JP4219874B2 - 導電性物質で銅箔メッシュの前面及び側面を処理する方法 - Google Patents
導電性物質で銅箔メッシュの前面及び側面を処理する方法 Download PDFInfo
- Publication number
- JP4219874B2 JP4219874B2 JP2004250104A JP2004250104A JP4219874B2 JP 4219874 B2 JP4219874 B2 JP 4219874B2 JP 2004250104 A JP2004250104 A JP 2004250104A JP 2004250104 A JP2004250104 A JP 2004250104A JP 4219874 B2 JP4219874 B2 JP 4219874B2
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- Japan
- Prior art keywords
- copper foil
- conductive material
- copper
- mesh
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 81
- 239000011889 copper foil Substances 0.000 title claims description 57
- 238000000034 method Methods 0.000 title claims description 37
- 239000004020 conductor Substances 0.000 title claims description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 58
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 49
- 238000007747 plating Methods 0.000 claims description 37
- 229910052742 iron Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 229910017052 cobalt Inorganic materials 0.000 claims description 23
- 239000010941 cobalt Substances 0.000 claims description 23
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 23
- 229910052759 nickel Inorganic materials 0.000 claims description 23
- 238000009713 electroplating Methods 0.000 claims description 15
- 239000003792 electrolyte Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 39
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000008151 electrolyte solution Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000000059 patterning Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- ZHDZZQCPMPRKFO-UHFFFAOYSA-N [Fe].[Ni].[Cu].[Co] Chemical compound [Fe].[Ni].[Cu].[Co] ZHDZZQCPMPRKFO-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000002932 luster Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- OBLMUVZPDITTKB-UHFFFAOYSA-N [Fe].[Co].[Cu] Chemical compound [Fe].[Co].[Cu] OBLMUVZPDITTKB-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- GOECOOJIPSGIIV-UHFFFAOYSA-N copper iron nickel Chemical compound [Fe].[Ni].[Cu] GOECOOJIPSGIIV-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
前記メッキ層としては、銅-鉄-コバルトまたは銅-鉄-ニッケルの金属組合が可能であるが、特に銅-コバルト-鉄-ニッケルからなるものが最も望ましい。
本実施例1では、下記の電解液組成と処理条件で銅-コバルト-鉄-ニッケルを含むメッキ表面処理をメッシュの前面及び側面に施した。
本実施例2では、下記の電解液組成と電解処理条件で銅-コバルト-鉄-ニッケルを含むメッキ表面処理をメッシュの前面及び側面に施した。
20 メッシュ
30 背面
40 前面
50 側面
60 導電性物質
Claims (7)
- 基材上に銅箔を接着した後、該銅箔を食刻することによりパターンを形成してパターン化した銅箔を用意する段階と、
パターン化した銅箔メッシュの前面40及び側面50を、銅、コバルト、鉄及びニッケルを含む電解液を用いて電気メッキすることによって、無光沢の黒色メッキ層をコーテイングする段階とを含み、
前記メッキ層は薄くて均一の厚さを持ち、その表面に低粗度を具現するための多数の微細ノジュールが形成されることを特徴とする導電性物質で銅箔メッシュの前面及び側面を処理する方法。 - 前記電解液は、銅の濃度が0.1〜2.0g/L、コバルトの濃度が0.1〜10.0g/L、鉄の濃度が0.1〜6.0g/L及びニッケルの濃度が0.02〜2.0g/Lであることを特徴とする請求項1に記載の導電性物質で銅箔メッシュの前面及び側面を処理する方法。
- 前記電解液は、銅の濃度が0.2〜1.0g/L、コバルトの濃度が3.0〜9.0g/L、鉄の濃度が1.5〜4.0g/L及びニッケルの濃度が0.1〜1.5g/Lであることを特徴とする請求項1に記載の導電性物質で銅箔メッシュの前面及び側面を処理する方法。
- 前記コーテイング段階において、電解液の温度が20〜50℃、pHが0.5〜6、処理時間が2〜30秒であり、陰極電流密度が0.5〜20A/dm 2 である条件で電解メッキ処理されることを特徴とする請求項1に記載の導電性物質で銅箔メッシュの前面及び側面を処理する方法。
- 前記コーテイング段階において、電解液の温度が30〜40℃、pHが1〜3、処理時間が5〜20秒、陰極電流密度が2〜15A/dm 2 である条件で電解メッキ処理されることを特徴とする請求項1に記載の導電性物質で銅箔メッシュの前面及び側面を処理する方法。
- 前記メッキ層の厚さは1μm以下であり、その表面粗度Rzは2μm以下であることを特徴とする請求項1に記載の導電性物質で銅箔メッシュの前面及び側面を処理する方法。
- 前記電気メッキのとき、直流及び/またはパルス電流を用いることを特徴とする請求項1乃至6の何れか一つに記載の導電性物質で銅箔メッシュの前面及び側面を処理する方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030060645A KR100590196B1 (ko) | 2003-08-30 | 2003-08-30 | 전도성 물질로 동박 매쉬의 전면 및 측면을 처리하는 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005076125A JP2005076125A (ja) | 2005-03-24 |
JP4219874B2 true JP4219874B2 (ja) | 2009-02-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004250104A Expired - Lifetime JP4219874B2 (ja) | 2003-08-30 | 2004-08-30 | 導電性物質で銅箔メッシュの前面及び側面を処理する方法 |
Country Status (2)
Country | Link |
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JP (1) | JP4219874B2 (ja) |
KR (1) | KR100590196B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100826113B1 (ko) * | 2006-09-28 | 2008-04-29 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR101091853B1 (ko) | 2008-09-17 | 2011-12-12 | 주식회사 엘지화학 | 전도성 패턴의 제조방법 및 이에 의해 제조된 전도성 패턴 |
JP5418816B2 (ja) * | 2009-04-23 | 2014-02-19 | 日立化成株式会社 | 金属パターン及び導体層パターン付き基材の製造法、導体層パターン付き基材並びにそれを用いた電磁波遮蔽部材 |
-
2003
- 2003-08-30 KR KR1020030060645A patent/KR100590196B1/ko not_active IP Right Cessation
-
2004
- 2004-08-30 JP JP2004250104A patent/JP4219874B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005076125A (ja) | 2005-03-24 |
KR20050022444A (ko) | 2005-03-08 |
KR100590196B1 (ko) | 2006-06-15 |
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