JP4105414B2 - 電子線又はｘ線レジスト組成物 - Google Patents
電子線又はｘ線レジスト組成物 Download PDFInfo
- Publication number
- JP4105414B2 JP4105414B2 JP2001244077A JP2001244077A JP4105414B2 JP 4105414 B2 JP4105414 B2 JP 4105414B2 JP 2001244077 A JP2001244077 A JP 2001244077A JP 2001244077 A JP2001244077 A JP 2001244077A JP 4105414 B2 JP4105414 B2 JP 4105414B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- electron beam
- compound
- resist composition
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 CC*(C)(C)*c(cc1)ccc1-c1ccccc1 Chemical compound CC*(C)(C)*c(cc1)ccc1-c1ccccc1 0.000 description 7
- QEGNUYASOUJEHD-UHFFFAOYSA-N CC1(C)CCCCC1 Chemical compound CC1(C)CCCCC1 QEGNUYASOUJEHD-UHFFFAOYSA-N 0.000 description 1
- MBISBHZYOAXXKP-UHFFFAOYSA-N CC1(C=CC(c(cc2)ccc2OCCOC)=CC1)O Chemical compound CC1(C=CC(c(cc2)ccc2OCCOC)=CC1)O MBISBHZYOAXXKP-UHFFFAOYSA-N 0.000 description 1
- VVBRJWVYPXVCJI-UHFFFAOYSA-N CN(COC)c1nc(N(COC)COC)nc(N(COC)COC)n1 Chemical compound CN(COC)c1nc(N(COC)COC)nc(N(COC)COC)n1 VVBRJWVYPXVCJI-UHFFFAOYSA-N 0.000 description 1
- DOLRQMDERJJLND-UHFFFAOYSA-N COCCOc(cc1)ccc1-c(cc1)ccc1OC Chemical compound COCCOc(cc1)ccc1-c(cc1)ccc1OC DOLRQMDERJJLND-UHFFFAOYSA-N 0.000 description 1
- MHASVDCHOMNPJU-UHFFFAOYSA-N COCCOc(cc1)ccc1-c1ccccc1 Chemical compound COCCOc(cc1)ccc1-c1ccccc1 MHASVDCHOMNPJU-UHFFFAOYSA-N 0.000 description 1
- TZOWCKSQGXNKHK-UHFFFAOYSA-N Cc(cc1COC)cc(C)c1O Chemical compound Cc(cc1COC)cc(C)c1O TZOWCKSQGXNKHK-UHFFFAOYSA-N 0.000 description 1
- YUWFEBAXEOLKSG-UHFFFAOYSA-N Cc1c(C)c(C)c(C)c(C)c1C Chemical compound Cc1c(C)c(C)c(C)c(C)c1C YUWFEBAXEOLKSG-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001244077A JP4105414B2 (ja) | 2000-08-15 | 2001-08-10 | 電子線又はｘ線レジスト組成物 |
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000246380 | 2000-08-15 | ||
| JP2000268891 | 2000-09-05 | ||
| JP2000278106 | 2000-09-13 | ||
| JP2000-294244 | 2000-09-27 | ||
| JP2000-246380 | 2000-09-27 | ||
| JP2000-278106 | 2000-09-27 | ||
| JP2000-268891 | 2000-09-27 | ||
| JP2000294244 | 2000-09-27 | ||
| JP2001244077A JP4105414B2 (ja) | 2000-08-15 | 2001-08-10 | 電子線又はｘ線レジスト組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002174904A JP2002174904A (ja) | 2002-06-21 |
| JP2002174904A5 JP2002174904A5 (enrdf_load_stackoverflow) | 2006-01-26 |
| JP4105414B2 true JP4105414B2 (ja) | 2008-06-25 |
Family
ID=27531637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001244077A Expired - Fee Related JP4105414B2 (ja) | 2000-08-15 | 2001-08-10 | 電子線又はｘ線レジスト組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4105414B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4678383B2 (ja) * | 2007-03-29 | 2011-04-27 | 信越化学工業株式会社 | 化学増幅ネガ型レジスト組成物及びパターン形成方法 |
| JP5548427B2 (ja) * | 2009-10-30 | 2014-07-16 | 富士フイルム株式会社 | 組成物、レジスト膜、パターン形成方法、及びインクジェット記録方法 |
| JP5703197B2 (ja) * | 2011-01-18 | 2015-04-15 | 富士フイルム株式会社 | 化学増幅型レジスト組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、レジストパターン形成方法、及び、フォトマスク、並びに、高分子化合物 |
| JP5597616B2 (ja) * | 2011-10-03 | 2014-10-01 | 富士フイルム株式会社 | ネガ型化学増幅レジスト組成物、並びに、それを用いたレジスト膜、レジスト塗布マスクブランクス、レジストパターン形成方法、及び、フォトマスク |
| JP5663526B2 (ja) * | 2012-06-06 | 2015-02-04 | 富士フイルム株式会社 | 化学増幅型レジスト組成物、並びに、それを用いたレジスト膜、マスクブランクス、及びレジストパターン形成方法 |
| CN104253024B (zh) | 2013-06-27 | 2017-07-28 | 第一毛织株式会社 | 硬掩模组合物、使用其形成图案的方法以及包括该图案的半导体集成电路装置 |
| JP6248861B2 (ja) * | 2014-08-19 | 2017-12-20 | 信越化学工業株式会社 | 化学増幅レジスト材料及びパターン形成方法 |
-
2001
- 2001-08-10 JP JP2001244077A patent/JP4105414B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002174904A (ja) | 2002-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4187934B2 (ja) | ポジ型レジスト組成物 | |
| JP3989149B2 (ja) | 電子線またはｘ線用化学増幅系ネガ型レジスト組成物 | |
| JP4194259B2 (ja) | ネガ型レジスト組成物 | |
| JP4243029B2 (ja) | ポジ型化学増幅レジスト組成物 | |
| KR100651042B1 (ko) | 네거티브 레지스트 조성물 | |
| US6489080B2 (en) | Positive resist composition | |
| JP3802179B2 (ja) | ポジ型フォトレジスト組成物 | |
| JP4007569B2 (ja) | ポジ型電子線又はｘ線レジスト組成物 | |
| US6727036B2 (en) | Positive-working radiation-sensitive composition | |
| KR20020070781A (ko) | 포지티브 레지스트 조성물 | |
| JP3894260B2 (ja) | ポジ型フォトレジスト組成物 | |
| KR100788808B1 (ko) | 포지티브 전자선 또는 엑스선 레지스트 조성물 | |
| JP4121309B2 (ja) | ネガ型レジスト組成物 | |
| JP4105414B2 (ja) | 電子線又はｘ線レジスト組成物 | |
| JP2001281864A (ja) | 電子線またはｘ線用レジスト組成物 | |
| JP3741330B2 (ja) | ポジ型フォトレジスト組成物及びそれを用いるパターン形成方法 | |
| JP2003330191A (ja) | ネガ型レジスト組成物 | |
| JP5075803B2 (ja) | ポジ型レジスト組成物及びこれを用いたパターン形成方法 | |
| JP4049237B2 (ja) | ポジ型電子線又はｘ線レジスト組成物 | |
| US20020058206A1 (en) | Positive resist composition | |
| JP2004020933A (ja) | ネガ型レジスト組成物 | |
| JP4486768B2 (ja) | ネガ型電子線又はｘ線用化学増幅レジスト組成物 | |
| JP2003057822A (ja) | 電子線又はｘ線用ネガ型レジスト組成物 | |
| KR100835611B1 (ko) | 포지티브 레지스트 조성물 | |
| JP4240868B2 (ja) | 電子線またはｘ線用ネガ型レジスト組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051129 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051129 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20060324 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20061124 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071108 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071115 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071122 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080226 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080312 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080327 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110404 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120404 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130404 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130404 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140404 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |