CN1747623B - 柔性印刷电路板 - Google Patents
柔性印刷电路板 Download PDFInfo
- Publication number
- CN1747623B CN1747623B CN200510088278XA CN200510088278A CN1747623B CN 1747623 B CN1747623 B CN 1747623B CN 200510088278X A CN200510088278X A CN 200510088278XA CN 200510088278 A CN200510088278 A CN 200510088278A CN 1747623 B CN1747623 B CN 1747623B
- Authority
- CN
- China
- Prior art keywords
- flexible printed
- circuit board
- printed circuit
- pattern
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
柔性印刷电路板,本发明提供一种在表面处理时药液不向对象以外的接合区侵入的柔性印刷电路板。在具有2个以上的表面处理区域,在这些区域实施了用于表面处理的遮挡的柔性印刷电路板上,其特征在于,在上述被遮挡的上述表面处理区域(1)上形成有防止处理液侵入用的图案(10)。
Description
技术领域
本发明涉及柔性印刷电路板,特别是可在表面处理时能够防止处理液侵入电路图案的柔性印刷电路板。
背景技术
伴随着电子机器的小型化,柔性电路基板得到了广泛应用。而且,在单一的柔性电路基板上要实施多种表面处理。由于这些处理根据各自不同的工序使用不同的处理液,所以在进行一个工程中的表面处理时,使用遮挡带将不实施处理的其他区域遮挡,以防止处理液进入。
但是,如图2及图3所示,在基板的接合区周围及遮挡带下的图案处,遮挡带的密合性未必完全。
图2是柔性电路基板的局部剖视图,包括表面处理部1及另一个表面处理部2,包围表面处理部2地覆盖有掩模带3。
在这种情况下,有时候用于处理表面处理部2的处理液通过箭头所示的渗入口4侵入到表面处理部1,损坏先前已经实施过的表面处理。
图3是将图2状态以剖面表示,在底膜5上通过粘合剂6设置导体7,在其上面设盖膜8、掩模带9。于是,处理液就从导体7之间的渗入口4侵入。
发明内容
本发明是考虑到上述问题而提出的,目的在于提供一种在表面处理时,药液不侵入对象以外的接合区的柔性印刷电路板。
为了达成上述目的,本发明提供一种柔性印刷电路板,具有两个以上的表面处理区域,在这些区域上实施了用于表面处理的遮挡,其特征在于,在上述被遮挡的上述表面处理区域上形成有防止处理液侵入用的图案。
本发明如上所述,由于设置了防止处理液侵入用的图案,故能够防止因处理一个表面处理区域的处理液而损坏其他的表面处理区域。
附图说明
图1是表示本发明的一个实施例的构成的柔性印刷电路板的局部俯视图。
图2是以往的柔性印刷电路板的局部俯视图。
图3是对应于图2的俯视图的剖视图。
具体实施方式
下面,参照图1说明本发明的一个实施例。
实施例1
图1表示本发明的一个实施例,且和图2相同的柔性印刷电路板的局部俯视图。此柔性印刷电路板具有表面处理部1及表面处理部2,包含表面处理部1的图示的左侧部分事先由掩模带3覆盖,其端面在图示的大致中央部垂直表示。
现在,将表面处理部2进行镀敷处理,在掩模带3的端面,作为处理液的镀敷液向表面处理部1侵入的路径如用圆圈圈出的A部的箭头所示,向图示的左上方生成。
因此,为了阻止沿着此侵入路径的镀敷液的侵入,形成防渗入坝10。此防渗入坝10例如是在形成电路图案时留下铜箔图案而形成的。而且,防渗入坝10形成与侵入路径垂直、并和其他的电路图案分离的状态。
据此,镀敷液的侵入路径只有防渗入坝10的两侧部,截面积减小,而且路径变得曲折。因此,镀敷液的侵入被大幅度地阻止。并且,通过设置防渗入坝10,在有此防渗入坝10的部分,防渗入坝10和掩模带3的的密合性提高。从这一点也能够使镀敷液的侵入路径变窄,能够强化防止镀敷液侵入。
为了进一步强化阻止侵入,设置多个防渗入坝10形成多重化构造.图示的情况是二重化。由于通过多重化,侵入路径增加了更多的曲折,而且侵入路径变长,故即使没有完全阻止镀敷液的侵入,也能够大幅度降低到实际中不产生问题的程度。
Claims (3)
1.一种柔性印刷电路板,具有两个以上的表面处理区域,在这些区域上实施了用于表面处理区域的覆盖,其特征在于,
在被覆盖的上述表面处理区域上,通过铜箔形成有防止处理液向掩模带和盖膜之间浸入用的图案。
2.如权利要求1所述的柔性印刷电路板,其特征在于,
上述图案是沿着和上述处理液的进入方向呈直角的方向设置的。
3.如权利要求1或2所述的柔性印刷电路板,其特征在于,
上述图案相对于上述处理液的进入方向至少设置二重。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004226724A JP4145850B2 (ja) | 2004-08-03 | 2004-08-03 | フレキシブルプリント基板 |
JP226724/04 | 2004-08-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1747623A CN1747623A (zh) | 2006-03-15 |
CN1747623B true CN1747623B (zh) | 2012-06-27 |
Family
ID=36027713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510088278XA Expired - Fee Related CN1747623B (zh) | 2004-08-03 | 2005-08-03 | 柔性印刷电路板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4145850B2 (zh) |
KR (1) | KR101088066B1 (zh) |
CN (1) | CN1747623B (zh) |
TW (1) | TW200607420A (zh) |
-
2004
- 2004-08-03 JP JP2004226724A patent/JP4145850B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-02 KR KR1020050047184A patent/KR101088066B1/ko active IP Right Grant
- 2005-06-03 TW TW094118418A patent/TW200607420A/zh not_active IP Right Cessation
- 2005-08-03 CN CN200510088278XA patent/CN1747623B/zh not_active Expired - Fee Related
Non-Patent Citations (4)
Title |
---|
JP特开2001-332820A 2001.11.30 |
JP特开2003-198078A 2003.07.11 |
JP特开平11-302611A 1999.11.02 |
JP特开平9-205261A 1997.08.05 |
Also Published As
Publication number | Publication date |
---|---|
CN1747623A (zh) | 2006-03-15 |
TW200607420A (en) | 2006-02-16 |
TWI316834B (zh) | 2009-11-01 |
KR101088066B1 (ko) | 2011-11-30 |
KR20060049504A (ko) | 2006-05-19 |
JP4145850B2 (ja) | 2008-09-03 |
JP2006049484A (ja) | 2006-02-16 |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20190803 |