JP4139216B2 - 半導体ウェハを露光する方法 - Google Patents

半導体ウェハを露光する方法 Download PDF

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Publication number
JP4139216B2
JP4139216B2 JP2002541450A JP2002541450A JP4139216B2 JP 4139216 B2 JP4139216 B2 JP 4139216B2 JP 2002541450 A JP2002541450 A JP 2002541450A JP 2002541450 A JP2002541450 A JP 2002541450A JP 4139216 B2 JP4139216 B2 JP 4139216B2
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Japan
Prior art keywords
exposure
wafer
regions
semiconductor wafer
parameters
Prior art date
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Expired - Fee Related
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JP2002541450A
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English (en)
Japanese (ja)
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JP2004513528A (ja
JP2004513528A5 (enExample
Inventor
トルステン シェーデル，
トルステン ザイデル，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies SC300 GmbH and Co KG
Original Assignee
Infineon Technologies SC300 GmbH and Co KG
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Publication of JP2004513528A publication Critical patent/JP2004513528A/ja
Publication of JP2004513528A5 publication Critical patent/JP2004513528A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/946—Step and repeat

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2002541450A 2000-11-09 2001-10-23 半導体ウェハを露光する方法 Expired - Fee Related JP4139216B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00124564A EP1205806A1 (en) 2000-11-09 2000-11-09 Method for exposing a semiconductor wafer
PCT/EP2001/012237 WO2002039188A1 (en) 2000-11-09 2001-10-23 Method for exposing a semiconductor wafer

Publications (3)

Publication Number Publication Date
JP2004513528A JP2004513528A (ja) 2004-04-30
JP2004513528A5 JP2004513528A5 (enExample) 2005-04-07
JP4139216B2 true JP4139216B2 (ja) 2008-08-27

Family

ID=8170335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002541450A Expired - Fee Related JP4139216B2 (ja) 2000-11-09 2001-10-23 半導体ウェハを露光する方法

Country Status (6)

Country Link
US (1) US6887722B2 (enExample)
EP (2) EP1205806A1 (enExample)
JP (1) JP4139216B2 (enExample)
KR (1) KR100540778B1 (enExample)
TW (1) TWI272653B (enExample)
WO (1) WO2002039188A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6873938B1 (en) * 2003-09-17 2005-03-29 Asml Netherlands B.V. Adaptive lithographic critical dimension enhancement
DE102004022329B3 (de) * 2004-05-06 2005-12-29 Infineon Technologies Ag Verfahren zur dynamischen Dosisanpassung in einem lithographischen Projektionsapparat und Projektionsapparat
US20060183025A1 (en) * 2005-02-14 2006-08-17 Micron Technology, Inc. Methods of forming mask patterns, methods of correcting feature dimension variation, microlithography methods, recording medium and electron beam exposure system
JP4682734B2 (ja) * 2005-07-29 2011-05-11 凸版印刷株式会社 フォトマスクのパターン描画方法
JP2008071838A (ja) * 2006-09-12 2008-03-27 Nec Electronics Corp 半導体装置の製造方法
JP2008091793A (ja) * 2006-10-04 2008-04-17 Tohoku Univ 露光方法及び露光装置
CN101086627B (zh) * 2007-04-29 2010-10-06 上海微电子装备有限公司 凸点光刻机的曝光方法
US9046788B2 (en) * 2008-05-19 2015-06-02 International Business Machines Corporation Method for monitoring focus on an integrated wafer
US8142966B2 (en) * 2008-05-21 2012-03-27 Kla-Tenor Corporation Substrate matrix to decouple tool and process effects
JP4683163B2 (ja) * 2010-10-29 2011-05-11 凸版印刷株式会社 フォトマスクのパターン描画方法
CN102200696B (zh) * 2011-05-27 2014-10-22 上海华虹宏力半导体制造有限公司 利用聚焦与曝光量矩阵确定最佳光刻工艺参数的方法
CN103076722B (zh) * 2013-01-11 2016-03-09 无锡华润上华科技有限公司 一种用于减少晶片边缘区域曝光散焦的曝光方法及光刻工艺
US9715180B2 (en) 2013-06-11 2017-07-25 Cymer, Llc Wafer-based light source parameter control
CN111312608B (zh) * 2020-02-25 2022-09-02 上海华虹宏力半导体制造有限公司 晶圆参数的修调方法
CN111273520B (zh) * 2020-03-05 2023-08-11 浙江晶引电子科技有限公司 一种改善蚀刻均匀性的曝光方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851514A (ja) * 1981-09-22 1983-03-26 Toshiba Corp ウエハ露光方法及びその装置
JPS58156938A (ja) * 1982-03-12 1983-09-19 Hitachi Ltd 露光装置
JPH03211820A (ja) * 1990-01-17 1991-09-17 Canon Inc 自動現像装置
US5646870A (en) * 1995-02-13 1997-07-08 Advanced Micro Devices, Inc. Method for setting and adjusting process parameters to maintain acceptable critical dimensions across each die of mass-produced semiconductor wafers
JP2000100701A (ja) * 1998-09-24 2000-04-07 Sony Corp パターンの疎密差評価方法
TW396433B (en) 1998-11-27 2000-07-01 Vanguard Int Semiconduct Corp A multi-exposure process that raises microlithography margin
US6689519B2 (en) * 2000-05-04 2004-02-10 Kla-Tencor Technologies Corp. Methods and systems for lithography process control

Also Published As

Publication number Publication date
EP1205806A1 (en) 2002-05-15
TWI272653B (en) 2007-02-01
WO2002039188A1 (en) 2002-05-16
EP1332407A1 (en) 2003-08-06
KR20030051787A (ko) 2003-06-25
US6887722B2 (en) 2005-05-03
US20040029027A1 (en) 2004-02-12
KR100540778B1 (ko) 2006-01-11
JP2004513528A (ja) 2004-04-30

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