JP4214265B2 - 光学測定装置、及び基板保持装置 - Google Patents
光学測定装置、及び基板保持装置 Download PDFInfo
- Publication number
- JP4214265B2 JP4214265B2 JP2008031943A JP2008031943A JP4214265B2 JP 4214265 B2 JP4214265 B2 JP 4214265B2 JP 2008031943 A JP2008031943 A JP 2008031943A JP 2008031943 A JP2008031943 A JP 2008031943A JP 4214265 B2 JP4214265 B2 JP 4214265B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- support member
- suction
- optical measurement
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Optical Filters (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008031943A JP4214265B2 (ja) | 2007-05-23 | 2008-02-13 | 光学測定装置、及び基板保持装置 |
TW097113757A TWI387748B (zh) | 2007-05-23 | 2008-04-16 | 光學測定裝置 |
TW101121281A TWI465713B (zh) | 2007-05-23 | 2008-04-16 | 基板保持裝置 |
KR1020080047582A KR100988691B1 (ko) | 2007-05-23 | 2008-05-22 | 광학 측정장치 |
KR1020100039475A KR100982079B1 (ko) | 2007-05-23 | 2010-04-28 | 기판 유지장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007136301 | 2007-05-23 | ||
JP2008031943A JP4214265B2 (ja) | 2007-05-23 | 2008-02-13 | 光学測定装置、及び基板保持装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008173228A Division JP5344545B2 (ja) | 2007-05-23 | 2008-07-02 | 基板保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009002928A JP2009002928A (ja) | 2009-01-08 |
JP4214265B2 true JP4214265B2 (ja) | 2009-01-28 |
Family
ID=40319447
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008031943A Expired - Fee Related JP4214265B2 (ja) | 2007-05-23 | 2008-02-13 | 光学測定装置、及び基板保持装置 |
JP2008173228A Active JP5344545B2 (ja) | 2007-05-23 | 2008-07-02 | 基板保持装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008173228A Active JP5344545B2 (ja) | 2007-05-23 | 2008-07-02 | 基板保持装置 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP4214265B2 (zh) |
KR (1) | KR100982079B1 (zh) |
TW (2) | TWI465713B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5495313B2 (ja) * | 2010-03-12 | 2014-05-21 | Ntn株式会社 | チャック装置、基板観察装置、および欠陥修正装置 |
JP5907759B2 (ja) * | 2012-03-02 | 2016-04-26 | 大阪瓦斯株式会社 | 磁気探傷装置 |
CN104425308B (zh) * | 2013-09-09 | 2018-03-09 | 东京毅力科创株式会社 | 测定装置、基板处理系统和测定方法 |
JP6246673B2 (ja) * | 2013-09-09 | 2017-12-13 | 東京エレクトロン株式会社 | 測定装置、基板処理システムおよび測定方法 |
TW201732997A (zh) * | 2016-01-18 | 2017-09-16 | Hoya股份有限公司 | 基板保持裝置、描繪裝置、光罩檢查裝置、及光罩之製造方法 |
JP7153231B2 (ja) * | 2018-12-21 | 2022-10-14 | 日本電気硝子株式会社 | ガラス板の撓み測定装置及びガラス板の製造方法 |
KR102241646B1 (ko) * | 2020-09-21 | 2021-04-16 | 엘지디스플레이 주식회사 | 기판 지지 장치 |
JP2023102048A (ja) * | 2022-01-11 | 2023-07-24 | Towa株式会社 | 加工装置、及び、加工品の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04194737A (ja) * | 1990-11-28 | 1992-07-14 | Hitachi Ltd | 基板表面異物検査装置 |
JP4130552B2 (ja) * | 2002-03-22 | 2008-08-06 | 株式会社ブイ・テクノロジー | ガラス基板の検査装置 |
JP4307872B2 (ja) * | 2003-03-18 | 2009-08-05 | オリンパス株式会社 | 基板検査装置 |
JP4443353B2 (ja) * | 2004-08-31 | 2010-03-31 | 東京応化工業株式会社 | 基板載置ステージ及び基板の吸着・剥離方法 |
JP4793851B2 (ja) * | 2005-05-31 | 2011-10-12 | レーザーテック株式会社 | カラーフィルタ基板のステージ装置及び検査装置 |
-
2008
- 2008-02-13 JP JP2008031943A patent/JP4214265B2/ja not_active Expired - Fee Related
- 2008-04-16 TW TW101121281A patent/TWI465713B/zh active
- 2008-04-16 TW TW097113757A patent/TWI387748B/zh active
- 2008-07-02 JP JP2008173228A patent/JP5344545B2/ja active Active
-
2010
- 2010-04-28 KR KR1020100039475A patent/KR100982079B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201243316A (en) | 2012-11-01 |
KR20100062984A (ko) | 2010-06-10 |
TWI465713B (zh) | 2014-12-21 |
TWI387748B (zh) | 2013-03-01 |
JP5344545B2 (ja) | 2013-11-20 |
JP2009002954A (ja) | 2009-01-08 |
TW200907332A (en) | 2009-02-16 |
KR100982079B1 (ko) | 2010-09-13 |
JP2009002928A (ja) | 2009-01-08 |
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