JP4224456B2 - 三次元モデリングのための方法 - Google Patents
三次元モデリングのための方法 Download PDFInfo
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Description
本発明は、シリコーンを含む熱可塑性組成物、および積層モデル製造により3次元モデルを造るためにこの組成物を用いる方法である。この熱可塑性組成物には、約10重量%未満のシリコーンが含まれている。
本発明は、図1に示した型の堆積によるモデル製造システムを参照しながら記載する。図1には、本発明の支持構造体28により支持されたモデル26を造る押し出し装置10が記載されている。この押し出し装置10には、押し出しヘッド12、材料受け入れ台14および材料供給装置18が含まれている。押し出しヘッド12は、垂直なZ方向に動く台14に対しXおよびY方向に動く。材料供給装置18は,原料を押し出しヘッド12に供給する。説明された実施態様では、固体原料は押し出しヘッド12に供給され、液化装置22で溶融され押し出しヘッド12により運ばれる。液化装置22は原料をその凝固点の少し上の温度まで加熱し、原料を溶融状態にする。溶融材料は、液化装置22のノズル24を通して台14の上に押し出される。原料は、連続的な長繊維、棒、棒状素材、ペレット、粒状物などの形をしている。
モデル用材料Aと支持用材料Bは、これらが使われる特定のモデル製造システムについて、一般に、熱的特性、強度、粘度および付着性に関連する多数のモデル製造基準を満たさねばならない。モデル用材料Aと支持用材料Bの溶融粘度は、モデル製造プロセスに適していなければならない。溶融堆積によるモデル製造に使われる材料は、溶融粘度が低いことが理想的である。溶融粘度は、押し出し温度で十分低いことが必要なので、材料は一般に連続的な道状またはビードとして押し出される。また、押し出し温度における溶融粘度は、十分低いことが必要なので、材料の堆積された道状またはビードの溶融強度は低く、これらの道状やビードはカール状に巻き上げられるよりもむしろ平らにすることができる。溶融粘度は、材料の押し出し温度を上げれば下げられる。しかし、押し出し温度が高いほど、エネルギー消費量が増加し、熱の発生量や材料が劣化する機会が増加する。
以下は、非常に高温のモデル製造環境(すなわち、組み立てチェンバーの温度が200℃以上)において支持用材料として使用するためにテストされた材料処方の例である。これらの材料処方は、ポリフェニルスルホン・モデル用材料について支持用材料としてテストされた。具体的には、各々の場合、ポリフェニルスルホン・モデル用材料は、Radel(登録商標)R 5600 NT(BP Amocoから入手できる)である。このポリフェニルスルホン樹脂の熱変形温度は236℃、1.2kgの荷重下の400℃におけるメルトフローは20〜30グラム/10分の範囲にある。実施例3は本発明を具体的な形で例示しているが、実施例1および2は比較例である。
種々のサイズのモデルが、ポリフェニルスルホン・モデル用材料およびポリフェニルスルホンとアモルファス・ポリアミドとのブレンドを含む支持用材料を用いて、約200〜225℃の温度を有する組み立てチェンバーで造られた。場合によっては支持用材料には、さらに、ポリスルホンが含まれている。種々の材料の成分は、ポリフェニルスルホンが約60〜90重量%、アモルファス・ポリアミド・ブレンドが約10〜40重量%の範囲にあるか、またはポリフェニルスルホンが約60〜90重量%、ポリスルホンが約1〜40重量%およびアモルファス・ポリアミド・ブレンドが約10〜40重量%の範囲にある。テストされた特定の代表的な樹脂は、Radel(登録商標)R 5600 NTポリフェニルスルホン(BP Amocoから入手できる)50重量%、Udel(登録商標)P 1710 NT 15ポリフェニルスルホン(BP Amocoから入手できる)25重量%およびEMS TR 70アモルファス・ポリアミド(スイスのEMS−Chemie AGから入手できる)25重量%のブレンドである。この樹脂の熱変形温度は224℃、メルトフローはモデル用材料のメルトフローと同等である。支持用材料は約350℃の温度を有する液化装置から押し出され、ポリフェニルスルホン樹脂を用いて造られたモデルの支持構造体を形成した。
テストモデルは、モデル用材料にポリフェニルスルホンを、支持用材料にはポリエーテルスルホン、ポリフェニルスルホンまたはポリエーテルイミド(すなわち、Ultem(商標))などの種々の樹脂を用いて、約200〜225℃の温度の組み立てチェンバーで造られた。これらの材料は、熱安定性は優れていたが、モデルから剥離することができなかった。ポリフェニルスルホンを含む支持用材料はモデルに非常に強く付着した。ポリエーテルイミドを含む支持用材料は、モデルにかなり強く付着し、ポリエーテルスルホンを含む支持用材料は、このモデルへの付着が最も弱かったが、適切な使用という点からは強すぎるほど付着した。
ポリフェニルスルホン製の大小のモデルが、ポリエーテルスルホン基本ポリマーとシリコーン離型剤とを含む支持用材料を用いて約200〜225℃の組み立てチェンバーで造られた。便宜上、基本ポリマーと調合されたシリコーンを含む「マスターバッチ」を得るために商業的に利用できるコンパウンドを用いた。ポリプロピレン、直鎖状低密度ポリエチレン、および高衝撃性ポリスチレンを含む種々のマスターバッチをテストした。さらに、粘度が60,000センチストークス(中程度の粘度)から5千万センチストークス(非常に高粘度)の範囲にある種々のシリコーンをテストした。非常に高粘度のシリコーンの分子量は高く、低粘度のシリコーンの分子量は低い。
基本ポリマーに少量のシリコーンを添加すると、基本ポリマーとモデル用材料との間の結合を弱め、そのポリマーを用いてそのモデルから剥離されうる支持構造体を形成できることが実証された。中間の粘度のシリコーン(約104〜105センチストークス)は剥離特性が優れているが、本発明では種々のシリコーンを有利に使用することができる。
Claims (25)
- 3次元モデルを造る累積的処理方法であって、
熱可塑性モデル用材料の固体原料を押し出しヘッドに供給し、
前記押し出しヘッドにおいて、前記熱可塑性モデル用材料の固体原料を溶融し、
前記3次元モデルを形成するために、前記押し出しヘッドから、熱可塑性モデル用材料の層を、加熱された組み立てチェンバーに堆積させ、
熱可塑性支持用材料の固体原料を、前記押し出しヘッドに供給し、
前記押し出しヘッドにおいて、前記熱可塑性支持用材料の固体原料を溶融し、
前記3次元モデルのための支持構造体を形成するために、前記熱可塑性支持用材料の層を、前記加熱された組み立てチェンバーに堆積させ、前記熱可塑性支持用材料は、シリコーン離型剤を1〜10重量%含む、
ことを含む、方法。 - 請求項1の方法であって、
前記熱可塑性支持用材料は、前記加熱された組み立てチェンバーの温度よりも高いガラス転移温度を備える、方法。 - 請求項1の方法であって、
前記熱可塑性支持用材料は、前記シリコーン離型剤を1〜3重量%含む、方法。 - 請求項1の方法であって、
前記熱可塑性支持用材料に、さらに、ポリエーテルスルホン、ポリエーテルイミド、ポリフェニルスルホン、ポリフェニレン、ポリカーボネート、高衝撃性ポリスチレン、ポリスルホン、ポリスチレン、アクリル系樹脂、アモルファス・ポリアミド、ポリエステル、ナイロン、PEEK、PEAKおよびABSからなる群から選択された基本ポリマーが含まれている、方法。 - 請求項1の方法であって、
前記熱可塑性支持用材料の熱変形温度が220℃を超えている、方法。 - 請求項5の方法であって、
前記熱可塑性支持用材料のメルトフローが450℃以下の温度、1.2kgの荷重の下で5〜30グラム/10分の範囲にある、方法。 - 請求項6の方法であって、
前記熱可塑性支持用材料に、さらに、ポリエーテルスルホン、ポリフェニルスルホンおよびポリエーテルイミドからなる群から選択された基本ポリマーが含まれている、方法。 - 請求項1の方法であって、
前記シリコーン離型剤が、104〜105センチストークスのオーダーの粘度を有する、方法。 - 請求項1の方法であって、
前記シリコーン離型剤が、ヒドロキシ末端ポリシロキサンである、方法。 - 請求項1の方法であって、
前記熱可塑性支持用材料が、前記熱可塑性モデル用材料の熱変形温度から20℃以内の熱変形温度を有し、450℃以下の温度、1.2kgの荷重の下で、メルトフローが、5〜30グラム/10分の範囲にある、方法。 - 請求項1の方法であって、
前記熱可塑性支持用材料が、180℃〜250℃の範囲の温度を有する前記組み立てチェンバーに堆積される、方法。 - 3次元モデルおよび前記3次元モデルの支持構造体を造る累積的処理方法であって、
モデル用材料を、堆積モデル製造システムに固体の状態で供給し、
前記堆積モデル製造システムにおいて、前記モデル用材料を溶融し、
前記3次元モデルを形成するために、溶融された前記モデル用材料の層を、前記堆積モデル製造システムの加熱された組み立てチェンバーに堆積させ、
支持用材料を、前記堆積モデル製造システムに固体の状態で供給し、前記支持用材料は 、1〜10重量%のシリコーン離型剤を含む熱可塑性組成物を含み、
前記堆積モデル製造システムにおいて、前記支持用材料を溶融し、
前記支持構造体を形成するために、溶融された前記支持用材料の層を、前記加熱された組み立てチェンバーに堆積させ、
前記支持構造体を、前記3次元モデルから分離する、
ことを含む、方法。 - 請求項12の方法であって、
前記支持用材料の熱可塑性組成物に、さらに、ポリエーテルスルホン、ポリエーテルイミド、ポリフェニルスルホン、ポリフェニレン、ポリカーボネート、高衝撃性ポリスチレン、ポリスルホン、ポリスチレン、アクリル系樹脂、アモルファス・ポリアミド、ポリエステル、ナイロン、PEEK、PEAKおよびABSからなる群から選択された基本ポリマーが含まれている、方法。 - 請求項12の方法であって、
前記モデル用材料に主成分としてポリフェニルスルホン樹脂が含まれている、方法。 - 請求項12の方法であって、
前記支持用材料に、さらに、ポリエーテルスルホン基本ポリマーが含まれている、方法。 - 請求項15の方法であって、
前記支持用材料に、さらに、高衝撃性ポリスチレンが含まれ、前記モデル用材料に、主成分としてポリフェニルスルホン樹脂が含まれている、方法。 - 層状に堆積される3次元モデル製造システムにて、3次元モデルを製造するための累積的処理方法であって、
前記3次元モデルを形成するために、熱可塑性モデル用材料の層を、加熱された組み立てチェンバーに堆積させ、
熱可塑性支持用材料の層を、前記加熱された組み立てチェンバーに堆積させ、前記熱可塑性支持用材料は、ポリエーテルスルホン、ポリエーテルイミド、ポリフェニルスルホン、ポリフェニレン、ポリカーボネート、ポリスルホン、ポリスチレン、アクリル系樹脂、アモルファス・ポリアミド、ポリエステル、ナイロン、PEEK、PEAKおよびABSにて構成される群から選択された基本ポリマー、および1〜10重量%のシリコーン離型剤を含み、且つ、前記熱可塑性モデル用材料の熱変形温度から20℃以内の熱変形温度を有し、450℃以下の温度、1.2kgの荷重の下で、メルトフローが、5〜30グラム/10分の範囲にある、
ことを含む、方法。 - 請求項17の累積的処理方法であって、
前記基本ポリマーが、ポリエーテルスルホン、ポリフェニルスルホンおよびポリエーテルイミドにて構成される群から選択され、前記熱可塑性支持用材料の熱変形温度が220℃を超えている、方法。 - 請求項18の累積的処理方法であって、
前記熱可塑性支持用材料が225℃以下の温度において少なくとも200時間以上にわたり熱的安定性を示す、方法。 - 請求項17の累積的処理方法であって、
前記シリコーン離型剤がヒドロキシ末端ポリシロキサンである、方法。 - 請求項17の累積的処理方法であって、
前記熱可塑性支持用材料中の前記基本ポリマーの重量パーセントは、60〜99%の範囲である、方法。 - 請求項21の累積的処理方法であって、
前記熱可塑性支持用材料に、さらに、3〜15重量%の高衝撃性ポリスチレンが含まれている、方法。 - 請求項22の累積的処理方法であって、
前記基本ポリマーがポリエーテルスルホンである、方法。 - 請求項23の累積的処理方法であって、
前記熱可塑性支持用材料中のポリエーテルスルホンの重量パーセントは90〜95%、前記熱可塑性支持用材料中の高衝撃性ポリスチレンの重量パーセントは3〜8%、および前記熱可塑性支持用材料中の前記シリコーン離型剤の重量パーセントは1〜3%の範囲である、方法。 - 請求項17の累積的処理方法であって、
さらに、
前記層状に堆積される3次元モデル製造システムの押し出しヘッドに、前記熱可塑性支持用材料を長繊維の形で供給する
ことを含む、方法。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20200062330A (ko) * | 2018-03-30 | 2020-06-03 | 데이진 가부시키가이샤 | 폴리카보네이트 수지 및 그것을 포함하는 광학 부재 |
KR102415801B1 (ko) | 2018-03-30 | 2022-06-30 | 데이진 가부시키가이샤 | 폴리카보네이트 수지 및 그것을 포함하는 광학 부재 |
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WO2004003823A1 (en) | 2004-01-08 |
US20030004600A1 (en) | 2003-01-02 |
CN1666217A (zh) | 2005-09-07 |
JP2005531439A (ja) | 2005-10-20 |
US7314591B2 (en) | 2008-01-01 |
EP1552459A1 (en) | 2005-07-13 |
US20080071030A1 (en) | 2008-03-20 |
AU2003261086A1 (en) | 2004-01-19 |
EP1552459A4 (en) | 2009-01-21 |
US7534386B2 (en) | 2009-05-19 |
EP1552459B1 (en) | 2016-12-14 |
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