JP4112615B2 - C4マイクロバンプ、tabマイクロバンプおよび超大規模相互接続の電解めっき用たわみ性連続カソード接点回路 - Google Patents
C4マイクロバンプ、tabマイクロバンプおよび超大規模相互接続の電解めっき用たわみ性連続カソード接点回路 Download PDFInfo
- Publication number
- JP4112615B2 JP4112615B2 JP51350197A JP51350197A JP4112615B2 JP 4112615 B2 JP4112615 B2 JP 4112615B2 JP 51350197 A JP51350197 A JP 51350197A JP 51350197 A JP51350197 A JP 51350197A JP 4112615 B2 JP4112615 B2 JP 4112615B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- wafer
- cathode
- flexible
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/534,489 US5807469A (en) | 1995-09-27 | 1995-09-27 | Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects |
| US08/534,489 | 1995-09-27 | ||
| PCT/US1996/015032 WO1997012079A1 (en) | 1995-09-27 | 1996-09-19 | Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000500825A JP2000500825A (ja) | 2000-01-25 |
| JP2000500825A5 JP2000500825A5 (OSRAM) | 2004-09-02 |
| JP4112615B2 true JP4112615B2 (ja) | 2008-07-02 |
Family
ID=24130274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51350197A Expired - Fee Related JP4112615B2 (ja) | 1995-09-27 | 1996-09-19 | C4マイクロバンプ、tabマイクロバンプおよび超大規模相互接続の電解めっき用たわみ性連続カソード接点回路 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5807469A (OSRAM) |
| EP (1) | EP0859877B1 (OSRAM) |
| JP (1) | JP4112615B2 (OSRAM) |
| AU (1) | AU7076496A (OSRAM) |
| DE (1) | DE69632591T2 (OSRAM) |
| WO (1) | WO1997012079A1 (OSRAM) |
Families Citing this family (92)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6375741B2 (en) | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
| US6752584B2 (en) * | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
| US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
| US6276072B1 (en) | 1997-07-10 | 2001-08-21 | Applied Materials, Inc. | Method and apparatus for heating and cooling substrates |
| EP1019954B1 (en) | 1998-02-04 | 2013-05-15 | Applied Materials, Inc. | Method and apparatus for low-temperature annealing of electroplated copper micro-structures in the production of a microelectronic device |
| US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TWI223678B (en) * | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| DE69929967T2 (de) * | 1998-04-21 | 2007-05-24 | Applied Materials, Inc., Santa Clara | Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten |
| US6416647B1 (en) | 1998-04-21 | 2002-07-09 | Applied Materials, Inc. | Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| US6994776B2 (en) * | 1998-06-01 | 2006-02-07 | Semitool Inc. | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device |
| US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US6267853B1 (en) | 1999-07-09 | 2001-07-31 | Applied Materials, Inc. | Electro-chemical deposition system |
| US6251236B1 (en) * | 1998-11-30 | 2001-06-26 | Applied Materials, Inc. | Cathode contact ring for electrochemical deposition |
| US6228233B1 (en) | 1998-11-30 | 2001-05-08 | Applied Materials, Inc. | Inflatable compliant bladder assembly |
| US6258220B1 (en) * | 1998-11-30 | 2001-07-10 | Applied Materials, Inc. | Electro-chemical deposition system |
| WO2000032835A2 (en) * | 1998-11-30 | 2000-06-08 | Applied Materials, Inc. | Electro-chemical deposition system |
| US6613214B2 (en) | 1998-11-30 | 2003-09-02 | Applied Materials, Inc. | Electric contact element for electrochemical deposition system and method |
| US6254760B1 (en) | 1999-03-05 | 2001-07-03 | Applied Materials, Inc. | Electro-chemical deposition system and method |
| US6251235B1 (en) * | 1999-03-30 | 2001-06-26 | Nutool, Inc. | Apparatus for forming an electrical contact with a semiconductor substrate |
| US7427337B2 (en) * | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
| US7578923B2 (en) * | 1998-12-01 | 2009-08-25 | Novellus Systems, Inc. | Electropolishing system and process |
| DE19859466C2 (de) | 1998-12-22 | 2002-04-25 | Steag Micro Tech Gmbh | Vorrichtung und Verfahren zum Behandeln von Substraten |
| WO2000040779A1 (en) * | 1998-12-31 | 2000-07-13 | Semitool, Inc. | Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
| US7192494B2 (en) | 1999-03-05 | 2007-03-20 | Applied Materials, Inc. | Method and apparatus for annealing copper films |
| US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
| US6197171B1 (en) * | 1999-03-31 | 2001-03-06 | International Business Machines Corporation | Pin contact mechanism for plating pin grid arrays |
| US6837978B1 (en) | 1999-04-08 | 2005-01-04 | Applied Materials, Inc. | Deposition uniformity control for electroplating apparatus, and associated method |
| US6582578B1 (en) | 1999-04-08 | 2003-06-24 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| US6557237B1 (en) * | 1999-04-08 | 2003-05-06 | Applied Materials, Inc. | Removable modular cell for electro-chemical plating and method |
| US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
| US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
| US6585876B2 (en) | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
| US6662673B1 (en) | 1999-04-08 | 2003-12-16 | Applied Materials, Inc. | Linear motion apparatus and associated method |
| US6551488B1 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Segmenting of processing system into wet and dry areas |
| US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7160421B2 (en) | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7020537B2 (en) * | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7264698B2 (en) * | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7438788B2 (en) * | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7585398B2 (en) * | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| JP4288010B2 (ja) * | 1999-04-13 | 2009-07-01 | セミトゥール・インコーポレイテッド | 処理流体の流れ具合を向上させる処理チャンバを備えた加工物処理装置 |
| US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
| US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
| US6516815B1 (en) | 1999-07-09 | 2003-02-11 | Applied Materials, Inc. | Edge bead removal/spin rinse dry (EBR/SRD) module |
| US6423636B1 (en) | 1999-11-19 | 2002-07-23 | Applied Materials, Inc. | Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer |
| US20050183959A1 (en) * | 2000-04-13 | 2005-08-25 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| AU2001259504A1 (en) * | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US20040079633A1 (en) * | 2000-07-05 | 2004-04-29 | Applied Materials, Inc. | Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing |
| US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
| AU2001282879A1 (en) * | 2000-07-08 | 2002-01-21 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
| US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
| US6908540B2 (en) * | 2001-07-13 | 2005-06-21 | Applied Materials, Inc. | Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| WO2003018874A2 (en) | 2001-08-31 | 2003-03-06 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6802947B2 (en) * | 2001-10-16 | 2004-10-12 | Applied Materials, Inc. | Apparatus and method for electro chemical plating using backside electrical contacts |
| US6770565B2 (en) | 2002-01-08 | 2004-08-03 | Applied Materials Inc. | System for planarizing metal conductive layers |
| US6911136B2 (en) | 2002-04-29 | 2005-06-28 | Applied Materials, Inc. | Method for regulating the electrical power applied to a substrate during an immersion process |
| US6893505B2 (en) * | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
| US7189313B2 (en) * | 2002-05-09 | 2007-03-13 | Applied Materials, Inc. | Substrate support with fluid retention band |
| US20040108212A1 (en) * | 2002-12-06 | 2004-06-10 | Lyndon Graham | Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces |
| JP4303484B2 (ja) * | 2003-01-21 | 2009-07-29 | 大日本スクリーン製造株式会社 | メッキ装置 |
| US7138039B2 (en) | 2003-01-21 | 2006-11-21 | Applied Materials, Inc. | Liquid isolation of contact rings |
| US7087144B2 (en) | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
| US7025861B2 (en) | 2003-02-06 | 2006-04-11 | Applied Materials | Contact plating apparatus |
| US7205153B2 (en) | 2003-04-11 | 2007-04-17 | Applied Materials, Inc. | Analytical reagent for acid copper sulfate solutions |
| US7311810B2 (en) | 2003-04-18 | 2007-12-25 | Applied Materials, Inc. | Two position anneal chamber |
| US20050167275A1 (en) | 2003-10-22 | 2005-08-04 | Arthur Keigler | Method and apparatus for fluid processing a workpiece |
| US7727366B2 (en) | 2003-10-22 | 2010-06-01 | Nexx Systems, Inc. | Balancing pressure to improve a fluid seal |
| US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
| US20050133406A1 (en) * | 2003-12-19 | 2005-06-23 | Wellington Scott L. | Systems and methods of producing a crude product |
| NL1027770C2 (nl) * | 2003-12-19 | 2006-07-13 | Shell Int Research | Systemen, methoden en katalysatoren voor het produceren van een ruwe-oliehoudend product. |
| US20070000810A1 (en) * | 2003-12-19 | 2007-01-04 | Bhan Opinder K | Method for producing a crude product with reduced tan |
| US20070000808A1 (en) * | 2003-12-19 | 2007-01-04 | Bhan Opinder K | Method and catalyst for producing a crude product having selected properties |
| US20050167327A1 (en) * | 2003-12-19 | 2005-08-04 | Bhan Opinder K. | Systems, methods, and catalysts for producing a crude product |
| US7745369B2 (en) * | 2003-12-19 | 2010-06-29 | Shell Oil Company | Method and catalyst for producing a crude product with minimal hydrogen uptake |
| US20100098602A1 (en) * | 2003-12-19 | 2010-04-22 | Opinder Kishan Bhan | Systems, methods, and catalysts for producing a crude product |
| US20050283993A1 (en) * | 2004-06-18 | 2005-12-29 | Qunwei Wu | Method and apparatus for fluid processing and drying a workpiece |
| US7285195B2 (en) | 2004-06-24 | 2007-10-23 | Applied Materials, Inc. | Electric field reducing thrust plate |
| TWI415930B (zh) * | 2005-04-06 | 2013-11-21 | Shell Int Research | 減少液態含烴原料總酸值(tan)的方法 |
| CN101166811A (zh) * | 2005-04-11 | 2008-04-23 | 国际壳牌研究有限公司 | 生产具有降低氮含量的原油产品的方法和催化剂 |
| RU2007141711A (ru) * | 2005-04-11 | 2009-05-20 | Шелл Интернэшнл Рисерч Маатсхаппий Б.В. (NL) | Способ получения полупродукта с пониженным содержанием азота и катализатора для его осуществления |
| WO2006110546A2 (en) * | 2005-04-11 | 2006-10-19 | Shell Internationale Research Maatschappij B.V. | Systems, methods, and catalysts for producing a crude product |
| CN101166808B (zh) * | 2005-04-11 | 2013-03-27 | 国际壳牌研究有限公司 | 生产具有降低mcr含量的原油产品的方法和催化剂 |
| WO2007149923A2 (en) * | 2006-06-22 | 2007-12-27 | Shell Oil Company | Method for producing a crude product with a long-life catalyst |
| US20080087575A1 (en) * | 2006-10-06 | 2008-04-17 | Bhan Opinder K | Systems and methods for producing a crude product and compositions thereof |
| TWI658175B (zh) * | 2014-02-25 | 2019-05-01 | 日商荏原製作所股份有限公司 | 陽極單元及具備該陽極單元之鍍覆裝置 |
| CN106711103B (zh) * | 2016-11-11 | 2019-02-05 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种半导体晶圆电镀用导电片及接电点密封结构 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4500394A (en) * | 1984-05-16 | 1985-02-19 | At&T Technologies, Inc. | Contacting a surface for plating thereon |
| US5118584A (en) * | 1990-06-01 | 1992-06-02 | Eastman Kodak Company | Method of producing microbump circuits for flip chip mounting |
| US5228976A (en) * | 1990-07-09 | 1993-07-20 | At&T Bell Laboratories | Hydrodynamically modulated hull cell |
| US5256274A (en) * | 1990-08-01 | 1993-10-26 | Jaime Poris | Selective metal electrodeposition process |
| US5413646A (en) * | 1991-02-08 | 1995-05-09 | Blount, Inc. | Heat-treatable chromium |
| SE467976B (sv) * | 1991-02-20 | 1992-10-12 | Dcm Innovation Ab | Anordning foer elektroplaetering, vid framstaellning av matriser foer tillverkning av t ex cd-skivor samt foerfarande foer tillverkning av matriser medelst anordningen |
| US5264787A (en) * | 1991-08-30 | 1993-11-23 | Hughes Aircraft Company | Rigid-flex circuits with raised features as IC test probes |
| US5223110A (en) * | 1991-12-11 | 1993-06-29 | Microelectronics And Computer Technology Corporation | Apparatus for electroplating electrical contacts |
| GB2263980B (en) * | 1992-02-07 | 1996-04-10 | Marconi Gec Ltd | Apparatus and method for testing bare dies |
| DE4203487A1 (de) * | 1992-02-07 | 1993-08-12 | Philips Patentverwaltung | Mehrstufenkollektor fuer elektrodenstrahlroehren |
| US5240580A (en) * | 1992-04-02 | 1993-08-31 | Vlsi Technology, Inc. | Conmag shield |
| JP3200468B2 (ja) * | 1992-05-21 | 2001-08-20 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | ウエーハ用めっき装置 |
| WO1993026143A1 (de) * | 1992-06-15 | 1993-12-23 | Dyconex Patente Ag | Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung |
| US5359768A (en) * | 1992-07-30 | 1994-11-01 | Intel Corporation | Method for mounting very small integrated circuit package on PCB |
| US5282944A (en) * | 1992-07-30 | 1994-02-01 | The United States Of America As Represented By The United States Department Of Energy | Ion source based on the cathodic arc |
| DE69400762T2 (de) * | 1993-02-16 | 1997-06-05 | Agfa Gevaert Nv | Vorrichtung zur elektrolytischer Rückgewinnung von Silber |
| US5317235A (en) * | 1993-03-22 | 1994-05-31 | Ism Technolog | Magnetically-filtered cathodic arc plasma apparatus |
| US5369545A (en) * | 1993-06-30 | 1994-11-29 | Intel Corporation | De-coupling capacitor on the top of the silicon die by eutectic flip bonding |
| US5409593A (en) * | 1993-12-03 | 1995-04-25 | Sifco Industries, Inc. | Method and apparatus for selective electroplating using soluble anodes |
| US5426345A (en) * | 1994-01-18 | 1995-06-20 | Andrex Radiation Products A/S | High voltage electronic tube with intermediate electrode |
| US5516416A (en) * | 1994-12-14 | 1996-05-14 | International Business Machines Corporation | Apparatus and method for electroplating pin grid array packaging modules |
-
1995
- 1995-09-27 US US08/534,489 patent/US5807469A/en not_active Expired - Fee Related
-
1996
- 1996-09-19 DE DE69632591T patent/DE69632591T2/de not_active Expired - Lifetime
- 1996-09-19 AU AU70764/96A patent/AU7076496A/en not_active Abandoned
- 1996-09-19 WO PCT/US1996/015032 patent/WO1997012079A1/en not_active Ceased
- 1996-09-19 JP JP51350197A patent/JP4112615B2/ja not_active Expired - Fee Related
- 1996-09-19 EP EP96931651A patent/EP0859877B1/en not_active Expired - Lifetime
-
1997
- 1997-10-17 US US08/953,354 patent/US5871626A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0859877A4 (en) | 1999-10-13 |
| DE69632591T2 (de) | 2005-06-09 |
| US5807469A (en) | 1998-09-15 |
| WO1997012079A1 (en) | 1997-04-03 |
| DE69632591D1 (de) | 2004-07-01 |
| JP2000500825A (ja) | 2000-01-25 |
| AU7076496A (en) | 1997-04-17 |
| EP0859877B1 (en) | 2004-05-26 |
| US5871626A (en) | 1999-02-16 |
| EP0859877A1 (en) | 1998-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4112615B2 (ja) | C4マイクロバンプ、tabマイクロバンプおよび超大規模相互接続の電解めっき用たわみ性連続カソード接点回路 | |
| US7078796B2 (en) | Corrosion-resistant copper bond pad and integrated device | |
| US7935568B2 (en) | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | |
| KR100264479B1 (ko) | 범프전극의 구조와 그 형성방법 | |
| US6627824B1 (en) | Support circuit with a tapered through-hole for a semiconductor chip assembly | |
| US20050001316A1 (en) | Corrosion-resistant bond pad and integrated device | |
| US20080064142A1 (en) | Method for fabricating a wafer level package having through wafer vias for external package connectivity | |
| EP2087516A2 (en) | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | |
| US6452281B1 (en) | Semiconductor integrated circuit and fabrication process therefor | |
| KR100608186B1 (ko) | 반도체 장치의 제조 방법 | |
| US5271822A (en) | Methods and apparatus for electroplating electrical contacts | |
| US20050045697A1 (en) | Wafer-level chip scale package | |
| TW201721826A (zh) | 半導體裝置及其製造方法 | |
| GB2095904A (en) | Semiconductor device with built-up low resistance contact and laterally conducting second contact | |
| US7442634B2 (en) | Method for constructing contact formations | |
| JP3836375B2 (ja) | 半導体装置の製造方法 | |
| JPH11163015A (ja) | メッキ装置 | |
| TW586169B (en) | Semiconductor die package with semiconductor die having side electrical connection | |
| US20220139815A1 (en) | Semiconductor device and method manufacturing thereof | |
| CN100524711C (zh) | 使用蚀刻引线框的半导体设备和半导体封装的制造方法 | |
| JP2023142146A (ja) | パッケージ基板、半導体装置 | |
| CN118315370A (zh) | 芯片、芯片封装结构及芯片制造方法 | |
| JP2003197815A (ja) | 半導体装置 | |
| JPS5828829A (ja) | 半導体ウエハ−のメツキ装置 | |
| JPH09186190A (ja) | 突起電極の構造およびその形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050809 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050726 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051020 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060822 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20061122 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070122 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070105 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070227 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070522 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070816 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20071018 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080311 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080410 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110418 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120418 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120418 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130418 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130418 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140418 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |