JP4103761B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP4103761B2 JP4103761B2 JP2003352502A JP2003352502A JP4103761B2 JP 4103761 B2 JP4103761 B2 JP 4103761B2 JP 2003352502 A JP2003352502 A JP 2003352502A JP 2003352502 A JP2003352502 A JP 2003352502A JP 4103761 B2 JP4103761 B2 JP 4103761B2
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Description
本発明の第1実施形態にかかる半導体装置のレイアウト構成を図1に示すと共に、図1におけるA−A断面を図2に示す。以下、これらの図に基づき、本実施形態における半導体装置の構成について説明する。
上記第1実施形態では、複数の制御回路パッド2aがセンサパッド1bと外部接続用パッド3bとに順番に接続される構成としている。しかしながら、これは一例であり、複数の制御回路パッド2aのうち、複数のセンサパッド1bのいずれかに接続されるもの同士の間に、少なくとも1つ、複数の外部接続用パッド3bのいずれかに接続されるものが配置された構成となっていればよい。
2a…制御回路パッド、3…パッケージ、3a…段付部、3b…外部接続用パッド、
3c…配線、3d…外部接続端子。
Claims (8)
- センサ素子(1a)が形成されていると共に、前記センサ素子に電気的に接続される複数のセンサパッド(1b)が備えられたセンサチップ(1)と、
制御回路に接続される複数の制御回路パッド(2a)が備えられた制御回路チップ(2)と、
前記センサチップ(1)および前記制御回路チップ(2)を収容し、その内壁に外部電極と電気的に接続された複数の外部接続用パッド(3b)が備えられたパッケージ(3)とを有し、
前記パッケージ(3)内において、前記制御回路チップ(2)上に前記センサチップ(1)が搭載されてなる半導体装置であって、
前記複数の制御回路パッド(2a)には、前記複数のセンサパッド(1b)のいずれかに接続されるものと前記複数の外部接続用パッド(3b)のいずれかに接続されるものとがあり、前記複数のセンサパッド(1b)のいずれかに接続されるもの同士の間に、少なくとも1つ、前記複数の外部接続用パッド(3b)のいずれかに接続されるものが配置されており、
前記複数の制御回路パッド(2a)のうち前記複数の外部接続用パッド(3b)に接続されるものは、前記複数の外部接続用パッド(3b)に対して逆ボンディングによってワイヤボンディングされ、かつ、そのワイヤ(5)が前記外部接続用パッド(3b)に対して直接ウェッジボンディングされていることを特徴とする半導体装置。 - センサ素子(1a)が形成されていると共に、前記センサ素子に電気的に接続される複数のセンサパッド(1b)が備えられたセンサチップ(1)と、
制御回路に接続される複数の制御回路パッド(2a)が備えられた制御回路チップ(2)と、
前記センサチップ(1)および前記制御回路チップ(2)を収容し、その内壁に外部電極と電気的に接続された複数の外部接続用パッド(3b)が備えられたパッケージ(3)とを有し、
前記パッケージ(3)内において、前記制御回路チップ(2)上に前記センサチップ(1)が搭載されてなる半導体装置であって、
前記複数の制御回路パッド(2a)には、前記複数のセンサパッド(1b)のいずれかに接続されるものと前記複数の外部接続用パッド(3b)のいずれかに接続されるものとがあり、前記複数のセンサパッド(1b)のいずれかに接続されるもの同士の間に、前記複数の外部接続用パッド(3b)のいずれかに接続されるものが1つずつ配置されることにより、前記複数のセンサパッド(1b)のいずれかに接続されるものと前記複数の外部接続用パッド(3b)のいずれかに接続されるものとが交互に順番に配置されており、
前記複数の制御回路パッド(2a)のうち前記複数の外部接続用パッド(3b)に接続されるものは、前記複数の外部接続用パッド(3b)に対して逆ボンディングによってワイヤボンディングされ、かつ、そのワイヤ(5)が前記外部接続用パッド(3b)に対して直接ウェッジボンディングされていることを特徴とする半導体装置。 - 前記複数のセンサパッド(1b)のそれぞれには、複数段のボールボンディングが成されており、
前記複数の制御回路パッド(2a)のうち前記複数のセンサパッド(1b)のいずれかに接続されるものは、前記複数のセンサパッド(1b)に対して逆ボンディングによってワイヤボンディングされ、かつ、そのワイヤ(4)は前記複数段のボールボンディング(4a)の上にウェッジボンディングされていることを特徴とする請求項1または2に記載の半導体装置。 - 前記パッケージ(3)の内壁には、前記センサチップ(1)および前記制御回路チップ(2)を前記パッケージ(3)に収容した際に、前記センサチップ(1)の表面と略面一となる面が備えられており、この面の表面に前記外部接続用パッド(3b)が形成されていることを特徴とする請求項1ないし3のいずれか1つに記載の半導体装置。
- センサ素子(1a)が形成されていると共に、前記センサ素子に電気的に接続される複数のセンサパッド(1b)が備えられたセンサチップ(1)と、
制御回路に接続される複数の制御回路パッド(2a)が備えられた制御回路チップ(2)と、
前記センサチップ(1)および前記制御回路チップ(2)を収容し、その内壁に外部電極と電気的に接続された複数の外部接続用パッド(3b)が備えられたパッケージ(3)とを有し、
前記パッケージ(3)内において、前記制御回路チップ(2)上に前記センサチップ(1)を搭載してなる半導体装置の製造方法であって、
前記複数の制御回路パッド(2a)のうち前記複数の外部接続用パッド(3b)のいずれかに接続されるものにボールボンディングしたのち、ワイヤを引き出しながら前記複数の外部接続用パッド(3b)のいずれかにウェッジボンディングする逆ボンディングを行う工程と、
前記複数の制御回路パッド(2a)のうち前記複数のセンサパッド(1b)のいずれかに接続されるものにボールボンディングしたのち、ワイヤを引き出しながら前記複数のセンサパッド(1b)のいずれかにウェッジボンディングする逆ボンディングを行う工程とを有し、
前記複数の制御回路パッド(2a)のうち前記複数の外部接続用パッド(3b)のいずれかに接続されるものすべてを前記複数の外部接続用パッド(3b)に逆ボンディングしたのち、前記複数の制御回路パッド(2a)のうち前記複数のセンサパッド(1b)のいずれかに接続されるものと前記複数のセンサパッド(1b)との逆ボンディングを行うことを特徴とする半導体装置の製造方法。 - センサ素子(1a)が形成されていると共に、前記センサ素子に電気的に接続される複数のセンサパッド(1b)が備えられたセンサチップ(1)と、
制御回路に接続される複数の制御回路パッド(2a)が備えられた制御回路チップ(2)と、
前記センサチップ(1)および前記制御回路チップ(2)を収容し、その内壁に外部電極と電気的に接続された複数の外部接続用パッド(3b)が備えられたパッケージ(3)とを有し、
前記パッケージ(3)内において、前記制御回路チップ(2)上に前記センサチップ(1)を搭載してなる半導体装置の製造方法であって、
前記複数の制御回路パッド(2a)のうち前記複数の外部接続用パッド(3b)のいずれかに接続されるものにボールボンディングしたのち、ワイヤを引き出しながら前記複数の外部接続用パッド(3b)のいずれかにウェッジボンディングする逆ボンディングを行う工程と、
前記複数の制御回路パッド(2a)のうち前記複数のセンサパッド(1b)のいずれかに接続されるものにボールボンディングしたのち、ワイヤを引き出しながら前記複数のセンサパッド(1b)のいずれかにウェッジボンディングする逆ボンディングを行う工程とを有し、
前記複数の制御回路パッド(2a)のうち前記複数の外部接続用パッド(3b)のいずれかに接続されるものと前記複数のセンサパッド(1b)のいずれかに接続されるものとが1つずつ交互に順番に配置されるようにすることを特徴とする半導体装置の製造方法。 - 前記複数のセンサパッド(1b)のそれぞれに複数段のボールボンディングを行う工程を有し、
前記複数の制御回路パッド(2a)と前記複数のセンサパッド(1b)との逆ボンディングを行う工程では、前記複数段のボールボンディングの上に前記ウェッジボンディングを行うことを特徴とする請求項5または6に記載の半導体装置の製造方法。 - 前記複数の制御回路パッド(2a)と前記複数の外部接続用パッド(3b)とを逆ボンディングする工程では、前記外部接続用パッド(3b)に対して直接ウェッジボンディングされていることを特徴とする請求項5または6に記載の半導体装置の製造方法。
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