JP2007099858A - Tape for semiconductor processing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape for semiconductor processing using a plastic film whose surface is embossed as a separator without coating a release agent such as polydimethylsiloxane (PDMS). <P>SOLUTION: The tape for semiconductor processing comprises a plastic film as a separator, wherein the film is not coated with a release agent and has a surface which is embossed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention mainly relates to a semiconductor processing tape used for protecting a wafer surface or for dicing a wafer during back grinding or processing of a semiconductor wafer.

As a separator for semiconductor processing tapes (such as dicing adhesive tape and back grind adhesive tape), it is common to use a polyethylene terephthalate (PET) separator coated with a release agent such as polydimethylsiloxane (PDMS). (For example, refer to Patent Document 1). However, there is a concern that a release agent such as PDMS may be transferred to the wafer chip, and there is a concern that the reliability after the chip is molded may be problematic.
On the other hand, when a separator that does not apply a release agent such as PDMS is used, the peelability of the semiconductor processing tape from the adhesive is poor, especially when the adhesive strength is strong, blocking occurs, and the function as a semiconductor processing tape is achieved. There was a problem of not fulfilling.
JP 2000-104026 A

  The object of the present invention is to provide a semiconductor processing tape using a plastic film having an embossed surface as a separator without applying a release agent such as polydimethylsiloxane (PDMS) in order to eliminate the above-mentioned problems. It is to provide.

As a result of intensive studies to achieve the above object, the present inventors have found that the release agent can be prevented from being transferred to the wafer chip and blocking at the time of peeling can be prevented by using a separator that has been embossed on the film. The headline and the present invention were made. That is, the present invention
(1) Semiconductor processing tape using a plastic film with an embossed surface that is not coated with a release agent as a separator,
(2) The semiconductor processing tape according to (1), wherein the embossed separator has an unevenness of at least 2 μm, and (3) the semiconductor according to (1) or (2), wherein the plastic film is polyethylene. A processing tape is provided.

  The semiconductor processing tape of the present invention can be peeled from the tape adhesive layer with good releasability, even though no release agent such as PDMS is applied.

Hereinafter, the present invention will be described in detail.
The tape for semiconductor processing of the present invention has, as a separator, a plastic film having an embossed surface that is not coated with a release agent.
First, the semiconductor wafer processing tape of the present invention will be described with reference to FIG.
FIG. 1 is an enlarged cross-sectional view of one embodiment of a semiconductor processing tape of the present invention. An adhesive layer 2 and an embossed separator 3 are sequentially laminated on the base film 1.
In the semiconductor wafer processing tape of the present invention, an arbitrary pressure-sensitive adhesive layer and / or an adhesive layer (adhesive layer) can be laminated between the separator and the base film.

The separator can be provided with a well-known separator such as polyethylene, polyethylene terephthalate (PET), or other release-treated film in consideration of peelability, but is preferably a polyethylene separator.
In the present specification and claims, embossing refers to providing an uneven pattern on the surface.
Examples of the method for embossing the separator adhesive surface of the separator include a method of attaching a film to an embossing roll, a method by sand mat treatment, a method of chemical treatment such as etching, and the like.

It is preferable that the unevenness of the separator after embossing is at least 2 μm. The unevenness is determined by the ten-point average height (R _z ). This can be measured with a surface roughness meter [for example, Sartronic Duo (trade name), manufactured by Taylor Hobson Ltd.].

The interval between the convex portions of the concavo-convex pattern formed by the embossing can be selected as appropriate.
As such a concavo-convex pattern, for example, a random concavo-convex pattern or rule that is formed over at least the entire surface of the separator on which the pressure-sensitive adhesive layer is applied, and substantially all of the formed convex portions are continuous at intervals of 100 μm or less. Concavo-convex pattern or the like. Among them, a concavo-convex pattern having a regular concavo-convex pattern in which the heights of the convex portions are uniform and the depths of the concave portions are uniform is preferable. Examples of such a concavo-convex pattern include a concavo-convex pattern in which dots, straight lines, arcs and the like are continuously arranged at intervals of several hundred μm or less over the entire surface.

The pressure-sensitive adhesive used for the semiconductor wafer processing tape of the present invention is not particularly limited, but may be any adhesive generally used for dicing die-bonding tapes, such as acrylic pressure-sensitive adhesive, epoxy resin / Phenol resin / acrylic resin blend adhesives are preferred, and acrylic adhesives are more preferred. The thickness may be appropriately set, but is preferably about 5 to 100 μm.
Even when an adhesive is used, it is not particularly limited, but any adhesive generally used for dicing die bonding tapes may be used. An acrylic adhesive, epoxy resin / An acrylic resin blend adhesive is preferred. If the adhesive is radiation (especially UV) curable, the chipping during dicing is small and advantageous.
The pressure-sensitive adhesive layer or the adhesive layer may be provided on both sides of the base film, and the thickness thereof may be appropriately set, but is preferably about 5 to 100 μm.

Moreover, as a base film used for the tape for wafer processing of this invention, arbitrary base films can be used. For example, the material may be a homopolymer or copolymer of α-olefin such as polyethylene, polypropylene, ethylene-propylene copolymer, polybutene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, ionomer, etc. Engineering plastics such as polyethylene terephthalate, polycarbonate, polymethyl methacrylate, or thermoplastic elastomers such as polyurethane, styrene-ethylene-butene or pentene copolymers.
Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.
The thickness of the base film is not particularly limited and may be appropriately set, but is preferably 2 to 200 μm.

EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these.

Example 1
A tape was prepared using a polyethylene embossed film having an original thickness of 40 μm and a thickness after embossing of 60 μm as a separator. The substrate used was a standard polyolefin (PO) substrate and the pressure-sensitive adhesive was a standard acrylic pressure-sensitive adhesive.
An embossed film separator, an adhesive layer, and a PO substrate were bonded together in this order to produce a wafer processing tape as shown in FIG.
The thickness of the separator film after embossing was measured using a surface roughness meter (trade name: Sartronic Duo, manufactured by Taylor Hobson Limited) (the same applies hereinafter).

Example 2
A tape was prepared using a polyethylene embossed film having an original thickness of 70 μm and a thickness after embossing of 45 μm as a separator. The base used was a standard PO base and the standard acrylic adhesive was used as the adhesive.
The wafer processing tape shown in FIG. 1 was manufactured by laminating an embossed film separator, an adhesive layer, and a PO base material in this order.

Comparative Example 1
A 38 μm thick PET film that was not surface-treated was prepared as a separator.
The PET film separator, the pressure-sensitive adhesive layer, and the PO base material were bonded together in this order to produce a wafer processing tape as shown in FIG.

Comparative Example 2
A tape was prepared using a polyethylene embossed film having an original thickness of 40 μm and a thickness of 42 μm after embossing as a separator. The base used was a standard PO base and the standard acrylic adhesive was used as the adhesive.
An embossed film separator, an adhesive layer, and a PO substrate were bonded together in this order to produce a wafer processing tape as shown in FIG.

[Blocking test]
The blocking test was evaluated by whether or not the pressure sensitive adhesive was transferred to the release film after leaving the roll tape at room temperature for 1 week.
The emboss height means the _Rz value measured by the surface roughness meter.
The results are shown in Table 1.

  Although blocking occurred in both of the tapes of Comparative Examples 1 and 2, blocking did not occur in the tapes of Examples 1 and 2 according to the present invention without using a release agent.

FIG. 1 is an enlarged cross-sectional view of one embodiment of a semiconductor processing tape of the present invention.

Explanation of symbols

1 Base film 2 Adhesive layer 3 Embossed separator

Claims (3)

  A tape for semiconductor processing using as a separator a plastic film to which at least the pressure-sensitive adhesive layer side surface has been embossed without a release agent applied.   2. The semiconductor processing tape according to claim 1, wherein the embossed separator has at least 2 [mu] m of irregularities. The tape for semiconductor processing according to claim 1 or 2, wherein the plastic film is polyethylene.

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