-reducing adhesive layer include a pressure-sensitive adhesive layer. In the pressure-sensitive adhesive layer, an adhesive layer formed from the radiation-curable adhesive described above with respect to the adhesive force-reducing adhesive layer is cured by irradiation in advance and has a certain adhesive force. An adhesive layer is included. As the adhesive that forms the non-adhesion-reducing adhesive layer, one kind of adhesive may be used, or two or more kinds of adhesives may be used. Further, the entire adhesive layer may be a non-adhesive force-reducing adhesive layer, or a part thereof may be a non-adhesive force-reducing adhesive layer. For example, when the adhesive layer has a single-layer structure, the entire adhesive layer may be a non-adhesive force-reducing adhesive layer, or a specific portion of the adhesive layer (for example, a dicing frame to be attached) A region outside the central region) is a non-adhesive force-reducing adhesive layer, and other portions (for example, a central region that is a semiconductor wafer divided body or a semiconductor wafer adhesion target region) It may be a pressure-sensitive adhesive layer capable of reducing the pressure-sensitive adhesive force. Further, when the adhesive layer has a laminated structure, all the adhesive layers in the laminated structure may be non-adhesive pressure-reducing adhesive layers, or some of the adhesive layers in the laminated structure may have non-adhesive strength. It may be a reduced pressure-sensitive adhesive layer.

The pressure-sensitive adhesive layer (irradiated radiation-curable pressure-sensitive adhesive layer) formed by pre-curing the pressure-sensitive adhesive layer (radiation-unexposed radiation-curable pressure-sensitive adhesive layer) formed from a radiation-curable pressure-sensitive adhesive by irradiation with radiation Even if the adhesive strength is reduced by irradiation, it exhibits adhesiveness due to the contained polymer component, and it is possible to exhibit the minimum adhesive strength required for the adhesive layer of the dicing tape in the dicing process or the like. When a radiation-cured pressure-sensitive adhesive layer that has been exposed to radiation is used, the entire pressure-sensitive adhesive layer may be the irradiated radiation-curing pressure-sensitive adhesive layer in the surface spreading direction of the pressure-sensitive adhesive layer, and a part of the pressure-sensitive adhesive layer may be It may be a radiation-curable pressure-sensitive adhesive layer that has been exposed to radiation, and the other portion may be a radiation-curable pressure-sensitive adhesive layer that has not been exposed to radiation. In this specification, the term "radiation-curable pressure-sensitive adhesive layer" refers to a pressure-sensitive adhesive layer formed from a radiation-curable pressure-sensitive adhesive. It includes both the radiation-cured radiation-curable pressure-sensitive adhesive layer after the agent layer has been cured by irradiation.

As the pressure-sensitive adhesive for forming the pressure-sensitive pressure-sensitive adhesive layer, a known or commonly used pressure-sensitive pressure-sensitive adhesive can be used, and an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferably used. can be done. When the pressure-sensitive adhesive layer contains an acrylic polymer as a pressure-sensitive adhesive, the acrylic polymer is preferably a polymer containing the structural unit derived from (meth)acrylic acid ester as the largest structural unit in terms of mass ratio. preferable. As the acrylic polymer, for example, the acrylic polymer described as the acrylic polymer that can be included in the additive-type radiation-curable pressure-sensitive adhesive can be employed.

The pressure-sensitive adhesive layer or the pressure-sensitive adhesive that forms the pressure-sensitive adhesive layer includes, in addition to the components described above, known or commonly used pressure-sensitive adhesive layers such as cross-linking accelerators, tackifiers, anti-aging agents, and coloring agents (pigments, dyes, etc.). Additives used in may be blended. Examples of the coloring agent include compounds that are colored by exposure to radiation. When a compound that is colored by irradiation is contained, only the irradiated portion can be colored. The compound that is colored by exposure to radiation is a compound that is colorless or light-colored before exposure to radiation and becomes colored by exposure to radiation, and examples thereof include leuco dyes. The amount of the compound that is colored by exposure to radiation is not particularly limited and can be appropriately selected.

The thickness of the pressure-sensitive adhesive layer is not particularly limited. From the viewpoint of balancing, it is preferably about 1 to 50 μm, more preferably 2 to 30 μm, and still more preferably 3 to 25 μm.

The back contact film of the present invention and the dicing tape-integrated back contact film of the present invention may have a separator on the back contact film surface. Specifically, each back contact film of the present invention or each dicing tape-integrated back contact film may be in the form of a sheet having a separator, or may have a long separator and a plurality of separators on it. back adhesion film or a plurality of dicing tape-integrated back adhesion films, and the separator may be wound to form a roll. The separator is an element for covering and protecting the back contact film of the present invention, and is peeled off from the sheet when using the back contact film of the present invention or the dicing tape-integrated back contact film of the present invention. The separator includes, for example, polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film or paper surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent.

The thickness of the separator is, for example, 10-200 μm, preferably 15-150 μm, more preferably 20-100 μm. When the thickness is 10 μm or more, the separator is less likely to break due to cuts during processing of the separator. When the thickness is 200 μm or less, the dicing tape-integrated back contact film can be easily peeled off from the separator when it is attached to the substrate and frame.

[Method for producing back adhesion film]
The back contact film 10, which is one embodiment of the back contact film of the present invention, is produced, for example, as follows.

For the back contact film 10 shown in FIG. 1, first, the adhesive layer 11 and the laser mark layer 12 are separately produced. The adhesive layer 11 is formed by applying a resin composition (adhesive composition) for forming the adhesive layer 11 on the separator to form a resin composition layer, and then removing the solvent and curing by heating. It can be made by solidifying the material layer. In producing the adhesive layer 11, the heating temperature is, for example, 90 to 150° C., and the heating time is, for example, 1 to 2 minutes. Examples of methods for applying the resin composition include roll coating, screen coating, and gravure coating. On the other hand, the laser mark layer 12 is formed by coating a resin composition for forming the laser mark layer 12 on a separator to form a resin composition layer, and then removing the solvent and curing by heating to solidify the resin composition layer. It can be made by In producing the laser mark layer 12, the heating temperature is, for example, 90 to 160° C., and the heating time is, for example, 2 to 4 minutes. The adhesive layer 11 and the laser mark layer 12 can be made in a form each with a separator. Then, the exposed surfaces of the adhesive layer 11 and the laser mark layer 12 are adhered to each other, and punching is performed so as to obtain the desired planar projected shape and planar projected area, thereby forming the adhesive layer 11 and the laser mark layer 12 . A back contact film 10 having a laminated structure of

[Manufacturing method of dicing tape-integrated back adhesion film]
The dicing tape-integrated back adhesion film 1, which is one embodiment of the dicing tape-integrated back adhesion film of the present invention, is produced, for example, as follows.

The dicing tape 20 of the dicing tape-integrated back adhesive film 1 shown in FIG. 3 can be produced by providing an adhesive layer 22 on a prepared base material 21 . For example, the base material 21 made of resin can be obtained by forming a film by a known or commonly used film forming method. Examples of the film-forming method include a calendar film-forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, a dry lamination method, and the like. The substrate 21 is subjected to surface treatment as necessary. In forming the adhesive layer 22, for example, after preparing an adhesive composition for forming an adhesive layer, first, the composition is applied on the substrate 21 or a separator to form an adhesive composition layer. do. Examples of methods for applying the pressure-sensitive adhesive composition include roll coating, screen coating, gravure coating, and the like. Next, the pressure-sensitive adhesive composition layer is heated to remove the solvent, if necessary, and to cause a cross-linking reaction, if necessary. The heating temperature is, for example, 80 to 150° C., and the heating time is, for example, 0.5 to 5 minutes. When the pressure-sensitive adhesive layer 22 is formed on the separator, the pressure-sensitive adhesive layer 22 with the separator is attached to the base material 21, and then the desired planar projection shape (for example, a shape similar to the back adhesive film 10) is formed. shape) and planar projected area, and then the separator is peeled off. As a result, the dicing tape 20 having a laminated structure of the substrate 21 and the adhesive layer 22 is produced.

Next, the laser mark layer 12 side of the rear adhesion film 10 obtained above is adhered to the adhesive layer 22 side of the dicing tape 20 . The bonding temperature is, for example, 30 to 50° C., and the bonding pressure (linear pressure) is, for example, 0.1 to 20 kgf/cm. When the pressure-sensitive adhesive layer 22 is the radiation-curable pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer 22 may be irradiated with radiation such as ultraviolet rays before the bonding, or the substrate 21 may be exposed after the bonding. The pressure-sensitive adhesive layer 22 may be irradiated with radiation such as ultraviolet rays from the side. Alternatively, such radiation irradiation may not be performed in the manufacturing process of the dicing tape-integrated back adhesive film 1 (in this case, the adhesive layer 22 is cured by radiation during the use process of the dicing tape-integrated back adhesive film 1. Is possible). When the adhesive layer 22 is of an ultraviolet curing type, the amount of ultraviolet irradiation for curing the adhesive layer 22 is, for example, 50 to 500 mJ/cm ² . In the dicing tape-integrated back adhesive film 1, the area (irradiated area R) where irradiation is performed as a measure to reduce the adhesive strength of the adhesive layer 22 is, for example, as shown in FIG. This is the area within the mating area excluding its periphery.

As described above, for example, the back contact film 10 of the present invention shown in FIG. 1 and the dicing tape-integrated back contact film 1 shown in FIG. 3 can be produced.

[Method for manufacturing a semiconductor device]
A semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention. Specifically, a step of attaching the back surface of the workpiece to the back surface adhesive film side (especially the adhesive layer side) of the dicing tape-integrated back surface adhesive film of the present invention (sticking step), and cutting an object including at least the workpiece. A semiconductor device can be manufactured by a manufacturing method including a step of obtaining individualized semiconductor chips (a dicing step). 4 to 7 show steps in a method of manufacturing a semiconductor device using the dicing tape-integrated back contact film 1 shown in FIG.

(Affixing process)
In the pasting step, the work to be pasted on the back adhesion film side (especially the adhesive layer side) of the dicing tape-integrated back adhesion film of the present invention may be a semiconductor wafer or a plurality of semiconductor chips each having a resin back and/or side surface. and the like. Then, for example, as shown in FIG. 4A, the semiconductor wafer 40 held by the wafer processing tape T1 is attached to the dicing tape-integrated back contact film 10 of the present invention (particularly, the adhesive layer 11). ). The surface of the semiconductor wafer 40 is provided with bumps (not shown) for flip-chip mounting. Thereafter, as shown in FIG. 4B, the wafer processing tape T1 is peeled off from the semiconductor wafer 40. Next, as shown in FIG.

(Thermal curing process)
When the back contact film of the present invention or the adhesive layer in the film is thermosetting, it is preferable to include a step of thermally curing the back contact film (thermosetting step) after the attaching step. For example, in the thermosetting step, heat treatment is performed to thermoset the adhesive layer 11 . The heating temperature is preferably 80 to 200°C, more preferably 100 to 150°C. The heating time is preferably 0.5 to 5 hours, more preferably 1 to 3 hours. Specifically, the heat treatment is performed at 120° C. for 2 hours, for example. In the heat curing step, the heat curing of the adhesive layer 11 increases the adhesion between the dicing tape-integrated back contact film 10 of the present invention and the semiconductor wafer 40, and the dicing tape-integrated back contact film 1 and The fixing and holding power of the back contact film 10 of the present invention to the semiconductor wafer is increased. In addition, when the back adhesion film of the present invention does not have thermosetting properties, it may be subjected to a baking treatment at, for example, a temperature range of 50 to 100° C. for several hours. Wafer fixing and holding force is increased.

(Laser marking process)
It is preferable that the above method for manufacturing a semiconductor device includes a step of performing laser marking (laser marking step) by irradiating the back adhesive film with a laser from the substrate side of the dicing tape. When the heat curing process is performed, the laser marking process is preferably performed after the heat curing process. Specifically, in the laser marking process, for example, laser marking is performed by irradiating the laser mark layer 12 with a laser from the base material 21 side of the dicing tape 20 . By this laser marking process, various information such as character information and graphic information can be marked on each semiconductor chip. In the laser marking process, it is possible to collectively and efficiently perform laser marking on a plurality of semiconductor chips in one laser marking process. Examples of lasers used in the laser marking process include gas lasers and solid-state lasers. Examples of gas lasers include carbon dioxide lasers (CO ₂ lasers) and excimer lasers. Examples of solid-state lasers include Nd:YAG lasers.

(Dicing process)
In the dicing step, for example, as shown in FIG. 5, a frame (dicing frame) 51 for pressing and fixing the dicing tape onto the adhesive layer 22 of the dicing tape-integrated back adhesive film 1 is attached to hold the dicing machine. After being held by the tool 52, cutting is performed by a dicing blade provided in the dicing machine. In FIG. 5, the cut portion is schematically represented by a thick line. In the dicing process, the semiconductor wafer is separated into semiconductor chips 41, and the back contact film 10 of the present invention of the back contact film 1 integrated with the dicing tape is cut into small pieces 10'. As a result, the semiconductor chip 41 with the film 10', that is, the semiconductor chip 41 with the film 10' is obtained.

(Radiation irradiation step)
The method for manufacturing a semiconductor device may include a step of irradiating the pressure-sensitive adhesive layer with radiation from the substrate side (radiation irradiation step). When the pressure-sensitive adhesive layer of the dicing tape is a layer formed of a radiation-curable pressure-sensitive adhesive, instead of the above-described radiation irradiation in the manufacturing process of the dicing tape-integrated back adhesive film, after the above-described dicing step, The pressure-sensitive adhesive layer may be irradiated with radiation such as ultraviolet rays from the substrate side. The dose is, for example, 50-500 mJ/cm ² . In the dicing tape-integrated back adhesion film, the region where irradiation is performed as a measure to reduce the adhesive force of the adhesive layer (irradiation region R shown in FIG. 3) is, for example, the peripheral edge in the back adhesion film bonding region in the adhesive layer This is the area excluding the part.

(Pickup process)
The method for manufacturing a semiconductor device preferably includes a step of picking up the film-attached semiconductor chip (pick-up step). The pick-up step includes, for example, a cleaning step of washing the semiconductor chip 41 side of the dicing tape 20 with the semiconductor chip 41 with the film 10′ using a washing liquid such as water, and a separation distance between the semiconductor chips 41 with the film 10′. An expansion step for spreading may be performed after passing through as necessary. For example, as shown in FIG. 6, the semiconductor chip 41 with the film 10 ′ is picked up from the dicing tape 20 . For example, in a state in which the dicing tape 20 with the dicing frame 51 is held by the holder 52 of the device, the pin member 53 of the pick-up mechanism is attached to the semiconductor chip 41 with the film 10' to be picked up on the lower side of the dicing tape 20 in the drawing. is raised and pushed up through the dicing tape 20, and then sucked and held by a suction jig 54. - 特許庁In the pick-up process, the pushing speed of the pin member 53 is, for example, 1 to 100 mm/sec, and the pushing amount of the pin member 53 is, for example, 50 to 3000 μm.

(Flip chip mounting process)
It is preferable that the method for manufacturing the semiconductor device described above includes a step of flip-chip mounting the film-attached semiconductor chip 41 (flip-chip step) after the pick-up step. For example, as shown in FIG. 7, a semiconductor chip 41 with a film 10' is flip-chip mounted on a mounting board 61. FIG. Examples of the mounting board 61 include a lead frame, a TAB (Tape Automated Bonding) film, and a wiring board. The semiconductor chip 41 is electrically connected to the mounting board 61 via the bumps 62 by flip chip mounting. Specifically, the substrate (electrode pad) (not shown) that the semiconductor chip 41 has on the circuit forming surface side and the terminal portion (not shown) that the mounting substrate 61 has are electrically connected via the bumps 62 . be. The bumps 62 are, for example, solder bumps. A thermosetting underfill agent 63 is interposed between the chip 41 and the mounting board 61 .

As described above, a semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention.

EXAMPLES The present invention will be described in more detail with reference to Examples below, but the present invention is not limited to these Examples.

Example 1
Acrylic resin (trade name “Teisan Resin SG-P3”, manufactured by Nagase ChemteX Corporation) 90 parts by mass and epoxy resin E ₁ (trade name “KI-3000-4”, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 40 parts by mass , epoxy resin E ₂ (trade name “JER YL980”, manufactured by Mitsubishi Chemical Corporation) 60 parts by mass, phenol resin (trade name “MEH7851-SS”, manufactured by Meiwa Kasei Co., Ltd.) 100 parts by mass, silica filler ( Trade name “SO-25R”, average particle size: 0.5 μm, Admatechs Co., Ltd.) 220 parts by mass, and visible light absorbing black dye (trade name “OIL BLACK BS”, Orient Chemical Industry Co., Ltd.) 5 Parts by mass, infrared absorbing pigment (heavy metal oxide colorant, maximum absorption wavelength: 1600 nm, average particle size: 20 nm) 30 parts by mass, and thermosetting catalyst (trade name “Curesol 2PHZ”, manufactured by Shikoku Kasei Co., Ltd.) 10 parts by mass of this was added to methyl ethyl ketone and mixed to obtain a resin composition having a solid content concentration of 36% by mass. Next, an applicator was used to apply the resin composition onto the silicone release-treated surface of a PET separator (thickness: 50 μm) having a silicone release-treated surface to form a resin composition layer. Next, this composition layer was heated at 130° C. for 2 minutes to remove the solvent, and a 25 μm-thick semiconductor back adhesion film (thermosetting semiconductor back adhesion film) was produced on a PET separator.

Example 2
A back contact film was produced in the same manner as in Example 1, except that the blending amount of the visible light-absorbing black dye was changed as shown in Table 1.

Example 3
(Preparation of laser mark layer)
Acrylic resin (trade name “Teisan Resin SG-P3”, manufactured by Nagase ChemteX Corporation) 90 parts by mass and epoxy resin E ₁ (trade name “KI-3000-4”, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 40 parts by mass , epoxy resin E ₂ (trade name “JER YL980”, manufactured by Mitsubishi Chemical Corporation) 60 parts by mass, phenol resin (trade name “MEH7851-SS”, manufactured by Meiwa Kasei Co., Ltd.) 100 parts by mass, silica filler ( Trade name “SO-25R”, average particle size: 0.5 μm, Admatechs Co., Ltd.) 220 parts by mass, and visible light absorbing black dye (trade name “OIL BLACK BS”, Orient Chemical Industry Co., Ltd.) 5 Parts by mass and 10 parts by mass of a thermosetting catalyst (trade name “Cure Sol 2PHZ”, manufactured by Shikoku Kasei Kogyo Co., Ltd.) were added to methyl ethyl ketone and mixed to obtain a resin composition having a solid content concentration of 36% by mass. Next, an applicator was used to apply the resin composition onto the silicone release-treated surface of a PET separator (thickness: 50 μm) having a silicone release-treated surface to form a resin composition layer. Next, this composition layer was heated at 130° C. for 2 minutes to remove the solvent, and a 12.5 μm-thick laser mark layer (thermally cured layer) was produced on the PET separator.

(Preparation of adhesive layer)
Acrylic resin (trade name “Teisan Resin SG-P3”, manufactured by Nagase ChemteX Corporation) 90 parts by mass and epoxy resin E ₁ (trade name “KI-3000-4”, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 40 parts by mass , epoxy resin E ₂ (trade name “JER YL980”, manufactured by Mitsubishi Chemical Corporation) 60 parts by mass, phenol resin (trade name “MEH7851-SS”, manufactured by Meiwa Kasei Co., Ltd.) 100 parts by mass, silica filler ( Trade name “SO-25R”, average particle size: 0.5 μm, Admatechs Co., Ltd.) 220 parts by mass, and infrared absorbing pigment (heavy metal oxide colorant, maximum absorption wavelength: 1600 nm, average particle size: 20 nm) 30 parts by mass of this was added to methyl ethyl ketone and mixed to obtain a resin composition having a solid content concentration of 28% by mass. Next, an applicator was used to apply the resin composition onto the silicone release-treated surface of a PET separator (thickness: 50 μm) having a silicone release-treated surface to form a resin composition layer. Next, this composition layer was heated at 130° C. for 2 minutes to remove the solvent, and an adhesive layer having a thickness of 12.5 μm was formed on the PET separator.

The laser mark layer on the PET separator prepared as described above and the adhesive layer on the PET separator were laminated using a laminator. Specifically, the exposed surfaces of the laser mark layer and the adhesive layer were bonded together under conditions of a temperature of 100° C. and a pressure of 0.6 MPa. A back adhesion film was produced as described above.

Comparative example 1
A back contact film was produced in the same manner as in Example 1, except that no infrared absorbing pigment was used.

Comparative example 2
A back contact film was prepared in the same manner as in Example 1, except that no visible light-absorbing black dye was used.

<Evaluation>
The back contact films obtained in Examples and Comparative Examples were evaluated as follows. Table 1 shows the results.

(1) Total Light Transmittance, Total Light Absorbance For the back adhesion films obtained in Examples and Comparative Examples, an ultraviolet-visible near-infrared spectrophotometer (trade name “V-670”, manufactured by JASCO Corporation) was integrated. Using a sphere unit, the transmittance (absorbance) spectrum was measured in a wavelength range including 500 nm and 1300 nm, and the total light transmittance and total light absorbance were calculated. Table 1 shows the total light transmittance at a wavelength of 1300 nm, the difference between the total light absorbance at a wavelength of 1300 nm and the total light absorbance at a wavelength of 500 nm, and the maximum transmittance and wavelength in the wavelength range of 500 to 1300 nm.

(2) Light-shielding properties The back contact films obtained in Examples and Comparative Examples are transmitted through an ultraviolet-visible-near-infrared spectrophotometer (trade name “V-670”, manufactured by JASCO Corporation) using an integrating sphere unit. The index spectrum was measured. The light-shielding property was evaluated as ○ when the total light transmittance at a wavelength of 1300 nm was less than 20%, and as x when it was 20% or more.

(3) Laser marking properties The back adhesion films obtained in Examples and Comparative Examples were laminated to a dicing tape to produce a back adhesion film integrated with the dicing tape, and a green laser with a wavelength of 532 nm was applied to the back adhesion film through the dicing tape. printed. Then, when the printed characters are easily visible (clear contrast) in dark field observation using a microscope, and when both criteria are met, and no air bubbles are generated, ◯, at least either The case where the criteria were not met was evaluated as x.

1 dicing tape integrated back adhesive film 10 back adhesive film of the present invention 11 adhesive layer 12 laser mark layer 20 dicing tape 21 base material 22 adhesive layer 30 separator 40 semiconductor wafer 41 semiconductor chip

Claims (7)

The total light transmittance in the wavelength range of 500 to 1300 nm is 20% or less ,
A semiconductor back adhesive film , wherein the difference between the total light absorbance at a wavelength of 500 nm and the total light absorbance at a wavelength of 1300 nm is 2 or less . 2. The semiconductor back adhesive film according to claim 1 , comprising an infrared absorbing agent having a maximum absorption wavelength of 850 nm or more in a wavelength range of 500 to 2000 nm. 3. The semiconductor back contact film according to claim 2 , wherein the content of the infrared absorbing agent is 0.2 to 30% by mass. 4. The semiconductor back contact film according to any one of claims 1 to 3 , comprising a visible light absorbing dye having a maximum absorbance in the wavelength region of 350 to 700 nm. 5. The semiconductor back contact film according to claim 4 , wherein the content of the visible light absorbing dye is 0.05 to 10% by mass. 6. The semiconductor back adhesive film according to any one of claims 1 to 5 , which contains an epoxy resin and an acrylic resin. The semiconductor back adhesion film according to any one of claims 1 to 6 , which contains a filler.

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