TW201936831A - Semiconductor back surface contact film and dicing tape-integrated semiconductor back surface contact film - Google Patents

Abstract

Provided is a semiconductor back surface contact film capable of rendering wrinkling thereof difficult when peeled off from a separator. This semiconductor back surface contact film has a planar projection area of 22500 mm2 or more, and has a non-circular planar projection shape having at least one R-portion in which a curvature radius R1 is 0.5-10 mm. This dicing tape-integrated semiconductor back surface contact film includes: a dicing tape which has a laminated structure including a base material and an adhesive layer; and the semiconductor back surface contact film which is peelably in contact with the adhesive layer of the dicing tape, wherein the dicing tape has a planar projection area larger than the semiconductor back surface contact film and has a planar projection shape having an R-portion.

Description

Semiconductor back surface adhesion film and dicing tape integrated semiconductor back surface adhesion film

The present invention relates to a semiconductor back surface adhesion film and a dicing tape integrated type semiconductor back surface adhesion film. More specifically, the present invention relates to a semiconductor back surface adhesion film and a diced tape integrated type semiconductor back surface adhesion film which can be used in the manufacturing process of a semiconductor device.

In the manufacture of a semiconductor device having a flip-chip mounted semiconductor wafer, a semiconductor back surface adhesion film is used as a film for forming a protective film on the so-called back surface of the wafer. Moreover, such a semiconductor back surface adhesion film is also provided in a form integrated with a dicing tape (see Patent Documents 1 and 2).
Prior art document patent document

Patent Document 1: Japanese Patent Laid-Open No. 2011-151360 Patent Document 2: International Publication No. 2014/092200

[The problem that the invention wants to solve]

The semiconductor back surface adhesion film is usually formed by a roll to role manner on the elongated spacers, and a plurality of semiconductor back surface adhesion films respectively punched into a substantially circular shape similar to the shape of the semiconductor wafer. Manufactured in the state of it. In the case where the semiconductor back surface adhesion film manufactured in this manner is used, the spacer is bent toward the side opposite to the semiconductor back surface adhesion film by the transfer roller in the longitudinal direction, and the end portion of the semiconductor back surface adhesion film is self-contained. The spacer floats and is used for peeling off from here.

In recent years, there has been a case of using a semiconductor device called a so-called Fan-out panel-level package (PLP). In this case, for example, a semiconductor back surface adhesion film which is larger than the previous large and quadrangular shape corresponding to the size and shape of the substrate of the fan-out type PLP is used. However, the semiconductor back surface adhesion film of such a shape has a case where, when peeling from the elongated spacer, the end portion is caught before the floating, and wrinkles are generated. Further, in the case of using the dicing tape-integrated semiconductor back surface adhesion film, there are cases in which a plurality of dicing tape-integrated semiconductor back surface adhesion films of a quadrangular shape are disposed on each of the elongated spacers. When the state is peeled off, wrinkles are generated.

The present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor back surface adhesion film which is less likely to wrinkle when peeled off from a separator.
[Technical means to solve the problem]

The present inventors have made an effort to achieve the above object, and as a result, found that if a plane projection area is 22500 mm ² or more and a plane projection shape is a non-corner portion having at least one radius of curvature R1 of 0.5 to 10 mm, The round-shaped semiconductor back surface adhesion film can be less likely to wrinkle when peeled off from the separator. The present invention has been completed based on these findings.

That is, the present invention provides a semiconductor back surface adhesion film having a planar projection area of 22,500 mm ² or more, and a planar projection shape having a non-circular shape having at least one rounded portion having a radius of curvature R1 of 0.5 to 10 mm. The semiconductor back surface adhesion film of such a configuration can be used in the manufacturing process of a semiconductor device.

As described above, the semiconductor back surface adhesion film of the present invention has a plane projection area of 22,500 mm ² or more. Further, the planar projection shape is a non-circular shape, and has at least one rounded portion having a radius of curvature R1 of 0.5 to 10 mm. The semiconductor back surface adhesion film of the present invention having such a configuration is relatively non-circular, but is less likely to wrinkle when peeled off from the spacer, although it is relatively larger than the semiconductor wafer having a circular shape of a maximum of 12 inches or less. Pleats. For example, the semiconductor back surface adhesion film is disposed so that the rounded portion having the radius of curvature R1 of 0.5 to 10 mm serves as a traveling direction during conveyance of the elongated spacer, and wrinkles are less likely to occur when peeling from the spacer.

In the semiconductor back surface adhesion film of the present invention, it is preferable that the planar projection shape has a shape in which the ratio of the short diameter to the long diameter (the long diameter/minor diameter) is from 1 to 10, and at least one of the squares is processed into the shape of the rounded portion. In the case where the semiconductor back surface adhesion film of the present invention has such a configuration, wrinkles at the time of peeling from the separator are less likely to occur.

Moreover, the present invention provides a dicing tape-integrated semiconductor back surface adhesion film comprising a dicing tape having a laminated structure including a substrate and an adhesive layer, and the adhesive layer of the dicing tape being detachably adhered thereto The semiconductor back surface adhesion film has a planar projection area of the dicing tape larger than the semiconductor back surface adhesion film, and the planar projection shape has a rounded portion. The diced tape-integrated semiconductor back surface adhesion film of such a configuration can be used in the manufacturing process of a semiconductor device.

As described above, the dicing tape-integrated semiconductor back surface adhesion film of the present invention includes a dicing tape having a laminated structure including a substrate and an adhesive layer, and the above-described adhesive layer in contact with the dicing tape. The semiconductor back surface is adhered to the film, and the planar projection area of the dicing tape is larger than the semiconductor back surface adhesion film, and the planar projection shape has a rounded portion. The dicing tape-integrated semiconductor back surface adhesion film having such a configuration can adhere the frame for cutting to the surface of the adhesive layer at the time of cutting, so that wrinkles at the time of peeling from the separator are less likely to occur.

Preferably, the planar projection shape of the uncut portion of the dicing tape is similar to the planar projection shape of the semiconductor back surface adhesion film without the rounded portion, and the similarity ratio of the similar shape is [1/the latter] is 1.01. the above. In the case where the dicing tape-integrated semiconductor back surface adhesion film of the present invention has such a configuration, the dicing frame can be directly bonded to the adhesive layer of the dicing tape for cutting.

The ratio [R2/R1] of the radius of curvature R2 of the rounded portion of the dicing tape to the radius of curvature R1 is preferably 0.5 to 100. When the dicing tape-integrated semiconductor back surface adhesion film of the present invention has such a configuration, the dicing frame can be fixed to the dicing tape without waste, even if the area between the dicing tape and the back surface adhesion film is poor, on the back surface. In the bonding step of the adhesion film and the dicing tape, wrinkles are not easily formed on the back surface adhesion film, and wrinkles are less likely to occur in the bonding step of the dicing tape and the substrate or the frame. Moreover, it is excellent in workability.
[Effects of the Invention]

The semiconductor back surface adhesion film of the present invention and the diced tape integrated type semiconductor back surface adhesion film of the present invention are relatively large and non-circular, but are less likely to wrinkle when peeled off from the separator. For example, the semiconductor back surface adhesion film is disposed so that the rounded corner portion within the specific radius of curvature R1 is in the traveling direction during the conveyance of the strip-shaped separator, and wrinkles are less likely to occur when peeling from the separator.

[Semiconductor back contact film]
The semiconductor back surface adhesion film of the present invention (sometimes simply referred to as "back surface adhesion film") has a plane projection area of 22500 mm ² or more, and the planar projection shape has at least one rounded portion having a radius of curvature R1 of 0.5 to 10 mm. Non-circular shape. In addition, in the present specification, the term "surface" of a semiconductor (workpiece) means a surface on which a workpiece is formed to be flip-chip mounted, and the "back surface" refers to the opposite side of the surface, that is, it is not formed. There are bumps on the surface. Further, the "back surface adhesion film" refers to a film that is used in close contact with the back surface of the semiconductor, and includes a film (semiconductor back surface protection film) for forming a protective film on the back surface (so-called back surface) of the semiconductor wafer. Further, in the present specification, the rounded portion having the radius of curvature R1 of 0.5 to 10 mm may be referred to as a "rounded portion X".

The planar projection shape of the back contact film of the present invention is a non-circular shape having at least one rounded portion X. As such a planar projection shape, for example, at least one corner other than a polygon (for example, a quadrangle such as a triangle, a square, or a rectangle, a hexagon, or an octagon) is processed into a shape of a rounded portion X in the traveling direction. The corner of the end portion of the straight portion having the shape of the straight portion extending in the width direction (for example, a semicircle or a sector shape) is processed into a shape other than a circle such as the shape of the rounded portion X. In particular, it is preferable that at least one corner (especially all corners) of the polygon is processed into a rounded portion X from the viewpoint of being able to correspond to a relatively large substrate and minimizing the discarded portion after use. The shape, more preferably at least one corner of the quadrilateral (especially a square) (especially all corners) is processed into the shape of the rounded portion X.

An embodiment of the back surface adhesion film of the present invention will be described below. Fig. 1 is a plan view (planar projection view) showing an embodiment of a back surface adhesion film of the present invention. As shown in Fig. 1, the back surface adhesive film 10 of the present invention is disposed in plural in one direction F on the elongated spacers (long strips). The shape (planar projection shape) observed from the upper surface of the back surface adhesive film 10 of the present invention shown in Fig. 1 is formed into the shape of the rounded portions X, i.e., 10a, 10b, 10c, and 10d. When the back surface adhesive film 10 of the present invention is peeled off from the elongated spacer 30, for example, the long spacers 30 are conveyed in one direction F from the end of the back surface of the film of the present invention in the direction F side. The strip-shaped separator 30 is bent to the side opposite to the side of the back-contact film 10 of the present invention by peeling, whereby the back-contact film 10 of the present invention is peeled off from the end portion. The back surface adhesive film 10 of the present invention shown in Fig. 1 is disposed such that the rounded portions 10a and 10c are at the ends of the one direction F, and is peeled in one direction F when peeled from the elongated spacer 30. The manner of the direction is carried by the elongated spacer 30. In addition, the back contact film 10 of the present invention has a size larger than that of the workpiece, and corresponds to a substrate or the like of a semiconductor wafer on which a workpiece to be bonded is placed.

The back surface adhesion film of the present invention has a planar projection area of 22,500 mm ² or more, preferably 23,225 mm ² or more, more preferably 32,400 mm ² or more. With the above-described plane projection area of 22,500 mm ² or more, it is possible to correspond to a relatively large substrate. Further, when the front back surface adhesive film has a plane projection area of 22,500 mm ² or more, wrinkles are particularly likely to occur at the time of peeling, but the back surface adhesive film of the present invention has a flat projection area of 22,500 mm ² or more. It is also difficult to produce wrinkles. The above projected area of the plane is, for example, 400,000 mm ² or less, preferably 360,000 mm ² or less. The above-mentioned plane projection area is, for example, the area of the back surface adhesion film 10 of the present invention in the plan view shown in FIG.

The radius of curvature R1 of the rounded portion X is 0.5 to 10 mm, preferably 0.55 to 9.5 mm, and more preferably 0.6 to 9.0 mm. When the radius of curvature R1 is 0.5 mm or more, even if the plane projection area is relatively large, wrinkles are less likely to occur at the time of peeling. Moreover, since the curvature radius R1 is 10 mm or less, the discarded portion after use can be minimized. In the case where the back contact film of the present invention has a plurality of rounded portions, at least one of the rounded portions may be the rounded portion X, and when there are other rounded portions, the radius of curvature of the rounded portion may be It is outside the range of the above curvature radius R1.

In the case where the planar projection shape of the back surface adhesion film of the present invention is such that at least one corner of the quadrilateral is processed into a shape of a rounded portion, the planar projection shape is preferably a ratio of a short side to a long side [long side/short side). At least one of the squares of 1 to 10 (especially a rectangle or a square) is processed into the shape of the rounded portion. The above comparison is preferably from 1 to 6, more preferably from 1 to 3. When the above ratio is within the above range, the wrinkles at the time of peeling from the separator are less likely to occur.

(adhesive layer)
The back contact film of the present invention comprises at least an adhesive layer having a bonding surface on the back surface of the workpiece. The layer of the adhesive layer may also be thermosetting so as to be adhered to the back side of the workpiece and then protected by thermal hardening followed by the back side of the workpiece. Further, in the case where the adhesive layer is non-thermosetting which does not have thermosetting property, the adhesive layer can be bonded to the workpiece by adhesion (wetting property) or chemical bonding obtained by pressure or the like at the interface. Protect the back. The subsequent layer may have a single layer configuration or a multilayer structure.

The adhesive layer and the adhesive composition (resin composition) forming the adhesive layer preferably contain a thermoplastic resin. In the case where the adhesive layer has thermosetting properties, the adhesive layer and the adhesive composition forming the adhesive layer may include a thermosetting resin and a thermoplastic resin, or may have a bond with the curing agent. Thermosetting functional thermoplastic resin. In the case where the adhesive layer contains a thermoplastic resin having a thermosetting functional group, the resin composition need not contain a thermosetting resin (epoxy resin or the like).

The thermoplastic resin in the subsequent layer is, for example, a function of a binder. Examples of the thermoplastic resin include acrylic resin, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, and ethylene-acrylate. Copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamine resin such as 6-nylon or 6,6-nylon, phenoxy resin, acrylic resin, polyterephthalic acid A saturated polyester resin such as ethylene glycol (PET) or polybutylene terephthalate (PBT), a polyamidoximine resin, a fluororesin or the like. The thermoplastic resin may be used singly or in combination of two or more. The thermoplastic resin is preferably an acrylic resin from the viewpoint of having less ionic impurities and high heat resistance.

The acrylic resin is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth) acrylonitrile group in a molecule) as a structural unit of a polymer. The acrylic resin is preferably a polymer containing a maximum amount of structural units derived from (meth) acrylate by mass ratio. Further, the acrylic resin may be used alone or in combination of two or more. In addition, in the present specification, "(meth)acrylic acid" means "acrylic acid" and/or "methacrylic acid" (either "acrylic acid" or "methacrylic acid" or both), and others the same.

The (meth) acrylate may, for example, be a hydrocarbon group-containing (meth) acrylate which may have an alkoxy group. Examples of the hydrocarbon group-containing (meth) acrylate include alkyl (meth)acrylate, cycloalkyl (meth)acrylate, and aryl (meth)acrylate. Examples of the alkyl (meth)acrylate include methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, second butyl ester, and third butyl ester of (meth)acrylic acid. , amyl ester, isoamyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, decyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester Lauryl ester), tridecyl ester, tetradecyl ester, cetyl ester, octadecyl ester, eicosyl ester, and the like. Examples of the cycloalkyl (meth)acrylate include cyclopentyl (meth)acrylate and cyclohexyl ester. Examples of the aryl (meth)acrylate include a phenyl ester of (meth)acrylic acid and a benzyl ester. The hydrocarbon group-containing (meth) acrylate having an alkoxy group may be one obtained by substituting one or more hydrogen atoms in the hydrocarbon group of the hydrocarbon group-containing (meth) acrylate with an alkoxy group, for example, Base 2-acrylic acid 2-methoxymethyl ester, 2-methoxyethyl ester, 2-methoxybutyl ester, and the like. The above-mentioned hydrocarbon group-containing (meth) acrylate having an alkoxy group may be used singly or in combination of two or more kinds.

The acrylic resin may contain a structural unit derived from another monomer component copolymerizable with a hydrocarbon group-containing (meth) acrylate having an alkoxy group for the purpose of modification such as cohesive force and heat resistance. Examples of the other monomer component include a carboxyl group-containing monomer, an acid anhydride monomer, a hydroxyl group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, and propylene. A nitrile or the like contains a functional group monomer or the like. Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, and fumaric acid. , butenoic acid, etc. Examples of the acid anhydride monomer include maleic anhydride and itaconic anhydride. Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and (meth)acrylic acid 6 -Hydroxyhexyl ester, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid (4-hydroxymethyl ring) Hexyl) methyl ester and the like. Examples of the glycidyl group-containing monomer include glycidyl (meth)acrylate and methyl glycidyl (meth)acrylate. Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, 2-(methyl)acrylamido-2-methylpropanesulfonic acid, and (meth)acrylamide. Sulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloxynaphthalenesulfonic acid, and the like. Examples of the phosphoric acid group-containing monomer include 2-hydroxyethyl acryloylphosphoric acid. The other monomer components may be used alone or in combination of two or more.

The acrylic resin which can be contained in the adhesive layer is preferably a butyl acrylate, an ethyl acrylate or an acrylonitrile from the viewpoint of the adhesion of the adhesive layer to the workpiece and the good cutability at the time of dicing. And a copolymer of a monomer suitably selected from acrylic acid.

In the case where the adhesive layer contains a thermosetting resin and a thermoplastic resin, examples of the thermosetting resin include an epoxy resin, a phenol resin, an amine resin, an unsaturated polyester resin, and a polyamine group. An acid ester resin, a polyoxynoxy resin, a thermosetting polyimide resin, or the like. The thermosetting resin may be used alone or in combination of two or more. The thermosetting resin is preferably an epoxy resin because the content of ionic impurities or the like which may cause corrosion of the semiconductor wafer tends to be small. Further, as the curing agent for the epoxy resin, a phenol resin is preferred.

Examples of the epoxy resin include a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol S epoxy resin, a brominated bisphenol A epoxy resin, and a hydrogenated bisphenol A ring. Oxygen resin, bisphenol AF type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, bismuth type epoxy resin, phenol novolak type epoxy resin, o-cresol novolac type epoxy resin and other cresol A polyfunctional epoxy resin such as a novolak type epoxy resin, a trishydroxyphenylmethane type epoxy resin, or a tetraphenol ethane type epoxy resin. The above epoxy resins may be used alone or in combination of two or more. Among them, a phenol novolac type epoxy resin, an o-cresol novolac type epoxy resin, a biphenyl type epoxy resin is preferable in terms of being highly reactive with a phenol resin as a curing agent and excellent in heat resistance. , trishydroxyphenylmethane type epoxy resin, tetraphenol ethane type epoxy resin.

Examples of the phenol resin which can function as a curing agent for the epoxy resin include a phenol novolak type resin, a phenol aralkyl resin, a cresol novolak resin, a third butyl phenol novolak type resin, and a nonyl phenol phenol type. A novolak type phenol resin such as a varnish type resin. Further, examples of the phenol resin include polyphenols such as a novolac type phenol resin and polyparaxyl styrene. The phenol resin may be used singly or in combination of two or more.

In the adhesive layer, the phenol resin has a hydroxyl group in the phenol resin as compared with the epoxy group per equivalent of the epoxy resin component from the viewpoint that the hardening reaction of the epoxy resin and the phenol resin is sufficiently performed. It is preferably contained in an amount of from 0.5 to 2.0 equivalents, more preferably from 0.8 to 1.2 equivalents.

In the case where the adhesive layer contains a thermosetting resin, the content ratio of the above thermosetting resin is preferably from 5 to 60 by mass with respect to the total mass of the adhesive layer from the viewpoint of suitably curing the adhesive layer. % is more preferably 10 to 50% by mass.

In the case where the adhesive layer contains a thermoplastic resin having a thermosetting functional group, as the thermoplastic resin, for example, an acrylic resin containing a thermosetting functional group can be used. The acrylic resin in the thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from a hydrocarbon group-containing (meth) acrylate as a structural unit having the largest mass ratio. Examples of the hydrocarbon group-containing (meth) acrylate include a hydrocarbon group-containing (meth) acrylate which forms an acrylic resin which is the thermoplastic resin which can be contained in the adhesive layer. On the other hand, examples of the thermosetting functional group in the acrylic resin containing a thermosetting functional group include a glycidyl group, a carboxyl group, a hydroxyl group, and an isocyanate group. Among them, a glycidyl group or a carboxyl group is preferred. In other words, the acrylic resin containing a thermosetting functional group is preferably a glycidyl group-containing acrylic resin or a carboxyl group-containing acrylic resin. In addition, it is preferable to include an acrylic resin containing a thermosetting functional group and a curing agent, and examples of the curing agent include a radiation curable adhesive which can be included in the formation of an adhesive layer as described below. The crosslinker is exemplified. When the thermosetting functional group in the acrylic resin containing a thermosetting functional group is a glycidyl group, a polyphenol compound is preferably used as the curing agent, and for example, various phenol resins described above can be used.

The subsequent layer preferably contains a thermosetting catalyst (thermosetting accelerator). When the thermosetting catalyst is contained, the curing reaction of the resin component can be sufficiently performed or the curing reaction rate can be increased when the adhesive layer is cured. Examples of the thermosetting catalyst include an imidazole compound, a triphenylphosphine compound, an amine compound, and a trihaloborane compound. Examples of the imidazole-based compound include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4-methylimidazole. , 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methyl Imidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methyl Imidazolyl-(1')]-ethyl s-triterpene, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl s-triterpene, 2,4-Diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyls-triazine, 2,4-diamino-6-[2 '-Methylimidazolyl-(1')]-ethyl s-triterpene isocyanurate adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4- Methyl-5-dihydroxymethylimidazole and the like. Examples of the triphenylphosphine-based compound include triphenylphosphine, tributylphosphine, tris(p-methylphenyl)phosphine, tris(nonylphenyl)phosphine, diphenyltolylphosphine, and bromination. Tetraphenylphosphonium, methyltriphenylphosphonium, methyltriphenylphosphonium chloride, methoxymethyltriphenylphosphonium, benzyltriphenylphosphonium chloride, and the like. The triphenylphosphine-based compound also contains a compound having a triphenylphosphine structure and a triphenylborane structure. Examples of such a compound include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-triborate, benzyltriphenylphosphonium tetraphenylborate, and triphenylphosphine triphenylborane. Wait. Examples of the amine compound include monoethanolamine trifluoroborate and dicyandiamide. Examples of the trihalogenated borane-based compound include trichloroborane and the like. The above-mentioned thermosetting catalyst may be contained alone or in combination of two or more.

The subsequent layer may also contain a filler. By including a filler, it is easy to adjust the physical properties such as the modulus of elasticity of the adhesive layer, the strength of the relief point, and the elongation at break. Examples of the filler include inorganic fillers and organic fillers. Examples of the constituent material of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium citrate, magnesium citrate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, and aluminum borate whisker. , tantalum nitride, boron nitride, crystalline germanium dioxide, amorphous germanium dioxide, and the like. Further, examples of the constituent material of the inorganic filler include elemental metals such as aluminum, gold, silver, copper, and nickel, or alloys, amorphous carbon, and graphite. Examples of the constituent material of the organic filler include polymethyl methacrylate (PMMA), polyimide, polyamidoximine, polyetheretherketone, polyetherimine, and polyesterimide. The above filler may be contained alone or in combination of two or more.

The above filler may have various shapes such as a spherical shape, a needle shape, and a sheet shape. The average particle diameter of the above filler is preferably from 30 to 500 nm, more preferably from 40 to 400 nm, still more preferably from 50 to 300 nm. That is, the adhesive layer preferably contains a nano filler. When a nano-sized filler having such a particle diameter is used as the filler, the cut-off property is further improved for the back-sealing film which is formed into a small piece. The average particle diameter of the filler can be determined, for example, by using a photometric type particle size distribution meter (trade name "LA-910", manufactured by Horiba, Ltd.). Moreover, when the filler layer contains a filler, the content ratio of the filler is preferably 10% by mass or more, more preferably 15% by mass or more, and still more preferably 20% by mass or more. The content ratio is preferably 50% by mass or less, more preferably 47% by mass or less, still more preferably 45% by mass or less.

The subsequent layer may also contain a colorant. As the coloring agent in the adhesive layer, for example, a coloring agent which can be contained as a laser marking layer described below can be exemplified. The coloring is achieved from the viewpoint of ensuring good contrast between the imprinted portion of the laser mark on the laser mark layer side of the back contact film and the other portions to ensure good visibility for the imprinted information. The agent is preferably a black colorant. These coloring agents may be used alone or in combination of two or more. Moreover, the content ratio of the coloring agent in the adhesive layer is preferably 0.5% by mass or more, and more preferably 1% by mass or more, from the viewpoint of achieving the above-described good visibility with respect to the marking information obtained by the laser marking. Further, it is preferably 2% by mass or more. The content ratio is preferably 10% by mass or less, more preferably 8% by mass or less, still more preferably 5% by mass or less.

The layer of the agent may also contain other ingredients as needed. Examples of the other components include a flame retardant, a decane coupling agent, and an ion scavenger. Examples of the flame retardant include metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, and complex metal hydroxides, phosphazene compounds, and antimony trioxide. Antimony pentoxide, brominated epoxy resin, etc. Examples of the above decane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropyltrimethoxydecane, and γ-glycidoxypropyl group. Diethoxy decane and the like. Examples of the ion scavenger include aluminum magnesium carbonate, barium hydroxide, barium hydroxide (for example, "IXE-300" manufactured by Toagosei Co., Ltd.), and zirconium phosphate of a specific structure (for example, East Asia Synthetic Co., Ltd.). Manufactured "IXE-100"), magnesium ruthenate (for example, "KYOWAAD 600" manufactured by Kyowa Chemical Industry Co., Ltd.), aluminum silicate (for example, "KYOWAAD 700" manufactured by Kyowa Chemical Industry Co., Ltd.). A compound which forms a complex with a metal ion can also be used as an ion scavenger. Examples of such a compound include a triazole compound, a tetrazole compound, and a bipyridine compound. Among these, a triazole-based compound is preferred from the viewpoint of stability of a complex formed between metal ions. Examples of such a triazole-based compound include 1,2,3-benzotriazole, 1-{N,N-bis(2-ethylhexyl)aminomethyl}benzotriazole, and carboxybenzene. Triazole, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-t-butylphenyl)-5-chlorobenzotriazole , 2-(2-hydroxy-3-t-butyl-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-t-pentylphenyl) Benzotriazole, 2-(2-hydroxy-5-th-octylphenyl)benzotriazole, 6-(2-benzotriazolyl)-4-trioctyl-6'-third Butyl-4'-methyl-2,2'-methylene bisphenol, 1-(2',3'-hydroxypropyl)benzotriazole, 1-(1,2-dicarboxydiethyl Benzotriazole, 1-(2-ethylhexylaminomethyl)benzotriazole, 2,4-di-t-pentyl-6-{(H-benzotriazol-1-yl)- Phenol, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 3-(2H-benzotriazol-2-yl)-5-(1,1- Octyl dimethyl)-4-hydroxy, 3-[3-t-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propanoate, 2-[3-Tertibutyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propanoic acid 2-ethylhexyl ester, 2-(2H-benzene And triazol-2-yl)-6-(1-methyl -1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2-(2H-benzotriazol-2-yl)-4-t-butylphenol , 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-th-octylphenyl)-benzotriazole, 2-(3-third 2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-t-pentylphenyl)benzotriazole, 2-(2 -hydroxy-3,5-di-t-butylphenyl)-5-chlorobenzotriazole, 2-[2-hydroxy-3,5-di(1,1-dimethylbenzyl)phenyl] -2H-benzotriazole, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl) Phenol], 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 3-[3-(2H-benzotriazole- Methyl 2-yl)-5-tert-butyl-4-hydroxyphenyl]propionate, and the like. Further, a specific hydroxy group-containing compound such as a sterol compound or a hydroxy hydrazine compound or a polyphenol compound can also be used as an ion scavenger. Specific examples of such a hydroxyl group-containing compound include 1,2-benzenediol, alizarin, indophenol, tannin, gallic acid, methyl gallate, and pyrogallol. The above other components may be used alone or in combination of two or more.

The tensile storage elastic modulus (before curing) of the subsequent layer at 23 ° C is not particularly limited, but is preferably 0.5 GPa or more, more preferably 0.75 GPa or more, and still more preferably 1 GPa or more. When the tensile storage elastic modulus is 0.5 GPa or more, adhesion to the carrier tape can be prevented. The upper limit of the tensile storage elastic modulus at 23 ° C is, for example, 50 GPa. The above-mentioned tensile storage elastic modulus can be adjusted by the kind of the resin component or its content, the kind of the filler, the content thereof, and the like.

The thickness of the subsequent layer is, for example, 2 to 200 μm, preferably 4 to 160 μm, more preferably 6 to 100 μm, still more preferably 10 to 80 μm.

The back contact film of the present invention may have a single layer structure including the above-mentioned adhesive layer, or may have a multilayer structure. The back surface adhesion film of the present invention having a multilayer structure has, for example, a laminated structure including the above-mentioned adhesive layer and a laser marking layer capable of imparting imprint information by a laser mark. The back surface adhesion film having such a multilayer structure is subjected to heat treatment at 120 ° C for 2 hours to obtain a laminated structure in which the above-mentioned adhesive layer is thermally cured, and on the other hand, the above-mentioned laser marking layer is not substantially thermally cured. Further, in the back contact film of the present invention, the hardened thermosetting layer is contained in the layer which is substantially not thermally cured by heat treatment at 120 ° C for 2 hours.

One embodiment of the case where the back surface adhesion film of the present invention is a multilayer structure including an adhesive layer and a laser mark layer is shown in FIG. 2 corresponds to a front cross-sectional view of the back contact film of the present invention shown in FIG. 1. As shown in FIG. 2, the back adhesion film 10 is disposed in plural in one direction F on the elongated spacer 30. The back surface adhesive film 10 has a multilayer structure including the adhesive layer 11 and the laser mark layer 12, and the laser mark layer 12 and the elongated spacer 30 are detachably adhered. Furthermore, in FIG. 2, the adhesive layer 11 and the laser marking layer 12 may also have opposite positional relationships (ie, the adhesive layer 11 and the elongated spacer 30 are releasably adhered to each other). When the adhesive layer 11 and the laser marking layer 12 are in the positional relationship shown in FIG. 2, the back surface adhesive film 10 can be bonded to the back surface of the workpiece and used in a heat-curing manner. On the other hand, when the positional relationship between the adhesive layer 11 and the laser marking layer 12 is opposite to that shown in Fig. 2, it can be favorably used for producing a dicing tape-integrated back surface adhesion film to be described later. Further, the surface of the back surface adhesive film 10 shown in Fig. 1 serves as the adhesive layer 11, and similarly, the surface may be the laser marking layer 12.

(laser marking layer)
In the case where the back contact film of the present invention has a multilayer structure of an adhesive layer and a laser mark layer, a laser mark is applied to the surface of the laser mark layer during the manufacturing process of the semiconductor device. Further, in the dicing tape-integrated back surface adhesion film, the laser marking layer is preferably located on the side of the dicing tape in the back surface adhesion film, and is in close contact with the dicing tape and the adhesive layer. Further, the laser marking layer is preferably a thermosetting layer (thermo-hardened layer) in which the thermosetting component is thermally hardened. The laser marking layer is formed by hardening a layer of a thermosetting resin composition formed of a resin composition forming a laser marking layer.

The laser marking layer and the resin composition forming the laser marking layer preferably comprise a thermoplastic resin. In the case where the above-mentioned laser marking layer is a thermosetting layer (ie, a thermosetting layer or a thermosetting layer), the above-mentioned laser marking layer or the resin composition forming the laser marking layer may contain a thermosetting resin. Further, the thermoplastic resin may further comprise a thermoplastic resin having a thermosetting functional group which can be bonded to the curing agent to bond.

The thermoplastic resin is, for example, a function of a binder in a laser marking layer, and examples of the thermoplastic resin include those described above as a thermoplastic resin which can be contained in an adhesive layer. The thermoplastic resin may be used singly or in combination of two or more. The thermoplastic resin is preferably an acrylic resin from the viewpoint of having less ionic impurities and high heat resistance.

The acrylic marking resin and the acrylic resin which can be contained in the above resin composition are preferably self-acrylic, from the viewpoint of the visibility of the imprinting information obtained by the laser marking and the good cutting property at the time of cutting. A copolymer of butyl ester, ethyl acrylate, acrylonitrile, and a suitably selected monomer of acrylic acid.

In the case where the thermosetting resin and the thermoplastic resin are contained together, examples of the thermosetting resin include an epoxy resin, a phenol resin, an amine resin, an unsaturated polyester resin, a polyurethane resin, and a poly A silicone resin, a thermosetting polyimide resin, or the like. The thermosetting resin may be used alone or in combination of two or more. The thermosetting resin is preferably an epoxy resin because the content of ionic impurities or the like which may cause corrosion of the semiconductor wafer tends to be small. Further, as the curing agent for the epoxy resin, a phenol resin is preferred.

Examples of the epoxy resin include those exemplified as the epoxy resin which can be included in the adhesive layer. The above epoxy resins may be used alone or in combination of two or more.

The phenol resin which can function as a hardener of an epoxy resin is exemplified as the phenol resin which can be contained as an adhesive layer mentioned above. The phenol resin may be used singly or in combination of two or more.

In the laser marking layer and the above resin composition, the phenol resin is used per gram of the epoxy group in the epoxy resin component from the viewpoint of sufficiently performing the hardening reaction of the epoxy resin and the phenol resin. The hydroxyl group in the resin is preferably contained in an amount of from 0.5 to 2.0 equivalents, more preferably from 0.8 to 1.2 equivalents.

In the case where the laser marking layer and the resin composition contain a thermosetting resin, the content ratio of the thermosetting resin is preferably 5 to 60% by mass based on the total mass of the laser marking layer and the resin composition. More preferably, it is 10 to 50% by mass.

In the case where the laser marking layer and the resin composition include a thermoplastic resin having a thermosetting functional group, the thermoplastic resin may be an acrylic resin containing a thermosetting functional group which may be contained as an adhesive layer. Example. In addition, it is preferable to include an acrylic resin containing a thermosetting functional group and a curing agent, and examples of the curing agent include a radiation curable adhesive which is formed as an adhesive layer described below. The agent is exemplified. When the thermosetting functional group in the acrylic resin containing a thermosetting functional group is a glycidyl group, a polyphenol compound is preferably used as the curing agent, and for example, various phenol resins described above can be used.

The laser marking layer and the above resin composition preferably contain a thermosetting catalyst (thermosetting accelerator). When the thermosetting catalyst is contained, the curing reaction of the resin component can be sufficiently performed or the curing reaction rate can be improved during the curing of the resin composition. Examples of the above-mentioned thermosetting catalyst include those described above as a thermosetting catalyst which can be contained in the adhesive layer. The above-mentioned thermosetting catalyst may be contained alone or in combination of two or more.

The laser marking layer and the above resin composition may also contain a filler. By including the filler, it is easy to adjust the physical properties such as the elastic modulus of the laser marking layer, the strength of the falling point, and the elongation at break. The filler is exemplified as the filler which can be contained as the adhesive layer. The above filler may be contained alone or in combination of two or more.

The above filler may have various shapes such as a spherical shape, a needle shape, and a sheet shape. The average particle diameter of the above filler is preferably from 30 to 500 nm, more preferably from 40 to 400 nm, still more preferably from 50 to 300 nm. That is, the laser marking layer and the above resin composition preferably contain a nano filler. When a nano-sized filler having such a particle diameter is used as a filler, the cut-off property and the cut-off property are more excellent for the small-sized back surface adhesive film. Further, when the laser marking layer or the resin composition contains a filler, the content ratio of the filler is preferably 10% by mass or more, more preferably 15% by mass or more, and still more preferably 20% by mass or more. The content ratio is preferably 50% by mass or less, more preferably 47% by mass or less, still more preferably 45% by mass or less.

The laser marking layer and the above resin composition may also contain a colorant. In the case of containing a coloring agent, it is possible to exhibit excellent marking properties and appearance, and it is possible to perform laser marking to impart various information such as text information or graphic information. Further, by appropriately selecting the color of the coloring agent, it is possible to make the information (character information, graphic information, and the like) given by the mark excellent visibility. Further, by the selection of the coloring agent, color discrimination can be performed for the product.

The above colorant may be a pigment or a dye. Examples of the colorant include a black coloring agent, a cyan coloring agent, a magenta coloring agent, and a yellow coloring agent. The information is imprinted on the laser mark layer by a laser mark, and a black colorant is preferable from the viewpoint of superior visibility of the information. The coloring agent may be contained alone or in combination of two or more.

Examples of the black coloring agent include azo pigments such as carbon black, carbon nanotubes, graphite, copper oxide, manganese dioxide, and azomethine azo black, nigrosine, and ruthenium. Titanium black, cyanine black, activated carbon, ferrite, magnetite, chromium oxide, iron oxide, molybdenum disulfide, composite oxide black pigment, lanthanide organic black dye, azo organic black dye, and the like. Examples of the carbon black include furnace black, chimney black, acetylene black, hot carbon black, and lamp black. Examples of the black coloring agent include CI solvent black 3, CI solvent black 7, CI solvent black 22, CI solvent black 27, CI solvent black 29, CI solvent black 34, CI solvent black 43, and CI solvent black 70; CI direct black 17, CI direct black 19, CI direct black 22, CI direct black 32, CI direct black 38, CI direct black 51, CI direct black 71; CI acid black 1, CI acid black 2, CI acid black 24, CI acid black 26, CI acid black 31, CI acid black 48, CI acid black 52, CI acid black 107, CI acid black 109, CI acid black 110, CI acid black 119, CI acid black 154; CI dispersion black 1, CI dispersion black 3, CI dispersion black 10, CI dispersion black 24; CI pigment black 1, CI pigment black 7, and the like.

Examples of the cyan coloring agent include CI solvent blue 25, CI solvent blue 36, CI solvent blue 60, CI solvent blue 70, CI solvent blue 93, CI solvent blue 95; CI acid blue 6, CI acid blue 45; CI Pigment Blue 1, CI Pigment Blue 2, CI Pigment Blue 3, CI Pigment Blue 15, CI Pigment Blue 15:1, CI Pigment Blue 15:2, CI Pigment Blue 15:3, CI Pigment Blue 15:4, CI Pigment Blue 15:5, CI Pigment Blue 15:6, CI Pigment Blue 16, CI Pigment Blue 17, CI Pigment Blue 17:1, CI Pigment Blue 18, CI Pigment Blue 22, CI Pigment Blue 25, CI Pigment Blue 56, CI Pigment Blue 60, CI Pigment Blue 63, CI Pigment Blue 65, CI Pigment Blue 66; CI Reduction Blue 4; CI Reduction Blue 60, CI Pigment Green 7, and the like.

Examples of the magenta coloring agent include CI solvent red 1, CI solvent red 3, CI solvent red 8, CI solvent red 23, CI solvent red 24, CI solvent red 25, CI solvent red 27, and CI solvent red 30. CI solvent red 49, CI solvent red 52, CI solvent red 58, CI solvent red 63, CI solvent red 81, CI solvent red 82, CI solvent red 83, CI solvent red 84, CI solvent red 100, CI solvent red 109, CI solvent red 111, CI solvent red 121, CI solvent red 122; CI dispersion red 9; CI solvent violet 8, CI solvent violet 13, CI solvent violet 14, CI solvent violet 21, CI solvent violet 27; CI dispersed violet 1; CI alkaline red 1, CI alkaline red 2, CI alkaline red 9, CI alkaline red 12, CI alkaline red 13, CI alkaline red 14, CI alkaline red 15, CI alkaline red 17, CI alkali Sexual red 18, CI alkaline red 22, CI alkaline red 23, CI alkaline red 24, CI alkaline red 27, CI alkaline red 29, CI alkaline red 32, CI alkaline red 34, CI alkaline red 35, CI alkaline red 36, CI alkaline red 37, CI alkaline red 38, CI alkaline red 39, CI alkaline red 40; CI alkaline purple 1, CI alkaline purple 3, CI alkaline purple 7, CI base Violet 10, C.I. Basic Violet 14, C.I. Basic Violet 15, C.I. Basic Violet 21, C.I. Basic Violet 25, C.I. Basic Violet 26, C.I. Basic Violet 27, 28 and the like. Further, examples of the magenta coloring agent include CI Pigment Red 1, CI Pigment Red 2, CI Pigment Red 3, CI Pigment Red 4, CI Pigment Red 5, CI Pigment Red 6, CI Pigment Red 7, and CI Pigment Red 8. , CI Pigment Red 9, CI Pigment Red 10, CI Pigment Red 11, CI Pigment Red 12, CI Pigment Red 13, CI Pigment Red 14, CI Pigment Red 15, CI Pigment Red 16, CI Pigment Red 17, CI Pigment Red 18 , CI Pigment Red 19, CI Pigment Red 21, CI Pigment Red 22, CI Pigment Red 23, CI Pigment Red 30, CI Pigment Red 31, CI Pigment Red 32, CI Pigment Red 37, CI Pigment Red 38, CI Pigment Red 39 , CI Pigment Red 40, CI Pigment Red 41, CI Pigment Red 42, CI Pigment Red 48:1, CI Pigment Red 48:2, CI Pigment Red 48:3, CI Pigment Red 48:4, CI Pigment Red 49, CI Pigment Red 49:1, CI Pigment Red 50, CI Pigment Red 51, CI Pigment Red 52, CI Pigment Red 52:2, CI Pigment Red 53:1, CI Pigment Red 54, CI Pigment Red 55, CI Pigment Red 56, CI Pigment Red 57:1, CI Pigment Red 58, CI Pigment Red 60, CI Pigment Red 60:1, CI Pigment Red 63, CI Pigment Red 63:1, CI Pigment Red 63:2, CI Pigment Red 64, CI Pigment Red 64:1, CI Pigment Red 67, CI Pigment Red 68, CI Pigment Red 81, CI Pigment Red 83, CI Pigment Red 87, CI Pigment Red 88, CI Pigment Red 89, CI Pigment Red 90, CI Pigment Red 92, CI Pigment Red 101, CI Pigment Red 104, CI Pigment Red 105, CI Pigment Red 106, CI Pigment Red 108, CI Pigment Red 112, CI Pigment Red 114, CI Pigment Red 122, CI Pigment Red 123, CI Pigment Red 139, CI Pigment Red 144, CI Pigment Red 146, CI Pigment Red 147, CI Pigment Red 149, CI Pigment Red 150, CI Pigment Red 151, CI Pigment Red 163, CI Pigment Red 166, CI Pigment Red 168, CI Pigment Red 170, CI Pigment Red 171, CI Pigment Red 172, CI Pigment Red 175, CI Pigment Red 176, CI Pigment Red 177, CI Pigment Red 178, CI Pigment Red 179, CI Pigment Red 184, CI Pigment Red 185, CI Pigment Red 187, CI Pigment Red 190, CI Pigment Red 193, CI Pigment Red 202, CI Pigment Red 206, CI Pigment Red 207, CI Pigment Red 209, CI Pigment Red 219, CI Pigment Red 222, CI Pigment Red 224, CI Pigment Red 238, CI Pigment Red 245; CI pigment violet 3, CI pigment violet 9, CI pigment violet 19, CI pigment violet 23, CI pigment violet 31, CI pigment violet 32, CI pigment violet 33, CI pigment violet 36, CI pigment violet 38, CI pigment violet 43, CI pigment violet 50; CI reduction red 1, CI reduction red 2, CI reduction red 10, CI reduction red 13, CI reduction red 15, CI reduction red 23, CI reduction red 29, CI reduction red 35 and the like.

Examples of the yellow coloring agent include CI Solvent Yellow 19, CI Solvent Yellow 44, CI Solvent Yellow 77, CI Solvent Yellow 79, CI Solvent Yellow 81, CI Solvent Yellow 82, CI Solvent Yellow 93, and CI Solvent Yellow 98. CI Solvent Yellow 103, CI Solvent Yellow 104, CI Solvent Yellow 112, CI Solvent Yellow 162; CI Pigment Orange 31, CI Pigment Orange 43; CI Pigment Yellow 1, CI Pigment Yellow 2, CI Pigment Yellow 3, CI Pigment Yellow 4, CI pigment yellow 5, CI pigment yellow 6, CI pigment yellow 7, CI pigment yellow 10, CI pigment yellow 11, CI pigment yellow 12, CI pigment yellow 13, CI pigment yellow 14, CI pigment yellow 15, CI pigment yellow 16, CI Pigment Yellow 17, CI Pigment Yellow 23, CI Pigment Yellow 24, CI Pigment Yellow 34, CI Pigment Yellow 35, CI Pigment Yellow 37, CI Pigment Yellow 42, CI Pigment Yellow 53, CI Pigment Yellow 55, CI Pigment Yellow 65, CI Pigment Yellow 73, CI Pigment Yellow 74, CI Pigment Yellow 75, CI Pigment Yellow 81, CI Pigment Yellow 83, CI Pigment Yellow 93, CI Pigment Yellow 94, CI Pigment Yellow 95, CI Pigment Yellow 97, CI Pigment Yellow 98, CI Pigment Yellow 100, CI Pigment Yellow 101, CI Pigment Yellow 104, CI Pigment Yellow 108, CI Pigment Yellow 109 CI Pigment Yellow 110, CI Pigment Yellow 113, CI Pigment Yellow 114, CI Pigment Yellow 116, CI Pigment Yellow 117, CI Pigment Yellow 120, CI Pigment Yellow 128, CI Pigment Yellow 129, CI Pigment Yellow 133, CI Pigment Yellow 138, CI Pigment Yellow 139, CI Pigment Yellow 147, CI Pigment Yellow 150, CI Pigment Yellow 151, CI Pigment Yellow 153, CI Pigment Yellow 154, CI Pigment Yellow 155, CI Pigment Yellow 156, CI Pigment Yellow 167, CI Pigment Yellow 172, CI Pigment Yellow 173, CI Pigment Yellow 180, CI Pigment Yellow 185, CI Pigment Yellow 195; CI Reduction Yellow 1, CI Reduction Yellow 3, CI Reduction Yellow 20, and the like.

Regarding the content ratio of the above coloring agent, with respect to the viewpoint of achieving high visibility by the information of the laser marking layer imprinted on the laser marking layer, for example, with respect to the total mass of the laser marking layer or the above resin composition, for example It is 0.5% by mass or more, preferably 1% by mass or more, and more preferably 2% by mass or more. The content ratio is, for example, 10% by mass or less, preferably 8% by mass or less, and more preferably 5% by mass or less.

The laser marking layer and the above resin composition may also contain other components as needed. Examples of the other components include a flame retardant, a decane coupling agent, an ion scavenger, and the like exemplified as the other components which may be included in the adhesive layer. The above other components may be used alone or in combination of two or more.

The tensile storage elastic modulus (after hardening) at 23 ° C of the laser marking layer is not particularly limited, but is preferably 0.5 GPa or more, more preferably 0.75 GPa or more, and still more preferably 1 GPa or more. When the tensile storage elastic modulus is 0.5 GPa or more, adhesion to the carrier tape can be prevented. Moreover, the back surface of the workpiece can be more firmly protected after the heat curing. The upper limit of the tensile storage elastic modulus at 23 ° C is, for example, 50 GPa. The above-mentioned tensile storage elastic modulus can be adjusted by the kind of the resin component or its content, the kind of the filler, the content thereof, and the like.

In the case where the back contact film of the present invention has a multilayer structure of an adhesive layer and a laser mark layer, the thickness of the laser mark layer is preferably 1 or more, more preferably 1.5 or more, with respect to the thickness of the adhesive layer. More preferably, it is 2 or more. The above ratio is, for example, 8 or less.

The thickness of the laser marking layer in the case of having a laser marking layer is, for example, 2 to 180 μm, preferably 4 to 160 μm.

The thickness of the back surface adhesion film of the present invention is, for example, 2 to 200 μm, preferably 4 to 160 μm, more preferably 6 to 100 μm, still more preferably 10 to 80 μm. When the thickness is 2 μm or more, the back surface of the workpiece can be more firmly protected. When the thickness is 200 μm or less, the workpiece after the back surface is adhered can be made thinner.

The peeling force (peeling angle of 180°, peeling speed of 300 mm/min) of the back surface adhesive film of the back surface of the separator of the present invention is not particularly limited, but is preferably 0.4 N/100 mm or less, more preferably 0.35 N/ It is 100 mm or less, and more preferably 0.3 N/100 mm or less. When the peeling force is 0.4 N/100 mm or less, the back contact film of the present invention can be more easily peeled off from the separator. Further, the peeling force is preferably as small as possible, and is, for example, 0.01 N/100 mm or more.

[Cutting Tape Integrated Semiconductor Back Contact Film]
The back contact film of the present invention may further comprise a dicing tape having a laminated structure including a substrate and an adhesive layer, and a back contact film of the present invention which is detachably adhered to the adhesive layer of the dicing tape. The dicing tape-integrated semiconductor back surface adhesion film (sometimes referred to as "the dicing tape-integrated back surface adhesion film" is used). In addition, the above-mentioned diced tape-integrated back surface adhesion film may be referred to as "the dicing tape-integrated back surface adhesion film of the present invention". When the back contact film of the present invention is used in the form of a diced tape-integrated back surface adhesion film, wrinkles are less likely to occur when attached to the substrate and the frame.

Preferably, the dicing tape of the dicing tape-integrated back surface adhesion film has a plane projection area larger than that of the back surface adhesion film of the present invention. In this case, the frame for cutting at the time of cutting can be attached to the surface of the adhesive layer.

Preferably, the dicing tape has a rounded portion in a planar projection shape. In this case, the dicing tape-integrated back surface adhesion film of the present invention can be more easily peeled off from the separator.

In the case where the planar projection shape of the dicing tape has a rounded portion, the radius of curvature R2 of the rounded portion is not particularly limited, but is preferably 0.5 to 50 mm, more preferably 0.7 to 40 mm, and further preferably 0.9 to 30 mm. When the radius of curvature R2 is 0.5 mm or more, even if the plane projection area is relatively large, wrinkles are less likely to occur at the time of peeling. Moreover, when the curvature radius R2 is 50 mm or less, the discarded portion after use can be minimized.

The ratio [R2/R1] of the radius of curvature R2 to the radius of curvature R1 is preferably from 0.5 to 100, more preferably from 0.8 to 50, still more preferably from 1 to 30. When the ratio is within the above range, the frame can be fixed to the dicing tape without waste, and even if the area between the dicing tape and the back surface adhesion film is poor, the bonding step of the back surface adhesion film and the dicing tape can be performed. In the meantime, it is not easy for the back adhesion film to wrinkle, and the dicing tape is less likely to wrinkle during the bonding step with the substrate or the frame. Moreover, it is excellent in workability.

In the case where the planar projection shape of the dicing tape and the back-contact film of the present invention having the rounded portion is a shape in which at least one corner is subjected to the rounded portion processing, at least one of the corner portions may be performed. The plane projection shape before the fillet portion is processed is called "the plane projection shape in which the rounded portion is not formed". Further, the planar projection shape of the dicing tape which is not formed with the rounded portion is preferably similar to the planar projection shape of the back surface adhesive film of the present invention in which the rounded portion is not formed. In this case, wrinkles from the peeling of the spacer are less likely to occur. Moreover, the discarded portion of the dicing tape after use can be minimized. In the case where the planar projection shape of the back surface adhesion film and the dicing tape of the present invention in which the rounded portion is not formed is a similar shape, the planar projection shape in which the rounded portion is not formed is, for example, a polygonal shape.

When the planar projection shape in which the rounded portion is not formed is a similar shape, the similarity ratio of the similar shape is not particularly limited, and is preferably 1.01 or more, more preferably 1.03 or more, and still more preferably 1.05. the above. If the above similar ratio is 1.01 or more, the cutting frame can be bonded to the adhesive layer of the dicing tape to be directly used for cutting. The above similarity ratio is, for example, 2.0 or less, preferably 1.8 or less.

In the case where the planar projection shape of the dicing tape has a rounded portion and the planar projection shape in which the rounded portion is not formed is a similar shape, it is preferable that the rounded portion and the rounded portion X of the dicing tape are not formed into a circle. The similar shape of the corner is the corresponding angle.

In the dicing tape-integrated back surface adhesion film, the peeling force of the back surface adhesive film of the present invention to the adhesive layer (peeling angle of 180°, peeling speed of 300 mm/min, and hardening) is not particularly limited, and is preferably 10 N. /20 mm or less, more preferably 5 N/20 mm or less. When the peeling force is 10 N/20 mm or less, the wafer can be easily picked up from the dicing tape at the time of picking up. The above peeling force is preferably 0.02 N/20 mm or more, more preferably 0.05 N/20 mm or more. When the peeling force is 0.02 N/20 mm or more, the back surface adhesive film after curing is not easily peeled off from the dicing tape at the time of cutting.

An embodiment of the dicing tape-integrated back surface adhesion film of the present invention will be described with reference to Figs. Fig. 3 is a plan view (planar projection view) showing an embodiment of a diced tape-integrated back surface adhesion film of the present invention. Fig. 4 is a plan view (planar projection view) of the dicing tape-integrated back surface adhesion film of the present invention shown in Fig. 3 as viewed from the side of the back surface adhesion film. Fig. 5 is a front cross-sectional view showing the dicing tape-integrated back surface adhesion film 1 of the present invention shown in Fig. 3. As shown in FIG. 3, the dicing tape-integrated back surface adhesion film 1 is disposed in plural in one direction F on the elongated spacer 30. As shown in FIG. 4, the planar projection shape of the back surface adhesion film 10 of the dicing tape-integrated back surface adhesion film 1 is processed into a rounded portion X, that is, 10a, 10b, as a square of a square projection shape in which a rounded portion is not formed. , 10c, and 10d shapes. Further, the planar projection shape of the dicing tape 20 of the dicing tape-integrated back surface adhesion film 1 is formed into rounded portions 20a, 20b, 20c, and 20d as all the squares of the square projection shape in which the rounded portion is not formed. shape. In the dicing tape-integrated back surface adhesion film 1 of the present invention, the back surface adhesion film 10 and the dicing tape 20 have a similar shape in a planar projection shape in which the rounded portion is not formed. When the dicing tape-integrated back surface adhesion film 1 of the present invention is peeled off from the elongated spacer 30, for example, the elongated spacer 30 is conveyed in one direction F and adhered from the dicing tape integrated back surface of the present invention. The strip-shaped separator 30 is bent toward the side opposite to the side of the dicing tape-integrated back surface adhesion film 1 of the present invention in such a manner that the end portion of the film 1 on the direction F side is peeled off, whereby the dicing tape of the present invention is obtained. The integrated back surface adhesive film 1 is peeled off from the above end.

(substrate)
The base material of the dicing tape is an element that functions as a support in the dicing tape or the diced tape-integrated back surface adhesion film. Examples of the substrate include a plastic substrate (especially a plastic film). The substrate may be a single layer or a laminate of the same or different substrates.

Examples of the resin constituting the plastic substrate include low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, and block. Copolymerized polypropylene, homopolypropylene, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionic polymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid Polyester resin such as ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyethylene terephthalate (PET), polynaphthalene Ethylene formate, polybutylene terephthalate (PBT) and other polyesters; polycarbonate; polyimine; polyetheretherketone; polyetherimine; aramid, aroma Polyamides such as polyamines; polyphenylene sulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resin; polyoxyl resin. In terms of ensuring good heat shrinkage in the substrate, in the expansion step for enlarging the distance between the diced semiconductor wafers, the use of the dicing tape or the local heat shrinkage of the substrate to easily maintain the wafer spacing distance is The substrate preferably contains ethylene-vinyl acetate copolymer or polyvinyl chloride as a main component. In addition, the main component of a base material is a component which is the largest mass ratio among a component. The above resins may be used alone or in combination of two or more. In the case where the adhesive layer is a radiation-curable adhesive layer as described below, the substrate preferably has radiation permeability.

When the substrate is a plastic film, the plastic film may be misaligned or aligned in at least one direction (uniaxial direction, biaxial direction, etc.). The plastic film can be thermally contracted in the at least one direction when it is aligned in at least one direction. When it is heat-shrinkable, even if wrinkles generate|occur|produce at the time of bonding of a board|substrate or a frame, it is set as the heat-shrinking heat-reduction, and wrinkles can be reduced. In order to impart isotropic heat shrinkability to the substrate and the dicing tape, the substrate is preferably a biaxial alignment film. Furthermore, the plastic film that is aligned in at least one direction can be obtained by extending the non-extending plastic film in at least one direction (uniaxial stretching, biaxial stretching, etc.). The heat shrinkage rate of the substrate and the dicing tape subjected to the heat treatment at a heating temperature of 100 ° C and a heating time of 60 seconds is preferably from 1 to 30%, more preferably from 2 to 25%, still more preferably from 3 to ～. 20%, especially 5-20%. The heat shrinkage rate is preferably a heat shrinkage ratio in at least one of a MD (Machine Direction) direction and a TD (Transverse Direction) direction. Furthermore, the above-mentioned heat shrinkage rate can be obtained by cutting a short strip of test piece having a length of 150 mm in the MD direction and a width of 25 mm from the dicing tape, and adding two lines to the test piece at intervals of 100 mm and measuring the distance between the lines. (distance between the lines before heating), and then the test piece was suspended from the crucible using a known tensile tester, and the test piece was heated at 100 ° C for 60 seconds using a dryer, followed by cooling, and measurement 2 The interval between the strip lines (the distance between the lines after heating) is obtained in the form of the distance between the lines after heating and the distance (%) between the lines before heating.

The surface of the adhesive layer side of the substrate may be subjected to corona discharge treatment, plasma treatment, sand roughening treatment, ozone exposure treatment, flame exposure treatment, for example, in order to improve adhesion to the adhesive layer, retention, and the like. Physical treatment such as high-voltage electric shock exposure treatment, ionizing radiation treatment, chemical treatment such as chromic acid treatment, and surface treatment by a coating agent (primer). Further, in order to impart antistatic ability, a vapor-deposited layer containing a conductive material such as a metal, an alloy, or the like may be provided on the surface of the substrate. The surface treatment for improving the adhesion is preferably carried out on the entire surface of the adhesive layer side of the substrate.

The thickness of the substrate is preferably 40 μm or more, and more preferably 50 μm, from the viewpoint of the strength of the substrate as a support for the dicing tape and the diced tape-integrated back surface adhesion film. The above is more preferably 55 μm or more, and particularly preferably 60 μm or more. Further, from the viewpoint of achieving moderate flexibility in the dicing tape and the dicing tape-integrated back surface adhesion film, the thickness of the substrate is preferably 200 μm or less, more preferably 180 μm or less, and further preferably Less than 150 μm.

(adhesive layer)
The adhesive layer of the dicing tape can be an adhesive layer (adhesive-reducing adhesive layer) which can deliberately reduce the adhesion by external action during the use of the dicing tape-integrated back contact film. It can be used for the adhesive layer of the dicing tape-integrated back-contact film, which has little or no adhesion due to external action (adhesive non-reducing adhesive layer), and can be used according to the use of the dicing tape. The singulation method or condition of the singulated workpiece of the integrated back surface adhesion film is appropriately selected. The adhesive layer may have a single layer structure or a multilayer structure.

In the case where the adhesive layer is adhesive to reduce the adhesive layer, the adhesive layer can be flexibly used to exhibit a relatively high adhesive force during the manufacturing process or during use of the dicing tape integrated back contact film. And exhibit a relatively low adhesion state. For example, in the manufacturing process of the dicing tape-integrated back surface adhesion film, when the back surface adhesion film is bonded to the adhesive layer of the dicing tape, or when the dicing tape integrated back surface adhesion film is used for the cutting step, adhesion can be utilized. The agent layer exhibits a relatively high adhesion state inhibition, prevents the back adhesion film from being embossed from the adhesive layer, and, on the other hand, picks up the semiconductor wafer from the dicing tape for self-cutting the integrated back surface adhesion film. In the picking up step, picking up can be easily performed by lowering the adhesive force of the adhesive layer.

Examples of the adhesive for forming such an adhesive-reducible adhesive layer include a radiation curable adhesive and a heat-foaming adhesive. As the adhesive for forming the adhesive-reducing adhesive layer, an adhesive may be used, or two or more adhesives may be used.

As the radiation curable adhesive, for example, an adhesive which is hardened by irradiation with an electron beam, ultraviolet rays, alpha rays, beta rays, gamma rays, or X-rays can be used, and it is particularly preferable to use ultraviolet rays. A hardening type of adhesive (ultraviolet curable adhesive).

For example, the radiation curable adhesive containing a base polymer such as an acrylic polymer and a radiation polymerizable monomer component or oligomer component having a functional group such as a carbon-carbon double bond of radiation polymerizability may be mentioned. Radiation-curable adhesive.

The acrylic polymer is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth) acrylonitrile group in a molecule) as a structural unit of a polymer. The acrylic polymer is preferably a polymer containing a maximum amount of structural units derived from (meth) acrylate by mass ratio. Further, the acrylic polymer may be used alone or in combination of two or more.

The (meth) acrylate may, for example, be a hydrocarbon group-containing (meth) acrylate which may have an alkoxy group. The hydrocarbon group-containing (meth) acrylate which may have an alkoxy group may, for example, be a hydrocarbon group-containing (meth) acrylate which may have an alkoxy group exemplified as a structural unit of the acrylic resin which may be contained in the adhesive layer. The above-mentioned hydrocarbon group-containing (meth) acrylate having an alkoxy group may be used singly or in combination of two or more kinds. The hydrocarbyl group-containing (meth) acrylate which may have an alkoxy group is preferably 2-ethylhexyl acrylate or lauryl acrylate. In order to appropriately exhibit the basic properties such as adhesion obtained by the hydrocarbyl group-containing (meth) acrylate having an alkoxy group in the adhesive layer, all of the monomer components for forming the acrylic polymer may have The ratio of the hydrocarbon group-containing (meth) acrylate of the alkoxy group is preferably 40% by mass or more, and more preferably 60% by mass or more.

The acrylic polymer may contain a structural unit derived from another monomer component copolymerizable with the above-described alkoxy group-containing hydrocarbon (meth) acrylate for modification of cohesive force, heat resistance and the like. Examples of the other monomer component include the other monomers exemplified as the structural unit of the acrylic resin which may be included in the adhesive layer. The other monomer components may be used alone or in combination of two or more. In order to properly exhibit the basic properties such as adhesion obtained by the hydrocarbyl group-containing (meth) acrylate having an alkoxy group in the adhesive layer, the above-mentioned other among all the monomer components for forming the acrylic polymer The total ratio of the monomer components is preferably 60% by mass or less, and more preferably 40% by mass or less.

The acrylic polymer may further contain a structural unit derived from a polyfunctional monomer copolymerizable with a monomer component forming an acrylic polymer in order to form a crosslinked structure in the polymer skeleton. Examples of the polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, and new Pentandiol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol Hexa(meth)acrylate, epoxy (meth)acrylate (for example, poly(meth)acrylate), polyester (meth)acrylate, (meth)acrylic acid urethane, etc. A monomer having a (meth) acrylonitrile group and other reactive functional groups in the molecule. The above polyfunctional monomer may be used alone or in combination of two or more. In order to appropriately exhibit the basic properties such as adhesion obtained by the hydrocarbyl group-containing (meth) acrylate having an alkoxy group in the adhesive layer, the above-mentioned plurality of all the monomer components of the acrylic polymer are formed. The ratio of the functional monomer is preferably 40% by mass or less, and more preferably 30% by mass or less.

The acrylic polymer can be obtained by polymerizing one or more monomer components including an acrylic monomer. Examples of the polymerization method include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and the like.

The acrylic polymer can be obtained by polymerizing a raw material monomer used for the acrylic polymer. Examples of the polymerization method include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and the like. The mass average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably 200,000 to 3,000,000. When the mass average molecular weight is 100,000 or more, the amount of the low molecular weight substance in the adhesive layer tends to be small, and contamination to the back surface adhesion film or the semiconductor wafer or the like can be further suppressed.

The adhesive layer or the adhesive forming the adhesive layer may contain a crosslinking agent. For example, when an acrylic polymer is used as the base polymer, the acrylic polymer can be crosslinked to further reduce the low molecular weight substance in the adhesive layer. Further, the mass average molecular weight of the acrylic polymer can be increased. Examples of the crosslinking agent include a polyisocyanate compound, an epoxy compound, a polyol compound (such as a polyphenol compound), an aziridine compound, and a melamine compound. In the case of using a crosslinking agent, the amount thereof is preferably about 5 parts by mass or less, more preferably from 0.1 to 5 parts by mass, per 100 parts by mass of the base polymer.

Examples of the radiation polymerizable monomer component include (meth)acrylic acid urethane, trimethylolpropane tri(meth)acrylate, and pentaerythritol tri(meth)acrylate. Pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylic acid Ester and the like. Examples of the radiation polymerizable oligomer component include various oligomers such as a urethane type, a polyether type, a polyester type, a polycarbonate type, and a polybutadiene type, and the molecular weight is preferably 100 to 30000 or so. The content of the radiation polymerizable monomer component and the oligomer component in the radiation curable adhesive forming the pressure-sensitive adhesive layer is, for example, 5 to 500 parts by mass, preferably 40 to 150, per 100 parts by mass of the base polymer. The mass is around. Further, as the additive-type radiation-curable adhesive, for example, those disclosed in JP-A-60-196956 can be used.

The radiation curable adhesive may be an intrinsic type of a base polymer containing a functional group such as a carbon-carbon double bond having a radiation polymerizable property in a polymer side chain or a polymer main chain at a polymer main chain terminal. Radiation hardening adhesive. When such an intrinsic type radiation curable adhesive is used, there is a tendency that the unintentional temporal change of the adhesive property due to the movement of the low molecular weight component in the formed adhesive layer can be suppressed.

The base polymer contained in the intrinsic radiation curable adhesive is preferably an acrylic polymer. The method of introducing the radiation-polymerizable carbon-carbon double bond into the acrylic polymer is, for example, a method of polymerizing (copolymerizing) a raw material monomer containing a monomer component having a first functional group to obtain an acrylic polymerization. Then, the compound having a second functional group capable of reacting with the first functional group and a compound having a carbon-carbon double bond which is radiation-polymerizable is allowed to directly condense the acrylic polymer by maintaining the radiopolymerizable property of the carbon-carbon double bond. Reaction or addition reaction.

Examples of the combination of the first functional group and the second functional group include a carboxyl group, an epoxy group, an epoxy group and a carboxyl group, a carboxyl group and an aziridine group, an aziridine group and a carboxyl group, and a hydroxyl group and an isocyanate group. , isocyanate group and hydroxyl group. Among these, from the viewpoint of tracking the easiness of the reaction, a combination of a hydroxyl group and an isocyanate group, and a combination of an isocyanate group and a hydroxyl group are preferred. Among them, the technical difficulty of producing a polymer having a high reactivity of an isocyanate group is high, and on the other hand, from the viewpoint of production and availability of an acrylic polymer having a hydroxyl group, it is preferred. The first functional group is a hydroxyl group and the second functional group is a combination of isocyanato groups. Examples of the isocyanate compound containing a radiation-polymerizable unsaturated functional group, which is a compound having an isocyanato group and a radioactive polymerizable carbon-carbon double bond, may, for example, be methacryl oxime isocyanate or 2-methylpropenyloxy group. Ethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. Further, examples of the acrylic polymer having a hydroxyl group include the above-described hydroxyl group-containing monomer, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, and the like. A structural unit of an ether compound.

The radiation curable adhesive preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include an α-keto alcohol compound, an acetophenone compound, a benzoin ether compound, a ketal compound, an aromatic sulfonium chloride compound, a photoactive quinone compound, and Benzophenone compound, 9-oxopurine A compound, camphorquinone, a halogenated ketone, a mercaptophosphine oxide, a decyl phosphate, or the like. Examples of the α-keto alcohol-based compound include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl) ketone and α-hydroxy-α,α'-dimethylbenzene. Ethyl ketone, 2-methyl-2-hydroxypropiophenone, 1-hydroxycyclohexyl phenyl ketone, and the like. Examples of the acetophenone-based compound include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, and 2- Methyl-1-[4-(methylthio)-phenyl]-2-morpholinylpropan-1-one and the like. Examples of the benzoin ether-based compound include benzoin ethyl ether, benzoin isopropyl ether, and aniseed methoxyether. Examples of the ketal-based compound include benzoin dimethyl ketal and the like. Examples of the aromatic sulfonium chloride-based compound include 2-naphthalenesulfonium chloride and the like. Examples of the photoactive quinone compound include 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl) hydrazine. Examples of the benzophenone-based compound include benzophenone, benzamidine benzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone. As the above 9-oxopurine a compound, for example, 9-oxopurine 2-chloro 9-oxosulfuron 2-methyl 9-oxothione 2,4-Dimethyl 9-oxothione Isopropyl 9-oxopurine 2,4-Dichloro 9-oxosulfuron 2,4-Diethyl 9-oxothione 2,4-diisopropyl 9-oxothione Wait. The content of the photopolymerization initiator in the radiation-curable adhesive is, for example, 0.05 to 20 parts by mass based on 100 parts by mass of the base polymer.

The heat-expandable pressure-sensitive adhesive contains an adhesive (foaming agent, heat-expandable microsphere, etc.) which is foamed or expanded by heating. Examples of the foaming agent include various inorganic foaming agents or organic foaming agents. Examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, and azide. Examples of the organic foaming agent include chlorofluorocarbons such as trichloromonofluoromethane and dichloromonofluoromethane; azobisisobutyronitrile, azodimethylamine, and azobiscarboxylate; Nitrogen-based compound; p-toluenesulfonate, diphenylindole-3,3'-disulfonium, 4,4'-oxybis(phenylsulfonate), allyl bis(sulfonate), etc. a compound; an amine urea compound such as p-toluenesulfonyl urea, 4,4'-oxybis(phenylsulfonylaminourea); 5-morpholinyl-1,2,3,4-thiatriazole And other triazole compounds; N, N'-dinitrosopentamethylenetetramine, N, N'-dimethyl-N, N'-dinitroso-p-xylamine and other N-Asia A nitro compound or the like. Examples of the heat-expandable microspheres include microspheres in which a material which is easily vaporized and expanded by heating is enclosed in a shell. Examples of the substance which is easily vaporized and expanded by heating are, for example, isobutane, propane, pentane or the like. The heat-expandable microspheres can be produced by encapsulating a substance which is easily vaporized and expanded by heating into a shell-forming substance by a coacervation method or an interfacial polymerization method. As the shell-forming substance, a substance which exhibits hot meltability or a substance which is rupturable by the action of thermal expansion of the enclosed substance can be used. Examples of such a substance include a vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polyfluorene, and the like. .

The pressure-sensitive adhesive layer is, for example, a pressure-sensitive adhesive layer. Further, the pressure-sensitive adhesive layer includes a radiation layer which is previously formed by the radiation-curable adhesive described above with respect to the adhesion-reducible adhesive layer by radiation irradiation, and also has a certain Adhesive layer in the form of adhesion. As the adhesive for forming the adhesive non-reducing adhesive layer, an adhesive may be used, or two or more adhesives may be used. Further, the entire adhesive layer is an adhesive non-reducing adhesive layer, and a part of the adhesive non-reducing adhesive layer. For example, in the case where the adhesive layer has a single layer structure, the entire adhesive layer is an adhesive non-reducing adhesive layer, or a specific portion of the adhesive layer (for example, a bonding object for a cutting frame). The region and the region outside the central region are adhesive non-reducing adhesive layers, and other portions (for example, a semiconductor wafer segment or a semiconductor wafer bonding target region, that is, a central region) are adhesively lowerable. Adhesive layer. Further, when the adhesive layer has a laminated structure, all of the adhesive layer in the buildup structure is an adhesive non-reducing adhesive layer, and a part of the adhesive layer in the laminated structure may be an adhesive non-reducing adhesive. Floor.

An adhesive layer (radiation-cured radiation-curable adhesive layer irradiated with radiation) in which an adhesive layer (radiation is not irradiated with a radiation-curable adhesive layer) formed by a radiation curable adhesive is irradiated by radiation, Even if the adhesion is lowered by radiation, the adhesion due to the polymer component contained can be exhibited, and the adhesive layer required for the dicing tape can be minimized in the dicing step or the like. In the case of using a radiation-curable adhesive layer irradiated with radiation, the radiation-curable adhesive layer or the adhesive layer may be irradiated with radiation as a whole in the direction in which the surface of the adhesive layer is widened. Some of them are radiation-curable adhesive layers that have been irradiated with radiation, and other portions are radiation-free adhesive layers that are not irradiated with radiation. In the present specification, the "radiation-curing adhesive layer" refers to an adhesive layer formed of a radiation-curable adhesive, and includes a radiation-curable radiation-free radiation-curable adhesive layer and the radiation-curable adhesive layer. The adhesive layer is cured by radiation irradiation to harden the radiation-hardened adhesive layer.

As the adhesive for forming the pressure-sensitive adhesive layer, a known or conventional pressure-sensitive adhesive can be used, and an acrylic adhesive or a rubber-based adhesive based on an acrylic polymer can be preferably used. In the case where the adhesive layer contains an acrylic polymer as a pressure-sensitive adhesive, the acrylic polymer preferably contains a structural unit derived from (meth) acrylate as the most structural unit by mass ratio. polymer. As the acrylic polymer, for example, the acrylic polymer described above as an acrylic polymer which may be included in the additive-type radiation curable adhesive can be used.

The adhesive layer or the adhesive forming the adhesive layer may be formulated with a known or conventional adhesive layer such as a crosslinking accelerator, an adhesion-imparting agent, an anti-aging agent, a coloring agent (pigment, dye, etc.) in addition to the above components. Additives used. Examples of the coloring agent include compounds which are colored by radiation irradiation. In the case of containing a compound colored by radiation irradiation, only the portion irradiated with radiation may be colored. The compound which is colored by radiation irradiation is a colorless or light-colored compound which is colored before irradiation with radiation, but becomes a colored compound by radiation irradiation, and examples thereof include a leuco dye. The amount of the compound to be colored by radiation irradiation is not particularly limited and may be appropriately selected.

The thickness of the adhesive layer is not particularly limited. When the adhesive layer is an adhesive layer formed of a radiation curable adhesive, the adhesion to the back adhesive film before and after the radiation hardening of the adhesive layer is taken. From the viewpoint of balance, it is preferably from about 1 to 50 μm, more preferably from 2 to 30 μm, still more preferably from 5 to 25 μm.

The dicing tape-integrated back surface adhesion film of the present invention preferably has a shape corresponding to an aggregate of semiconductor wafers in which a semiconductor wafer or a semiconductor wafer to be processed in a semiconductor device manufacturing process is formed. The plane projection area of the dicing tape-integrated back surface adhesion film of the present invention is, for example, preferably 22725 mm ² or more, more preferably 23457 mm ² or more, still more preferably 32724 mm ² or more. The above projected area of the plane is, for example, 800,000 mm ² or less, preferably 720,000 mm ² or less. Furthermore, in the dicing tape-integrated back-contact film of the present invention, the planar projected area of the dicing tape is the same as or larger than the planar projected area of the back-contact film of the present invention. In the case, the plane projection area of the dicing tape-integrated back surface adhesion film of the present invention is the same as the plane projection area of the dicing tape.

The back adhesion film of the present invention and the dicing tape-integrated back surface adhesion film of the present invention may have a separator on the surface of the back surface adhesion film. Specifically, it may be in the form of a sheet having a separator including the back surface adhesion film of the present invention or a dicing tape-integrated back surface adhesion film, and may also be as shown in FIGS. 1, 2, 3, and 5. In general, the separator is formed into a strip shape, and a plurality of back surface adhesion films or a plurality of dicing tape integrated back surface adhesion films are disposed thereon, and the separator is wound and formed into a roll. The spacer is used for covering the back adhesion film of the present invention (the surface of the back adhesion film 10 in the aspects shown in FIGS. 1, 2, 3, and 5) for protecting the back contact film or the present invention. In the case of the inventive dicing tape-integrated back-contact film, the sheet is peeled off. Examples of the separator include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, and a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent. Coated plastic film or paper.

The thickness of the separator is, for example, 10 to 200 μm, preferably 15 to 150 μm, more preferably 20 to 100 μm. If the thickness is 10 μm or more, it is not easily broken from the slit during the processing of the separator. When the thickness is 200 μm or less, it is easier to peel the dicing tape-integrated back surface adhesion film from the separator when bonding to the substrate and the frame.

[Method of Manufacturing Back Contact Film]
The back surface adhesion film 10 which is one embodiment of the back surface adhesion film of this invention is manufactured, for example as follows.

In the production of the back contact film 10 shown in Figs. 1 and 2, first, the adhesive layer 11 and the laser mark layer 12 are independently formed. The subsequent agent layer 11 can be produced by applying a resin composition (adhesive composition) for forming the adhesive layer 11 to a separator to form a resin composition layer, and thereafter, performing solvent removal by heating or The resin composition layer is cured by hardening. In the production of the adhesive layer 11, the heating temperature is, for example, 90 to 150 ° C, and the heating time is, for example, 1 to 2 minutes. Examples of the coating method of the resin composition include roll coating, screen coating, gravure coating, and the like. On the other hand, the laser marking layer 12 can be produced by applying a resin composition for forming the laser marking layer 12 to a separator to form a resin composition layer, and thereafter, performing solvent removal by heating or The resin composition layer is cured by hardening. In the production of the laser marking layer 12, the heating temperature is, for example, 90 to 160 ° C, and the heating time is, for example, 2 to 4 minutes. As described above, the adhesive layer 11 and the laser marking layer 12 can be formed separately in the form of a spacer. Then, the exposed surfaces of the adhesive layer 11 and the laser marking layer 12 are bonded to each other, and then die-cutting is performed so as to be a target planar projection shape and a planar projection area, thereby producing an adhesive layer 11 and a ray. The back surface adhesive film 10 of the laminated structure of the marking layer 12 is formed.

[Method of manufacturing dicing tape integrated back surface adhesion film]
The dicing tape-integrated back surface adhesion film 1 which is one embodiment of the dicing tape-integrated back surface adhesion film of the present invention is produced, for example, in the following manner.

The dicing tape 20 of the dicing tape-integrated back surface adhesion film 1 shown in FIGS. 3 to 5 can be produced by providing the adhesive layer 22 on the prepared substrate 21. For example, the resin substrate 21 can be obtained by film formation by a known or conventional film forming method. Examples of the film forming method include a calender film forming method, a casting method in an organic solvent, an expansion extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method. The substrate 21 is subjected to a surface treatment as needed. In the formation of the adhesive layer 22, for example, an adhesive composition (adhesive) for forming an adhesive layer is prepared, and thereafter, the composition is first applied onto the substrate 21 or the spacer to form an adhesive combination. Layer of matter. Examples of the coating method of the pressure-sensitive adhesive composition include roll coating, screen coating, gravure coating, and the like. Then, in the adhesive composition layer, desolvation is carried out by heating as needed, and a crosslinking reaction is generated as needed. The heating temperature is, for example, 80 to 150 ° C, and the heating time is, for example, 0.5 to 5 minutes. In the case where the adhesive layer 22 is formed on the spacer, the adhesive layer 22 accompanying the spacer is attached to the substrate 21, and then becomes a target planar projection shape (for example, a shape similar to the back adhesion film 10). The punching process is performed in the form of a shape and a projected area of the plane, and thereafter the separator is peeled off. Thereby, a dicing tape 20 having a laminated structure of the substrate 21 and the adhesive layer 22 is produced.

Then, the side of the laser marking layer 12 of the back surface adhesive film 10 obtained above is bonded to the side of the adhesive layer 22 of the dicing tape 20. The bonding temperature is, for example, 30 to 50 ° C, and the bonding pressure (linear pressure) is, for example, 0.1 to 20 kgf/cm. When the adhesive layer 22 is the radiation curable adhesive layer, the adhesive layer 22 may be irradiated with radiation such as ultraviolet rays before the bonding, or the adhesive layer 22 may be applied from the substrate 21 side after the bonding. Irradiation of radiation such as ultraviolet rays. Alternatively, the radiation irradiation may be performed in the manufacturing process of the dicing tape-integrated back surface adhesion film 1 (in this case, the adhesive layer 22 may be irradiated during use of the dicing tape-integrated back surface adhesion film 1). hardening). In the case where the adhesive layer 22 is of an ultraviolet curing type, the ultraviolet irradiation amount for curing the adhesive layer 22 is, for example, 50 to 500 mJ/cm ² . The region (irradiation region R) to be irradiated as a measure for reducing the adhesion of the adhesive layer 22 in the dicing tape-integrated back surface adhesive film 1 is bonded to the back surface adhesive film 10 of the adhesive layer 22, for example, as shown in FIG. An area in the area other than its peripheral portion.

As described above, for example, the back surface adhesive film 10 shown in FIGS. 1 and 2 and the diced tape integrated back surface adhesion film 1 shown in FIGS. 3 to 5 can be produced.

[Method of Manufacturing Semiconductor Device]
A semiconductor device can be manufactured using the dicing tape-integrated back surface adhesion film of the present invention. Specifically, the step of attaching the back surface of the workpiece to the back surface of the diced tape-integrated back surface adhesive film of the present invention (particularly on the side of the adhesive layer) (attachment step), and by A semiconductor device is manufactured by a manufacturing method including a step (cutting step) of cutting a semiconductor wafer by at least a workpiece of a workpiece. In addition, FIGS. 6 to 9 show the steps of a method of manufacturing a semiconductor device using the dicing tape-integrated back surface adhesion film 1 shown in FIGS. 3 to 5.

(attachment step)
The workpiece attached to the back surface of the dicing tape-integrated back surface adhesion film of the present invention (particularly on the side of the adhesive layer) in the above-mentioned attaching step may be a semiconductor wafer or, for example, as shown in FIG. 6 (a) A sealing body in which a plurality of semiconductor wafers are sealed by a resin, respectively, on the back surface and/or the side surfaces. Then, as shown in FIG. 6(b), the sealing body 40 held by the wafer processing tape T1 is opposed to the back surface adhesion film 10 (particularly, the adhesive layer 11) of the dicing tape-integrated back surface adhesion film 1. Fit the ground. In the sealing body 40, the side surface of the semiconductor wafer 41 is sealed by a sealing resin 42. A substrate 43 having bumps 44 for flip chip mounting is connected to the surface of the sealing body 40. Thereafter, as shown in FIG. 6(c), the wafer processing tape T1 is peeled off from the sealing body 40.

(thermal hardening step)
In the case where the back surface adhesive film of the present invention has a thermosetting adhesive layer, it is preferred to have a step of thermally curing the adhesive layer of the back surface adhesive film after the above-mentioned attaching step (thermosetting step). For example, heat treatment for thermally hardening the adhesive layer 11 is performed in the above-described thermosetting step. The heating temperature is preferably from 80 to 200 ° C, more preferably from 100 to 150 ° C. The heating time is preferably from 0.5 to 5 hours, more preferably from 1 to 3 hours. The heat treatment is specifically carried out, for example, at 120 ° C for 2 hours. In the thermal curing step, by the thermal hardening of the adhesive layer 11, the adhesion between the back surface adhesion film 10 of the dicing tape-integrated back surface adhesion film 1 and the sealing body 40 becomes high, and the dicing tape-integrated back surface adhesion film 1 and The fixed holding force of the back surface adhesive film 10 to the sealing body becomes high. Further, in the case where the back surface adhesive film of the present invention does not have a thermosetting adhesive layer, for example, drying treatment can be carried out for several hours in the range of 50 to 100 ° C, whereby the wettability at the interface of the adhesive layer is obtained. Lifting, the fixing force to the sealing body becomes high.

(laser marking step)
In the case where the back contact film of the present invention has a laser mark layer, the method for fabricating the above semiconductor device preferably has a step of laser marking the laser mark layer from the substrate side of the dicing tape. Shoot the marking step). The laser marking step is preferably performed after the above thermal hardening step. Specifically, in the laser marking step, for example, the laser marking layer 12 is irradiated with a laser from the side of the substrate 21 of the dicing tape 20 to perform laser marking. With the laser marking step, various information such as text information or graphic information can be imprinted on a semiconductor wafer. In the laser marking step, a plurality of semiconductor wafers can be efficiently laser-marked together in one laser marking process. As the laser used in the laser marking step, for example, a gas laser or a solid laser can be cited. Examples of the gas laser include carbon dioxide laser (CO ₂ laser) and excimer laser. As the solid laser, for example, a Nd:YAG laser can be cited.

(cutting step)
In the above cutting step, for example, as shown in FIG. 7, a frame (cutting frame) 51 for pressing against the fixed dicing tape is attached to the adhesive layer of the dicing tape-integrated back surface adhesive film and kept in the cutting. The holder 52 of the apparatus is thereafter subjected to cutting processing by a cutting blade provided in the above cutting apparatus. In Fig. 7, the cutting portion is schematically indicated by a thick solid line. In the dicing step, the sealing body 40 is singulated into individual semiconductor wafers 41, and at the same time, the back surface bonding film 10 of the dicing tape-integrated back surface bonding film 1 is cut into small pieces of the film 10'. Thereby, the sealing body 40' accompanying the film 10' for forming a film on the back surface of the wafer, that is, the sealing body 40' of the film 10' is obtained.

(radiation irradiation step)
The method of manufacturing the semiconductor device described above may have a step of irradiating the adhesive layer with radiation from the substrate side (radiation irradiation step). When the adhesive layer of the dicing tape is a layer formed of a radiation curable adhesive, the adhesive layer may be irradiated with ultraviolet rays or the like from the substrate side instead of the dicing tape-integrated back surface adhesion after the dicing step. The above-described radiation irradiation during the manufacture of the film. The irradiation amount is, for example, 50 to 500 mJ/cm ² . The region (the irradiation region R shown in FIG. 5) which is irradiated as a measure for reducing the adhesion of the adhesive layer in the dicing tape-integrated back surface adhesion film is, for example, the adhesion layer in the back surface of the adhesive layer. An area other than the peripheral part.

(pickup step)
The manufacturing method of the above semiconductor device is preferably a step (pickup step) having a sealing body for picking up a film. The pick-up step may be, for example, a cleaning step of washing the sealing body 40' side of the dicing tape 20 of the sealing body 40' with the film 10' as needed, or by expanding the film 10 as needed. The step of expanding the distance between the seal bodies 40' is performed after the step of expanding. For example, as shown in FIG. 8, the sealing body 40' of the attached film 10' is picked up from the dicing tape 20. For example, in a state in which the dicing tape 20 attached to the dicing frame 51 is held by the holder 52 of the apparatus, the sealing body 40' of the attachment film 10' of the pickup object is made in the lower side in the figure of the dicing tape 20. The pin member 53 of the pickup mechanism is raised to rise up via the dicing tape 20, and thereafter, adsorption holding is performed by the adsorption jig 54. In the picking up step, the jacking speed of the pin member 53 is, for example, 1 to 100 mm/sec, and the amount of lifting of the pin member 53 is, for example, 50 to 3000 μm.

(Crystal mounting step)
Preferably, the method of manufacturing the semiconductor device has a step of performing flip chip mounting of the sealing film 40' with a film after the picking step (the flip chip step). For example, as shown in FIG. 9, the sealing body 40' of the film 10' is flip-chip mounted on the opposite side to the mounting substrate 61. Examples of the mounting substrate 61 include a lead frame, a TAB (Tape Automated Bonding) film, and a wiring board. The semiconductor wafer 41 is electrically connected to the mounting substrate 61 via the bumps 44 by flip chip mounting. Specifically, the substrate 43 (electrode pad) provided on the circuit formation surface side of the semiconductor wafer 41 and the terminal portion (not shown) of the mounting substrate 61 are electrically connected via the bumps 44 . The bump 44 is, for example, a solder bump. Further, a thermosetting underfill 63 is interposed between the wafer 41 and the mounting substrate 61.

The semiconductor device can be manufactured by using the diced tape-integrated back surface adhesion film of the present invention as described above.
[Examples]

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited by the examples.

Example 1
<Production of back contact film>
(laser marking layer)
Acrylic resin (trade name "Teisan Resin SG-P3", mass average molecular weight: 850,000, glass transition temperature Tg: 12 ° C, manufactured by Nagase ChemteX Co., Ltd.) 100 parts by mass, epoxy resin E ₁ (trade name "KI-3000-4", manufactured by Tohto Kasei Co., Ltd.) 50 parts by mass, epoxy resin E ₂ (trade name "JER YL980", manufactured by Mitsubishi Chemical Co., Ltd.) 20 parts by mass, phenol resin (trade name "MEH7851- SS", manufactured by Minghe Chemical Co., Ltd.) 75 parts by mass, filler (trade name "SO-25R", cerium oxide, average particle size 0.5 μm, manufactured by Admatechs Co., Ltd.) 175 parts by mass, black dye (commodity) 15 parts by mass of "OIL BLACK BS", manufactured by Orient Chemical Industries Co., Ltd., and thermosetting catalyst Z ₁ (trade name "Curezol 2PZ", manufactured by Shikoku Chemical Industry Co., Ltd.) 20 parts by mass. The mixture was mixed in a ketone to obtain a resin composition having a solid content concentration of 30% by mass. Then, the resin composition was coated with an applicator on a polyfluorinated mold release surface having a long PET-shaped separator (thickness: 50 μm) having a surface subjected to polyoxynitride treatment, to form a resin composition. Floor. Then, the composition layer was subjected to dehydration and thermal hardening at 130 ° C for 2 minutes to form a laser mark layer (thermo-hardened layer) having a thickness of 18 μm on the elongated PET spacer.

(adhesive layer)
100 parts by mass of an acrylic resin (trade name "Teisan Resin SG-P3", manufactured by Nagase ChemteX Co., Ltd.) and epoxy resin E ₁ (trade name "KI-3000-4", manufactured by Tohto Kasei Co., Ltd.) 50 20 parts by mass of epoxy resin E ₂ (trade name "JER YL980", manufactured by Mitsubishi Chemical Co., Ltd.), phenol resin (trade name "MEH7851-SS", manufactured by Mingwa Chemical Co., Ltd.), 75 parts by mass, filler (product name "SO-25R", manufactured by Admatech Co., Ltd.) 175 parts by mass, black dye (trade name "OIL BLACK BS", manufactured by Orient Chemical Industries, Inc.) 15 parts by mass, and thermosetting catalyst Z ₂ (Product name "Curezol 2PHZ", manufactured by Shikoku Chemical Industry Co., Ltd.) 7 parts by mass of methyl ethyl ketone was added and mixed to obtain a resin composition having a solid content concentration of 36% by mass. Then, the resin composition was coated with an applicator on a polyfluorinated mold release surface having a long strip of PET separator (thickness 50 μm) having a surface subjected to polyfluorination release treatment to form a resin combination. Layer of matter. Then, the composition layer was subjected to heating at 130 ° C for 2 minutes to remove the solvent, and an adhesive layer (thermosetting adhesive layer) having a thickness of 7 μm was formed on the elongated PET separator.

The laser marking layer on the elongated PET separator produced in the above manner was bonded to the adhesive layer on the elongated PET separator using a laminator. Specifically, the exposed surfaces of the laser marking layer and the adhesive layer were bonded to each other under conditions of a temperature of 100 ° C and a pressure of 0.85 MPa to form a film. The film obtained in the above manner is processed into a rounded portion having a radius of curvature shown in Table 1 in a square shape (the ratio of the short side to the long side [long side/short side] is 1). The punching process is performed in such a manner that the plane projection area of the shape. The back surface adhesion film of Example 1 was produced as above.

Examples 2 to 4
A back surface adhesion film was produced in the same manner as in Example 1 except that the plane projection shape was a shape in which all the corners of the square were processed into a rounded portion having the radius of curvature shown in Table 1.

Example 5
The same manner as in the first embodiment was carried out except that all the corners of the rectangular shape in which the plane projection shape was 10 (long side/short side) were processed into the shape of the rounded portion having the radius of curvature shown in Table 1. Adhesive film on the back.

Comparative example 1
A back surface adhesion film was produced in the same manner as in Example 1 except that the plane projection shape was not formed into a rounded corner.

Example 6
<Production of dicing tape>
a benzoic acid containing 100 parts by mass of 2-ethylhexyl acrylate and 19 parts by mass of 2-hydroxyethyl acrylate as a polymerization initiator in a reaction vessel equipped with a condenser, a nitrogen gas introduction tube, a thermometer, and a stirring device A mixture of 0.4 parts by mass of formazan and 80 parts by mass of toluene as a polymerization solvent was stirred at 60 ° C for 10 hours under a nitrogen atmosphere (polymerization reaction). Accordingly, the borrowed containing acrylic polymer ₁ to polymer P solution. Then, a mixture of the polymer solution containing the acrylic polymer P ₁ , 2-methylpropenyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst is contained in the air. The mixture was stirred at 50 ° C for 60 hours under an atmosphere (addition reaction). To this reaction solution, the formulation amount of the MOI with respect to 100 parts by mass of the acrylic polymer P ₁ is 12 parts by mass, the amount of dibutyl tin dilaurate February formulation with respect to the 100 parts by mass of the acrylic polymer P ₁ is 0.06 parts by mass. By this addition reaction, a polymer solution containing the acrylic polymer P ₂ having a methacrylate group in its side chain was obtained. Then, 2 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Tosoh Co., Ltd.) and 2 parts by mass of photopolymerization are added to 100 parts by mass of the acrylic polymer P ₂ in the polymer solution. An initiator (trade name "Irgacure 369", manufactured by BASF Corporation) and toluene were mixed and obtained to obtain an adhesive composition having a solid content concentration of 28% by mass. Then, the adhesive composition was applied using an applicator on a polyfluorinated mold release surface having a PET separator (thickness 50 μm) on which the surface of the polyoxymethylene mold release treatment was applied to form an adhesive composition layer. Then, the composition layer was subjected to desolvation by heating at 120 ° C for 2 minutes to form an adhesive layer having a thickness of 30 μm on the PET separator. Then, a polypropylene film (trade name "SC040PP1-BL", thickness 40 μm, manufactured by Kurabo Industries Co., Ltd.) as a substrate was bonded to the exposed surface of the adhesive layer at room temperature using a laminator. Thereafter, the bonded body was stored at 23 ° C for 72 hours. A dicing tape was produced as above.

<Production of dicing tape integrated back surface adhesion film>
A back surface adhesion film was produced in the same manner as in Example 1 except that the punching process was performed so as to have a rounded corner portion and a plane projection area of the radius of curvature shown in Table 2. Then, the long PET film spacer on the side of the laser marking layer is peeled off from the back surface adhesive film, and the dicing tape obtained as described above is peeled off from the PET separator, and thereafter, exposed in the dicing tape The adhesive layer was bonded to the surface of the back surface adhesive film which was peeled off by the PET separator, and was bonded using a bonding machine. Then, the dicing tape bonded to the back surface adhesive film in this manner is such that the center of the dicing tape coincides with the center of the back surface adhesion film so as to have a rounded portion having a radius of curvature shown in Table 2 and a similar ratio. The method is punching. A diced tape-integrated back surface adhesion film having a laminated structure including a dicing tape and a back surface adhesion film was produced as described above. Further, regarding the back surface adhesion film and the dicing tape, the planar projection shape (square) in which the rounded portion is not formed is a similar shape.

Examples 7 to 9, Reference Example 1, and Comparative Examples 2 to 3
The back surface adhesion film and the dicing tape were produced in the same manner as in Example 6 except that the plane projection shape was formed into a shape in which all the corners of the square were formed into rounded corners having the radius of curvature shown in Table 2. The back contact film and the dicing tape integrated back contact film. Further, the back contact film of Comparative Examples 2 and 3 and the dicing tape of Example 9 and Comparative Example 2 were formed into a planar projection shape having no rounded portion. Further, the back-contact film and the dicing tape of the dicing tape-integrated back surface adhesion film have a planar projection shape (square shape) in which the rounded portions are not formed, and the similarities are shown in Table 2.

Example 10
Regarding the planar projection shape of the dicing tape, it is assumed that all of the corners having a rectangular projection shape (square) having a short side of 1.01 times and a long side of 1.1 times are formed with respect to the planar projection shape (square) of the back surface adhesion film. A diced tape-integrated back surface adhesion film was produced in the same manner as in Example 6 except that the shape of the rounded portion of the radius of curvature shown in Table 2 was used.

<evaluation>
The back adhesion film and the diced tape-integrated back surface adhesion film obtained in the examples, the reference examples, and the comparative examples were evaluated as follows. The results are shown in Tables 1 and 2.

(1) Peeling evaluation 1 (discarded part of back contact film)
With respect to the back surface adhesive films obtained in Examples 1 to 5 and Comparative Example 1, a back surface adhesive film including a long PET separator and a rounded portion having a radius of curvature R1 shown in Table 1 was retained, and the back surface of the peripheral portion was left. The adhesive film and the separator on the side opposite to the elongated PET spacer are peeled off and removed via the back contact film, and the ridge of the back surface adhesive film including the rounded portion from the elongated PET spacer at this time In the case of the occurrence of wrinkles due to peeling, the case where the back contact film is wrinkled is set to ×, and the case where it appears is ○. The results are shown in the column of "peeling evaluation 1" in Table 1.

(2) Peeling evaluation 2 (back contact film)
The back surface adhesion film which has the strip-shaped PET spacer and the said round part was obtained by the peeling evaluation 1, and the edge part of the said back surface adhesion film was peeled by the strip-shaped PET spacer. At this time, the case where the back surface adhesion film was wrinkled was set to ×, and the case where it did not appear was set to ○. The results are shown in the column of "peeling evaluation 2" in Table 1.

(3) Peel evaluation (cutting tape integrated back contact film)
The dicing tape-integrated back surface adhesion film obtained in Examples 6 to 10, Reference Example 1, and Comparative Examples 2 to 3 was partially cut from the strip-shaped PET backing film from the strip-shaped PET backing film. Peeling, at the same time, is attached to one side of the frame, and the peeling from the PET spacer and the bonding to the frame are continuously performed by rollers. At this time, the case where the dicing tape-integrated back surface adhesion film was wrinkled was set to ×, and the case where it did not appear was ○. The results are shown in the column of "peeling evaluation 3" in Table 2.

[Table 1]

[Table 2]

1‧‧‧Cutting Tape Integrated Back Bonding Film

10‧‧‧Back contact film

10'‧‧‧ film

10a‧‧‧Row section

10b‧‧‧Row section

10c‧‧‧Row section

10d‧‧‧Fillet

11‧‧‧ adhesive layer

12‧‧‧Laser Marking Layer

20‧‧‧Cutting Tape

20a‧‧‧Row section

20b‧‧‧Row section

20c‧‧‧Row section

20d‧‧‧Fillet

21‧‧‧Substrate

22‧‧‧Adhesive layer

30‧‧‧Long strips of insulation

40‧‧‧ Sealing body

40'‧‧‧ Sealing body

41‧‧‧Semiconductor wafer

42‧‧‧ sealing resin

43‧‧‧Substrate

44‧‧‧Bumps

51‧‧‧ cutting frame

52‧‧‧Holding

53‧‧‧ pin components

54‧‧‧Adsorption fixture

61‧‧‧Installation substrate

63‧‧‧Bottom filler

F‧‧‧ directions

R‧‧‧illuminated area

T1‧‧‧ Wafer processing tape

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic top plan view (planar projection view) showing an embodiment of a semiconductor back surface adhesion film of the present invention.

Figure 2 is a front cross-sectional view showing the semiconductor back surface adhesion film of the present invention shown in Figure 1.

Fig. 3 is a schematic top plan view (planar projection view) showing an embodiment of a diced tape-integrated semiconductor back surface adhesion film of the present invention.

Fig. 4 is a plan view (planar projection view) of the dicing tape-integrated semiconductor back surface adhesion film of the present invention shown in Fig. 3 as viewed from the side of the semiconductor back surface adhesion film.

Fig. 5 is a front cross-sectional view showing the dicing tape-integrated semiconductor back surface adhesion film of the present invention shown in Fig. 3.

6(a) to 6(c) are schematic diagrams (front cross-sectional views) showing an embodiment of the attaching step.

Fig. 7 is a schematic view (front cross-sectional view) showing an embodiment of a cutting step.

Fig. 8 is a schematic view (front cross-sectional view) showing an embodiment of a pickup step.

Fig. 9 is a schematic view (front cross-sectional view) showing an embodiment of a flip chip mounting step.

Claims (5)

A semiconductor back surface adhesion film having a planar projection area of 22500 mm ² or more, and a planar projection shape having a non-circular shape having at least one rounded portion having a radius of curvature R1 of 0.5 to 10 mm. The semiconductor back surface adhesion film of claim 1, wherein the planar projection shape is a ratio of a short side to a long side, and at least one of the squares having a long side/short side of 1 to 10 is processed into the shape of the rounded portion. . A dicing tape integrated semiconductor back surface adhesion film, comprising: a dicing tape having a laminated structure including a substrate and an adhesive layer, and The above-mentioned adhesive layer of the above-mentioned dicing tape is detachably adhered to the semiconductor back surface adhesion film of claim 1 or 2; The planar projection area of the dicing tape is larger than the semiconductor back surface adhesion film, and the planar projection shape has a rounded portion. The dicing tape-integrated semiconductor back surface adhesion film of claim 3, wherein a planar projection shape of the dicing tape having no rounded portion is similar to a planar projection shape of the semiconductor back surface adhesion film having no rounded portion. The similarity ratio of the above similar shapes [the former/the latter] is 1.01 or more. The tangential tape-integrated semiconductor back surface adhesion film of claim 3 or 4, wherein a ratio [R2/R1] of a radius of curvature R2 of the rounded portion of the dicing tape to the radius of curvature R1 is 0.5 to 100.