JP4182035B2 - インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド - Google Patents

インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド Download PDF

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Publication number
JP4182035B2
JP4182035B2 JP2004236607A JP2004236607A JP4182035B2 JP 4182035 B2 JP4182035 B2 JP 4182035B2 JP 2004236607 A JP2004236607 A JP 2004236607A JP 2004236607 A JP2004236607 A JP 2004236607A JP 4182035 B2 JP4182035 B2 JP 4182035B2
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JP
Japan
Prior art keywords
layer
electrode wiring
substrate
heat generating
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004236607A
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English (en)
Japanese (ja)
Other versions
JP2006051772A (ja
JP2006051772A5 (enExample
Inventor
稔康 坂井
照夫 尾崎
賢二 小野
一郎 斎藤
宇 横山
智 伊部
和昭 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004236607A priority Critical patent/JP4182035B2/ja
Priority to EP05017617A priority patent/EP1627742B1/en
Priority to DE602005013864T priority patent/DE602005013864D1/de
Priority to US11/203,130 priority patent/US7641316B2/en
Priority to CNB2005100926025A priority patent/CN100406256C/zh
Publication of JP2006051772A publication Critical patent/JP2006051772A/ja
Publication of JP2006051772A5 publication Critical patent/JP2006051772A5/ja
Application granted granted Critical
Publication of JP4182035B2 publication Critical patent/JP4182035B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2004236607A 2004-08-16 2004-08-16 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド Expired - Fee Related JP4182035B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004236607A JP4182035B2 (ja) 2004-08-16 2004-08-16 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
EP05017617A EP1627742B1 (en) 2004-08-16 2005-08-12 Ink jet head circuit board, method of manufacturing the same, and ink jet head using the same
DE602005013864T DE602005013864D1 (de) 2004-08-16 2005-08-12 Schaltungsplatte für Tintenstrahldruckkopf, Verfahren zu ihrer Herstellung und damit ausgestatteter Tintenstrahldruckkopf
US11/203,130 US7641316B2 (en) 2004-08-16 2005-08-15 Ink jet head circuit board, method of manufacturing the same and ink jet head using the same
CNB2005100926025A CN100406256C (zh) 2004-08-16 2005-08-16 喷墨头用基板、该基板的制造方法和使用上述基板的喷墨头

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004236607A JP4182035B2 (ja) 2004-08-16 2004-08-16 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド

Publications (3)

Publication Number Publication Date
JP2006051772A JP2006051772A (ja) 2006-02-23
JP2006051772A5 JP2006051772A5 (enExample) 2007-03-01
JP4182035B2 true JP4182035B2 (ja) 2008-11-19

Family

ID=35058718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004236607A Expired - Fee Related JP4182035B2 (ja) 2004-08-16 2004-08-16 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド

Country Status (5)

Country Link
US (1) US7641316B2 (enExample)
EP (1) EP1627742B1 (enExample)
JP (1) JP4182035B2 (enExample)
CN (1) CN100406256C (enExample)
DE (1) DE602005013864D1 (enExample)

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JP4537246B2 (ja) * 2004-05-06 2010-09-01 キヤノン株式会社 インクジェット記録ヘッド用基体の製造方法及び該方法により製造された前記基体を用いた記録ヘッドの製造方法
JP4137027B2 (ja) * 2004-08-16 2008-08-20 キヤノン株式会社 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
JP4646602B2 (ja) * 2004-11-09 2011-03-09 キヤノン株式会社 インクジェット記録ヘッド用基板の製造方法
US8142678B2 (en) * 2005-08-23 2012-03-27 Canon Kabushiki Kaisha Perovskite type oxide material, piezoelectric element, liquid discharge head and liquid discharge apparatus using the same, and method of producing perovskite type oxide material
JP4926669B2 (ja) 2005-12-09 2012-05-09 キヤノン株式会社 インクジェットヘッドのクリーニング方法、インクジェットヘッドおよびインクジェット記録装置
US8438729B2 (en) * 2006-03-09 2013-05-14 Canon Kabushiki Kaisha Method of producing liquid discharge head
JP4963679B2 (ja) * 2007-05-29 2012-06-27 キヤノン株式会社 液体吐出ヘッド用基体及びその製造方法、並びに該基体を用いる液体吐出ヘッド
WO2008146894A1 (en) * 2007-05-29 2008-12-04 Canon Kabushiki Kaisha Substrate for liquid discharge head, method of manufacturing the same, and liquid discharge head using such substrate
US7862156B2 (en) * 2007-07-26 2011-01-04 Hewlett-Packard Development Company, L.P. Heating element
JP5311975B2 (ja) * 2007-12-12 2013-10-09 キヤノン株式会社 液体吐出ヘッド用基体及びこれを用いる液体吐出ヘッド
US8152279B2 (en) * 2008-06-18 2012-04-10 Canon Kabushiki Kaisha Liquid ejection head having substrate with nickel-containing layer
JP5312202B2 (ja) 2008-06-20 2013-10-09 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP2015080918A (ja) 2013-10-23 2015-04-27 キヤノン株式会社 液体吐出ヘッドおよび該液体吐出ヘッドの製造方法
US9776402B2 (en) * 2014-01-29 2017-10-03 Hewlett-Packard Development Company, L.P. Thermal ink jet printhead
JP6504905B2 (ja) 2015-05-08 2019-04-24 キヤノン株式会社 液体吐出ヘッド及び該ヘッドのクリーニング方法、並びに記録装置
JP7163134B2 (ja) 2018-10-18 2022-10-31 キヤノン株式会社 液体吐出ヘッド、液体吐出ヘッドの製造方法および液体吐出装置
US11945233B2 (en) * 2019-03-26 2024-04-02 Kyocera Corporation Thermal head and thermal printer
US11247459B2 (en) * 2019-07-22 2022-02-15 Canon Kabushiki Kaisha Liquid charging apparatus, liquid charging method, and manufacturing method
CN110931629A (zh) * 2019-12-11 2020-03-27 重庆大学 一种用于高掺钪浓度氮化铝生长的结构

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JP4537246B2 (ja) 2004-05-06 2010-09-01 キヤノン株式会社 インクジェット記録ヘッド用基体の製造方法及び該方法により製造された前記基体を用いた記録ヘッドの製造方法
JP4137027B2 (ja) 2004-08-16 2008-08-20 キヤノン株式会社 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
JP4630680B2 (ja) 2005-01-31 2011-02-09 キヤノン株式会社 半導体素子の製造方法およびインクジェット記録ヘッドの製造方法

Also Published As

Publication number Publication date
JP2006051772A (ja) 2006-02-23
DE602005013864D1 (de) 2009-05-28
EP1627742B1 (en) 2009-04-15
US7641316B2 (en) 2010-01-05
CN100406256C (zh) 2008-07-30
CN1736714A (zh) 2006-02-22
EP1627742A1 (en) 2006-02-22
US20060033782A1 (en) 2006-02-16

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