JP4111187B2 - 部品ユニットの製造方法 - Google Patents

部品ユニットの製造方法 Download PDF

Info

Publication number
JP4111187B2
JP4111187B2 JP2004345365A JP2004345365A JP4111187B2 JP 4111187 B2 JP4111187 B2 JP 4111187B2 JP 2004345365 A JP2004345365 A JP 2004345365A JP 2004345365 A JP2004345365 A JP 2004345365A JP 4111187 B2 JP4111187 B2 JP 4111187B2
Authority
JP
Japan
Prior art keywords
kneaded material
heat
heat sink
substrate
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004345365A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006156721A5 (enExample
JP2006156721A (ja
Inventor
美智博 宮内
哲也 津村
悦夫 辻本
浩二 中嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004345365A priority Critical patent/JP4111187B2/ja
Publication of JP2006156721A publication Critical patent/JP2006156721A/ja
Publication of JP2006156721A5 publication Critical patent/JP2006156721A5/ja
Application granted granted Critical
Publication of JP4111187B2 publication Critical patent/JP4111187B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004345365A 2004-11-30 2004-11-30 部品ユニットの製造方法 Expired - Fee Related JP4111187B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004345365A JP4111187B2 (ja) 2004-11-30 2004-11-30 部品ユニットの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004345365A JP4111187B2 (ja) 2004-11-30 2004-11-30 部品ユニットの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008035613A Division JP4636092B2 (ja) 2008-02-18 2008-02-18 部品ユニット

Publications (3)

Publication Number Publication Date
JP2006156721A JP2006156721A (ja) 2006-06-15
JP2006156721A5 JP2006156721A5 (enExample) 2007-07-12
JP4111187B2 true JP4111187B2 (ja) 2008-07-02

Family

ID=36634618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004345365A Expired - Fee Related JP4111187B2 (ja) 2004-11-30 2004-11-30 部品ユニットの製造方法

Country Status (1)

Country Link
JP (1) JP4111187B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156718A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 放熱板の製造方法
JP2006156717A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 放熱板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101153995B1 (ko) 2011-05-25 2012-06-07 주식회사 이지트로닉스 전력변환장치
JP2013229366A (ja) * 2012-04-24 2013-11-07 Meidensha Corp 電子部品の固定構造
JP5963732B2 (ja) 2013-10-31 2016-08-03 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ チップ支持基板の配線部裏面に放熱器設置の面領域を設定する方法およびチップ支持基板並びにチップ実装構造体
JP7351102B2 (ja) 2019-05-09 2023-09-27 富士電機株式会社 半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685502U (ja) * 1993-05-21 1994-12-06 オリジン電気株式会社 モールド型半導体装置を用いた高周波装置
JP3189590B2 (ja) * 1994-09-20 2001-07-16 東海ゴム工業株式会社 放熱シートおよびその製法
JP4077963B2 (ja) * 1998-11-04 2008-04-23 日東電工株式会社 放熱シート
JP2001274578A (ja) * 2000-03-27 2001-10-05 Daikin Ind Ltd 電気素子の放熱機構
JP2002138205A (ja) * 2000-11-02 2002-05-14 Polymatech Co Ltd 熱伝導性成形体
JP4268778B2 (ja) * 2001-12-27 2009-05-27 ポリマテック株式会社 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート
JP2004104115A (ja) * 2002-08-21 2004-04-02 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
JP4023257B2 (ja) * 2002-08-29 2007-12-19 松下電器産業株式会社 放熱用基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156718A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 放熱板の製造方法
JP2006156717A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 放熱板

Also Published As

Publication number Publication date
JP2006156721A (ja) 2006-06-15

Similar Documents

Publication Publication Date Title
US7057896B2 (en) Power module and production method thereof
WO2002007485A1 (en) Circuit board and method for manufacturing the same, and electronic apparatus comprising it
JP5012066B2 (ja) 電源モジュール
JP6031642B2 (ja) パワーモジュールとその製造方法
JP4261713B2 (ja) 熱伝導基板とその製造方法
JP2014165486A (ja) パワーデバイスモジュールとその製造方法
JP2010245563A (ja) 部品ユニット
JP4111187B2 (ja) 部品ユニットの製造方法
JPWO2015132969A1 (ja) 絶縁基板及び半導体装置
JP2004104115A (ja) パワーモジュール及びその製造方法
JP2006156721A5 (enExample)
JP4545022B2 (ja) 回路装置およびその製造方法
JP2007243210A (ja) 放熱用基板及びその製造方法
JP4636092B2 (ja) 部品ユニット
JP4581655B2 (ja) 放熱板
JP4013945B2 (ja) 部品ユニットの製造方法
JP4325329B2 (ja) 放熱実装体
JP2006156725A (ja) 放熱板の製造方法
JP2006156720A5 (enExample)
JP4581656B2 (ja) 放熱板の製造方法
JP2006156726A (ja) 放熱板の製造方法
JP2008301592A (ja) 電源ユニット
JP4075549B2 (ja) 放熱用基板及びその製造方法
JP2006156727A (ja) 放熱板の製造方法
JP3985558B2 (ja) 熱伝導性基板の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070522

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070522

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20070522

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20070613

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20070615

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070626

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070827

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070925

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071122

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080218

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080318

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080331

R151 Written notification of patent or utility model registration

Ref document number: 4111187

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110418

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120418

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130418

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130418

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140418

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees