JP2004520712A5 - - Google Patents
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- Publication number
- JP2004520712A5 JP2004520712A5 JP2002561272A JP2002561272A JP2004520712A5 JP 2004520712 A5 JP2004520712 A5 JP 2004520712A5 JP 2002561272 A JP2002561272 A JP 2002561272A JP 2002561272 A JP2002561272 A JP 2002561272A JP 2004520712 A5 JP2004520712 A5 JP 2004520712A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- cutting
- separation
- housing
- cutting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 claims description 127
- 238000000926 separation method Methods 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 19
- 238000004080 punching Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 16
- 239000004593 Epoxy Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000005336 cracking Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1017215A NL1017215C2 (nl) | 2001-01-29 | 2001-01-29 | Werkwijze en inrichting voor het uit een drager verwijderen van een draagdeel. |
| NL1018511A NL1018511C2 (nl) | 2001-07-11 | 2001-07-11 | Werkwijze en inrichting voor het met een enkele bewerking uit een drager verwijderen van een dragerdeel, en een uit een drager verwijderd product. |
| PCT/NL2002/000068 WO2002061822A1 (en) | 2001-01-29 | 2002-01-29 | Method and apparatus for removing a carrier part from a carrier, and a product removed from a carrier |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004520712A JP2004520712A (ja) | 2004-07-08 |
| JP2004520712A5 true JP2004520712A5 (enExample) | 2005-06-23 |
| JP4225781B2 JP4225781B2 (ja) | 2009-02-18 |
Family
ID=26643289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002561272A Expired - Fee Related JP4225781B2 (ja) | 2001-01-29 | 2002-01-29 | 担体から担体の一部を取り除くための方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7162906B2 (enExample) |
| EP (1) | EP1358672A1 (enExample) |
| JP (1) | JP4225781B2 (enExample) |
| KR (2) | KR100909117B1 (enExample) |
| WO (1) | WO2002061822A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7051911B2 (en) * | 2001-12-21 | 2006-05-30 | Eastman Kodak Company | Apparatus and method for cutting sheet materials |
| WO2005097373A1 (ja) * | 2004-04-09 | 2005-10-20 | Toyota Boshoku Kabushiki Kaisha | せん断加工装置 |
| WO2008144893A1 (en) * | 2007-05-25 | 2008-12-04 | Magna International Inc. | Integrated die trim and method |
| JP5383255B2 (ja) * | 2009-02-27 | 2014-01-08 | 日本発條株式会社 | 板材の切断方法、板材の切断装置、ヘッドサスペンション及び板材の積層品 |
| DE102016201433A1 (de) * | 2016-02-01 | 2017-08-03 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zum Bearbeiten und/oder Herstellen eines Bauteils |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1434190A (en) * | 1921-04-08 | 1922-10-31 | Automatic Machinery & Equipmen | Process of coining and dies therefor |
| DE1169404B (de) * | 1959-09-02 | 1964-05-06 | Kienzle Apparate Gmbh | Werkzeug zum Stanzschneiden von Blech |
| US3656379A (en) * | 1969-10-22 | 1972-04-18 | Vandervell Products Ltd | Methods of cutting laminated strip material |
| DE2526318A1 (de) | 1975-06-12 | 1976-12-23 | Siemens Ag | Metallischer zwischentraeger zur halterung und kontaktierung eines halbleiterkoerpers |
| US4362902A (en) * | 1981-03-27 | 1982-12-07 | Amp Incorporated | Ceramic chip carrier |
| JPS5890750A (ja) | 1982-11-15 | 1983-05-30 | Hitachi Ltd | リ−ドフレ−ムの製法 |
| JPH065758A (ja) | 1992-06-19 | 1994-01-14 | Mitsubishi Electric Corp | 半導体装置の製造方法及び半導体装置の製造装置 |
| US5458158A (en) * | 1993-03-30 | 1995-10-17 | Toyo Communication Equipment Co., Ltd. | Lead cutting apparatus and an anticorrosive coat structure of lead |
| JPH0722554A (ja) | 1993-06-30 | 1995-01-24 | Dainippon Printing Co Ltd | 薄板のトリミング装置およびその方法 |
| JP2586352B2 (ja) | 1995-01-26 | 1997-02-26 | 日本電気株式会社 | 半導体装置用リード切断装置 |
| JPH09223706A (ja) | 1996-02-15 | 1997-08-26 | Sony Corp | 半導体製造方法およびその製造装置 |
| JPH09307046A (ja) | 1996-05-15 | 1997-11-28 | Nec Corp | 金型及び該金型を用いたタイバ−切断方法 |
| JP3110413B2 (ja) | 1999-01-20 | 2000-11-20 | 広島日本電気株式会社 | 半導体装置用リード切断装置 |
| US6401510B1 (en) * | 1999-04-07 | 2002-06-11 | 3M Innovative Properties Company | Method for stamping a part from a multi-layered strip |
-
2002
- 2002-01-29 EP EP02711527A patent/EP1358672A1/en not_active Ceased
- 2002-01-29 KR KR1020087015182A patent/KR100909117B1/ko not_active Expired - Fee Related
- 2002-01-29 JP JP2002561272A patent/JP4225781B2/ja not_active Expired - Fee Related
- 2002-01-29 WO PCT/NL2002/000068 patent/WO2002061822A1/en not_active Ceased
- 2002-01-29 US US10/470,317 patent/US7162906B2/en not_active Expired - Fee Related
- 2002-01-29 KR KR10-2003-7009927A patent/KR20040010582A/ko not_active Ceased
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