JP4130073B2 - イオン交換体の再生方法及び再生装置 - Google Patents
イオン交換体の再生方法及び再生装置 Download PDFInfo
- Publication number
- JP4130073B2 JP4130073B2 JP2001365147A JP2001365147A JP4130073B2 JP 4130073 B2 JP4130073 B2 JP 4130073B2 JP 2001365147 A JP2001365147 A JP 2001365147A JP 2001365147 A JP2001365147 A JP 2001365147A JP 4130073 B2 JP4130073 B2 JP 4130073B2
- Authority
- JP
- Japan
- Prior art keywords
- ion exchanger
- electrode
- regeneration
- ion
- exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000011069 regeneration method Methods 0.000 title claims description 107
- 230000008929 regeneration Effects 0.000 title claims description 104
- 150000002500 ions Chemical class 0.000 claims description 303
- 230000001172 regenerating effect Effects 0.000 claims description 49
- 239000007788 liquid Substances 0.000 claims description 44
- 238000005342 ion exchange Methods 0.000 claims description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 150000001768 cations Chemical class 0.000 claims description 33
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 31
- 239000012498 ultrapure water Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 25
- 238000005868 electrolysis reaction Methods 0.000 claims description 17
- 239000008151 electrolyte solution Substances 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 77
- 150000001450 anions Chemical class 0.000 description 29
- 239000010949 copper Substances 0.000 description 29
- 229910052802 copper Inorganic materials 0.000 description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 27
- 238000005341 cation exchange Methods 0.000 description 26
- 238000005349 anion exchange Methods 0.000 description 19
- 238000003754 machining Methods 0.000 description 16
- -1 hydrogen ions Chemical class 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 238000010559 graft polymerization reaction Methods 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000004745 nonwoven fabric Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 7
- 239000003792 electrolyte Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 5
- 230000009471 action Effects 0.000 description 5
- 229910001431 copper ion Inorganic materials 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007784 solid electrolyte Substances 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- MNCGMVDMOKPCSQ-UHFFFAOYSA-M sodium;2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=CC1=CC=CC=C1 MNCGMVDMOKPCSQ-UHFFFAOYSA-M 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Landscapes
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001365147A JP4130073B2 (ja) | 2001-11-29 | 2001-11-29 | イオン交換体の再生方法及び再生装置 |
TW091134719A TWI267417B (en) | 2001-11-29 | 2002-11-29 | Method and device for regenerating ion exchanger, and electrolytic processing apparatus |
EP02785985A EP1448811A4 (en) | 2001-11-29 | 2002-11-29 | METHOD AND DEVICE FOR REGENERATING ION EXCHANGERS AND DEVICE FOR ELECTROLYTIC PROCESSING |
CNB028276892A CN100346008C (zh) | 2001-11-29 | 2002-11-29 | 用于再生离子交换剂的方法与设备以及电解处理装置 |
PCT/JP2002/012519 WO2003046263A1 (en) | 2001-11-29 | 2002-11-29 | Method and device for regenerating ion exchanger, and electrolytic processing apparatus |
KR1020047008256A KR100917433B1 (ko) | 2001-11-29 | 2002-11-29 | 이온 교환기를 재생시키는 방법 및 장치, 그리고 전해질처리장치 |
US10/432,397 US7427345B2 (en) | 2001-11-29 | 2002-11-29 | Method and device for regenerating ion exchanger, and electrolytic processing apparatus |
US12/222,733 US8133380B2 (en) | 2001-11-29 | 2008-08-14 | Method for regenerating ion exchanger |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001365147A JP4130073B2 (ja) | 2001-11-29 | 2001-11-29 | イオン交換体の再生方法及び再生装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003164768A JP2003164768A (ja) | 2003-06-10 |
JP2003164768A5 JP2003164768A5 (enrdf_load_stackoverflow) | 2004-12-24 |
JP4130073B2 true JP4130073B2 (ja) | 2008-08-06 |
Family
ID=19175210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001365147A Expired - Fee Related JP4130073B2 (ja) | 2001-11-29 | 2001-11-29 | イオン交換体の再生方法及び再生装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4130073B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7476303B2 (en) | 2003-08-11 | 2009-01-13 | Ebara Corporation | Electrolytic processing apparatus and electrolytic processing method |
JP4695206B2 (ja) * | 2009-06-18 | 2011-06-08 | 国立大学法人北陸先端科学技術大学院大学 | 金属回収方法および金属回収装置 |
-
2001
- 2001-11-29 JP JP2001365147A patent/JP4130073B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2003164768A (ja) | 2003-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4043234B2 (ja) | 電解加工装置及び基板処理装置 | |
US20070187259A1 (en) | Substrate processing apparatus and method | |
US8133380B2 (en) | Method for regenerating ion exchanger | |
US7101465B2 (en) | Electrolytic processing device and substrate processing apparatus | |
JP2003205428A (ja) | 電解加工装置及び方法 | |
JP2008160134A (ja) | 基板処理方法 | |
JP4130073B2 (ja) | イオン交換体の再生方法及び再生装置 | |
JP4172945B2 (ja) | 電解加工用イオン交換体の再生方法及び再生装置 | |
US20040256237A1 (en) | Electrolytic processing apparatus and method | |
JP3995463B2 (ja) | 電解加工方法 | |
JP2004015028A (ja) | 基板処理方法及び半導体装置 | |
US20080217164A1 (en) | Electrolytic Processing Apparatus | |
JP2003080421A (ja) | 電解加工装置 | |
JP3967207B2 (ja) | 電解加工装置 | |
JP4076430B2 (ja) | 基板処理装置 | |
JP4274714B2 (ja) | 加工装置及び加工方法 | |
JP2007284795A (ja) | 電極構造及び電解加工装置 | |
JP2003225831A (ja) | 電解加工装置 | |
JP4233403B2 (ja) | 電解加工装置及び電解加工方法 | |
JP4127361B2 (ja) | 電解加工装置 | |
JP2004060027A (ja) | 電解加工方法及び装置 | |
JP4245453B2 (ja) | 電解加工装置及び電解加工方法 | |
JP2004255479A (ja) | 電解加工方法及び電解加工装置 | |
JP2004002910A (ja) | 電解加工方法及び装置 | |
JP2005199401A (ja) | 電解加工装置及び方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040116 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040116 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071225 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080225 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080520 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080520 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4130073 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110530 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110530 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120530 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130530 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140530 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |