AU7076496A - Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects - Google Patents

Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects

Info

Publication number
AU7076496A
AU7076496A AU70764/96A AU7076496A AU7076496A AU 7076496 A AU7076496 A AU 7076496A AU 70764/96 A AU70764/96 A AU 70764/96A AU 7076496 A AU7076496 A AU 7076496A AU 7076496 A AU7076496 A AU 7076496A
Authority
AU
Australia
Prior art keywords
microbumps
tab
large scale
electrolytic plating
cathode contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU70764/96A
Other languages
English (en)
Inventor
Douglas E. Crafts
Hirofumi Ishida
Steven M. Swain
Kenji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU7076496A publication Critical patent/AU7076496A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
AU70764/96A 1995-09-27 1996-09-19 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects Abandoned AU7076496A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/534,489 US5807469A (en) 1995-09-27 1995-09-27 Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects
US534489 1995-09-27
PCT/US1996/015032 WO1997012079A1 (en) 1995-09-27 1996-09-19 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects

Publications (1)

Publication Number Publication Date
AU7076496A true AU7076496A (en) 1997-04-17

Family

ID=24130274

Family Applications (1)

Application Number Title Priority Date Filing Date
AU70764/96A Abandoned AU7076496A (en) 1995-09-27 1996-09-19 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects

Country Status (6)

Country Link
US (2) US5807469A (OSRAM)
EP (1) EP0859877B1 (OSRAM)
JP (1) JP4112615B2 (OSRAM)
AU (1) AU7076496A (OSRAM)
DE (1) DE69632591T2 (OSRAM)
WO (1) WO1997012079A1 (OSRAM)

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Also Published As

Publication number Publication date
EP0859877A4 (en) 1999-10-13
DE69632591T2 (de) 2005-06-09
US5807469A (en) 1998-09-15
WO1997012079A1 (en) 1997-04-03
JP4112615B2 (ja) 2008-07-02
DE69632591D1 (de) 2004-07-01
JP2000500825A (ja) 2000-01-25
EP0859877B1 (en) 2004-05-26
US5871626A (en) 1999-02-16
EP0859877A1 (en) 1998-08-26

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