JP4193712B2 - ランドを備える基板の製造方法 - Google Patents
ランドを備える基板の製造方法 Download PDFInfo
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- JP4193712B2 JP4193712B2 JP2004023001A JP2004023001A JP4193712B2 JP 4193712 B2 JP4193712 B2 JP 4193712B2 JP 2004023001 A JP2004023001 A JP 2004023001A JP 2004023001 A JP2004023001 A JP 2004023001A JP 4193712 B2 JP4193712 B2 JP 4193712B2
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- land
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- noble metal
- metal film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
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Description
図1は、本発明の第1実施形態に係るランドを備える基板100の単体状態すなわち実装工程に施される前の状態の概略断面構成を示す図、図2は、この基板100にボンディングワイヤ30、31を接続し、各種部品20、21、22、23を実装した状態を示す概略断面図である。
基板100は、本例では積層基板100であり、この積層基板100は、個々についてその表面および内部に配線層が形成された複数のセラミック層11、12、13、14、を積層して形成されたものである。
次に、限定するものではないが、上記図1に示される積層基板100の製造方法および上記図2に示される実装構造の組み付け方法の一具体例について説明する。
図9は、本発明の第2実施形態に係る基板100の要部を示す概略断面図であり、(a)は図1に示されるような実装前の基板100における本実施形態の各ランド15a、15b、15cの拡大断面図、(b)および(c)は図3に示されるような実装後の基板100における本実施形態の各ランド15a、15b、15cの拡大断面図である。
図10は、本発明の第3実施形態に係る基板100の要部を示す概略断面図であり、(a)は図1に示されるような実装前の基板100における本実施形態の各ランド15a、15b、15cの拡大断面図、(b)、(c)および(d)は図3に示されるような実装後の基板100における本実施形態の各ランド15a、15b、15cの拡大断面図である。
図11は、本発明の第4実施形態に係る基板100の要部を示す概略断面図であり、(a)は基板100における本実施形態の接続直前の各ランド15a、15b、15cの拡大断面図、(b)は図3に示されるような実装後の基板100における本実施形態の各ランド15a、15b、15cの拡大断面図である。
15c…はんだランド、30…金ボンディングワイヤ、
31…Alボンディングワイヤ、100…基板としての積層基板、
151…タングステンもしくはモリブデンからなる層としてのタングステン層、
152…銅メッキもしくはニッケルメッキからなるメッキ層としての銅メッキ層、
153…金メッキ層、154…貴金属膜。
Claims (2)
- 基板(100)の表面に複数のランド(15a、15b、15c)を形成した後、前記ランド(15a、15b、15c)にボンディングワイヤ(30、31)や微細部品を接続してなるランドを備える基板の製造方法において、
前記基板(100)の表面に前記複数のランド(15a、15b、15c)を形成した後、前記ランド(15a、15b、15c)に前記ボンディングワイヤ(30、31)や前記微細部品を接続する前に、
前記複数のランド(15a、15b、15c)を検査し、欠損が存在すると判断されたランドの表面に、選択的に、貴金属のナノオーダ粒子を含むペースト状のナノペーストを塗布して硬化してなる貴金属膜(154)を形成することを特徴とするランドを備える基板の製造方法。 - 前記複数のランド(15a、15b、15c)の検査は、自動認識機にて行う外観検査であり、色の異なる複数の光源により、2値化して前記欠陥を認識することを特徴とする請求項1に記載のランドを備える基板の製造方法。
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JP5003347B2 (ja) * | 2007-08-22 | 2012-08-15 | 株式会社デンソー | 電子装置およびその製造方法 |
WO2009090849A1 (ja) * | 2008-01-17 | 2009-07-23 | Applied Nanoparticle Laboratory Corporation | ワイヤボンディング方法及び電子部品実装体 |
JP5416136B2 (ja) * | 2008-12-26 | 2014-02-12 | 株式会社応用ナノ粒子研究所 | ワイヤボンディング方法、電子部品、発光電子部品、複合発光電子部品及び発光装置 |
JP5405339B2 (ja) * | 2010-02-03 | 2014-02-05 | 日本メクトロン株式会社 | 配線回路基板及びその製造方法 |
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