JP4111187B2 - 部品ユニットの製造方法 - Google Patents
部品ユニットの製造方法 Download PDFInfo
- Publication number
- JP4111187B2 JP4111187B2 JP2004345365A JP2004345365A JP4111187B2 JP 4111187 B2 JP4111187 B2 JP 4111187B2 JP 2004345365 A JP2004345365 A JP 2004345365A JP 2004345365 A JP2004345365 A JP 2004345365A JP 4111187 B2 JP4111187 B2 JP 4111187B2
- Authority
- JP
- Japan
- Prior art keywords
- kneaded material
- heat
- heat sink
- substrate
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 25
- 239000011256 inorganic filler Substances 0.000 claims description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000004898 kneading Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 52
- 239000012212 insulator Substances 0.000 description 33
- 238000009413 insulation Methods 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
と線膨張係数を小さくできる。
12 基板
14 絶縁体
16 電子部品
18 筐体
20 接続端子
22 回路基板
24 混練物
26 フィルム
28 ローラー
30 熱盤
32 上金型
34 下金型
36 凹部
Claims (3)
- 金属製の基板の上に、無機フィラーと未硬化の熱硬化性の絶縁樹脂を混練して形成した混練物を、略一定の厚みになるように積層する工程と、
前記絶縁樹脂を硬化し、放熱板とした後に、この放熱板に接続端子を有する電子部品を接着剤で面接触させて装着する工程と、
前記接続端子を前記放熱板に対向するように配置された回路基板に接続する工程と、
を有する部品ユニットの製造方法。 - 前記接続端子は、略垂直に折り曲げることを特徴とする請求項1に記載の部品ユニットの製造方法。
- 放熱板の絶縁層を積層しない部分で、前記放熱板を機器の筐体もしくはシャーシに取り付ける請求項1に記載の部品ユニットの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004345365A JP4111187B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004345365A JP4111187B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008035613A Division JP4636092B2 (ja) | 2008-02-18 | 2008-02-18 | 部品ユニット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006156721A JP2006156721A (ja) | 2006-06-15 |
JP2006156721A5 JP2006156721A5 (ja) | 2007-07-12 |
JP4111187B2 true JP4111187B2 (ja) | 2008-07-02 |
Family
ID=36634618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004345365A Expired - Fee Related JP4111187B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4111187B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156717A (ja) * | 2004-11-30 | 2006-06-15 | Matsushita Electric Ind Co Ltd | 放熱板 |
JP2006156718A (ja) * | 2004-11-30 | 2006-06-15 | Matsushita Electric Ind Co Ltd | 放熱板の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101153995B1 (ko) | 2011-05-25 | 2012-06-07 | 주식회사 이지트로닉스 | 전력변환장치 |
JP2013229366A (ja) * | 2012-04-24 | 2013-11-07 | Meidensha Corp | 電子部品の固定構造 |
JP5963732B2 (ja) | 2013-10-31 | 2016-08-03 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | チップ支持基板の配線部裏面に放熱器設置の面領域を設定する方法およびチップ支持基板並びにチップ実装構造体 |
JP7351102B2 (ja) | 2019-05-09 | 2023-09-27 | 富士電機株式会社 | 半導体装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685502U (ja) * | 1993-05-21 | 1994-12-06 | オリジン電気株式会社 | モールド型半導体装置を用いた高周波装置 |
JP3189590B2 (ja) * | 1994-09-20 | 2001-07-16 | 東海ゴム工業株式会社 | 放熱シートおよびその製法 |
JP4077963B2 (ja) * | 1998-11-04 | 2008-04-23 | 日東電工株式会社 | 放熱シート |
JP2001274578A (ja) * | 2000-03-27 | 2001-10-05 | Daikin Ind Ltd | 電気素子の放熱機構 |
JP2002138205A (ja) * | 2000-11-02 | 2002-05-14 | Polymatech Co Ltd | 熱伝導性成形体 |
JP4268778B2 (ja) * | 2001-12-27 | 2009-05-27 | ポリマテック株式会社 | 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート |
JP2004104115A (ja) * | 2002-08-21 | 2004-04-02 | Matsushita Electric Ind Co Ltd | パワーモジュール及びその製造方法 |
JP4023257B2 (ja) * | 2002-08-29 | 2007-12-19 | 松下電器産業株式会社 | 放熱用基板の製造方法 |
-
2004
- 2004-11-30 JP JP2004345365A patent/JP4111187B2/ja not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156717A (ja) * | 2004-11-30 | 2006-06-15 | Matsushita Electric Ind Co Ltd | 放熱板 |
JP2006156718A (ja) * | 2004-11-30 | 2006-06-15 | Matsushita Electric Ind Co Ltd | 放熱板の製造方法 |
JP4581655B2 (ja) * | 2004-11-30 | 2010-11-17 | パナソニック株式会社 | 放熱板 |
JP4581656B2 (ja) * | 2004-11-30 | 2010-11-17 | パナソニック株式会社 | 放熱板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006156721A (ja) | 2006-06-15 |
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