JP4145850B2 - フレキシブルプリント基板 - Google Patents
フレキシブルプリント基板 Download PDFInfo
- Publication number
- JP4145850B2 JP4145850B2 JP2004226724A JP2004226724A JP4145850B2 JP 4145850 B2 JP4145850 B2 JP 4145850B2 JP 2004226724 A JP2004226724 A JP 2004226724A JP 2004226724 A JP2004226724 A JP 2004226724A JP 4145850 B2 JP4145850 B2 JP 4145850B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible printed
- printed circuit
- surface treatment
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
2以上の表面処理領域を有し、これら領域に表面処理のためのマスキングが施されたフレキシブルプリント基板において、
マスキングされた前記表面処理領域に、処理液侵入防止用のパターンを銅箔により形成した
ことを特徴とするフレシキシブルプリント基板、
を提供するものである。
5 ベースフィルム、6 接着剤、7 導体、8 カバーフィルム、
10 染み込み防止ダム、A 侵入領域。
Claims (3)
- 2以上の表面処理領域を有し、これら領域に表面処理のためのマスキングが施されたフレキシブルプリント基板において、
マスキングされた前記表面処理領域に、処理液侵入防止用のパターンを銅箔により形成した
ことを特徴とするフレシキシブルプリント基板。 - 請求項1記載のフレキシブルプリント基板において、
前記パターンは、前記処理液進入方向にほぼ直角方向に沿って設けられたことを特徴とするフレキシブルプリント基板。 - 請求項1または2記載のフレキシブルプリント基板において、
前記パターンは、前記処理液の進入方向に対して少なくとも二重に設けられたフレキシブルプリント基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004226724A JP4145850B2 (ja) | 2004-08-03 | 2004-08-03 | フレキシブルプリント基板 |
KR1020050047184A KR101088066B1 (ko) | 2004-08-03 | 2005-06-02 | 플렉시블 프린트기판 |
TW094118418A TW200607420A (en) | 2004-08-03 | 2005-06-03 | Flexible PCB |
CN200510088278XA CN1747623B (zh) | 2004-08-03 | 2005-08-03 | 柔性印刷电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004226724A JP4145850B2 (ja) | 2004-08-03 | 2004-08-03 | フレキシブルプリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006049484A JP2006049484A (ja) | 2006-02-16 |
JP4145850B2 true JP4145850B2 (ja) | 2008-09-03 |
Family
ID=36027713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004226724A Expired - Fee Related JP4145850B2 (ja) | 2004-08-03 | 2004-08-03 | フレキシブルプリント基板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4145850B2 (ja) |
KR (1) | KR101088066B1 (ja) |
CN (1) | CN1747623B (ja) |
TW (1) | TW200607420A (ja) |
-
2004
- 2004-08-03 JP JP2004226724A patent/JP4145850B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-02 KR KR1020050047184A patent/KR101088066B1/ko active IP Right Grant
- 2005-06-03 TW TW094118418A patent/TW200607420A/zh not_active IP Right Cessation
- 2005-08-03 CN CN200510088278XA patent/CN1747623B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200607420A (en) | 2006-02-16 |
JP2006049484A (ja) | 2006-02-16 |
KR101088066B1 (ko) | 2011-11-30 |
KR20060049504A (ko) | 2006-05-19 |
CN1747623A (zh) | 2006-03-15 |
TWI316834B (ja) | 2009-11-01 |
CN1747623B (zh) | 2012-06-27 |
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