DE69632591D1 - Flexible kontinuierliche kathodenschaltung für die elektrolytische beschichtung von c4, tab microbump und schaltungen im ultragrossmassstab - Google Patents
Flexible kontinuierliche kathodenschaltung für die elektrolytische beschichtung von c4, tab microbump und schaltungen im ultragrossmassstabInfo
- Publication number
- DE69632591D1 DE69632591D1 DE69632591T DE69632591T DE69632591D1 DE 69632591 D1 DE69632591 D1 DE 69632591D1 DE 69632591 T DE69632591 T DE 69632591T DE 69632591 T DE69632591 T DE 69632591T DE 69632591 D1 DE69632591 D1 DE 69632591D1
- Authority
- DE
- Germany
- Prior art keywords
- microbump
- tab
- circuits
- large scale
- cathode circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/534,489 US5807469A (en) | 1995-09-27 | 1995-09-27 | Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects |
US534489 | 1995-09-27 | ||
PCT/US1996/015032 WO1997012079A1 (en) | 1995-09-27 | 1996-09-19 | Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69632591D1 true DE69632591D1 (de) | 2004-07-01 |
DE69632591T2 DE69632591T2 (de) | 2005-06-09 |
Family
ID=24130274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69632591T Expired - Lifetime DE69632591T2 (de) | 1995-09-27 | 1996-09-19 | Flexible kontinuierliche kathodenschaltung für die elektrolytische beschichtung von c4, tab microbump und schaltungen im ultragrossmassstab |
Country Status (6)
Country | Link |
---|---|
US (2) | US5807469A (de) |
EP (1) | EP0859877B1 (de) |
JP (1) | JP4112615B2 (de) |
AU (1) | AU7076496A (de) |
DE (1) | DE69632591T2 (de) |
WO (1) | WO1997012079A1 (de) |
Families Citing this family (80)
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US7578923B2 (en) * | 1998-12-01 | 2009-08-25 | Novellus Systems, Inc. | Electropolishing system and process |
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US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6197171B1 (en) * | 1999-03-31 | 2001-03-06 | International Business Machines Corporation | Pin contact mechanism for plating pin grid arrays |
US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
US6557237B1 (en) | 1999-04-08 | 2003-05-06 | Applied Materials, Inc. | Removable modular cell for electro-chemical plating and method |
US6551488B1 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Segmenting of processing system into wet and dry areas |
US6582578B1 (en) | 1999-04-08 | 2003-06-24 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
US6662673B1 (en) | 1999-04-08 | 2003-12-16 | Applied Materials, Inc. | Linear motion apparatus and associated method |
US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
US6837978B1 (en) | 1999-04-08 | 2005-01-04 | Applied Materials, Inc. | Deposition uniformity control for electroplating apparatus, and associated method |
US6585876B2 (en) | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
US7585398B2 (en) * | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7438788B2 (en) * | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
CN1296524C (zh) * | 1999-04-13 | 2007-01-24 | 塞米用具公司 | 对工件进行电化学处理的处理容器、反应器和方法 |
US7020537B2 (en) * | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US7264698B2 (en) * | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6516815B1 (en) | 1999-07-09 | 2003-02-11 | Applied Materials, Inc. | Edge bead removal/spin rinse dry (EBR/SRD) module |
US6423636B1 (en) | 1999-11-19 | 2002-07-23 | Applied Materials, Inc. | Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer |
US20050183959A1 (en) * | 2000-04-13 | 2005-08-25 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece |
AU2001259504A1 (en) * | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20040079633A1 (en) * | 2000-07-05 | 2004-04-29 | Applied Materials, Inc. | Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing |
US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
US7102763B2 (en) * | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
US6908540B2 (en) * | 2001-07-13 | 2005-06-21 | Applied Materials, Inc. | Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
US6802947B2 (en) * | 2001-10-16 | 2004-10-12 | Applied Materials, Inc. | Apparatus and method for electro chemical plating using backside electrical contacts |
US6770565B2 (en) | 2002-01-08 | 2004-08-03 | Applied Materials Inc. | System for planarizing metal conductive layers |
US6893505B2 (en) * | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
US7189313B2 (en) * | 2002-05-09 | 2007-03-13 | Applied Materials, Inc. | Substrate support with fluid retention band |
US20040108212A1 (en) * | 2002-12-06 | 2004-06-10 | Lyndon Graham | Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces |
JP4303484B2 (ja) * | 2003-01-21 | 2009-07-29 | 大日本スクリーン製造株式会社 | メッキ装置 |
US7138039B2 (en) | 2003-01-21 | 2006-11-21 | Applied Materials, Inc. | Liquid isolation of contact rings |
US7087144B2 (en) | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
US7025861B2 (en) | 2003-02-06 | 2006-04-11 | Applied Materials | Contact plating apparatus |
US7205153B2 (en) | 2003-04-11 | 2007-04-17 | Applied Materials, Inc. | Analytical reagent for acid copper sulfate solutions |
CN1894442B (zh) | 2003-10-22 | 2012-01-04 | 内克斯系统公司 | 用于对工件进行流体处理的方法和设备 |
US7727366B2 (en) * | 2003-10-22 | 2010-06-01 | Nexx Systems, Inc. | Balancing pressure to improve a fluid seal |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US20070000808A1 (en) * | 2003-12-19 | 2007-01-04 | Bhan Opinder K | Method and catalyst for producing a crude product having selected properties |
US20050133417A1 (en) * | 2003-12-19 | 2005-06-23 | Bhan Opinder K. | Systems, methods, and catalysts for producing a crude product |
US20070000810A1 (en) * | 2003-12-19 | 2007-01-04 | Bhan Opinder K | Method for producing a crude product with reduced tan |
US7745369B2 (en) * | 2003-12-19 | 2010-06-29 | Shell Oil Company | Method and catalyst for producing a crude product with minimal hydrogen uptake |
US7879223B2 (en) | 2003-12-19 | 2011-02-01 | Shell Oil Company | Systems and methods of producing a crude product |
US20100098602A1 (en) * | 2003-12-19 | 2010-04-22 | Opinder Kishan Bhan | Systems, methods, and catalysts for producing a crude product |
BRPI0405566A (pt) * | 2003-12-19 | 2005-09-20 | Shell Int Research | Métodos de produzir um produto de petróleo bruto e combustìvel de transporte, combustìvel de aquecimento, lubrificantes ou substâncias quìmicas, e, produto de petróleo bruto |
US20050283993A1 (en) * | 2004-06-18 | 2005-12-29 | Qunwei Wu | Method and apparatus for fluid processing and drying a workpiece |
TWI415930B (zh) * | 2005-04-06 | 2013-11-21 | Shell Int Research | 減少液態含烴原料總酸值(tan)的方法 |
CA2604012C (en) | 2005-04-11 | 2013-11-19 | Shell Internationale Research Maatschappij B.V. | Method and catalyst for producing a crude product having a reduced mcr content |
BRPI0609416A2 (pt) * | 2005-04-11 | 2011-10-11 | Shell Int Research | método para produzir um produto bruto |
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EP1869143A2 (de) * | 2005-04-11 | 2007-12-26 | Shell Internationale Research Maatschappij B.V. | Systeme, methoden und katalysatoren zur herstellung von rohölprodukten |
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US20080083655A1 (en) * | 2006-10-06 | 2008-04-10 | Bhan Opinder K | Methods of producing a crude product |
TWI658175B (zh) * | 2014-02-25 | 2019-05-01 | 日商荏原製作所股份有限公司 | 陽極單元及具備該陽極單元之鍍覆裝置 |
CN106711103B (zh) * | 2016-11-11 | 2019-02-05 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种半导体晶圆电镀用导电片及接电点密封结构 |
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-
1995
- 1995-09-27 US US08/534,489 patent/US5807469A/en not_active Expired - Fee Related
-
1996
- 1996-09-19 JP JP51350197A patent/JP4112615B2/ja not_active Expired - Fee Related
- 1996-09-19 WO PCT/US1996/015032 patent/WO1997012079A1/en active IP Right Grant
- 1996-09-19 AU AU70764/96A patent/AU7076496A/en not_active Abandoned
- 1996-09-19 DE DE69632591T patent/DE69632591T2/de not_active Expired - Lifetime
- 1996-09-19 EP EP96931651A patent/EP0859877B1/de not_active Expired - Lifetime
-
1997
- 1997-10-17 US US08/953,354 patent/US5871626A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5871626A (en) | 1999-02-16 |
WO1997012079A1 (en) | 1997-04-03 |
DE69632591T2 (de) | 2005-06-09 |
EP0859877A4 (de) | 1999-10-13 |
EP0859877A1 (de) | 1998-08-26 |
US5807469A (en) | 1998-09-15 |
JP2000500825A (ja) | 2000-01-25 |
EP0859877B1 (de) | 2004-05-26 |
AU7076496A (en) | 1997-04-17 |
JP4112615B2 (ja) | 2008-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |