JP2006186398A5 - - Google Patents

Claims (9)

A board holder for holding a circuit board,
The main body,
A holding layer configured in a planar shape on the main body by an adhesive material,
On the surface of the holding layer, the first adhesive holding region for holding the circuit board with the first adhesive degree, and the first adhesive holding region with the second adhesive degree different from the first adhesive degree, A second adhesive holding region for holding the circuit board is integrally formed;
The board | substrate holder characterized by the uneven | corrugated characteristic of each surface of the said 1st adhesion holding area | region and the said 2nd adhesion holding area | region being different. The substrate holder according to claim 1, wherein the first adhesive holding region and the second adhesive holding region have different surface roughness. The substrate holder according to claim 2, wherein one of the first adhesive holding region and the second adhesive holding region surrounds the other region. The first adhesion degree is lower than the second adhesion degree, and the first adhesion holding area includes the second adhesion holding area. Board holder. The first adhesion is lower than the second adhesion;
The substrate holder according to any one of claims 1 to 4, wherein a through-hole into which a circuit board peeling pin is inserted is formed in the first adhesive holding region. A substrate holder for detachably holding a circuit board,
A base plate defined by generally parallel first and second surfaces facing each other;
A holding layer provided on the first surface and having a holding surface for adhering and holding the circuit board;
In the holding layer,
A first adhesive holding region for holding the circuit board at a first degree of adhesion;
The second adhesive holding area for holding the circuit board together with the first adhesive holding area at a second adhesive degree different from the first adhesive degree is integrally formed of the same adhesive material, and A plurality of openings extend between a surface and the holding surface;
The substrate holder according to claim 1, wherein the opening is used for peeling the circuit board from the holding surface. A method of manufacturing a substrate holder for holding a substrate made of a base plate and an adhesive material,
Placing the adhesive material on the base plate;
And a step of pressing the pressure-sensitive adhesive material while heating the mold on which the unevenness pattern for adjusting the degree of adhesion is formed. The method for manufacturing a substrate holder according to claim 7 , wherein the mold has a region in which a first uneven pattern is formed and a region in which a second uneven pattern is formed. 9. The substrate holding according to claim 8 , wherein the mold has a step between a region where the first concavo-convex pattern is formed and a region where the second concavo-convex pattern is formed. Manufacturing method of the tool.