JP2006156721A - 部品ユニット - Google Patents
部品ユニット Download PDFInfo
- Publication number
- JP2006156721A JP2006156721A JP2004345365A JP2004345365A JP2006156721A JP 2006156721 A JP2006156721 A JP 2006156721A JP 2004345365 A JP2004345365 A JP 2004345365A JP 2004345365 A JP2004345365 A JP 2004345365A JP 2006156721 A JP2006156721 A JP 2006156721A
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- heat
- component
- component unit
- kneaded material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 239000011256 inorganic filler Substances 0.000 claims description 22
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 22
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 19
- 230000017525 heat dissipation Effects 0.000 abstract description 18
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 51
- 238000000034 method Methods 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】基板12に絶縁体14を積層して形成した放熱板10と、この放熱板10に装着した電子部品16とを備え、電子部品16は放熱板10の絶縁体14に面接触させて装着した構成にすることで、面接触により放熱板10の絶縁体14との接触面積が大きくなり、放熱性を損なわずに、絶縁性を向上することができる。
【選択図】図1
Description
12 基板
14 絶縁体
16 電子部品
18 筐体
20 接続端子
22 回路基板
24 混練物
26 フィルム
28 ローラー
30 熱盤
32 上金型
34 下金型
36 凹部
Claims (8)
- 基板に絶縁体を積層して形成した放熱板と、前記放熱板に装着した発熱部品とを備え、前記絶縁体は、無機フィラーを含有した絶縁樹脂であって、前記無機フィラーの熱伝導率が前記絶縁樹脂の熱伝導率よりも大きく、前記発熱部品は、前記放熱板の前記絶縁体に面接触させて装着するとともに、前記発熱部品の接続端子を回路基板に接続して前記発熱部品を前記回路基板に実装した部品ユニット。
- 前記放熱板には、複数の前記発熱部品を一体化して装着、または近傍に配置して装着した請求項1記載の部品ユニット。
- 前記発熱部品は、コイル部にコアを組み合わせた電源トランスであって、前記電源トランスのコアを前記放熱板の絶縁体に面接触させた請求項1記載の部品ユニット。
- 前記絶縁体に発熱部品装着用の凹部を設けた請求項1記載の部品ユニット。
- 前記無機フィラーの粒径は、0.1〜100μmである請求項1記載の部品ユニット。
- 前記絶縁体は、前記無機フィラーを70〜95重量%含有した請求項1記載の部品ユニット。
- 前記無機フィラーは、Al2O3、MgO、SiO2、BN、AlNの少なくとも1つを含有した請求項1記載の部品ユニット。
- 前記絶縁樹脂は、熱硬化性であって、エポキシ樹脂、フェノール樹脂、シアネート樹脂の少なくとも1つを含有した請求項1記載の部品ユニット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004345365A JP4111187B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004345365A JP4111187B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008035613A Division JP4636092B2 (ja) | 2008-02-18 | 2008-02-18 | 部品ユニット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006156721A true JP2006156721A (ja) | 2006-06-15 |
JP2006156721A5 JP2006156721A5 (ja) | 2007-07-12 |
JP4111187B2 JP4111187B2 (ja) | 2008-07-02 |
Family
ID=36634618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004345365A Expired - Fee Related JP4111187B2 (ja) | 2004-11-30 | 2004-11-30 | 部品ユニットの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4111187B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101153995B1 (ko) | 2011-05-25 | 2012-06-07 | 주식회사 이지트로닉스 | 전력변환장치 |
JP2013229366A (ja) * | 2012-04-24 | 2013-11-07 | Meidensha Corp | 電子部品の固定構造 |
US9558311B2 (en) | 2013-10-31 | 2017-01-31 | International Business Machines Corporation | Surface region selection for heat sink placement |
US11177224B2 (en) | 2019-05-09 | 2021-11-16 | Fuji Electric Co., Ltd. | Method of manufacturing semiconductor device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4581655B2 (ja) * | 2004-11-30 | 2010-11-17 | パナソニック株式会社 | 放熱板 |
JP4581656B2 (ja) * | 2004-11-30 | 2010-11-17 | パナソニック株式会社 | 放熱板の製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685502U (ja) * | 1993-05-21 | 1994-12-06 | オリジン電気株式会社 | モールド型半導体装置を用いた高周波装置 |
JPH0888488A (ja) * | 1994-09-20 | 1996-04-02 | Tokai Rubber Ind Ltd | 放熱シートおよびその製法 |
JP2000151160A (ja) * | 1998-11-04 | 2000-05-30 | Nitto Denko Corp | 放熱シート |
JP2001274578A (ja) * | 2000-03-27 | 2001-10-05 | Daikin Ind Ltd | 電気素子の放熱機構 |
JP2002138205A (ja) * | 2000-11-02 | 2002-05-14 | Polymatech Co Ltd | 熱伝導性成形体 |
JP2003198166A (ja) * | 2001-12-27 | 2003-07-11 | Polymatech Co Ltd | 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート |
JP2004095608A (ja) * | 2002-08-29 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 放熱用基板及びその製造方法 |
JP2004104115A (ja) * | 2002-08-21 | 2004-04-02 | Matsushita Electric Ind Co Ltd | パワーモジュール及びその製造方法 |
-
2004
- 2004-11-30 JP JP2004345365A patent/JP4111187B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685502U (ja) * | 1993-05-21 | 1994-12-06 | オリジン電気株式会社 | モールド型半導体装置を用いた高周波装置 |
JPH0888488A (ja) * | 1994-09-20 | 1996-04-02 | Tokai Rubber Ind Ltd | 放熱シートおよびその製法 |
JP2000151160A (ja) * | 1998-11-04 | 2000-05-30 | Nitto Denko Corp | 放熱シート |
JP2001274578A (ja) * | 2000-03-27 | 2001-10-05 | Daikin Ind Ltd | 電気素子の放熱機構 |
JP2002138205A (ja) * | 2000-11-02 | 2002-05-14 | Polymatech Co Ltd | 熱伝導性成形体 |
JP2003198166A (ja) * | 2001-12-27 | 2003-07-11 | Polymatech Co Ltd | 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート |
JP2004104115A (ja) * | 2002-08-21 | 2004-04-02 | Matsushita Electric Ind Co Ltd | パワーモジュール及びその製造方法 |
JP2004095608A (ja) * | 2002-08-29 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 放熱用基板及びその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101153995B1 (ko) | 2011-05-25 | 2012-06-07 | 주식회사 이지트로닉스 | 전력변환장치 |
JP2013229366A (ja) * | 2012-04-24 | 2013-11-07 | Meidensha Corp | 電子部品の固定構造 |
US9558311B2 (en) | 2013-10-31 | 2017-01-31 | International Business Machines Corporation | Surface region selection for heat sink placement |
US11177224B2 (en) | 2019-05-09 | 2021-11-16 | Fuji Electric Co., Ltd. | Method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP4111187B2 (ja) | 2008-07-02 |
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